JP2013058595A - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP2013058595A
JP2013058595A JP2011195889A JP2011195889A JP2013058595A JP 2013058595 A JP2013058595 A JP 2013058595A JP 2011195889 A JP2011195889 A JP 2011195889A JP 2011195889 A JP2011195889 A JP 2011195889A JP 2013058595 A JP2013058595 A JP 2013058595A
Authority
JP
Japan
Prior art keywords
housing
groove
seal member
flange portion
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2011195889A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013058595A5 (enExample
Inventor
Toru Kirihara
徹 桐原
Yuki Matsumoto
勇樹 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2011195889A priority Critical patent/JP2013058595A/ja
Priority to EP12181796A priority patent/EP2568785A2/en
Priority to CN2012103275153A priority patent/CN103002696A/zh
Priority to US13/606,546 priority patent/US20130063878A1/en
Publication of JP2013058595A publication Critical patent/JP2013058595A/ja
Publication of JP2013058595A5 publication Critical patent/JP2013058595A5/ja
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Studio Devices (AREA)
JP2011195889A 2011-09-08 2011-09-08 電子機器 Abandoned JP2013058595A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011195889A JP2013058595A (ja) 2011-09-08 2011-09-08 電子機器
EP12181796A EP2568785A2 (en) 2011-09-08 2012-08-24 Electronic apparatus
CN2012103275153A CN103002696A (zh) 2011-09-08 2012-09-03 电子装置
US13/606,546 US20130063878A1 (en) 2011-09-08 2012-09-07 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011195889A JP2013058595A (ja) 2011-09-08 2011-09-08 電子機器

Publications (2)

Publication Number Publication Date
JP2013058595A true JP2013058595A (ja) 2013-03-28
JP2013058595A5 JP2013058595A5 (enExample) 2014-10-16

Family

ID=47115228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011195889A Abandoned JP2013058595A (ja) 2011-09-08 2011-09-08 電子機器

Country Status (4)

Country Link
US (1) US20130063878A1 (enExample)
EP (1) EP2568785A2 (enExample)
JP (1) JP2013058595A (enExample)
CN (1) CN103002696A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023079786A1 (ja) * 2021-11-05 2023-05-11 パナソニックＩｐマネジメント株式会社 撮像装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9661213B2 (en) * 2013-07-29 2017-05-23 Lg Innotek Co., Ltd. Camera module
DE202014101818U1 (de) * 2014-04-16 2015-07-20 Weidmüller Interface GmbH & Co. KG Metallgehäuse für den Einbau elektronischer Bauteile
KR102281998B1 (ko) * 2017-08-30 2021-07-27 삼성전자 주식회사 이종재질 통신장치 함체
JP7111933B1 (ja) * 2022-01-31 2022-08-02 ファナック株式会社 シール構造
CN115297637B (zh) * 2022-07-05 2025-08-26 中航光电科技股份有限公司 一种压接型igbt模块用压力均衡结构及液压均衡系统
EP4567306A1 (en) * 2023-12-06 2025-06-11 Koninklijke Philips N.V. Multi-function interface seals
WO2025056381A1 (en) 2023-09-11 2025-03-20 Koninklijke Philips N.V. Multi-function interface seals
WO2025127263A1 (ko) * 2023-12-12 2025-06-19 엘지전자 주식회사 파워 뱅크

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0135095Y2 (enExample) * 1985-04-24 1989-10-25
DE3618066C1 (de) * 1986-05-29 1987-12-03 Licentia Gmbh Verfahren zum dichten Verschliessen eines becherfoermigen aus Metall gefertigten Gehaeuses eines elektrischen Bauelements mit einem Deckel aus Kunststoff
US4749821A (en) * 1986-07-10 1988-06-07 Fic Corporation EMI/RFI shield cap assembly
US5160122A (en) * 1990-03-20 1992-11-03 Peter J. Balsells Coil spring with an elastomer having a hollow coil cross section
AU709051B2 (en) * 1996-01-19 1999-08-19 Helmut Kahl Electrically screening housing
JP2001124206A (ja) 1999-10-25 2001-05-11 Nec Corp 筐体のガスケット取付構造、ガスケット、及び筐体
JP2001326475A (ja) * 2000-05-15 2001-11-22 Nec Corp 通信機器の防水構造
JP2004158650A (ja) * 2002-11-06 2004-06-03 Nec Corp 電磁波シールド及び防水構造型筐体
JP2011071362A (ja) 2009-09-28 2011-04-07 Kyocera Corp 通信機器用の金属筺体
JP5498213B2 (ja) 2010-03-19 2014-05-21 株式会社Ｕａｃｊ ろう付け性に優れた高強度熱交換器用アルミニウム合金クラッド材
CN101915047A (zh) * 2010-08-26 2010-12-15 衡阳泰豪通信车辆有限公司 屏蔽门

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023079786A1 (ja) * 2021-11-05 2023-05-11 パナソニックＩｐマネジメント株式会社 撮像装置

Also Published As

Publication number Publication date
EP2568785A2 (en) 2013-03-13
CN103002696A (zh) 2013-03-27
US20130063878A1 (en) 2013-03-14

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