JP2013055109A - Substrate with built-in component and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate with a built-in component, in which an opening for incorporating an electronic component therein can be made small.SOLUTION: A substrate with a built-in component 10 includes: a first substrate 3A in which a first conductive layer 4c1 is formed on a first insulating layer 3c and an interlayer conduction part 1c2 is formed in the first insulating layer 3c; an electronic component 2 connected to the interlayer conduction part 1c2; and a second substrate 2A in which a second conductive layer 4b1 is formed on a second insulating layer 3b and which has an opening 6 at a position where the electronic component 2 is to be incorporated. The second conductive layer 4b1 includes a frame-shaped part 7b1 having a frame shape in a plan view. The opening 6 is formed to penetrate the second insulating layer 3b in the thickness direction in an entire inner region 8b1 of the frame-shaped part 7b1.

Description

  The present invention relates to a component-embedded substrate that incorporates an electronic component and a method for manufacturing the same.

As electronic devices become smaller and more functional, electronic components built into the devices are also becoming smaller, and printed wiring boards on which electronic components are mounted are also required to have higher density, multiple layers, and improved high-speed transmission characteristics. It has been. As a technique for meeting these requirements, there is a package technique called EWLP (Embedded Wafer Level Package).
EWLP is a technology in which a semiconductor structure (electronic component) such as WLCSP (Wafer Level Chip Size Package) is built in a printed wiring board. According to EWLP, the mounting density can be improved, the wiring length between semiconductor elements can be shortened, and the high-speed transmission characteristics can be improved.

As a component-embedded substrate, there is a substrate in which single-sided wiring boards are laminated on both sides of a double-sided wiring board containing electronic components (see Patent Document 1).
FIG. 13 shows an example of a component-embedded substrate. The component-embedded substrate 100 includes an insulating resin layer 3 on one side and the other surface of a double-sided wiring board A102 in which a conductive layer 4 is formed on both sides of the insulating resin layer 3. Single-sided wiring boards A101 and A103 having a conductive layer 4 formed on the outer surface side are laminated. The double-sided wiring board A102 has the electronic component 2 built in the opening 6 formed in the insulating resin layer 3. The wiring boards A101 to A103 are bonded to each other through the adhesive layer 5, and are electrically connected to each other by the interlayer conductive portion 1.

FIG. 14 and FIG. 15 show the process of forming the opening 6 in the insulating resin layer 3 of the double-sided wiring board A102. As shown in this figure, the opening 6 has, for example, a plurality of both surfaces before singulation. The insulating resin layer 3 of the wiring board A102 is formed by laser processing or drilling.
FIG. 16 is a plan view of the insulating resin layer 3 of the double-sided wiring board A102 in the step of forming the opening 6. The region 6a indicated by the two-dot chain line in FIG. 16A is removed by laser processing, drilling, or the like. Thus, the opening 6 shown in FIG. 16B can be formed.

JP 2008-270362 A

However, in the component-embedded substrate, there is a possibility that the position where the opening 6 is formed is displaced, which may hinder the incorporation of the electronic component 2. Therefore, the opening 6 needs to be formed in a large size in consideration of the displacement. Improvements have been demanded in order to reduce the size of the component-embedded substrate.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a component-embedded substrate that can reduce the opening for incorporating an electronic component and a method for manufacturing the same.

The present invention includes a first substrate having a first conductive layer formed on one surface of the first insulating layer, and having an interlayer conductive portion penetrating the first insulating layer and extending from the first conductive layer to the other surface. An electronic component connected to the interlayer conductive portion; a second substrate in which a second conductive layer is formed in a second insulating layer; and an opening is formed in the second insulating layer at a position in which the electronic component is embedded. And the second conductive layer has a frame-like portion having a frame shape in plan view, and the opening is the second insulation in the entire inner region of the frame-like portion. Provided is a component-embedded substrate formed by penetrating layers in a thickness direction.
The frame-shaped portion is formed on both surfaces of the second insulating layer, respectively, and the frame-shaped portion on one surface side has a larger area of the inner region than the frame-shaped portion on the opposite surface side, and It is preferable that the inner region on one surface side includes the inner region on the opposite surface side in plan view.

