JP2013064897A - Proximity exposure device, exposure amount adjustment method of proximity exposure device, and manufacturing method of display panel substrate - Google Patents

Proximity exposure device, exposure amount adjustment method of proximity exposure device, and manufacturing method of display panel substrate Download PDF

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JP2013064897A
JP2013064897A JP2011203913A JP2011203913A JP2013064897A JP 2013064897 A JP2013064897 A JP 2013064897A JP 2011203913 A JP2011203913 A JP 2011203913A JP 2011203913 A JP2011203913 A JP 2011203913A JP 2013064897 A JP2013064897 A JP 2013064897A
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exposure
substrate
amount
mask
section
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Hiroshi Toikawa
博志 樋川
Kazuyuki Nakano
和幸 中野
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Hitachi High Tech Corp
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Hitachi High Tech Corp
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Abstract

PROBLEM TO BE SOLVED: To effectively prevent occurrence of pattern steps in boundaries of sections when an exposure region of a substrate is exposed by diving the region into a plurality of consecutive sections.SOLUTION: Exposure amount adjustment plates 42a, 42b, 43a, and 43b are arranged above a mask 2 held by a mask holder 20. The exposure amount adjustment plates 42a, 42b, 43a, and 43b are moved in the vicinity of boundaries of respective sections A, B, C, and D of the exposure region of the substrate 1 to adjust light volumes of exposure light radiated to the vicinity of the boundaries of respective sections A, B, C, and D. When exposing exposure regions A, B, C, and D of the substrate 1, exposure light fluxes adjusted by respective exposure amount adjustment plates 42a, 42b, 43a, and 43b are radiated to the vicinity of the boundaries of respective sections A, B, C, and D in overlapped manners.

Description

本発明は、液晶ディスプレイ装置等の表示用パネル基板の製造において、プロキシミティ方式を用いて基板の露光を行うプロキシミティ露光装置、プロキシミティ露光装置の露光量調節方法、及びそれらを用いた表示用パネル基板の製造方法に係り、特に、基板の露光領域を連続する複数の区画に分けて露光するプロキシミティ露光装置、プロキシミティ露光装置の露光量調節方法、及びそれらを用いた表示用パネル基板の製造方法に関する。   The present invention relates to a proximity exposure apparatus that exposes a substrate using a proximity method in manufacturing a display panel substrate such as a liquid crystal display device, a method for adjusting the exposure amount of the proximity exposure apparatus, and a display using the same BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a panel substrate, and in particular, a proximity exposure apparatus that performs exposure by dividing an exposure area of a substrate into a plurality of continuous sections, a method for adjusting an exposure amount of the proximity exposure apparatus, and a display panel substrate using the same It relates to a manufacturing method.

表示用パネルとして用いられる液晶ディスプレイ装置のTFT(Thin Film Transistor)基板やカラーフィルタ基板、プラズマディスプレイパネル用基板、有機EL(Electroluminescence)表示パネル用基板等の製造は、露光装置を用いて、フォトリソグラフィー技術により基板上にパターンを形成して行われる。露光装置としては、レンズ又は鏡を用いてマスクのパターンを基板上に投影するプロジェクション方式と、マスクと基板との間に微小な間隙(プロキシミティギャップ)を設けてマスクのパターンを基板へ転写するプロキシミティ方式とがある。プロキシミティ方式は、プロジェクション方式に比べてパターン解像性能は劣るが、照射光学系の構成が簡単で、かつ処理能力が高く量産用に適している。   Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

プロキシミティ露光装置では、マスクのパターンを基板へ1対1に転写するため、基板が大型化して露光領域が大きくなると、露光領域と同じ大きさのマスクが必要となり、マスクのコストが増加する。そこで、例えば、液晶ディスプレイ装置のカラーフィルタ基板等の露光で、同じ形状のパターンを繰り返して形成する場合には、露光領域より小さなマスクを用い、基板の露光領域を連続する複数の区画に分けて露光することが行われている。   In the proximity exposure apparatus, the mask pattern is transferred to the substrate on a one-to-one basis. Therefore, when the substrate is enlarged and the exposure area is increased, a mask having the same size as the exposure area is required, and the cost of the mask increases. Therefore, for example, when a pattern having the same shape is repeatedly formed by exposure of a color filter substrate or the like of a liquid crystal display device, a mask smaller than the exposure area is used, and the exposure area of the substrate is divided into a plurality of continuous sections. Exposure is performed.

基板の露光領域を連続する複数の区画に分けて露光する場合、露光光の光量が区画毎にばらつくと、形成されるパターンの高さが各区画の境界で急激に変化し、パターンの段差が発生する。表示用パネル基板では、このパターンの段差が人の目で認識されて、表示品質が劣化する。特許文献1には、従来技術として、透過率の勾配がついたフィルターを用いて、マスクの端部で露光量を緩やか傾斜させ、隣り合う区画同士で端部を重複して露光して、境界部分の露光量を均一化することが記載されている。また、特許文献1には、マスクに露光領域と遮光領域を縦横に交互に配置して、境界部分の露光量の差を小さくする技術が開示されている。   When exposure is performed by dividing the exposure area of the substrate into a plurality of continuous sections, if the amount of exposure light varies from section to section, the height of the pattern to be formed changes abruptly at the boundary of each section, and the pattern step is Occur. In the display panel substrate, the step of this pattern is recognized by the human eye, and the display quality deteriorates. In Patent Document 1, as a conventional technique, a filter with a gradient of transmittance is used, the exposure amount is gently inclined at the edge of the mask, the edge is overlapped between adjacent sections, and the boundary is exposed. It describes that the exposure amount of the part is made uniform. Japanese Patent Application Laid-Open No. H10-228561 discloses a technique for reducing the difference in exposure amount at the boundary portion by alternately arranging exposure areas and light-shielding areas in the vertical and horizontal directions on the mask.

特開2004−133200号公報JP 2004-133200 A

マスクの全面で露光光の光量を均一にすることは難しく、特にマスクの周辺部では、露光光の回折等により、露光光の光量が場所によって異なってくる。例えば、露光される各区画の上側端部と下側端部、又は右側端部と左側端部とでは、露光光の光量が異なり、これらの露光光の光量のばらつきは、露光装置毎あるいはマスク毎に変化する。しかしながら、特許文献1に従来技術として記載されたフィルターを用いる方法では、各区画の周辺部での露光光の光量の違いに対応することができなかった。また、特許文献1に記載の技術では、マスクに特殊な加工が必要であった。   It is difficult to make the amount of exposure light uniform over the entire surface of the mask, and particularly in the peripheral portion of the mask, the amount of exposure light varies depending on the location due to diffraction of the exposure light. For example, the amount of exposure light differs between the upper end and lower end of each section to be exposed, or the right end and left end, and the variation in the amount of exposure light varies depending on the exposure apparatus or mask. It changes every time. However, the method using the filter described in Patent Document 1 as the prior art cannot cope with the difference in the amount of exposure light at the periphery of each section. In addition, the technique described in Patent Document 1 requires special processing for the mask.

本発明の課題は、基板の露光領域を連続する複数の区画に分けて露光する際、マスクに特殊な加工を施すことなく、各区画の境界でパターンの段差が発生するのを効果的に防止することである。また、本発明の課題は、高品質な表示用パネル基板を製造することである。   It is an object of the present invention to effectively prevent the occurrence of a pattern step at the boundary of each section without performing special processing on the mask when the exposure area of the substrate is divided into a plurality of continuous sections. It is to be. Another object of the present invention is to manufacture a high-quality display panel substrate.

本発明のプロキシミティ露光装置は、基板を支持するチャックと、マスクを保持するマスクホルダとを備え、チャックに支持された基板の露光領域を、連続する複数の区画に分けて露光するプロキシミティ露光装置において、マスクホルダに保持されたマスクの上方に設けられ、基板の露光領域の各区画の境界付近で移動して、各区画の境界付近へ照射される露光光の光量を調節する露光量調節板を備え、基板の露光領域の各区画の露光時に、露光量調節板により光量を調節した露光光を、各区画の境界付近へ重ねて照射するものである。   A proximity exposure apparatus according to the present invention includes a chuck that supports a substrate and a mask holder that holds a mask, and performs proximity exposure in which an exposure area of the substrate supported by the chuck is divided into a plurality of continuous sections. In the apparatus, the exposure amount adjustment is provided above the mask held by the mask holder, moves near the boundary of each section of the exposure area of the substrate, and adjusts the amount of exposure light irradiated to the vicinity of each section boundary. In the exposure of each section of the exposure area of the substrate, exposure light whose light amount is adjusted by the exposure amount adjusting plate is overlapped and irradiated near the boundary of each section.

