JP2013064168A - Film deposition apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film deposition apparatus which shortens the time for attaching and detaching works of a deposition preventing plate installed in a film deposition chamber for performing deposition of a film such as an organic EL film, and assures safety during exchange.SOLUTION: The film deposition apparatus includes: the film deposition chamber for depositing a film deposition material on a substrate; a film deposition material supply source for supplying the film deposition material to the substrate; and the deposition preventing plate 1, at least a portion of which is provided between a casing of the film deposition chamber and the film deposition material supply source and which prevents the sticking of the film deposition material, supplied from the film deposition material supply source, on the casing. In the film deposition apparatus, the deposition preventing plate 1 is divided into a plurality of members at least in the vertical direction and has a deposition preventing plate conveying mechanism for moving the upper deposition preventing plate 1 downward. The deposition preventing plate conveying mechanism includes: a frame engaged with the casing; a first conveying block which moves along the frame; a rail placed in the direction orthogonal to an opening part of the film deposition chamber; and a second conveying block which moves along the rail.

Description

  The present invention relates to a film forming apparatus for forming an organic EL film or the like, and more particularly to a film forming apparatus provided with a deposition preventing plate for preventing film formation on a portion other than a substrate to be formed. .

  As a method of forming an organic EL (Electro Luminescence) film, a vacuum deposition method is generally used in which an organic EL material is sublimated into vapor and an organic EL thin film is formed at a predetermined position via a shadow mask. Yes. During the vacuum deposition, the organic EL vapor isotropically spreads from the deposition source (the crucible), and therefore adheres to the inner wall of the vacuum chamber in addition to the target substrate. If the organic EL material adhering to the inner wall is peeled for some reason, a defect may occur in film formation on the substrate. Therefore, a shield called an adhesion preventing plate is provided on the inner wall of the vacuum chamber, and the occurrence of such a defect is prevented by cleaning the adhesion preventing plate.

  For example, Patent Literature 1 discloses a vapor deposition apparatus in which a deposition preventing plate is disposed so as to surround three sides of a vapor deposition source.

  Patent Document 2 discloses a vacuum in which a deposition plate having an opening is arranged so as to divide the inside of the vacuum vessel, and the evaporated particles from the evaporation source pass through the opening and reach the substrate. A vapor deposition apparatus is disclosed.

JP-A-62-218557 JP-A-5-70931

  The organic EL panel is increasing in size like the liquid crystal panel, and in the near future, mass production of a sixth generation (1500 mm × 1850 mm) panel is expected.

  Corresponding to such a large panel, the film forming apparatus also becomes large. Along with this, the protective plate becomes larger and heavier. In particular, in the case of a vertical film forming apparatus that evaporates by standing a substrate, as the size of the substrate increases, the height of the vapor deposition tank (vacuum tank) increases. come. Therefore, it is necessary to consider so that the replacement of the protection plate provided at a high place can be performed quickly and safely.

  The present invention has been made to solve the above problems, and its purpose is to reduce the time required for attaching and removing the protective plate installed in the film forming chamber for forming a film such as an organic EL, Another object of the present invention is to provide a film forming apparatus that ensures safety during replacement.

  The structure of the film forming apparatus provided with the adhesion-preventing plate transport mechanism of the present invention includes a film forming chamber for forming a material on a substrate, a film forming material supply source for supplying the material to be formed to the substrate, At least a part of the film formation chamber is provided between the film formation chamber casing and the film formation material supply source to prevent the film formation material supplied from the film formation material supply source from adhering to the case. In the film forming apparatus including the adhesion preventing plate, the adhesion preventing plate is divided into a plurality of members at least in the vertical direction, and includes an adhesion preventing plate transport mechanism that moves the upper adhesion preventing plate downward. It is a thing.

  The substrate may be any substrate as long as a film can be formed on the surface thereof. For example, a glass substrate, a semiconductor substrate, a flexible film-like material, etc. are typical. The film forming material supply source is typically an evaporation source for evaporating the film forming material, a sputtering target for sputtering, or the like, but any film forming material can be supplied. Also good. The housing of the film formation chamber preferably has a function of separating the film formation chamber from the outside. When the film forming material supply source is an evaporation source, the vacuum chamber corresponds to the housing. Even if it is not a vacuum chamber, it may be anything as long as it has a function of preventing dust from the outside from affecting the substrate. The adhesion-preventing plate may be anything as long as it covers at least a part of the inner surface of the housing. It is common to use a metal plate so that it can withstand periodic removal of the deposited film-forming substance, and it is preferable to process and use a stainless plate that is resistant to rust and the like.