The present invention includes a first substrate having a first conductive layer formed on one surface of the first insulating layer, and having an interlayer conductive portion penetrating the first insulating layer and extending from the first conductive layer to the other surface. An electronic component connected to the interlayer conductive portion; a second substrate in which a second conductive layer is formed in a second insulating layer; and an opening is formed in the second insulating layer at a position in which the electronic component is embedded. And a manufacturing method of a component-embedded substrate comprising at least a frame-like frame-shaped portion made of the second conductive layer formed in the second insulating layer and positioned inside the frame-shaped portion. Irradiating the second insulating layer with laser light to form the opening through the second insulating layer in the thickness direction by laser processing, and the inner side of the frame-shaped portion. When forming the opening by irradiating the insulating layer with laser light, the laser light Both provide a method for manufacturing a component-embedded substrate for irradiating a region including the inner periphery of the frame-like portion.
The present invention includes a first substrate having a first conductive layer formed on one surface of the first insulating layer, and having an interlayer conductive portion penetrating the first insulating layer and extending from the first conductive layer to the other surface. An electronic component connected to the interlayer conductive portion; a second substrate in which a second conductive layer is formed in a second insulating layer; and an opening is formed in the second insulating layer at a position in which the electronic component is embedded. And a manufacturing method of a component-embedded substrate comprising at least a frame-like frame-shaped portion made of the second conductive layer formed in the second insulating layer and positioned inside the frame-shaped portion. There is provided a method of manufacturing a component-embedded substrate including a step of penetrating the second insulating layer in the thickness direction by wet etching to form the opening.

According to the present invention, since the opening is formed in the inner region of the frame-shaped portion made of the second conductive layer, the position of the opening with respect to the second conductive layer (conductive circuit) does not shift.
Therefore, it is not necessary to form a large opening in consideration of a deviation in the formation position of the opening, and the component-embedded substrate can be downsized.
Further, since the opening has a shape along the inner peripheral edge of the frame-like portion, the shape of the opening (for example, the shape of the corner of the rectangular opening) is not affected by the spot diameter of the laser beam, the drill diameter, or the like. . For this reason, the processing time can be shortened by using a laser beam having a large spot diameter.
In addition, since it is not necessary to consider the spot diameter or drill diameter of the laser beam, the degree of freedom in designing the size and shape of the opening is increased, which is advantageous in reducing the size of the component-embedded substrate.

It is sectional drawing which shows the component built-in board | substrate of one Embodiment of this invention. It is a top view which shows the frame-shaped part and opening part of the component built-in board | substrate of FIG. It is process drawing which shows the manufacturing process of the component built-in board | substrate of FIG. It is process drawing following a previous figure. It is process drawing following a previous figure. It is process drawing following a previous figure. It is process drawing following a previous figure. It is process drawing following a previous figure. It is sectional drawing which shows typically an example of the process of forming an opening part. It is a top view which shows typically the process of forming an opening part. It is sectional drawing which shows typically the other example of the process of forming an opening part. It is a figure which shows the wiring board of the state before forming an opening part, (A) is sectional drawing, (B) is a top view. It is sectional drawing which shows an example of the conventional component built-in board | substrate. It is process drawing which shows the manufacturing process of the component built-in board | substrate of a previous figure. It is process drawing following a previous figure. It is a top view which shows the process of forming an opening part, (A) shows the state before forming an opening part, (B) shows the state which formed the opening part.

An embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view showing a component built-in substrate 10 which is a method for manufacturing a component built-in substrate according to the present invention. FIG. 2 is a plan view showing the frame-like portion 7 and the opening 6 of the component-embedded substrate 10. Hereinafter, the positional relationship of each component may be described based on the vertical position in FIG.

As shown in FIG. 1, the component built-in substrate 10 is, for example, a laminated printed wiring board that incorporates an electronic component 2. The wiring boards 1A and 3A are stacked.
The wiring boards 1A to 3A include, for example, a conductive layer 4 made of a conductor such as copper on one or both surfaces of an insulating resin layer 3 made of polyimide or the like, and are bonded to each other via an adhesive layer 5 to provide an interlayer conductive portion. 1 are electrically connected to each other.