また、本発明のプロキシミティ露光装置の露光量調節方法は、基板を支持するチャックと、マスクを保持するマスクホルダと備え、チャックに支持された基板の露光領域を、連続する複数の区画に分けて露光するプロキシミティ露光装置の露光量調節方法であって、マスクホルダに保持されたマスクの上方に露光量調節板を設け、露光量調節板を基板の露光領域の各区画の境界付近で移動させて、各区画の境界付近へ照射される露光光の光量を調節し、基板の露光領域の各区画の露光時に、露光量調節板により光量を調節した露光光を、各区画の境界付近へ重ねて照射するものである。   The exposure amount adjusting method of the proximity exposure apparatus of the present invention includes a chuck that supports a substrate and a mask holder that holds the mask, and divides the exposure area of the substrate supported by the chuck into a plurality of continuous sections. An exposure amount adjustment method for a proximity exposure apparatus that performs exposure by providing an exposure amount adjustment plate above a mask held by a mask holder and moving the exposure amount adjustment plate near the boundary of each section of the exposure area of the substrate And adjusting the amount of exposure light irradiated to the vicinity of each section boundary, and exposing the exposure light adjusted by the exposure amount adjustment plate to the vicinity of each section boundary when exposing each section of the exposure area of the substrate. It is irradiated repeatedly.

さらに、本発明のプロキシミティ露光装置は、露光量調節板を移動させる駆動手段を備え、駆動手段が、露光量調節板の移動開始時刻及び移動速度を調節して、各区画の境界付近へ照射される露光光の光量を、各区画の境界毎に調節させるものである。また、本発明のプロキシミティ露光装置の露光量調節方法は、露光量調節板の移動開始時刻及び移動速度を調節して、各区画の境界付近へ照射される露光光の光量を、各区画の境界毎に調節するものである。   Further, the proximity exposure apparatus of the present invention includes a driving unit that moves the exposure amount adjusting plate, and the driving unit adjusts the movement start time and the moving speed of the exposure amount adjusting plate to irradiate near the boundary of each section. The amount of exposure light to be adjusted is adjusted for each boundary of each section. Further, the exposure amount adjustment method of the proximity exposure apparatus of the present invention adjusts the movement start time and the movement speed of the exposure amount adjustment plate, and the amount of exposure light radiated to the vicinity of the boundary of each section is set. It adjusts for each boundary.

マスクホルダに保持されたマスクの上方に露光量調節板を設け、露光量調節板を基板の露光領域の各区画の境界付近で移動させて、各区画の境界付近へ照射される露光光の光量を調節するので、露光量調節板の移動開始時刻及び移動速度を調節することにより、各区画の周辺部での露光光の光量の違いに応じて、各区画の境界付近へ照射される露光光の光量を、各区画の境界毎に高精度に調節することができる。そして、基板の露光領域の各区画の露光時に、露光量調節板により光量を調節した露光光を、各区画の境界付近へ重ねて照射するので、各区画の境界付近へ照射される露光光の総光量がなだらかに変化し、各区画の境界でパターンの段差が発生するのが効果的に防止される。   An exposure adjustment plate is provided above the mask held by the mask holder, and the exposure adjustment plate is moved near the boundary of each section of the exposure area of the substrate, so that the amount of exposure light irradiated near the boundary of each section Therefore, by adjusting the movement start time and movement speed of the exposure amount adjustment plate, the exposure light irradiated to the vicinity of the boundary of each section according to the difference in the amount of exposure light in the peripheral part of each section Can be adjusted with high accuracy for each boundary of each section. Then, when exposing each section of the exposure area of the substrate, the exposure light whose light amount is adjusted by the exposure amount adjusting plate is radiated in the vicinity of the boundary of each section, so that the exposure light irradiated near the boundary of each section is irradiated. It is effectively prevented that the total light quantity changes gently and a pattern step occurs at the boundary between the sections.

さらに、本発明のプロキシミティ露光装置は、マスクホルダに保持されたマスクの上方に、マスクのY方向の幅に渡って配置され、基板の露光領域の各区画のY方向に伸びる境界付近でX方向へそれぞれ独立に移動して、各区画のY方向に伸びる境界付近へ照射される露光光の光量を調節する複数の第1の露光量調節板と、マスクホルダに保持されたマスクの上方に、マスクのX方向の幅に渡って配置され、基板の露光領域の各区画のX方向に伸びる境界付近でY方向へそれぞれ独立に移動して、各区画のX方向に伸びる境界付近へ照射される露光光の光量を調節する複数の第2の露光量調節板とを備えたものである。   Furthermore, the proximity exposure apparatus of the present invention is arranged over the mask held by the mask holder over the width in the Y direction of the mask, and near the boundary extending in the Y direction of each section of the exposure area of the substrate. A plurality of first exposure adjustment plates for adjusting the amount of exposure light irradiated to the vicinity of the boundary extending in the Y direction of each section, and a mask held by the mask holder, respectively. The mask is arranged over the width in the X direction, moves independently in the Y direction near the boundary extending in the X direction of each section of the exposure area of the substrate, and is irradiated near the boundary extending in the X direction of each section. And a plurality of second exposure adjustment plates for adjusting the amount of exposure light.

また、本発明のプロキシミティ露光装置の露光量調節方法は、マスクホルダに保持されたマスクの上方に、マスクのY方向の幅に渡って複数の第1の露光量調節板を設け、各第1の露光量調節板を、基板の露光領域の各区画のY方向に伸びる境界付近でX方向へそれぞれ独立に移動させて、各区画のY方向に伸びる境界付近へ照射される露光光の光量を調節し、マスクホルダに保持されたマスクの上方に、マスクのX方向の幅に渡って複数の第2の露光量調節板を設け、各第2の露光量調節板を、基板の露光領域の各区画のX方向に伸びる境界付近でY方向へそれぞれ独立に移動させて、各区画のX方向に伸びる境界付近へ照射される露光光の光量を調節するものである。   In the proximity exposure method of the proximity exposure apparatus according to the present invention, a plurality of first exposure adjustment plates are provided over the width of the mask in the Y direction above the mask held by the mask holder. The amount of exposure light irradiated to the vicinity of the boundary extending in the Y direction of each section by independently moving the exposure amount adjusting plate in the X direction in the vicinity of the boundary extending in the Y direction of each section of the exposure area of the substrate And a plurality of second exposure amount adjustment plates are provided over the width of the mask in the X direction above the mask held by the mask holder, and each second exposure amount adjustment plate is attached to the exposure region of the substrate. These are moved independently in the Y direction in the vicinity of the boundary extending in the X direction of each section, and the amount of exposure light irradiated to the vicinity of the boundary extending in the X direction of each section is adjusted.