  According to the present invention, there is provided a film forming apparatus capable of shortening the time required for attaching and removing a protection plate installed in a film forming chamber for forming a film such as an organic EL and ensuring safety at the time of replacement. be able to.

It is a perspective view of the vapor deposition chamber used for vapor deposition of an organic electroluminescent panel. It is sectional drawing of the vapor deposition chamber used for vapor deposition of an organic electroluminescent panel. It is the perspective view which shows the structure of the deposition-prevention board conveyance mechanism of the film-forming apparatus which concerns on 1st embodiment of this invention, a deposition board, and the vapor deposition chamber in connection with it (the 1). It is a perspective view which shows the structure of the adhesion prevention board conveyance mechanism of the film-forming apparatus which concerns on 1st embodiment of this invention, an adhesion prevention board, and the vapor deposition chamber in connection with it (the 2). It is sectional drawing of the horizontal base | substrate and vertical base | substrate part of an adhesion prevention board conveyance mechanism. It is a front view which shows a mode that the adhesion prevention board was arranged. It is a figure which shows a mode when an adhesion prevention board is inserted in a fitting frame. It is a perspective view which shows the adhesion prevention board conveyance mechanism of the film-forming apparatus which concerns on 2nd embodiment of this invention. It is the front view seen from the C direction of the adhesion prevention board conveyance mechanism of the film-forming apparatus shown to FIG. 7A. FIG. 7C is a D cross-sectional view of the adhesion-preventing plate carrying mechanism of the film forming apparatus shown in FIG. 7A. It is a perspective view which shows the structure of the adhesion prevention board conveyance mechanism of the film-forming apparatus which concerns on 3rd embodiment of this invention. It is a figure explaining the adhesion prevention board which concerns on 3rd embodiment of this invention.

  Embodiments according to the present invention will be described below with reference to FIGS.

Embodiment 1
A first embodiment according to the present invention will be described below with reference to FIGS. 1 to 7C.

  First, the vapor deposition chamber used for vapor deposition of the organic EL panel according to the present invention will be described with reference to FIGS. 1 and 2.

  FIG. 1 is a perspective view of a vapor deposition chamber used for vapor deposition of an organic EL panel.

  FIG. 2 is a cross-sectional view of a vapor deposition chamber used for vapor deposition of an organic EL panel.

  When manufacturing an organic EL panel, a step of depositing a light emitting layer by a vacuum deposition method is necessary. As shown in FIG. Vapor deposition.

  In FIG. 1, a part of the inside of the vapor deposition chamber 100 is seen through, and the deposition preventing plate 1 and the substrate 200 are illustrated. 2 is a cross-sectional view taken along the line AA in the vapor deposition chamber of FIG.

  The substrate 200 that has been processed in the previous process is placed on the hand 154 at the tip of the arm 152 of the transfer robot 150 and transferred into the vapor deposition chamber 100. Then, after being placed on the substrate holder 160, the substrate holder 160 is rotated to stand upright and aligned with the shadow mask 204, and then the substrate 200 and the shadow mask 204 are made of means such as a spring or an electromagnet. To hold both of them closely together. The shadow mask 204 is a member that has an opening and masks in order to deposit a material on a necessary portion (a portion to be a pixel) on the substrate.

  In order to perform vacuum deposition, the deposition chamber 100 exhausts the internal air through a vacuum valve so as to be evacuated by the vacuum pump 130 and depressurizes it.

  Then, an organic material 122 for forming the light emitting layer is sprayed from the nozzle 124 of the evaporation source 120, passes through the opening 220, and is deposited on the panel.

  At this time, in the direction of the substrate 200 and the shadow mask 204 toward the evaporation source 120, the deposition preventing plate 1 is installed over the entire surface of the vapor deposition chamber 100, and an organic material adheres to the inner wall or the like of the vapor deposition chamber 100. To prevent.

  Next, with reference to FIGS. 3A to 6, details of the deposition preventing plate transport mechanism and the deposition preventing plate of the film forming apparatus according to the first embodiment of the present invention will be described.

  FIG. 3A and FIG. 3B are perspective views showing the structure of the deposition-preventing plate transport mechanism, the deposition-preventing plate, and the deposition chamber related thereto in the film forming apparatus according to the first embodiment of the present invention.

