JPH0697261A - Device and method for controlling wafer transfer - Google Patents

Abstract

PURPOSE:To provide a wafer transfer control device and method of high reliability, where misjudgment and mishandling made by an operator are eliminated so as to protect wafers and a boat against damage by displaying adequate commands which should be inputted by an operator at trouble. CONSTITUTION:A command table 12 where a situation indication command corresponding to the trouble of a wafer transfer operation and a continuation indication command which indicates that a device continues to operate in the situation concerned are stored and a processing control 11 which reads out two commands corresponding to the state of trouble are provided inside a controller 5. Situation indication commands are displayed on a display 21 corresponding to the state of troubles, and when one of the commands is inputted through a key input section 22, a continuation indication command corresponding to the situation indication command is indicated on the display 21, and then the continuation indication command is inputted through input, keys, whereby a wafer transfer control device continues a transfer operation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer control device in a semiconductor manufacturing apparatus such as a load-lock type vertical diffusion / CVD apparatus, and more particularly, to display an appropriate command to be input when trouble occurs. The present invention relates to a wafer transfer control device and a control method therefor, which can eliminate operator's erroneous judgments and operation mistakes, prevent damage to wafers and boats, and improve reliability.

[0002]

2. Description of the Related Art A vertical diffusion / CVD apparatus as a conventional semiconductor manufacturing apparatus will be described with reference to FIG. Figure 8
1 is a schematic configuration diagram of a vertical diffusion / CVD apparatus. As shown in FIG. 8, the vertical diffusion / CVD apparatus includes a transfer chamber 1 in which wafers are transferred, a cassette 2 in which a plurality of wafers to be transferred are stored, and a transfer chamber. 1 Vertical diffusion / CVD inside
A cassette chamber door 10 for shutting off from the outside of the apparatus, a vertical fixed boat 3 for performing wafer diffusion / CVD processing,
Wafer transfer from cassette 2 to boat 3 (charge)
Or a wafer transfer machine 4 for performing wafer transfer (discharging) from the boat 3 to the cassette 2,
Further, the wafer of the wafer transfer machine 4 is provided outside the transfer chamber 1.
(C) A controller 5 for controlling the transfer operation, and a controller
An operation terminal 6 which is connected to the laser 5 and displays the state of the wafer transfer machine 4 and inputs control instructions is provided.
The wafer transfer device 4, the controller 5, and the operation terminal 6 constitute a wafer transfer control device that controls the wafer transfer operation.

Next, each part of the conventional wafer transfer control device will be specifically described with reference to FIG. Operation
The minal 6 includes a display section for displaying error information and a key input section for inputting a command at the operator's discretion when the error information is displayed when a trouble occurs in the wafer transfer machine 4. It is configured.

The controller 5 carries out a wafer transfer operation by the wafer transfer machine 4 in accordance with predetermined transfer data, and monitors the operation by a rotary encoder or the like. Appropriate error control is performed, and further, a trouble of the wafer transfer operation of the wafer transfer machine 4 is detected, error information is output to the display section of the operation terminal 6, and the trouble is also returned. At some time, the wafer transfer machine 4 is controlled according to the command input from the operation terminal 6.

The wafer transfer machine 4 vacuum-adsorbs the wafer so that it is picked up from the bottom, takes it out from the cassette 2 or the boat 3, and transfers the wafer. A quartz tweezer of a quartz plate is attached to the tip of the ha transfer machine 4, and two wafer adsorbing holes are provided on the upper surface of the quartz tweezer.

Next, the wafer transfer operation in the conventional vertical diffusion / CVD apparatus will be described with reference to FIG. First, the normal wafer transfer operation will be described. A quartz tweezer of the wafer transfer machine 4 vacuum-adsorbs the wafer, removes the wafer from the cassette 2, and transfers it to the boat 3. Charge. Then, the wafer transfer machine 4 which has finished charging the wafer to the boat 3 returns to the cassette 2 again, charges the next wafer, and repeats this operation.