マスクホルダに保持されたマスクの上方に、マスクのY方向の幅に渡って複数の第1の露光量調節板を設け、各第1の露光量調節板を、基板の露光領域の各区画のY方向に伸びる境界付近でX方向へそれぞれ独立に移動させて、各区画のY方向に伸びる境界付近へ照射される露光光の光量を調節するので、各区画のY方向に伸びる境界付近へ照射される露光光の光量を高精度に調節することができる。また、マスクホルダに保持されたマスクの上方に、マスクのX方向の幅に渡って複数の第2の露光量調節板を設け、各第2の露光量調節板を、基板の露光領域の各区画のX方向に伸びる境界付近でY方向へそれぞれ独立に移動させて、各区画のX方向に伸びる境界付近へ照射される露光光の光量を調節するので、各区画のX方向に伸びる境界付近へ照射される露光光の光量を高精度に調節することができる。従って、基板の露光領域をXY方向に連続する複数の区画に分けて露光する際、各区画のX方向に伸びる境界付近及びY方向に伸びる境界付近へ照射される露光光の総光量がなだらかに変化し、各区画のX方向に伸びる境界及びY方向に伸びる境界でパターンの段差が発生するのが効果的に防止される。   A plurality of first exposure amount adjustment plates are provided over the width of the mask in the Y direction above the mask held by the mask holder, and each first exposure amount adjustment plate is attached to each section of the exposure region of the substrate. In the vicinity of the boundary extending in the Y direction, the light is moved independently in the X direction to adjust the amount of exposure light irradiated to the vicinity of the boundary extending in the Y direction of each section. The amount of exposure light to be applied can be adjusted with high accuracy. Further, a plurality of second exposure amount adjustment plates are provided over the width of the mask in the X direction above the mask held by the mask holder, and each second exposure amount adjustment plate is attached to each of the exposure regions of the substrate. In the vicinity of the boundary extending in the X direction of each section, the amount of exposure light irradiated to the vicinity of the boundary extending in the X direction of each section is adjusted by independently moving in the Y direction near the boundary extending in the X direction. It is possible to adjust the amount of exposure light irradiated to the head with high accuracy. Therefore, when the exposure area of the substrate is divided into a plurality of sections that are continuous in the X and Y directions, the total amount of exposure light irradiated in the vicinity of the boundary extending in the X direction and the boundary extending in the Y direction of each section is gently reduced. It is effectively prevented that the step of the pattern changes at the boundary extending in the X direction and the boundary extending in the Y direction.

本発明の表示用パネル基板の製造方法は、上記のいずれかのプロキシミティ露光装置を用いて基板の露光を行い、あるいは、上記のいずれかのプロキシミティ露光装置の露光量調節方法を用いて露光光の光量を調節しながら、基板の露光を行うものである。上記のプロキシミティ露光装置又はプロキシミティ露光装置の露光量調節方法を用いることにより、基板の露光領域を連続する複数の区画に分けて露光する際、各区画の境界でパターンの段差が発生するのが効果的に防止されるので、高品質な表示用パネル基板が製造される。   The method for producing a display panel substrate according to the present invention exposes a substrate by using any one of the above-described proximity exposure apparatuses, or performs exposure by using the exposure adjustment method of any of the above-described proximity exposure apparatuses. The substrate is exposed while adjusting the amount of light. By using the above-described proximity exposure apparatus or the exposure amount adjustment method of the proximity exposure apparatus, when the exposure area of the substrate is divided into a plurality of continuous sections and exposed, a pattern step occurs at the boundary of each section. Is effectively prevented, and a high-quality display panel substrate is manufactured.

本発明のプロキシミティ露光装置及びプロキシミティ露光装置の露光量調節方法によれば、マスクホルダに保持されたマスクの上方に露光量調節板を設け、露光量調節板を基板の露光領域の各区画の境界付近で移動させて、各区画の境界付近へ照射される露光光の光量を調節し、基板の露光領域の各区画の露光時に、露光量調節板により光量を調節した露光光を、各区画の境界付近へ重ねて照射することにより、マスクに特殊な加工を施すことなく、各区画の境界でパターンの段差が発生するのを効果的に防止することができる。   According to the proximity exposure apparatus and the exposure amount adjustment method of the proximity exposure apparatus of the present invention, the exposure amount adjustment plate is provided above the mask held by the mask holder, and the exposure amount adjustment plate is divided into each section of the exposure region of the substrate. The exposure light with the light amount adjusted by the exposure amount adjustment plate at the time of exposure of each section of the exposure area of the substrate is adjusted by adjusting the amount of exposure light irradiated near the boundary of each section. By overlapping and irradiating the vicinity of the boundary of the section, it is possible to effectively prevent the occurrence of a pattern step at the boundary of each section without performing special processing on the mask.

さらに、本発明のプロキシミティ露光装置及びプロキシミティ露光装置の露光量調節方法によれば、マスクホルダに保持されたマスクの上方に、マスクのY方向の幅に渡って複数の第1の露光量調節板を設け、各第1の露光量調節板を、基板の露光領域の各区画のY方向に伸びる境界付近でX方向へそれぞれ独立に移動させて、各区画のY方向に伸びる境界付近へ照射される露光光の光量を調節し、マスクホルダに保持されたマスクの上方に、マスクのX方向の幅に渡って複数の第2の露光量調節板を設け、各第2の露光量調節板を、基板の露光領域の各区画のX方向に伸びる境界付近でY方向へそれぞれ独立に移動させて、各区画のX方向に伸びる境界付近へ照射される露光光の光量を調節することにより、基板の露光領域をXY方向に連続する複数の区画に分けて露光する場合、各区画のX方向に伸びる境界及びY方向に伸びる境界でパターンの段差が発生するのを効果的に防止することができる。   Further, according to the proximity exposure apparatus and the exposure amount adjustment method of the proximity exposure apparatus of the present invention, a plurality of first exposure amounts over the width of the mask in the Y direction above the mask held by the mask holder. An adjustment plate is provided, and each first exposure amount adjustment plate is independently moved in the X direction in the vicinity of the boundary extending in the Y direction of each section of the exposure region of the substrate, to the vicinity of the boundary extending in the Y direction of each section. A plurality of second exposure adjustment plates are provided over the width of the mask in the X direction above the mask held by the mask holder by adjusting the amount of exposure light to be irradiated, and each second exposure adjustment By adjusting the amount of exposure light irradiated to the vicinity of the boundary extending in the X direction of each section by moving the plate independently in the Y direction near the boundary extending in the X direction of each section of the exposure area of the substrate The exposure area of the substrate is connected in the XY direction. When exposure is divided into a plurality of sections which, it is possible to prevent the level difference of the pattern at the boundary extending in the boundary and the Y-direction extending in the X direction of each partition is generated effectively.

本発明の表示用パネル基板の製造方法によれば、基板の露光領域を連続する複数の区画に分けて露光する際、各区画の境界でパターンの段差が発生するのを効果的に防止することができるので、高品質な表示用パネル基板を製造することができる。   According to the method for manufacturing a display panel substrate of the present invention, when the exposure area of a substrate is divided into a plurality of continuous sections and exposed, it is possible to effectively prevent the occurrence of a pattern step at the boundary of each section. Therefore, a high-quality display panel substrate can be manufactured.

本発明の一実施の形態によるプロキシミティ露光装置の概略構成を示す図である。It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. チャックを露光位置へ移動した状態を示す側面図である。It is a side view which shows the state which moved the chuck | zipper to the exposure position. 図3(a)はマスクホルダ及び露光量調節装置の上面図、図3(b)は図3(a)のE−E部の断面図である。FIG. 3A is a top view of the mask holder and the exposure amount adjusting device, and FIG. 3B is a cross-sectional view of the EE portion of FIG. 基板の露光領域とマスクの一例を示す図である。It is a figure which shows an example of the exposure area | region of a board | substrate, and a mask. 露光量調節板の動作を説明する図である。It is a figure explaining operation | movement of an exposure amount adjustment board. 液晶ディスプレイ装置のTFT基板の製造工程の一例を示すフローチャートである。It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. 液晶ディスプレイ装置のカラーフィルタ基板の製造工程の一例を示すフローチャートである。It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

図1は、本発明の一実施の形態によるプロキシミティ露光装置の概略構成を示す図である。また、図2は、チャックを露光位置へ移動した状態を示す側面図である。プロキシミティ露光装置は、ベース3、Xガイド4、Xステージ5、Yガイド6、Yステージ7、θステージ8、チャック支持台9、チャック10、マスクホルダ20、露光量調節装置、露光量調節装置駆動回路52、ステージ駆動回路60、及び主制御装置70を含んで構成されている。なお、図1及び図2では、後述する露光量調節装置が省略されている。プロキシミティ露光装置は、これらの他に、基板1をチャック10へ搬入し、また基板1をチャック10から搬出する基板搬送ロボット、露光光を照射する照射光学系、装置内の温度管理を行う温度制御ユニット等を備えている。   FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. FIG. 2 is a side view showing a state where the chuck is moved to the exposure position. The proximity exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck support base 9, a chuck 10, a mask holder 20, an exposure adjustment device, and an exposure adjustment device. The drive circuit 52, the stage drive circuit 60, and the main controller 70 are included. In FIG. 1 and FIG. 2, an exposure amount adjusting device to be described later is omitted. In addition to these, the proximity exposure apparatus carries a substrate 1 into the chuck 10 and also carries a substrate transport robot that unloads the substrate 1 from the chuck 10, an irradiation optical system that irradiates exposure light, and a temperature at which temperature management in the apparatus is performed. A control unit is provided.