  FIG. 4 is a cross-sectional view of the horizontal substrate and the vertical substrate of the deposition plate transport mechanism of the film forming apparatus.

  FIG. 5 is a front view showing a state in which the adhesion preventing plates are arranged.

  FIG. 6 is a diagram showing a state where the deposition preventing plate is fitted into the fitting frame.

  When the vapor deposition chamber 100 of FIG. 1 is viewed from the B direction, it is as shown in FIG. 3A. The adhesion prevention plates 1 in this embodiment are arranged in the vertical direction in front of the substrate 200, but the left and right vertical frames 170 and the upper and lower horizontal frames 172 are combined on the surface slightly behind it to form a rectangular shape. There is no.

  When the deposition preventing plate 1 is viewed from the direction of the vapor deposition source 120, it is as shown in FIG. There are two types of the protective plates 1, Type I and Type II. Type I is arranged 2 × 3 above and below the opening 220, and Type II is arranged 3 × 1 respectively on the left and right.

  Two holes 20 having a rectangular shape are formed in the deposition preventing plate 1, and are fitted into and supported by the convex portions 182 of the deposition preventing plate support 180 disposed rearward. As shown in FIG. 5, the attachment plate support 180 is arranged on the left and right, and each attachment plate support 180 has a total of 36 convex portions 182 in accordance with the arrangement of the attachment plate 1. Yes.

  The deposition preventing plate 1 is made of stainless steel (SUS, Stainless steel) as a material, and is subjected to sandblasting on the surface so that a deposit is easily attached. For example, as shown in FIG. 5, the size of the type I deposition preventing plate is about 350 mm × 700 mm, and the size of the type II deposition preventing plate is about 460 mm × 380 mm. The weight of one deposition preventing plate 1 is 5 to 8 kg.

  As shown in FIG. 6, the adhesion preventing plate 1 of this embodiment is fitted into the attachment fitting frame 230 as shown in FIG. 6 so that a plurality of attachments and removals can be performed simultaneously. For example, a set of 2 × 3 anti-adhesion plates (6 types I) at the top of the opening, and an anti-adhesion structure of 2 × 3 (6 types I) at the bottom of the opening One set of plates, 3x1 construction of protection plate on the left of the opening (type II is 3 pieces) One set, construction of 3x1 protection plate on the right of the opening Four attachment plate fitting frames are used so that (three type II) are in one set. Hereinafter, when it is necessary to distinguish these, as shown in FIG. 6 (b), the upper part is fitted with a fitting plate 230t, the lower part is fitted with a fitting plate 230b, and the left part is fitted with a fitting plate 230l. The right part is represented as a fitting frame 230r.

  Here, the worker w usually rides on the step 242 arranged on the table 240 shown in FIG. 3A and performs the attachment and removal work, but the height of the upper end of the opening 220 is increased. However, the height from the ground to 3 m from the ground up to 3.7 m from the ground can reach 3.7 m from the ground, and the weight of the deposition plate 1 may be heavy, particularly at the top of the opening 220. The attachment and removal work of the protection plate 1 involves difficulties.

  Therefore, in this embodiment, as shown in FIG. 3A, the attachment plate transporting mechanism 10 for transporting the attachment plate 1 is provided at the time of attaching and removing the attachment plate 1.

  The adhesion-plate transport mechanism 10 has a structure in which an upper horizontal base 3t, a vertical base 3v, and a lower horizontal base 3b are combined in a U-shape. A block 2tx is attached to the tip of the upper lateral base 3t, and a block 2bx is attached to the tip of the lower lateral base 3b. The guide rails are provided on the upper and lower lateral frames 172. It can move in the X-axis direction along 8t and 8b.

  As shown in FIG. 4, a guide rail 8z is also provided on the surface of the vertical base 3v facing the opening 220, so that the block 2z can move in the Z-axis direction (vertical direction). . The fixed pulley 12 is attached to the upper part of the joint between the upper horizontal base 3t and the vertical base 3v, and the reel 5 is attached to the lower side opposite to the surface facing the opening 220 of the vertical base 3v. A handle 14 is attached to the reel 5. A wire 16 is attached to the block 2z. Then, the wire 16 passes through the hole 17 of the transverse member 3t, and is laid in the order of the fixed pulley 12 and the reel 5, and the operator moves the block 2z in the Z-axis direction by turning the handle 14. Can do.