In the upper wiring board 1A, a conductive layer 4 (4a1) is formed on one surface 3a1 side (upper surface in FIG. 1) of the insulating resin layer 3 (3a). The insulating resin layer 3 (3a) is formed with one or a plurality of interlayer conductive portions 1 (1a1) penetrating the insulating resin layer 3 and extending from the conductive layer 4 (4a1) to the other surface 3a2 side (lower surface in FIG. 1). Has been.
The lower end of the interlayer conductive portion 1 (1a1) reaches the conductive layer 4 (4b1) on the one surface side (upper surface) of the double-sided wiring board 2A, whereby the conductive layer 4 (4a1) of the upper-layer wiring board 1A and the double-sided wiring board 2A. The conductive layer 4 (4b1) is connected.
As the upper wiring board 1A, for example, a single-sided copper clad laminate (CCL) in which a conductive layer 4 made of a conductor such as copper is provided on one surface of an insulating resin layer 3 made of polyimide or the like can be used.

In the double-sided wiring board 2A (second substrate), the conductive layer 4 (4b1) (second conductive layer) is formed on the one surface 3b1 side (upper surface) of the insulating resin layer 3 (3b) (second insulating layer). A conductive layer 4 (4b2) (second conductive layer) is formed on the surface 3b2 side (lower surface).
An opening 6 is formed in the insulating resin layer 3 (3b) at a position where the electronic component 2 is built.

As shown in FIGS. 1 and 2, the conductive layer 4 (4b1) on the one surface 3b1 side (upper surface) of the insulating resin layer 3 (3b) is a frame-like portion 7b1 having a frame shape in plan view (a frame-like portion on the opposite surface side). ).
The frame-like portion 7b1 is a part of the conductive layer 4 (4b1), and is a layer made of a conductor such as copper, for example. The other part of the conductive layer 4 (4b1) constitutes the conductive circuit 12 (wiring layer).
The outer shape (planar shape) of the frame-like portion 7b1 is not particularly limited, and may be, for example, a rectangle (square, rectangle), a circle, an indefinite shape, or the like. The outer shape of the frame-like portion 7b1 in the illustrated example is a rectangle (square).

  The planar view shape (the shape formed by the inner peripheral edge 7b1a of the frame-like portion 7b1) of the inner region 8b1 of the frame-like portion 7b1 is a shape corresponding to the electronic component 2, for example, a rectangle (square, rectangle), a circle, an indeterminate shape, etc. It may be. The inner region 8b1 in the illustrated example is a rectangle (square). The frame-like part 7b1 can be a rectangular frame having a constant width.

  In the insulating resin layer 3 (3b), the opening 6 having the same planar view shape as the inner region 8b1 is formed in the inner region 8b1 of the frame-like portion 7b1 in a plan view. The opening 6 is formed through the insulating resin layer 3 (3b) in the entire inner region 8b1 in the thickness direction.

The conductive layer 4 (4b2) on the other surface 3b2 side (lower surface) of the insulating resin layer 3 (3b) has a frame-like portion 7b2 (a frame-like portion on one surface side) having a frame shape in plan view.
The frame-like portion 7b2 is a part of the conductive layer 4 (4b2), and is a layer made of a conductor such as copper. The other part of the conductive layer 4 (4b2) constitutes the conductive circuit 12 (wiring layer).
The outer shape (planar shape) of the frame-like portion 7b2 is not particularly limited, and may be, for example, a rectangle (square, rectangle, etc.), a circle, an indeterminate shape, or the like. The outer shape of the frame-like portion 7b2 in the illustrated example is a rectangle (square). The planar view shape (the shape formed by the inner peripheral edge 7b2a of the frame-like portion 7b2) of the inner region 8b2 of the frame-like portion 7b2 may be, for example, a rectangle (square, rectangle), a circle, an indefinite shape, or the like. The inner region 8b2 in the illustrated example is a rectangle (square). The frame-like portion 7b2 can be a rectangular frame having a constant width.