Next, the boat 3 on which the wafer is charged
Then, diffusion / CVD processing is performed. After that, the wafer is taken out from the boat 3 by the wafer transfer machine 4 and discharged into the cassette 2, and the same operation is repeated so that all the wafers from the boat 3 are cassettes. It is discharged to 2.

Next, the wafer transfer control when a trouble occurs will be described with reference to FIG. Before that, the problem of wafer transfer will be described in detail. The first problem is that the contact surface between the quartz tweezers at the tip of the wafer transfer machine 4 and the wafer has an inclination or a gap. The wafer cannot be vacuum-sucked due to some reason, and the wafer is loaded into the cassette 2 or the boat 3.
In some cases, the drive mechanism of the wafer transfer machine 4 may overrun as a second trouble, and as a third trouble, wafer transfer may occur. The motor of the drive mechanism of the machine 4 may be abnormal.

In the case of the first trouble, the suction sensor provided on the quartz tweezers detects an abnormality in the wafer suction and stops the wafer transfer operation of the wafer transfer machine 4. ,
In the case of the second and third troubles, the rotary encoder that monitors the rotation of the motor detects an abnormality in the rotation of the motor and stops the transfer operation of the wafer transfer machine 4. It is like this.

Next, when the wafer transfer operation is interrupted in this way, an error is reported from the mechanical controller controlling the wafer transfer machine 4 to the main controller controlling the entire system, and the operation is performed. Error information is displayed on the display portion of the terminal 6, and the operator is notified of the occurrence of trouble by blinking and an alarm by a buzzer.

Then, the operator who recognizes the occurrence of the trouble is in a situation at the time of the trouble (wafer transfer machine 4, wafer,
The condition of the cassette 2 and the boat 3) is visually checked to determine whether or not to continue the wafer transfer, and a command such as a continuation instruction for that is input from the input section of the operation terminal 6. I was doing trouble processing.

[0012]

However, in the above-mentioned conventional wafer transfer control device in the vertical diffusion / CVD apparatus, the operator visually inputs a command to continue the operation. Therefore, due to operator's erroneous judgment, operation error, malfunction of the wafer transfer machine 4 caused by improper command input, etc., a quartz tweezer, a wafer, etc. may be damaged. In the worst case, there was a problem that the boat was damaged.

In addition, the interior is invisible because of the mechanical structure.
In the dock-type vertical diffusion / CVD apparatus, it is impossible for the operator to make a decision, so that there is a problem in that it is not possible to carry out a trouble process using the conventional wafer transfer control apparatus.

The present invention has been made in view of the above circumstances, and by displaying an appropriate command to be input by the operator in the event of a trouble, the operator's erroneous judgment and operation mistake are eliminated, and a diffusion / CVD apparatus is provided. An object of the present invention is to provide a highly reliable wafer transfer control device and a control method thereof, which prevent damage to the wafer and the boat.

[0015]

The invention according to claim 1 for solving the problems of the above-mentioned conventional example is a wafer transfer machine for performing a wafer transfer operation, and the wafer transfer machine. In a wafer transfer control device having a controller for controlling a mounting machine, a command table storing a command corresponding to a trouble of the wafer transfer operation in the controller, and the trouble. A processing control section is provided for judging the situation and reading a corresponding command from the command table, and a display section for displaying the command output by the processing control section and a key according to the command displayed on the display section. It is characterized by having a key input section for inputting.

According to a second aspect of the present invention for solving the above-mentioned problems of the conventional example, in the control method of the wafer transfer control device according to the first aspect, the processing control unit is a wafer transfer machine. The trouble status of the transfer operation is determined, the command corresponding to the trouble is read from the command table and output, the command is displayed on the display unit, and the wafer transfer is performed by the key input according to the command. The feature is that an action is performed.