  A base 4 is fixed to the block 2z, forms an L-shape with the block 2z, and the other end of the base 4 protrudes in the direction of the opening 220. Two guide rails 8y are provided on the upper surface of the base 4, and are engaged with the block 2y so as to be movable in the Y-axis direction.

  At one end in the direction of the opening 220 of the block 2y, an arm 6 integrally formed by left and right L-shaped vertical members 6a and a horizontal member 6b connecting the same is attached. The left and right L-shaped tips have hooks 7 bent upward.

When the deposition preventing plate 1 is removed by such a deposition preventing plate transport mechanism 10, the operation is performed as follows. Here, a description will be given of the case where the six anti-adhesion plates 1 fitted into the anti-adhesion plate fitting frame 230t having a 2 × 3 configuration above the opening 220 are removed.
(1) The blocks 2tx and 2bx are in a position close to the vertical frame 170 in the initial state (when the deposition preventing plate transport mechanism 10 is not used). Block 2z is down. The block 2y is in a direction far from the opening 220.
(2) By pushing the blocks 2tx and 2bx so as to slide along the guide rails 8t and 8b, the blocks 2tx and 2bx are brought to the center of the opening 220.
(3) The handle 14 is operated to raise the block 2z and bring it to a position where the tip of the arm 6 can pass through the opening 220.
(4) By pushing the block 2y so as to slide along the guide rail 8y, the block 2y is moved in the direction of the opening 220, and the hook 7 at the tip of the arm 6 is inserted into the opening 220.
(5) Further, the handle 14 is operated, the block 2z is raised, and the hook 7 at the tip of the arm 6 is hooked on the lower side of the attachment frame fitting frame 230t.
(6) By pushing the block 2y so as to slide along the guide rail 8y, the block 2y is moved away from the opening 220.
(7) Operate the handle 14 in the reverse direction to lower the block 2z and lower it to a position where it can safely handle the attachment plate fitting frame 230t.

  FIG. 3B shows a state when reaching (7).

  When attaching the protection plate 1, the transport of the protection plate 1 fitted in the attachment plate fitting frame 230 t is started from a position close to the ground, and the movement of the blocks is reversed in order from (7). .

  According to the deposition plate transport mechanism of the film forming apparatus of this embodiment, the blocks in the X-axis direction, the Y-axis direction, and the Z-axis direction can be safely and quickly applied to the deposition plate 1 at a particularly high position. By moving it, it can be transported safely and quickly.

[Embodiment 2]
Hereinafter, a second embodiment of the present invention will be described with reference to FIGS. 7A to 7C.

  FIG. 7A is a perspective view showing a deposition-preventing plate transport mechanism of the film forming apparatus according to the second embodiment of the present invention.

  FIG. 7B is a front view of the deposition preventing plate transport mechanism of the film forming apparatus shown in FIG.

  FIG. 7C is a D cross-sectional view of the adhesion-preventing plate carrying mechanism of the film forming apparatus shown in FIG. 7A.

  In the present embodiment, the structure of the adhesion-preventing plate transport mechanism of the first embodiment is changed.

  The form of the adherence plate conveying mechanism 30 is wide from the lower third of the vertical base 33v to the upper direction, and two grooves 35 are dug in the widened surface.

  One surface of the block 32z has two convex portions 34, and the block 32z can be moved in the Z-axis direction by moving the two grooves 35 of the vertical base 33v.

  Further, the other surface of the block 32z has two convex portions 36 and is engaged with the groove 38 of the block 32y, so that the block 32y can move in the Y-axis direction with respect to the block 32z. ing.

  Also, the arm 6 is attached to one end of the block 32y close to the opening 220, and the left and right ends thereof have hooks 7, which are hooked on the lower side of the attachment plate fitting frame 230 to move. It is the same as that of the adhesion prevention board conveyance mechanism 10 shown to FIG. 3A.

[Embodiment 3]
Hereinafter, a third embodiment according to the present invention will be described with reference to FIGS. 8 and 9.

  In 1st embodiment and 3rd embodiment, in order to remove and attach the adhesion prevention board 1 collectively, the adhesion prevention board 1 was fitted to the frame 230, and the adhesion prevention board 1 was handled.

  The present embodiment relates to a deposition plate transport mechanism of a film forming apparatus that removes and attaches the deposition plate in units of one sheet.

  FIG. 8 is a perspective view showing the structure of the deposition preventing plate transport mechanism and deposition preventing plate of the film forming apparatus according to the third embodiment of the present invention.