As shown in FIG. 2, the inner region 8b2 on the other surface 3b2 side (lower surface in FIG. 1) of the insulating resin layer 3 (3b) has a larger area than the inner region 8b1 on the one surface 3b1 side (upper surface in FIG. 1). In addition, it is desirable to include the inner region 8b1 in plan view.
The inner peripheral edge 7b2a of the frame-like part 7b2 is preferably located outward from the inner peripheral edge 7b1a of the frame-like part 7b1 over the entire circumference in plan view. It is desirable that the inner peripheral edge 7b2a is located outward with a certain distance from the inner peripheral edge 7b1a over the entire periphery.
In the illustrated example, the four side portions of the inner peripheral edge 7b2a can be positioned, for example, 20 to 50 μm outward from the corresponding side portions of the inner peripheral edge 7b1a. The length of the side part of the inner peripheral edge 7b2a is preferably 30 to 150 μm longer than the corresponding side part of the inner peripheral edge 7b1a, for example.
In the example shown in FIG. 2, the inner region 8b2 of the frame-like portion 7b2 has a larger area than the inner region 8b1 of the frame-like portion 7b1, and includes the inner region 8b1 in plan view. Even when the viewing position is deviated from the frame-like portion 7b1, the dimension of the opening 6 is not affected. For this reason, there is no problem in incorporating the electronic component 2 into the opening 6.
As the double-sided wiring board 2A, for example, a double-sided copper-clad laminate (CCL) in which conductive layers 4 are provided on both sides of an insulating resin layer 3 made of polyimide or the like can be used.

As shown in FIG. 1, the lower wiring board 3A (first substrate) has a conductive layer 4 (on one surface) on the other surface 3c2 side (lower surface) (one surface) of the insulating resin layer 3 (3c) (first insulating layer). 4c1) (first conductive layer) is formed. The insulating resin layer 3 (3c) includes one or a plurality of interlayer conductive portions 1 (1c1, 1c2) penetrating the insulating resin layer 3 and extending from the conductive layer 4 (4c1) to the one surface 3c1 side (upper surface) (the other surface). ) Is formed.
Some of the interlayer conductive portions 1 (1c1) have their upper ends reaching the conductive layer 4 (4b2) on the other surface 3b2 side (lower surface) of the double-sided wiring board 2A, and thereby the conductive layer 4 (4b2) of the double-sided wiring board 2A. Are connected to the conductive layer 4 (4c1) of the lower wiring board 3A.
The other upper part of the interlayer conductive portion 1 (1c2) reaches the conductive layer 4 (4d1) of the electronic component 2 at the upper end, whereby the conductive layer 4 (4d1) of the electronic component 2 and the conductive layer of the lower wiring board 3A 4 (4c2).

The electronic component 2 may be a passive component such as a resistor or a capacitor, or may be an active component such as an IC, a diode, or a transistor. Further, it may be a semiconductor (bare) chip having a semiconductor element or WLCSP.
A conductive layer 4 (4d1) is formed on the other surface 2a2 side (lower surface) of the electronic component 2.
Since the electronic component 2 is disposed in the opening 6 of the double-sided wiring board 2A, it is disposed between the upper wiring board 1A and the lower wiring board 3A.

For the adhesive layer 5, various kinds of adhesives known in the field of manufacturing printed wiring boards can be used. For example, a polyimide-based adhesive or an epoxy-based adhesive is suitable.
The interlayer conductive portion 1 is preferably one obtained by heating and curing a conductive paste containing metal particles such as nickel, silver, copper, tin, bismuth, indium, and lead.

Next, an example of the manufacturing method of the component built-in substrate of the present invention will be specifically described.
As shown in FIG. 3, an insulating resin layer 3 (3b) having a conductive layer 4A formed on both surfaces is prepared, and through holes 9 are formed in the insulating resin layer 3 by laser processing or the like as shown in FIG.
As shown in FIG. 5, a conductive layer 4 (4b3) for connecting the conductive layers 4 on both sides of the insulating resin layer 3 to each other is formed on the inner surface of the through hole 9 by electrolytic plating or the like.
As shown in FIG. 6, the conductive layer 4A is formed by patterning the conductive layer 4A by photolithography. The conductive layer 4 formed at this time includes frame-like portions 7b1 and 7b2 and a conductive circuit 12.
The frame-like portions 7b1 and 7b2 are part of the conductive layer 4 similarly to the conductive circuit 12, and are formed at the same time as the conductive circuit 12, so that the position of the opening 6 with respect to the conductive circuit 12 does not shift. For this reason, the accuracy of the mounting position of the electronic component 2 can be improved.