なお、以下に説明する実施の形態におけるXY方向は例示であって、X方向とY方向とを入れ替えてもよい。   Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

図1において、チャック10は、基板1のロード及びアンロードを行うロード/アンロード位置にある。ロード/アンロード位置において、図示しない基板搬送ロボットにより、基板1がチャック10へ搬入され、また基板1がチャック10から搬出される。チャック10への基板1のロード及びチャック10からの基板1のアンロードは、チャック10に設けた複数の突き上げピンを用いて行われる。突き上げピンは、チャック10の内部に収納されており、チャック10の内部から上昇して、基板1をチャック10にロードする際、基板搬送ロボットから基板1を受け取り、基板1をチャック10からアンロードする際、基板搬送ロボットへ基板1を受け渡す。チャック10は、基板1の裏面を真空吸着して支持する。   In FIG. 1, the chuck 10 is in a load / unload position where the substrate 1 is loaded and unloaded. At the load / unload position, the substrate 1 is carried into the chuck 10 and the substrate 1 is carried out of the chuck 10 by a substrate transfer robot (not shown). The loading of the substrate 1 onto the chuck 10 and the unloading of the substrate 1 from the chuck 10 are performed using a plurality of push-up pins provided on the chuck 10. The push-up pin is housed inside the chuck 10 and is lifted from the inside of the chuck 10 to receive the substrate 1 from the substrate transfer robot and unload the substrate 1 from the chuck 10 when loading the substrate 1 onto the chuck 10. In doing so, the substrate 1 is delivered to the substrate transfer robot. The chuck 10 supports the back surface of the substrate 1 by vacuum suction.

基板1の露光を行う露光位置の上空には、マスク2を保持するマスクホルダ20が設置されている。マスクホルダ20には、露光光が通過する開口20aが設けられており、開口20aの下方には、マスク2が装着されている。マスクホルダ20の下面の開口20aの周囲には、吸着溝が設けられており、マスクホルダ20は、吸着溝により、マスク2の周辺部を真空吸着して保持している。マスクホルダ20に保持されたマスク2の上空には、図示しない照射光学系が配置されている。基板1の表面には、感光樹脂材料(フォトレジスト)が塗布されており、露光時、照射光学系からの露光光がマスク2を透過して基板1へ照射されることにより、マスク2のパターンが基板1の表面に転写され、基板1上にパターンが形成される。   A mask holder 20 that holds the mask 2 is installed above the exposure position where the substrate 1 is exposed. The mask holder 20 is provided with an opening 20a through which exposure light passes, and the mask 2 is mounted below the opening 20a. A suction groove is provided around the opening 20a on the lower surface of the mask holder 20, and the mask holder 20 holds the peripheral portion of the mask 2 by vacuum suction using the suction groove. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. The surface of the substrate 1 is coated with a photosensitive resin material (photoresist). During exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate 1, whereby the pattern of the mask 2. Is transferred to the surface of the substrate 1, and a pattern is formed on the substrate 1.

図2において、チャック10は、チャック支持台9を介してθステージ8に搭載されており、θステージ8の下にはYステージ7及びXステージ5が設けられている。Xステージ5は、ベース3に設けられたXガイド4に搭載され、Xガイド4に沿ってX方向(図2の図面横方向)へ移動する。Yステージ7は、Xステージ5に設けられたYガイド6に搭載され、Yガイド6に沿ってY方向(図2の図面奥行き方向)へ移動する。θステージ8は、Yステージ7に搭載され、θ方向へ回転する。チャック支持台9は、θステージ8に搭載され、チャック10を複数箇所で支持する。Xステージ5、Yステージ7、及びθステージ8には、ボールねじ及びモータや、リニアモータ等の図示しない駆動機構が設けられており、各駆動機構は、図1のステージ駆動回路60により駆動される。   In FIG. 2, the chuck 10 is mounted on the θ stage 8 via the chuck support 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves along the X guide 4 in the X direction (lateral direction in FIG. 2). The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5, and moves along the Y guide 6 in the Y direction (the drawing depth direction in FIG. 2). The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support 9 is mounted on the θ stage 8 and supports the chuck 10 at a plurality of locations. The X stage 5, Y stage 7, and θ stage 8 are provided with drive mechanisms (not shown) such as ball screws and motors, linear motors, etc., and each drive mechanism is driven by a stage drive circuit 60 of FIG. The

Xステージ5のX方向への移動及びYステージ7のY方向への移動により、チャック10は、ロード/アンロード位置と露光位置との間を移動される。ロード/アンロード位置において、Xステージ5のX方向への移動、Yステージ7のY方向への移動、及びθステージ8のθ方向への回転により、チャック10に搭載された基板1のプリアライメントが行われる。露光位置において、Xステージ5のX方向への移動及びYステージ7のY方向への移動により、チャック10に搭載された基板1のXY方向へのステップ移動が行われる。また、図示しないZ−チルト機構により、マスクホルダ20をZ方向(図2の図面上下方向)へ移動及びチルトすることによって、マスク2と基板1とのギャップ合わせが行われる。そして、Xステージ5のX方向への移動、Yステージ7のY方向への移動、及びθステージ8のθ方向への回転により、マスク2と基板1との位置合わせが行われる。図1において、主制御装置70は、ステージ駆動回路60を制御して、Xステージ5のX方向への移動、Yステージ7のY方向への移動、及びθステージ8のθ方向へ回転を行う。   The chuck 10 is moved between the load / unload position and the exposure position by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. At the load / unload position, the substrate 1 mounted on the chuck 10 is pre-aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Is done. At the exposure position, the X stage 5 is moved in the X direction and the Y stage 7 is moved in the Y direction, whereby the substrate 1 mounted on the chuck 10 is stepped in the XY direction. Further, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction (vertical direction in FIG. 2) by a Z-tilt mechanism (not shown). Then, the mask 2 and the substrate 1 are aligned by the movement of the X stage 5 in the X direction, the movement of the Y stage 7 in the Y direction, and the rotation of the θ stage 8 in the θ direction. In FIG. 1, the main controller 70 controls the stage drive circuit 60 to move the X stage 5 in the X direction, move the Y stage 7 in the Y direction, and rotate the θ stage 8 in the θ direction. .

なお、本実施の形態では、マスクホルダ20をZ方向へ移動及びチルトすることにより、マスク2と基板1とのギャップ合わせを行っているが、チャック支持台9にZ−チルト機構を設けて、チャック10をZ方向へ移動及びチルトすることにより、マスク2と基板1とのギャップ合わせを行ってもよい。また、本実施の形態では、Xステージ5及びYステージ7によりチャック10をXY方向へ移動することにより、マスク2と基板1との位置合わせを行っているが、マスクホルダ20をXY方向へ移動するステージを設けて、マスクホルダ20をXY方向へ移動することにより、マスク2と基板1との位置合わせを行ってもよい。   In the present embodiment, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction. However, the chuck support base 9 is provided with a Z-tilt mechanism, The gap between the mask 2 and the substrate 1 may be adjusted by moving and tilting the chuck 10 in the Z direction. In this embodiment, the mask 10 and the substrate 1 are aligned by moving the chuck 10 in the XY direction by the X stage 5 and the Y stage 7, but the mask holder 20 is moved in the XY direction. The mask 2 may be aligned with the substrate 1 by moving the mask holder 20 in the XY directions.