  FIG. 9 is a view for explaining a deposition preventing plate according to the third embodiment of the present invention.

  The deposition plate transport mechanism 40 of the film forming apparatus according to the third embodiment of the present invention has substantially the same structure as the deposition plate transport mechanism 10 of the first embodiment, but the arm 6 attached to the block 2y. The structure of ′ is different.

  The arm 6 'is attached to the side surface of the block 2y, and the shape thereof is a single L-shape, and a hook 7' is attached to the tip of the arm 6 '. The arm 6 ′ is different from the arm 6 of the deposition-preventing plate transport mechanism 10 of the film forming apparatus according to the first embodiment in that it has a single L-shape. The hook 7 ′ has a slightly smaller shape than the hook 7 of the deposition-preventing plate transport mechanism 10 of the film forming apparatus according to the first embodiment.

  As shown in FIG. 9, the attachment plate 1 ′ of the present embodiment is provided with a hook 21 in the middle of the hole 20.

  In the deposition plate transport mechanism 40 of the film forming apparatus of the present embodiment, when transporting each deposition plate 1 ′, the hook 7 ′ at the tip of the arm 6 ′ is hooked to the hooking bracket of the deposition plate 1 ′. Insert it into the hole 21 and install and remove it.

  Note that the structure of the deposition plate transport mechanism of the film forming apparatus of the present embodiment has been described with the arm described in FIG. 3A being modified, but the arm illustrated in FIG. 7A may be deformed. .

  In this embodiment, when attaching and detaching, the attachment plate 1 'must be done one by one, but the attachment plate does not require a structure such as a fitting frame, and is fitted. There is an advantage that the time and effort is reduced.

  In addition, there is an advantage that the safety of the work place is improved because the attachment and detachment of the protective plate 1 'is performed one by one.

DESCRIPTION OF SYMBOLS 1 ... Protection board, 20 ... Hole, 21 ... Hook metal fitting,
DESCRIPTION OF SYMBOLS 100 ... Deposition chamber, 120 ... Evaporation source, 122 ... Organic material, 124 ... Nozzle, 130 ... Vacuum pump, 150 ... Transfer robot, 152 ... Arm, 154 ... Hand, 160 ... Substrate holder, 170 ... Vertical frame, 172 ... Horizontal frame, 180, 184 ... deposition-proof plate support, 182 ... convex part,
200 ... Substrate, 204 ... Shadow mask, 220 ... Opening, 230 ... Fitting frame, 230t ... Fitting frame (upper part), 230b ... Fitting frame (lower part), 230l ... Fitting prevention board Frame (left), 230r ... Adhering plate (right), 240 ... stand, 242 ... step,
10, 20, 30, 40 ... adhesion plate transport mechanism,
3t ... Vertical substrate, 3v ... Horizontal substrate,
2tx, 2bx, 2y, 2z ... block, 8t, 8b, 8y, 8z ... guide rail,
6 ... arm, 7 ... hook,
5 ... reel, 12 ... fixed pulley, 14 ... handle, 16 ... wire, 17 ... hole,
32y, 32z ... block, 33v ... vertical base, 34, 36 ... convex, 35, 38 ... groove.

Claims (5)

A film forming chamber for forming a material on the substrate, a film forming material supply source for supplying the film forming material to the substrate, and at least a part of the film forming chamber housing and the film forming material A deposition apparatus provided between a supply source and an adhesion preventing plate that prevents the deposition material supplied from the deposition material supply source from adhering to the housing;
The deposition preventing plate is divided into a plurality of members at least in the vertical direction,
A film forming apparatus comprising an adhesion preventing plate conveying mechanism for moving the upper adhesion preventing plate downward. The film forming apparatus according to claim 1,
The film-forming apparatus, wherein the adhesion-plate transport mechanism includes a frame that engages with the housing, and a first transport block that moves along the frame. The film forming apparatus according to claim 1,
The deposition preventing plate transport mechanism includes a rail laid in a direction orthogonal to the opening of the film forming chamber, and a second transport block that moves along the rail. Membrane device. The film forming apparatus according to claim 1,
The deposition plate is fitted into a deposition plate fitting frame into which a plurality of deposition plates are fitted, and the deposition plate transport mechanism moves the deposition plate fitted into the fitting frame. A film forming apparatus. The film forming apparatus according to claim 1,
The deposition plate conveying mechanism includes means for engaging with a part of the deposition plate, and is moved by one piece by engaging with a portion of the deposition plate.

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