Next, as shown in FIG. 7, by removing the insulating resin layer 3 (3b) in the inner region 8b1 of the frame-like portion 7b1 by laser processing, the opening 6 having the same shape (planar shape) as the inner region 8b1. Form.
Hereinafter, the step of forming the opening 6 will be described in detail with reference to FIGS.
As shown in FIGS. 9A and 9B, the laser light L1 is applied to the insulating resin layer 3 (3b) in the inner region 8b1 of the frame-like portion 7b1 from the one surface 3b1 side of the insulating resin layer 3 (3b). Irradiate. Specifically, the laser beam L1 is applied to a region including at least the peripheral portion 8b1a (see FIG. 10A) of the inner region 8b1. In this example, the laser beam L1 is irradiated while being moved along the inner peripheral edge 7b1a. In addition, you may irradiate the laser beam L1 to the whole inner area | region 8b1 at once. For laser processing, a carbon dioxide laser, an excimer laser, or the like can be used.

As shown in FIG. 9B and FIG. 10A, it is preferable that the laser beam L1 is applied to at least a region including the inner peripheral edge 7b1a of the frame-like portion 7b1. In this example, a part of the laser beam L1 is irradiated to the frame-like part 7b1 including the inner peripheral edge 7b1a, and the other part is irradiated to the insulating resin layer 3 (3b) including the peripheral part 8b1a of the inner region 8b1. The
By irradiating the region including the inner peripheral edge 7b1a of the frame-shaped portion 7b1 with the laser light L1, the laser light L1 is surely applied to the peripheral portion 8b1a of the inner region 8b1, and the opening 6 having the same shape as the inner region 8b1 is formed. It can be reliably formed.
The laser light L1 is preferably output adjusted so that only the insulating resin layer 3 is processed and the frame-like portion 7b1 is not damaged.
By irradiating the laser beam L1 over the entire circumference along the inner peripheral edge 7b1a, the opening 6 can be formed in the insulating resin layer 3 (3b).

As shown in FIGS. 9C and 9D, the cut-out portion 13 of the insulating resin layer 3 cut out by laser processing along the inner peripheral edge 7b1a is removed.
As shown in FIG. 9D and FIG. 10B, the laser light L1 is applied to the insulating resin layer 3 (3b) in the region including the peripheral edge 8b1a of the inner region 8b1, and thus has the same shape as the inner region 8b1. The opening 6 can be formed with high accuracy.
The opening 6 may be formed on the insulating resin layer 3 after being separated into pieces, or may be formed on the insulating resin layer 3 before being separated into pieces (FIGS. 14 and 15). See).

As shown in FIG. 8, the upper layer wiring board 1A, the double-sided wiring board 2A, the lower layer wiring board 3A, and the electronic component 2 are respectively aligned and arranged, and the wiring boards 1A to 3A and the electronic component 2 are laminated by a batch lamination method. Thus, the component built-in substrate 10 shown in FIG. 1 is obtained.
When the wiring boards 1A to 3A and the electronic component 2 are stacked, a large force in the thickness direction is applied to the double-sided wiring board 2A, but the frame-like portions 7b1 and 7b2 function as reinforcing members, and therefore the adhesive layer 5 As a result, the insulating resin layer 3 (3b) is not bent and deformed by the influence of the flow, and the flatness of the component-embedded substrate 10 can be ensured.

In the component built-in substrate 10, the opening 6 is formed in the inner region 8 b 1 of the frame-like portion 7 b 1 made of the conductive layer 4, so that the position of the opening 6 with respect to the conductive layer 4 (conductive circuit 12) is shifted. There is no.
Accordingly, it is not necessary to make the opening 6 large in consideration of a shift in the position where the opening 6 is formed, and the component-embedded substrate 10 can be downsized.
Further, since the opening 6 has a shape along the inner peripheral edge 7b1a of the frame-like portion 7b1, the shape of the opening 6 (for example, the shape of the corner of the rectangular opening 6) is the laser beam spot diameter, drill diameter, etc. Not affected. For this reason, the processing time can be shortened by using the laser beam L1 having a large spot diameter. The processing time can be set to, for example, about 1/3 to 1/5 as compared with the case where the frame-shaped portion is not formed.
In addition, since it is not necessary to consider the spot diameter of the laser beam, the drill diameter, etc., the degree of freedom in designing the size and shape of the opening 6 is increased, which is advantageous in reducing the size of the component-embedded substrate 10.