図3(a)はマスクホルダ及び露光量調節装置の上面図、図3(b)は図3(a)のE−E部の断面図である。露光量調節装置は、露光量調節板42a,42b,43a,43b、ボールねじナット44a,44b,45a,45b、ボールねじ46a,46b,47a,47b、ガイド48,49、及びモータ50a,50b,51a,51bを含んで構成されている。   FIG. 3A is a top view of the mask holder and the exposure amount adjusting device, and FIG. 3B is a cross-sectional view of the EE portion of FIG. The exposure adjustment device includes exposure adjustment plates 42a, 42b, 43a, 43b, ball screw nuts 44a, 44b, 45a, 45b, ball screws 46a, 46b, 47a, 47b, guides 48, 49, and motors 50a, 50b, 51a and 51b are comprised.

図3(a),(b)において、露光量調節板42a,42bは、マスクホルダ20に保持されたマスク2の上方に、マスク2のY方向の幅に渡って配置されている。露光量調節板42aの両端は、ボールねじナット44aを介して、マスクホルダ20の内側面に取り付けたガイド48に移動可能に保持されている。各ボールねじ46aに連結された各モータ50aを同期して駆動することにより、露光量調節板42aはガイド48に沿ってX方向へ移動される。同様に、露光量調節板42bの両端は、ボールねじナット44bを介して、ガイド48に移動可能に保持されている。各ボールねじ46bに連結された各モータ50bを同期させて駆動することにより、露光量調節板42bはガイド48に沿ってX方向へ移動される。図1において、露光量調節装置駆動回路52は、主制御装置70の制御により、各モータ50a,50bを駆動する。   In FIGS. 3A and 3B, the exposure adjustment plates 42 a and 42 b are arranged over the width of the mask 2 in the Y direction above the mask 2 held by the mask holder 20. Both ends of the exposure adjustment plate 42a are movably held by guides 48 attached to the inner surface of the mask holder 20 via ball screw nuts 44a. By driving each motor 50a connected to each ball screw 46a synchronously, the exposure adjustment plate 42a is moved along the guide 48 in the X direction. Similarly, both ends of the exposure adjustment plate 42b are movably held by the guide 48 via ball screw nuts 44b. By driving each motor 50b connected to each ball screw 46b in synchronization, the exposure adjustment plate 42b is moved in the X direction along the guide 48. In FIG. 1, the exposure adjustment device driving circuit 52 drives the motors 50 a and 50 b under the control of the main controller 70.

図3(a),(b)において、露光量調節板43a,43bは、マスクホルダ20に保持されたマスク2の上方に、マスク2のX方向の幅に渡って配置されている。露光量調節板43aの両端は、ボールねじナット45aを介して、マスクホルダ20の内側面に取り付けたガイド49に移動可能に保持されている。各ボールねじ47aに連結された各モータ51aを同期して駆動することにより、露光量調節板43aはガイド49に沿ってY方向へ移動される。同様に、露光量調節板43bの両端は、ボールねじナット45bを介して、ガイド49に移動可能に保持されている。各ボールねじ47bに連結された各モータ51bを同期させて駆動することにより、露光量調節板43bはガイド49に沿ってY方向へ移動される。図1において、露光量調節装置駆動回路52は、主制御装置70の制御により、各モータ51a,51bを駆動する。   3A and 3B, the exposure adjustment plates 43 a and 43 b are disposed over the width of the mask 2 in the X direction above the mask 2 held by the mask holder 20. Both ends of the exposure adjustment plate 43a are movably held by guides 49 attached to the inner surface of the mask holder 20 via ball screw nuts 45a. By driving each motor 51 a connected to each ball screw 47 a synchronously, the exposure adjustment plate 43 a is moved in the Y direction along the guide 49. Similarly, both ends of the exposure adjustment plate 43b are movably held by the guide 49 via ball screw nuts 45b. By driving each motor 51b connected to each ball screw 47b in synchronization, the exposure adjustment plate 43b is moved in the Y direction along the guide 49. In FIG. 1, the exposure adjustment device driving circuit 52 drives the motors 51 a and 51 b under the control of the main controller 70.

図4は、基板の露光領域とマスクの一例を示す図である。図4(a)は、基板1の全面の露光領域を、破線で示したXY方向に連続する4つの区画A,B,C,Dに分けて露光する例を示している。図4(b)は、このとき使用されるマスク2を示し、マスク2上の破線で示した部分が、マスクホルダ20の露光光が通過する開口20aに相当する部分である。   FIG. 4 is a diagram illustrating an example of an exposure area of a substrate and a mask. FIG. 4A shows an example in which the exposure area on the entire surface of the substrate 1 is divided into four sections A, B, C, and D that are continuous in the XY directions indicated by the broken lines. FIG. 4B shows the mask 2 used at this time, and a portion indicated by a broken line on the mask 2 is a portion corresponding to the opening 20a through which the exposure light of the mask holder 20 passes.

図5は、露光量調節板の動作を説明する図である。図5(a)は、基板1の露光領域の区画Aを露光するときの露光量調節板42aの動作を示し、図5(b)は、このとき基板1へ照射される露光光のX方向の光量を示している。基板1の露光領域の区画Aを露光するとき、主制御装置70は、露光量調節装置駆動回路52を制御して、各モータ50aを駆動させ、露光量調節板42aを、基板1の露光領域の区画A,BのY方向に伸びる境界付近で、図5(a)に矢印で示すX方向へ移動させる。これにより、基板1へ照射される露光光の光量は、図5(b)に示す様に、基板1の露光領域の区画A,BのY方向に伸びる境界付近で、なだらかに変化する。   FIG. 5 is a diagram for explaining the operation of the exposure adjustment plate. 5A shows the operation of the exposure adjustment plate 42a when exposing the section A of the exposure region of the substrate 1, and FIG. 5B shows the X direction of the exposure light irradiated on the substrate 1 at this time. Indicates the amount of light. When exposing the section A of the exposure area of the substrate 1, the main controller 70 controls the exposure adjustment device drive circuit 52 to drive the motors 50 a, so that the exposure adjustment plate 42 a is moved to the exposure area of the substrate 1. In the vicinity of the boundary of the sections A and B extending in the Y direction, it is moved in the X direction indicated by the arrow in FIG. As a result, the amount of exposure light applied to the substrate 1 changes gently in the vicinity of the boundary extending in the Y direction of the sections A and B of the exposure area of the substrate 1 as shown in FIG.

なお、図5(b)は、露光光の光量がX方向において均一でなく、区画Aの左側周辺部の露光光の光量が、区画Aの右側周辺部の露光光の光量よりも多い場合を示している。   FIG. 5B shows a case where the amount of exposure light is not uniform in the X direction, and the amount of exposure light in the left peripheral portion of the section A is larger than the amount of exposure light in the right peripheral portion of the section A. Show.

同様に、基板1の露光領域の区画Aを露光するとき、主制御装置70は、露光量調節装置駆動回路52を制御して、各モータ51aを駆動させ、露光量調節板43aを、基板1の露光領域の区画A,DのX方向に伸びる境界付近で、Y方向へ移動させる。これにより、基板1へ照射される露光光の光量は、基板1の露光領域の区画A,DのX方向に伸びる境界付近で、なだらかに変化する。   Similarly, when exposing the section A of the exposure area of the substrate 1, the main controller 70 controls the exposure adjustment device drive circuit 52 to drive each motor 51 a, so that the exposure adjustment plate 43 a is attached to the substrate 1. Is moved in the Y direction in the vicinity of the boundary extending in the X direction of the sections A and D of the exposure area. Thereby, the light quantity of the exposure light irradiated to the board | substrate 1 changes gently in the vicinity of the boundary extended in the X direction of the divisions A and D of the exposure area | region of the board | substrate 1. FIG.

図5(c)は、基板1の露光領域の区画Bを露光するときの露光量調節板42bの動作を示し、図5(d)は、このとき基板1へ照射される露光光のX方向の光量を示している。基板1の露光領域の区画Bを露光するとき、主制御装置70は、露光量調節装置駆動回路52を制御して、各モータ50bを駆動させ、露光量調節板42bを、基板1の露光領域の区画A,BのY方向に伸びる境界付近で、図5(c)に矢印で示すX方向へ移動させる。これにより、基板1へ照射される露光光の光量は、図5(d)に示す様に、基板1の露光領域の区画A,BのY方向に伸びる境界付近で、なだらかに変化する。   5C shows the operation of the exposure adjustment plate 42b when exposing the section B of the exposure area of the substrate 1, and FIG. 5D shows the X direction of the exposure light irradiated on the substrate 1 at this time. Indicates the amount of light. When exposing the section B of the exposure area of the substrate 1, the main controller 70 controls the exposure adjustment device driving circuit 52 to drive each motor 50 b, so that the exposure adjustment plate 42 b is moved to the exposure area of the substrate 1. In the vicinity of the boundary extending in the Y direction of the sections A and B, it is moved in the X direction indicated by the arrow in FIG. As a result, the amount of exposure light applied to the substrate 1 changes gently in the vicinity of the boundary extending in the Y direction of the sections A and B of the exposure area of the substrate 1 as shown in FIG.