[0017]

According to the first aspect of the present invention, the command corresponding to the trouble of the wafer transfer operation is stored in the command table, the trouble situation is judged, and the corresponding command is read out from the command table. Department is control
Since the wafer transfer control device is provided in the controller and key-inputted by the key input unit according to the command displayed on the display unit, an appropriate command corresponding to the trouble situation is displayed and the command is displayed. Since the operator can enter the key by referring to it, it eliminates the operator's misjudgment and operation mistakes and spreads
It is possible to prevent damage to wafers, boats, etc. in the CVD apparatus and improve the reliability of the semiconductor manufacturing apparatus of the diffusion / CVD apparatus.

According to the second aspect of the present invention, in the control method of the wafer transfer control device according to the first aspect, the processing control section determines the trouble situation of the transfer operation in the wafer transfer machine. Then, the command corresponding to the trouble is read from the command table, displayed on the display, and the key according to the command is read.
Since the control method of the wafer transfer control device in which the wafer transfer operation is performed by the input is performed, an appropriate command corresponding to the trouble situation is displayed, and the key input by the operator referring to the command is input. Since the wafer transfer operation can be continued, it eliminates operator's mistakes in judgment and operation,
It is possible to prevent damage to the wafer, boat, etc. in the diffusion / CVD apparatus, reliably and simplify the transfer operation against troubles, and improve the reliability of the semiconductor manufacturing apparatus of the diffusion / CVD apparatus.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. The load lock type vertical diffusion / CVD apparatus in which the wafer transfer control apparatus of this embodiment is used is substantially the same as the conventional vertical diffusion / CVD apparatus shown in FIG.
As shown in, a transfer chamber 1 in which wafers are transferred,
Cassette chamber door 1 that shuts off the inside of the transfer chamber 1 from the outside of the device
0, a cassette 2 in which a plurality of wafers are stored, a vertically fixed boat 3 in which the wafers stored in the cassette 2 are charged and diffusion / CVD processing is performed, The wafer is vacuum-sucked by a quartz tweezers, and the vacuum-sucked wafer is charged from the cassette 2 to the boat 3 or the diffusion / CVD-processed wafer is transferred from the boat 3 to the wafer. If a trouble occurs in the wafer transfer machine 4 that discharges to the cassette 2, the controller 5 that controls the wafer transfer machine 4, and the wafer transfer machine 4, an error information is displayed. And an operation terminal 6 having a key input unit for inputting a command selected by the operator at the time of displaying the error information.

The load-lock type vertical diffusion / CVD apparatus can seal the transfer chamber 1 in order to suppress the generation of a natural oxide film on the wafer, remove oxygen to perform the diffusion / CVD process. This is an apparatus for highly integrated devices.

Next, the wafer transfer control device of this embodiment will be described with reference to FIG. FIG. 1 is a configuration block diagram of the wafer transfer control device of the present embodiment. As shown in FIG. 1, the wafer transfer control device of the present embodiment comprises a controller 5 of a load-lock type vertical diffusion / CVD device, an operation terminal 6, and a wafer transfer device. 4 and further,
It has a drive unit 7 connected to the wafer transfer machine 4 and a rotary encoder 8.

The controller 5 sets a processing control section 11, a command table 12 in which commands are stored, and set values corresponding to an initial transfer position (initial position) which is a delimiter for transfer operation. The initial value sensor 13 and the input / output unit 14 for inputting / outputting commands and signals.

As shown in FIG. 2, which is an external front view of the operation terminal 6, the operation terminal 6 is a display unit 21 such as a liquid crystal display for displaying error information and commands.
And a key input section 22 for key input of the command displayed on the display section 21.

The drive unit 7 is composed of a motor for driving the wafer transfer machine 4 and a motor control unit for controlling the motor. The rotary encoder 8 is a motor of the drive unit 7.
An encoder that reads the number of rotations of the data and outputs a corresponding code to the processing control unit 11.