In the manufacturing method described above, the opening 6 is formed by laser processing, but the opening 6 may be formed by other methods. Hereinafter, an example of a method for forming the opening 6 by wet etching will be described.
Insulating resin layer 3 (3b) (hereinafter referred to as wiring board 2B) having conductive layer 4 is fabricated according to the method shown in FIGS.
As shown in FIGS. 11 (A) and 11 (B), the frame-like portions 7b1 and 7b2 are insulated with the portions including the inner peripheral edges 7b1a and 7b2a (the inner peripheral portions 14b1 and 14b2) and the inner regions 8b1 and 8b2. The surface 3b1, 3b2 of the resin layer 3 (3b) and the conductive layer 4 (4b1, 4b2) are covered with a protective coating resin 11.
As shown in FIG. 11C, the insulating resin layer 3 (3b) in the inner region 8b1 of the frame-like portion 7b1 is brought into contact with the wiring board 2B, for example, by an etching solution mainly containing potassium hydroxide. By removing, the opening 6 is formed. Next, as shown in FIG. 11D, the coating resin 11 is removed.
The formation of the opening 6 by etching may be performed on the insulating resin layer 3 before being separated into pieces (see FIGS. 14 and 15). By forming the openings 6 in the insulating resin layer 3 before separation, a plurality of openings 6 can be formed at a time, and the manufacturing efficiency can be increased.

  In this method, since the opening 6 is formed by removing the insulating resin layer 3 (3b) inside the frame-like portion 7b1 by etching, the opening 6 can be accurately formed by an easy operation. .

Next, another example of a method for forming the opening 6 by wet etching will be described with reference to FIG.
12A and 12B are diagrams showing the wiring board 2B in a state before the opening 6 is formed. FIG. 12A is a cross-sectional view and FIG. 12B is a plan view.
In this method, when the conductive layer 4 is formed by patterning the conductive layer 4A (see FIG. 5), not all the conductive layers in the inner regions 8b1 and 8b2 are removed, but as shown in FIG. The conductive layers only in the peripheral portions of the regions 8b1 and 8b2 are removed, and the conductive layers 4B1 and 4B2 are left in the central portions of the inner regions 8b1 and 8b2, and the steps shown in FIGS. 11B to 11D are performed. The opening 6 is formed.
In this method, since the conductive layers 4B1 and 4B2 function as reinforcing members, the insulating resin layer 3 (3b) is not easily deformed, and therefore the opening 6 can be formed with high accuracy.

  The component built-in substrate 10 shown in FIG. 1 and the like is a laminate of the wiring boards 1A to 3A, but the component built-in substrate manufactured in the present invention may include other wiring boards other than these. .

DESCRIPTION OF SYMBOLS 1, 1c2 ... Interlayer conduction | electrical_connection part, 2 ... Electronic component, 2A ... Double-sided wiring board (2nd board | substrate), 3 ... Insulation resin layer (insulation layer), 3b ... Insulation resin layer (Second insulating layer), 3c ... Insulating resin layer (first insulating layer), 3A ... Lower wiring board (first substrate), 4 ... Conductive layer, 4b1, 4b2 ... Conductive layer (Second conductive layer), 4c1 ... conductive layer (first conductive layer), 6 ... opening, 7b1 ... frame-like part (frame-like part on the opposite side), 7b1a ... inner periphery 7b2... Frame-shaped portion (frame-shaped portion on one surface side) 8, 8b1, 8b2.