なお、図5(d)は、図5(b)と同様に、露光光の光量がX方向において均一でなく、区画Bの左側周辺部の露光光の光量が、区画Bの右側周辺部の露光光の光量よりも多い場合を示している。   5D, similarly to FIG. 5B, the amount of exposure light is not uniform in the X direction, and the amount of exposure light in the left peripheral portion of the section B is equal to that in the right peripheral portion of the section B. This shows a case where the amount of exposure light is greater than the amount of exposure light.

同様に、基板1の露光領域の区画Bを露光するとき、主制御装置70は、露光量調節装置駆動回路52を制御して、各モータ51aを駆動させ、露光量調節板43aを、基板1の露光領域の区画B,CのX方向に伸びる境界付近で、Y方向へ移動させる。これにより、基板1へ照射される露光光の光量は、基板1の露光領域の区画B,CのX方向に伸びる境界付近で、なだらかに変化する。   Similarly, when exposing the section B of the exposure area of the substrate 1, the main controller 70 controls the exposure adjustment device driving circuit 52 to drive each motor 51 a, and the exposure adjustment plate 43 a is attached to the substrate 1. Is moved in the Y direction in the vicinity of the boundary extending in the X direction of the sections B and C of the exposure area. Thereby, the light quantity of the exposure light irradiated to the board | substrate 1 changes gently in the vicinity of the boundary extended in the X direction of the divisions B and C of the exposure area | region of the board | substrate 1. FIG.

同様にして、基板1の露光領域の区画Cを露光するとき、主制御装置70は、露光量調節装置駆動回路52を制御して、各モータ50bを駆動させ、露光量調節板42bを、基板1の露光領域の区画C,DのY方向に伸びる境界付近でX方向へ移動させる。これにより、基板1へ照射される露光光の光量は、基板1の露光領域の区画C,DのY方向に伸びる境界付近で、なだらかに変化する。また、基板1の露光領域の区画Cを露光するとき、主制御装置70は、露光量調節装置駆動回路52を制御して、各モータ51bを駆動させ、露光量調節板43bを、基板1の露光領域の区画B,CのX方向に伸びる境界付近で、Y方向へ移動させる。これにより、基板1へ照射される露光光の光量は、基板1の露光領域の区画B,CのX方向に伸びる境界付近で、なだらかに変化する。   Similarly, when exposing the section C of the exposure area of the substrate 1, the main controller 70 controls the exposure adjustment device driving circuit 52 to drive each motor 50b, and the exposure adjustment plate 42b is attached to the substrate. It is moved in the X direction in the vicinity of the boundary extending in the Y direction of sections C and D of one exposure area. Thereby, the light quantity of the exposure light irradiated to the board | substrate 1 changes gently in the vicinity of the boundary extended in the Y direction of the divisions C and D of the exposure area | region of the board | substrate 1. FIG. Further, when exposing the section C of the exposure area of the substrate 1, the main controller 70 controls the exposure adjustment device drive circuit 52 to drive each motor 51b, and the exposure adjustment plate 43b is attached to the substrate 1. It is moved in the Y direction in the vicinity of the boundary extending in the X direction between the sections B and C of the exposure area. Thereby, the light quantity of the exposure light irradiated to the board | substrate 1 changes gently in the vicinity of the boundary extended in the X direction of the divisions B and C of the exposure area | region of the board | substrate 1. FIG.

同様にして、基板1の露光領域の区画Dを露光するとき、主制御装置70は、露光量調節装置駆動回路52を制御して、各モータ50aを駆動させ、露光量調節板42aを、基板1の露光領域の区画C,DのY方向に伸びる境界付近でX方向へ移動させる。これにより、基板1へ照射される露光光の光量は、基板1の露光領域の区画C,DのY方向に伸びる境界付近で、なだらかに変化する。また、基板1の露光領域の区画Dを露光するとき、主制御装置70は、露光量調節装置駆動回路52を制御して、各モータ51bを駆動させ、露光量調節板43bを、基板1の露光領域の区画A,DのX方向に伸びる境界付近で、Y方向へ移動させる。これにより、基板1へ照射される露光光の光量は、基板1の露光領域の区画A,DのX方向に伸びる境界付近で、なだらかに変化する。   Similarly, when exposing the section D of the exposure region of the substrate 1, the main controller 70 controls the exposure amount adjusting device driving circuit 52 to drive each motor 50a, so that the exposure amount adjusting plate 42a is attached to the substrate. It is moved in the X direction in the vicinity of the boundary extending in the Y direction of sections C and D of one exposure area. Thereby, the light quantity of the exposure light irradiated to the board | substrate 1 changes gently in the vicinity of the boundary extended in the Y direction of the divisions C and D of the exposure area | region of the board | substrate 1. FIG. Further, when exposing the section D of the exposure area of the substrate 1, the main controller 70 controls the exposure adjustment device driving circuit 52 to drive each motor 51 b, so that the exposure adjustment plate 43 b is attached to the substrate 1. The exposure area is moved in the Y direction in the vicinity of the boundary extending in the X direction between the sections A and D of the exposure area. Thereby, the light quantity of the exposure light irradiated to the board | substrate 1 changes gently in the vicinity of the boundary extended in the X direction of the divisions A and D of the exposure area | region of the board | substrate 1. FIG.

マスクホルダ20に保持されたマスク2の上方に露光量調節板42a,42b,43a,43bを設け、露光量調節板42a,42b,43a,43bを基板1の露光領域の各区画A,B,C,Dの境界付近で移動させて、各区画A,B,C,Dの境界付近へ照射される露光光の光量を調節するので、露光量調節板42a,42b,43a,43bの移動開始時刻及び移動速度を調節することにより、各区画A,B,C,Dの周辺部での露光光の光量の違いに応じて、各区画A,B,C,Dの境界付近へ照射される露光光の光量を、各区画A,B,C,Dの境界毎に高精度に調節することができる。   Exposure amount adjustment plates 42 a, 42 b, 43 a, 43 b are provided above the mask 2 held by the mask holder 20, and the exposure amount adjustment plates 42 a, 42 b, 43 a, 43 b are provided in the sections A, B, Since the amount of exposure light irradiated near the boundaries between the sections A, B, C, and D is adjusted by moving near the boundaries between C and D, the movement of the exposure amount adjustment plates 42a, 42b, 43a, and 43b is started. By adjusting the time and moving speed, the light is irradiated to the vicinity of the boundaries of the sections A, B, C, and D according to the difference in the amount of exposure light in the peripheral portions of the sections A, B, C, and D. The amount of exposure light can be adjusted with high accuracy for each boundary between the sections A, B, C, and D.

図5(e)は、本発明を用いない場合に基板1へ照射される露光光のX方向の光量を示している。図5(b),(d)と同様に、区画A,Bの左側周辺部の露光光の光量が、区画A,Bの右側周辺部の露光光の光量よりも多い場合、区画A,Bを単にX方向に並べて露光すると、図5(e)に示す様に、露光光の光量が区画A,Bの境界で急激に変化する。そのため、形成されるパターンの高さが区画A,Bの境界で急激に変化し、パターンの段差が発生する。   FIG. 5E shows the amount of exposure light in the X direction irradiated to the substrate 1 when the present invention is not used. Similarly to FIGS. 5B and 5D, when the amount of exposure light in the left peripheral part of the sections A and B is larger than the amount of exposure light in the right peripheral part of the sections A and B, the sections A and B Are arranged in the X direction and exposed, the amount of exposure light changes abruptly at the boundary between the sections A and B as shown in FIG. Therefore, the height of the pattern to be formed changes abruptly at the boundary between the sections A and B, and a pattern step is generated.