Next, each part of the controller 5 will be described with reference to FIGS. 1 and 3. FIG. 3 is a conceptual diagram for explaining the contents of the command table 12. As shown in FIG. 3, the commands stored in the command table 12 include a command display request CCD (Charge Comand D
isplay) and "CCD" and "LF" are input, the display unit 2
1 and a continuation instruction command displayed on the display unit 21 when the situation instruction command is input. Here, “LF” means a command execution command.

The command display request CCD is a command for requesting the display of a status instruction command. The status instruction command is a command for the wafer transfer machine 4 when trouble occurs and the transfer operation is interrupted. It is a command for instructing the operation status, and is composed of six commands such as DCG, CHG, ..., and the continuation instruction command corresponds to the operation status of the wafer transfer machine 4 in response to the instruction of the status instruction command. It is a command for causing the wafer transfer machine 4 to continue the wafer transfer operation by the appropriate processing described above, and is composed of RCNTN and SCNT commands.

Each status indication command will be further described. DCG is a dummy wafer charge, CHG is a wafer charge, DCH is a wafer discharge, and DDC is a dummy wafer discharge. The MDC
Means that the monitor wafer discharge is being performed, and PDC means that the process wafer discharge is being performed, which is displayed on the display unit 21 of the operation terminal 6 when the operation is interrupted.

Explaining the continuation instruction command, "RCNTN" means that the wafer transfer which has been executed up to that time is re-executed, and then the retry transfer is continued to continue the next wafer transfer. "SCNTN" means skip continuation that continues from the next wafer transfer of the wafer transfer that has been executed so far.

Then, the processing control unit 1 in the controller 5
1 is an input / output unit 14 for the output from the rotary encoder 8
Determining means for determining whether or not the wafer transfer device 4 is operating normally by receiving via the initial value sensor 13, reading the set value by the initial value sensor 13 and comparing it, and calculating an error from the set value. It has 15. When the processing control section 11 detects that the wafer transfer machine 4 is not operating normally from the judgment result of the judgment means 15, the processing transfer section 11 transfers the wafer to the drive section 7 via the input / output section 14. A signal for stopping the operation of the machine 4 is output to interrupt the transfer operation, output error information to the operation terminal 6, and then a command display request "C
When "CD" and "LF" are input, the judgment means 15 judges the trouble situation and reads the situation instruction command corresponding to the situation from the command table 12 to the operation terminal 6 as a characteristic part of this embodiment. When the operator outputs the status indication command displayed and then inputs the status indication command, the continuation instruction command corresponding to the status indication command is read out from the command table 12 and operated.
It is output to the minal 6.

Next, the output standard of the continuation instruction command of the wafer transfer control device of this embodiment will be described. First,
During the interruption when the wafer transfer machine 4 is operating from the cassette 2 to the boat 3, that is, during the interruption during charging, the wafer transfer machine 4 mounts the wafer. If not, the retry continuation (RCNTN) is displayed on the display unit 21 of the operation terminal 6 and the skip continuation (SCNTN) is displayed if the wafer transfer machine 4 is mounting the wafer. It has become. In addition, skip continuation (SCNTN) during interruption during charging means returning the wafer placed on the cassette 2 to the cassette 2 and continuing the charging from the next wafer. is there.

When the wafer transfer machine 4 is operating from the boat 3 to the cassette 2 while the wafer transfer machine 4 is operating, that is, when the wafer transfer machine 4 is interrupted during discharge, the wafer transfer machine 4 is operated by the wafer transfer machine 4. -Retry continues if C is not installed (RCNTN)
If the wafer transfer device 4 is mounting the wafer, the skip continue (SCNTN) is displayed on the display unit 21 of the operation terminal 6.
It is supposed to be displayed. In addition, skip continuation (SCNTN) during interruption during discharge means that the wafer that has been placed is not returned to the boat 3 but is transferred to the cassette 2 and then the next It means continuing the discharge from the wafer.