The present invention includes a first substrate having a first conductive layer formed on one surface of the first insulating layer, and having an interlayer conductive portion penetrating the first insulating layer and extending from the first conductive layer to the other surface. An electronic component connected to the interlayer conductive portion; a second substrate in which a second conductive layer is formed in a second insulating layer; and an opening is formed in the second insulating layer at a position in which the electronic component is embedded. And the second conductive layer has a frame-like portion having a frame shape in plan view, and the opening is the second insulation in the entire inner region of the frame-like portion. The frame-shaped portion is formed on both surfaces of the second insulating layer, and the frame-shaped portion on the first substrate side is the frame on the opposite surface side. The area of the inner region is larger than the shape portion, and the inner region on the first substrate side is the inner side on the opposite surface side in a plan view. An inner periphery of the frame-like part on the first substrate side is located outside the inner periphery of the frame-like part on the opposite surface side in plan view, and the electronic component is A component-embedded substrate connected to the interlayer conductive portion by a component conductive layer formed on the first substrate side surface is provided.
The present invention includes a third substrate having a third insulating layer on a surface opposite to the first substrate side of the second substrate, and the third substrate includes the third insulating layer. A third conductive layer formed on a side opposite to the second substrate side, and an interlayer conductive portion that penetrates the third insulating layer and extends from the third conductive layer to the surface on the second substrate side. Is preferred.

The present invention is a method for manufacturing the component-embedded substrate, and by irradiating the second insulating layer located inside the frame-like portion on the opposite side to the first substrate side with laser light, Including a step of forming the opening through the second insulating layer in the thickness direction by laser processing, and the laser beam is formed on the side opposite to the first substrate when forming the opening. From this , the manufacturing method of the component built-in board | substrate which irradiates the area | region including the inner periphery of the frame-shaped part at least on this surface side is provided.
The present invention is a method for manufacturing the component-embedded substrate, wherein the second insulating layer positioned inside the frame-like portion on the opposite surface side to the first substrate side is wet-etched in the thickness direction. Provided is a method for manufacturing a component-embedded substrate, which includes a step of forming the opening through the component.

Claims (4)

A first substrate having a first conductive layer formed on one surface of the first insulating layer and having an interlayer conductive portion penetrating the first insulating layer and extending from the first conductive layer to the other surface;
An electronic component connected to the interlayer conductive portion;
A component-embedded substrate comprising at least a second substrate in which a second conductive layer is formed in the second insulating layer and an opening is formed at a position where the electronic component of the second insulating layer is embedded;
The second conductive layer has a frame-like portion having a frame shape in plan view;
The component-embedded substrate, wherein the opening is formed so as to penetrate the second insulating layer in the entire inner region of the frame-shaped portion in the thickness direction.   The frame-shaped portion is formed on both surfaces of the second insulating layer, respectively, and the frame-shaped portion on one surface side has a larger area of the inner region than the frame-shaped portion on the opposite surface side, and 2. The component built-in board according to claim 1, wherein an inner region on one surface side includes the inner region on the opposite surface side in a plan view. A first substrate having a first conductive layer formed on one surface of the first insulating layer and having an interlayer conductive portion penetrating the first insulating layer and extending from the first conductive layer to the other surface;
An electronic component connected to the interlayer conductive portion;
And a second substrate having a second conductive layer formed on the second insulating layer and an opening formed at a position where the electronic component is embedded in the second insulating layer. There,
The second insulating layer is formed with a frame-like frame-like portion made of the second conductive layer in a plan view, and the second insulating layer positioned inside the frame-like portion is irradiated with laser light, thereby producing a laser. Forming the opening through the second insulating layer in the thickness direction by processing,
When forming the opening by irradiating the second insulating layer inside the frame-shaped portion with the laser beam, the laser beam is irradiated to a region including at least the inner periphery of the frame-shaped portion. A method for manufacturing a component-embedded substrate. A first substrate having a first conductive layer formed on one surface of the first insulating layer and having an interlayer conductive portion penetrating the first insulating layer and extending from the first conductive layer to the other surface;
An electronic component connected to the interlayer conductive portion;
And a second substrate having a second conductive layer formed on the second insulating layer and an opening formed at a position where the electronic component is embedded in the second insulating layer. There,
A frame-like frame-like portion made of the second conductive layer is formed in the second insulating layer, and the second insulating layer located inside the frame-like portion penetrates in the thickness direction by wet etching. Then, the manufacturing method of the component built-in board | substrate characterized by including the process of forming the said opening part.

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