図5(f)は、本実施の形態により基板1へ照射される露光光のX方向の総光量を示している。基板1の露光領域の各区画A,B,C,Dの露光時に、露光量調節板42a,42b,43a,43bにより光量を調節した露光光を、各区画A,B,C,Dの境界付近へ重ねて照射するので、各区画A,B,C,Dの境界付近へ照射される露光光の総光量がなだらかに変化し、各区画A,B,C,Dの境界でパターンの段差が発生するのが効果的に防止される。   FIG. 5F shows the total light amount in the X direction of the exposure light irradiated onto the substrate 1 according to the present embodiment. At the exposure of each section A, B, C, D of the exposure area of the substrate 1, exposure light whose light amount is adjusted by the exposure amount adjusting plates 42a, 42b, 43a, 43b is used as the boundary between the sections A, B, C, D. Since irradiation is performed in the vicinity, the total amount of exposure light irradiated to the vicinity of the boundaries between the sections A, B, C, and D changes gently, and the pattern step at the boundary between the sections A, B, C, and D Is effectively prevented from occurring.

以上説明した実施の形態によれば、マスクホルダ20に保持されたマスク2の上方に露光量調節板42a,42b,43a,43bを設け、露光量調節板42a,42b,43a,43bを基板1の露光領域の各区画A,B,C,Dの境界付近で移動させて、各区画A,B,C,Dの境界付近へ照射される露光光の光量を調節し、基板1の露光領域の各区画A,B,C,Dの露光時に、露光量調節板42a,42b,43a,43bにより光量を調節した露光光を、各区画A,B,C,Dの境界付近へ重ねて照射することにより、マスクに特殊な加工を施すことなく、各区画A,B,C,Dの境界でパターンの段差が発生するのを効果的に防止することができる。   According to the embodiment described above, the exposure adjustment plates 42a, 42b, 43a, 43b are provided above the mask 2 held by the mask holder 20, and the exposure adjustment plates 42a, 42b, 43a, 43b are attached to the substrate 1. The exposure area of the substrate 1 is adjusted by adjusting the amount of exposure light radiated to the vicinity of the boundaries of the sections A, B, C, and D. During the exposure of each of the sections A, B, C, and D, exposure light whose light amount is adjusted by the exposure amount adjustment plates 42a, 42b, 43a, and 43b is superimposed and irradiated near the boundaries of the sections A, B, C, and D. By doing so, it is possible to effectively prevent the occurrence of pattern steps at the boundaries of the sections A, B, C, and D without performing special processing on the mask.

さらに、マスクホルダ20に保持されたマスク2の上方に、マスク2のY方向の幅に渡って複数の第1の露光量調節板42a,42bを設け、各第1の露光量調節板42a,42bを、基板1の露光領域の各区画A,B,C,DのY方向に伸びる境界付近でX方向へそれぞれ独立に移動させて、各区画A,B,C,DのY方向に伸びる境界付近へ照射される露光光の光量を調節し、マスクホルダ20に保持されたマスク2の上方に、マスク2のX方向の幅に渡って複数の第2の露光量調節板43a,43bを設け、各第2の露光量調節板43a,43bを、基板1の露光領域の各区画A,B,C,DのX方向に伸びる境界付近でY方向へそれぞれ独立に移動させて、各区画A,B,C,DのX方向に伸びる境界付近へ照射される露光光の光量を調節することにより、基板1の露光領域をXY方向に連続する複数の区画A,B,C,Dに分けて露光する場合、各区画A,B,C,DのX方向に伸びる境界及びY方向に伸びる境界でパターンの段差が発生するのを効果的に防止することができる。   Furthermore, a plurality of first exposure amount adjustment plates 42a and 42b are provided over the width of the mask 2 in the Y direction above the mask 2 held by the mask holder 20, and the first exposure amount adjustment plates 42a and 42a are provided. 42b is moved independently in the X direction in the vicinity of the boundary extending in the Y direction of each section A, B, C, D of the exposure area of the substrate 1, and extends in the Y direction of each section A, B, C, D. A plurality of second exposure amount adjustment plates 43a and 43b are arranged over the width of the mask 2 in the X direction above the mask 2 held by the mask holder 20 by adjusting the amount of exposure light irradiated to the vicinity of the boundary. The second exposure amount adjusting plates 43a and 43b are independently moved in the Y direction in the vicinity of the boundaries extending in the X direction of the sections A, B, C, and D of the exposure region of the substrate 1, respectively. Amount of exposure light irradiated near the boundary extending in the X direction of A, B, C, D When the exposure is performed by dividing the exposure area of the substrate 1 into a plurality of sections A, B, C, and D continuous in the XY direction, the boundary extending in the X direction of each section A, B, C, and D and the Y It is possible to effectively prevent the occurrence of a pattern step at the boundary extending in the direction.

本発明のプロキシミティ露光装置を用いて基板の露光を行い、あるいは、本発明のプロキシミティ露光装置の露光量調節方法を用いて露光光の光量を調節しながら、基板の露光を行うことにより、基板の露光領域を連続する複数の区画に分けて露光する際、各区画の境界でパターンの段差が発生するのを効果的に防止することができるので、高品質な表示用パネル基板を製造することができる。   By exposing the substrate using the proximity exposure apparatus of the present invention, or by adjusting the amount of exposure light using the exposure amount adjustment method of the proximity exposure apparatus of the present invention, When the exposure area of the substrate is divided into a plurality of continuous sections for exposure, it is possible to effectively prevent the occurrence of a pattern step at the boundary of each section, so that a high-quality display panel substrate is manufactured. be able to.

例えば、図6は、液晶ディスプレイ装置のTFT基板の製造工程の一例を示すフローチャートである。薄膜形成工程(ステップ101)では、スパッタ法やプラズマ化学気相成長(CVD)法等により、基板上に液晶駆動用の透明電極となる導電体膜や絶縁体膜等の薄膜を形成する。レジスト塗布工程(ステップ102)では、ロール塗布法等により感光樹脂材料(フォトレジスト)を塗布して、薄膜形成工程(ステップ101)で形成した薄膜上にフォトレジスト膜を形成する。露光工程(ステップ103)では、プロキシミティ露光装置や投影露光装置等を用いて、マスクのパターンをフォトレジスト膜に転写する。現像工程(ステップ104)では、シャワー現像法等により現像液をフォトレジスト膜上に供給して、フォトレジスト膜の不要部分を除去する。エッチング工程(ステップ105)では、ウエットエッチングにより、薄膜形成工程(ステップ101)で形成した薄膜の内、フォトレジスト膜でマスクされていない部分を除去する。剥離工程(ステップ106)では、エッチング工程(ステップ105)でのマスクの役目を終えたフォトレジスト膜を、剥離液によって剥離する。これらの各工程の前又は後には、必要に応じて、基板の洗浄/乾燥工程が実施される。これらの工程を数回繰り返して、基板上にTFTアレイが形成される。   For example, FIG. 6 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

また、図7は、液晶ディスプレイ装置のカラーフィルタ基板の製造工程の一例を示すフローチャートである。ブラックマトリクス形成工程(ステップ201)では、レジスト塗布、露光、現像、エッチング、剥離等の処理により、基板上にブラックマトリクスを形成する。着色パターン形成工程(ステップ202)では、染色法、顔料分散法、印刷法、電着法等により、基板上に着色パターンを形成する。この工程を、R、G、Bの着色パターンについて繰り返す。保護膜形成工程(ステップ203)では、着色パターンの上に保護膜を形成し、透明電極膜形成工程(ステップ204)では、保護膜の上に透明電極膜を形成する。これらの各工程の前、途中又は後には、必要に応じて、基板の洗浄/乾燥工程が実施される。   FIG. 7 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

図6に示したTFT基板の製造工程では、露光工程(ステップ103)において、図7に示したカラーフィルタ基板の製造工程では、ブラックマトリクス形成工程(ステップ201)及び着色パターン形成工程(ステップ202)の露光処理において、本発明のプロキシミティ露光装置又はプロキシミティ露光装置の露光量調節方法を適用することができる。   In the TFT substrate manufacturing process shown in FIG. 6, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 7, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the proximity exposure apparatus or the exposure amount adjustment method of the proximity exposure apparatus of the present invention can be applied.