Next, the abnormality processing in the wafer transfer control device of this embodiment will be described with reference to FIGS. 1, 6 and 7. 6 and 7 are flowcharts showing a wafer transfer control method when a trouble occurs in the wafer transfer control device of this embodiment. Although FIG. 6 and FIG. 7 are a series of flow charts, they are divided into two due to space limitations and are connected in (A).

If any abnormality occurs in the transfer chamber 1 during the transfer operation, the determination unit 15 of the processing control unit 11 causes a trouble in the wafer transfer machine 4 as shown in FIG. It is judged whether it has occurred (100), and the wafer transfer machine 4
If a trouble occurs in the process controller 11, the process controller 11 stops the operation of the wafer transfer machine 4 (101). Subsequently, the processing control section 11 displays error information on the display section 21 of the operation terminal 6 and notifies the operator of the trouble occurrence together with an alarm by a buzzer or the like (102).

Next, when the operator notified of the trouble occurrence inputs "CCD" and "LF", which are command display requests, from the key input unit 22 of the operation terminal 6, (103), The determination unit 15 of the processing control unit 11 determines whether or not the trouble is in the charge (discharging) (104). If the trouble is in the charge, a valid status instruction in the charge is given. The commands DCG and CHG are displayed with a "→" mark attached (105). In case of trouble during discharge, DCH, DDC, MD which are valid status indication commands during discharge.
"→" is added to C and PDC and displayed (10
6). The “→” mark here is attached to a valid command that can be taken corresponding to the operation status of the wafer transfer machine 4 at the time of trouble.

Then, when the operator selects one from the situation instruction commands displayed with the mark "→" and key-inputs it (107), next, as shown in FIG. It is determined whether the wafer is placed on the wafer transfer machine 4 (108), and if the wafer is placed, “RCNTN” for instructing to continue the retry is displayed on the display unit 21. (109) Then, the retry is continued by the key input by the operator (110). On the other hand, if the wafer is not mounted, the command "SCNT
“N” is displayed on the display unit 21 (111), and the operator's key is pressed.
The skip continues by input (112).

Next, as a specific example of the wafer transfer control method of this embodiment, the cassette 2 is transferred to the boat 3 while the wafer transfer machine 4 is not mounting the wafer. Processing when a trouble occurs while charging is described with reference to FIGS. 4 and 5. FIG. 4 is a display example of the situation instruction command on the display unit 21 of the operation terminal 6, and FIG.
4 is a display example of a continuation instruction command on the display unit 21 of the operation terminal 6.

When a trouble occurs in the wafer transfer machine 4, the judgment section 15 judges that the wafer transfer machine 4 is stopped and the error information is displayed on the display section 21. Then, the operator recognizes the error information and requests the command display "CC
When "D" and "LF" are performed, the determination unit 15 determines whether or not the charge is stopped during the charge. Since the wafer transfer machine 4 is now stopped during the charge, as shown in FIG. DCG and CH, which are status indication commands effective for interruption during charging
It is displayed on the display unit 21 in a state where “→” is attached to G.

Next, a valid status indication command (DCG,
When a worker selects one command from CHG) and inputs it from the key input unit 22, the determination unit 15 determines whether or not the wafer transfer device 4 is mounting the wafer. , The wafer transfer machine 4 does not have a wafer mounted thereon.
, The continuation instruction command (CONTINUEC
OMAND) is displayed, and the command “1 → HMX 2 → RCNTN” for instructing to continue the retry is displayed on the display unit 2.
It is displayed at 1, and the operator continues the retry by keying in the order of 1 → 2. Here, the numbers indicate the order of input, and the "→" marks indicate the commands that are input according to the order.