1 基板
2 マスク
3 ベース
4 Xガイド
5 Xステージ
6 Yガイド
7 Yステージ
8 θステージ
9 チャック支持台
10 チャック
20 マスクホルダ
20a 開口
42a,42b,43a,43b 露光量調節板
44a,44b,45a,45b ボールねじナット
46a,46b,47a,47b ボールねじ
48,49 ガイド
52 露光量調節装置駆動回路
50a,50b,51a,51b モータ
60 ステージ駆動回路
1 substrate 2 mask 3 base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 chuck support 10 chuck 20 mask holder 20a opening 42a, 42b, 43a, 43b exposure amount adjusting plate 44a, 44b, 45a, 45b Ball screw nut 46a, 46b, 47a, 47b Ball screw 48, 49 Guide 52 Exposure amount adjusting device drive circuit 50a, 50b, 51a, 51b Motor 60 Stage drive circuit

Claims (8)

基板を支持するチャックと、マスクを保持するマスクホルダとを備え、前記チャックに支持された基板の露光領域を、連続する複数の区画に分けて露光するプロキシミティ露光装置において、
前記マスクホルダに保持されたマスクの上方に設けられ、基板の露光領域の各区画の境界付近で移動して、各区画の境界付近へ照射される露光光の光量を調節する露光量調節板を備え、
基板の露光領域の各区画の露光時に、前記露光量調節板により光量を調節した露光光を、各区画の境界付近へ重ねて照射することを特徴とするプロキシミティ露光装置。
In a proximity exposure apparatus that includes a chuck for supporting a substrate and a mask holder for holding a mask, and exposes an exposure area of the substrate supported by the chuck in a plurality of continuous sections.
An exposure amount adjusting plate provided above the mask held by the mask holder, moving near the boundary of each section of the exposure area of the substrate, and adjusting the amount of exposure light irradiated to the vicinity of each section boundary; Prepared,
A proximity exposure apparatus that irradiates exposure light, the amount of which is adjusted by the exposure amount adjusting plate, in the vicinity of the boundary of each section during exposure of each section of the exposure area of the substrate.
前記露光量調節板を移動させる駆動手段を備え、該駆動手段は、前記露光量調節板の移動開始時刻及び移動速度を調節して、各区画の境界付近へ照射される露光光の光量を、各区画の境界毎に調節させることを特徴とする請求項1に記載のプロキシミティ露光装置。   A driving unit that moves the exposure amount adjusting plate; and the driving unit adjusts the movement start time and the moving speed of the exposure amount adjusting plate to adjust the amount of exposure light irradiated to the vicinity of each partition, The proximity exposure apparatus according to claim 1, wherein adjustment is performed for each partition boundary. 前記マスクホルダに保持されたマスクの上方に、マスクのY方向の幅に渡って配置され、基板の露光領域の各区画のY方向に伸びる境界付近でX方向へそれぞれ独立に移動して、各区画のY方向に伸びる境界付近へ照射される露光光の光量を調節する複数の第1の露光量調節板と、
前記マスクホルダに保持されたマスクの上方に、マスクのX方向の幅に渡って配置され、基板の露光領域の各区画のX方向に伸びる境界付近でY方向へそれぞれ独立に移動して、各区画のX方向に伸びる境界付近へ照射される露光光の光量を調節する複数の第2の露光量調節板とを備えたことを特徴とする請求項1又は請求項2に記載のプロキシミティ露光装置。
Above the mask held by the mask holder, it is arranged over the width in the Y direction of the mask, and independently moves in the X direction near the boundary extending in the Y direction of each section of the exposure area of the substrate. A plurality of first exposure adjustment plates for adjusting the amount of exposure light irradiated to the vicinity of the boundary extending in the Y direction of the section;
Above the mask held by the mask holder, it is arranged over the width of the mask in the X direction, and moves independently in the Y direction in the vicinity of the boundary extending in the X direction of each section of the exposure area of the substrate. 3. The proximity exposure according to claim 1, further comprising a plurality of second exposure amount adjustment plates that adjust the amount of exposure light irradiated to the vicinity of the boundary extending in the X direction of the section. apparatus.
基板を支持するチャックと、マスクを保持するマスクホルダと備え、チャックに支持された基板の露光領域を、連続する複数の区画に分けて露光するプロキシミティ露光装置の露光量調節方法であって、
マスクホルダに保持されたマスクの上方に露光量調節板を設け、露光量調節板を基板の露光領域の各区画の境界付近で移動させて、各区画の境界付近へ照射される露光光の光量を調節し、
基板の露光領域の各区画の露光時に、露光量調節板により光量を調節した露光光を、各区画の境界付近へ重ねて照射することを特徴とするプロキシミティ露光装置の露光量調節方法。
A method for adjusting an exposure amount of a proximity exposure apparatus, comprising: a chuck for supporting a substrate; and a mask holder for holding a mask; and exposing an exposure area of the substrate supported by the chuck in a plurality of continuous sections.
An exposure adjustment plate is provided above the mask held by the mask holder, and the exposure adjustment plate is moved near the boundary of each section of the exposure area of the substrate, so that the amount of exposure light irradiated near the boundary of each section Adjust
An exposure amount adjustment method for a proximity exposure apparatus, wherein exposure light whose light amount is adjusted by an exposure amount adjustment plate is irradiated and overlapped near the boundary of each division at the time of exposure of each division of an exposure region of a substrate.
露光量調節板の移動開始時刻及び移動速度を調節して、各区画の境界付近へ照射される露光光の光量を、各区画の境界毎に調節することを特徴とする請求項4に記載のプロキシミティ露光装置の露光量調節方法。   5. The light amount of exposure light irradiated to the vicinity of each section boundary is adjusted for each boundary of each section by adjusting the movement start time and moving speed of the exposure amount adjusting plate. Exposure amount adjustment method for proximity exposure apparatus. マスクホルダに保持されたマスクの上方に、マスクのY方向の幅に渡って複数の第1の露光量調節板を設け、各第1の露光量調節板を、基板の露光領域の各区画のY方向に伸びる境界付近でX方向へそれぞれ独立に移動させて、各区画のY方向に伸びる境界付近へ照射される露光光の光量を調節し、
マスクホルダに保持されたマスクの上方に、マスクのX方向の幅に渡って複数の第2の露光量調節板を設け、各第2の露光量調節板を、基板の露光領域の各区画のX方向に伸びる境界付近でY方向へそれぞれ独立に移動させて、各区画のX方向に伸びる境界付近へ照射される露光光の光量を調節することを特徴とする請求項4又は請求項5に記載のプロキシミティ露光装置の露光量調節方法。
A plurality of first exposure amount adjustment plates are provided over the width of the mask in the Y direction above the mask held by the mask holder, and each first exposure amount adjustment plate is attached to each section of the exposure region of the substrate. Move independently in the X direction near the boundary extending in the Y direction, and adjust the amount of exposure light irradiated to the vicinity of the boundary extending in the Y direction of each section,
A plurality of second exposure amount adjustment plates are provided over the width of the mask in the X direction above the mask held by the mask holder, and each second exposure amount adjustment plate is attached to each section of the exposure region of the substrate. 6. The amount of exposure light irradiated to the vicinity of the boundary extending in the X direction of each section is adjusted by independently moving in the Y direction in the vicinity of the boundary extending in the X direction. A method for adjusting an exposure amount of the proximity exposure apparatus described.
請求項1乃至請求項3のいずれか一項に記載のプロキシミティ露光装置を用いて基板の露光を行うことを特徴とする表示用パネル基板の製造方法。   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the proximity exposure apparatus according to any one of claims 1 to 3. 請求項4乃至請求項6のいずれか一項に記載のプロキシミティ露光装置の露光量調節方法を用いて露光光の光量を調節しながら、基板の露光を行うことを特徴とする表示用パネル基板の製造方法。   A display panel substrate, wherein the substrate is exposed while adjusting the amount of exposure light by using the exposure amount adjustment method of the proximity exposure apparatus according to claim 4. Manufacturing method.
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