According to the wafer transfer control apparatus and its control method of the present embodiment, even in a semiconductor manufacturing apparatus such as a load lock type vertical diffusion / CVD apparatus in which the inside of the apparatus cannot be seen, work can be performed. Since an appropriate continuation instruction command corresponding to the trouble situation is displayed without the operator judging the trouble situation, the operator simply inputs the command by referring to the continuation instruction command displayed at the time of trouble. Ha transfer control can be performed, and it has an effect that abnormal processing of wafer transfer can be performed reliably and simply. Moreover, damage accidents such as quartz tweezers, wafers and boats can be prevented. Therefore, there is an effect that it can be prevented and the reliability of the semiconductor manufacturing apparatus can be improved.

[0040]

According to the first aspect of the invention, the command corresponding to the trouble of the wafer transfer operation is the command table.
It is stored in a cable, judges the trouble situation, and
There is a processing control unit for reading the corresponding command from the controller in the controller, and the wafer transfer control device is key-inputted by the key input unit according to the command displayed on the display unit. The appropriate command corresponding to is displayed, and the operator can key-in by referring to the command, eliminating the operator's erroneous judgment and operation mistake,
This has the effect of preventing damage to the wafer and boat in the diffusion / CVD apparatus and improving the reliability of the diffusion / CVD apparatus in the semiconductor manufacturing apparatus.

According to the second aspect of the present invention, in the control method of the wafer transfer control device according to the first aspect, the processing control section determines the trouble situation of the transfer operation in the wafer transfer machine. Then, the command corresponding to the trouble is read from the command table, displayed on the display, and the key according to the command is read.
Since the control method of the wafer transfer control device in which the wafer transfer operation is performed by the input is performed, an appropriate command corresponding to the trouble situation is displayed, and the key input by the operator referring to the command is input. Since the wafer transfer operation can be continued, it eliminates operator's mistakes in judgment and operation,
Effect of preventing damage to wafers and boats in the diffusion / CVD apparatus, reliably and simplifying transfer operation against troubles, and improving reliability of the semiconductor manufacturing apparatus of the diffusion / CVD apparatus There is.

[Brief description of drawings]

FIG. 1 is a configuration block diagram of a wafer transfer control device according to an embodiment of the present invention.

FIG. 2 is an external front view of an operation terminal.

FIG. 3 is a conceptual diagram illustrating the contents of a command table.

FIG. 4 is a diagram showing a display example of a situation instruction command on a display unit of an operation terminal.

FIG. 5 is a diagram showing a display example of a continuation instruction command on a display unit of an operation terminal.

FIG. 6 is a flowchart showing a wafer transfer control method when a trouble occurs in the wafer transfer control device.

FIG. 7 is a flowchart showing a wafer transfer control method when a trouble occurs in the wafer transfer control device.

FIG. 8 is a schematic configuration diagram of a conventional rod-lock type vertical diffusion / CVD apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Transfer room, 2 ... Cassette, 3 ... Boat, 4 ... Wafer transfer machine, 5 ... Controller, 6 ... Operation terminal, 7 ... Drive part, 8 ... Rotarian encoder , 1
0 ... Cassette room door, 11 ... Processing control section, 12 ... Command table, 13 ... Initial value sensor, 14 ... Input / output section, 15 ... Judgment section, 21 ... Display section, 22 ... Key
Input section

Claims (2)

[Claims] 1. A wafer transfer control device having a wafer transfer machine for carrying out a wafer transfer operation and a controller for controlling the wafer transfer machine, wherein: A command table for storing a command corresponding to the trouble of the wafer transfer operation and a processing control section for judging the trouble situation and reading the corresponding command from the command table are provided in the loader; A wafer transfer control device comprising: a display unit for displaying the command output by the processing control unit; and a key input unit for key-inputting in accordance with the command displayed on the display unit. 2. A processing control unit determines a trouble situation of a transfer operation in a wafer transfer machine, reads a command corresponding to the trouble from a command table and outputs it, and a display unit displays the command. Key according to the above command.
2. The method of controlling the wafer transfer control device according to claim 1, wherein the wafer transfer operation is performed by an input.