JP2013054960A - Lighting fixture - Google Patents

Lighting fixture Download PDF

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JP2013054960A
JP2013054960A JP2011193106A JP2011193106A JP2013054960A JP 2013054960 A JP2013054960 A JP 2013054960A JP 2011193106 A JP2011193106 A JP 2011193106A JP 2011193106 A JP2011193106 A JP 2011193106A JP 2013054960 A JP2013054960 A JP 2013054960A
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screw
hole
substrate
mounting surface
light source
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JP5773810B2 (en
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Masakazu Tange
理和 丹下
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Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
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Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a lighting fixture in which insulation is secured and adhesion between an LED board and a heat radiation member is improved.SOLUTION: The lighting fixture includes an LED board 130 having a board through-hole 133; a heat radiation section 110 having a board mounting surface 111 for mounting the LED board 130 thereon, a recessed section 112 arranged at a location corresponding to the board through-hole 133, and a female screw section 112a arranged at a bottom of the recessed section 112; board mounting screws 131; and a contact section having a disk through-hole 132j which causes a screw shaft section 131b to penetrate therethrough and locks a screw head 131a, the disk through-hole 132j being communicated with the board through-hole 133, and arranged so that a rear face 132f of the contact section makes contact with a mounting surface 134 around the board through-hole 133. The board mounting screw 131 fixes the LED board 130 to the board mounting surface 111 by pushing the contact section to the mounting surface 134 while the screw shaft section 131b penetrates the disk through-hole 132j and the board through-hole 133 and a male screw section 131c is screwed into the female screw section 112a.

Description

本発明は、例えば、LEDを用いた照明器具に関する。   The present invention relates to a lighting fixture using LEDs, for example.

近年、LEDを用いた照明器具では高出力化が求められており、照明器具の器具発光面が大型化している。また、器具発光面の大型化に伴い、LEDを光源として実装する光源基板が大きくなり、LEDが発生する熱を効率よく放熱する必要性が高まっている。LEDを光源として実装する光源基板は、アルミニウム等の金属製の基板であることが多く、光源基板を放熱部材に熱接続させることによりLEDが発生する熱を放熱させている。   In recent years, there has been a demand for higher output in lighting fixtures using LEDs, and the light emitting surface of the lighting fixtures has become larger. In addition, with the increase in the size of the light emitting surface of the appliance, the light source substrate on which the LED is mounted as a light source has become larger, and the need to efficiently dissipate the heat generated by the LED has increased. A light source substrate on which an LED is mounted as a light source is often a metal substrate such as aluminum, and heat generated by the LED is dissipated by thermally connecting the light source substrate to a heat dissipation member.

LED基板を放熱部材に取り付ける方法として、LED基板の周辺部を放熱部材に押しつけて取り付ける方法がある(特許文献1参照)。   As a method of attaching the LED substrate to the heat dissipation member, there is a method of attaching the peripheral portion of the LED substrate by pressing it against the heat dissipation member (see Patent Document 1).

特開2011−134453号公報JP 2011-134453 A

LEDを光源として実装する光源基板が大きくなると、放熱効率を向上させるために光源基板と放熱部材との密着性を高くする必要がある。しかし、従来のように、光源基板の周辺部を放熱部材に取り付けるという方法では、光源基板の中央部分の密着性が低い。光源基板が大きくなると、光源基板の中央部分と放熱部材との密着性が特に低くなり、放熱性が低くなる。   When the light source substrate on which the LED is mounted as a light source becomes large, it is necessary to increase the adhesion between the light source substrate and the heat dissipation member in order to improve the heat dissipation efficiency. However, in the conventional method of attaching the peripheral portion of the light source substrate to the heat radiating member, the adhesion of the central portion of the light source substrate is low. When the light source substrate becomes large, the adhesion between the central portion of the light source substrate and the heat radiating member becomes particularly low, and the heat radiating property becomes low.

そこで、光源基板の中央部分をねじ等により放熱部材に固定するという方法があるが、単純に金属のねじで固定した場合、ねじと光源基板との絶縁距離の確保が難しいという課題がある。また、金属製の光源基板にねじ穴を設けた場合、ねじ穴を形成する縁部の断面から金属が露出するため、ねじ穴の断面と放熱部材との絶縁距離の確保が難しいという課題がある。   Therefore, there is a method of fixing the central portion of the light source substrate to the heat radiating member with screws or the like. However, when simply fixing with a metal screw, there is a problem that it is difficult to secure an insulation distance between the screw and the light source substrate. In addition, when a screw hole is provided in a metal light source substrate, the metal is exposed from the cross section of the edge that forms the screw hole, and thus there is a problem that it is difficult to secure an insulation distance between the cross section of the screw hole and the heat dissipation member .

光源基板の中央部分の固定に絶縁材である樹脂製のねじを採用することも考えられるが、樹脂製のねじには劣化による保持力の低下のおそれがあり、信頼性が低い。また、樹脂製のねじを採用した場合でも、ねじ穴の断面と放熱部材との絶縁距離の確保が難しいという課題は残されたままである。   Although it is conceivable to employ a resin screw as an insulating material for fixing the central portion of the light source substrate, the resin screw has a risk of lowering the holding force due to deterioration, and is not reliable. Even when resin screws are employed, there remains a problem that it is difficult to secure an insulation distance between the cross section of the screw hole and the heat radiating member.

本発明は、光源基板とねじ、光源基板と放熱部材との絶縁距離を確保するとともに、光源基板と放熱部材の密着性を高めた照明器具を提供することを主な目的とする。   The main object of the present invention is to provide a lighting fixture that secures an insulation distance between a light source substrate and a screw, a light source substrate and a heat dissipation member, and has improved adhesion between the light source substrate and the heat dissipation member.

本発明に係る照明器具は、
光源が実装される実装面と前記実装面の裏側の面である非実装面とを有する光源基板であって、貫通孔が設けられた光源基板と、
前記光源基板が取り付けられる基板取付面であって前記光源基板の非実装面から前記光源で発生する熱が伝熱される基板取付面と、前記基板取付面に設けられた凹部であって前記光源基板の貫通孔に対応する位置に設けられた凹部と、前記凹部の底部に設けられためねじ部とを備え、前記基板取付面に伝熱される熱を放熱する放熱部と、
ねじ頭部と、おねじ部を備えるねじ軸部とを備える固定ねじと、
絶縁材により形成され、表面と裏面とを有する板状の当接部品であって、前記ねじ軸部を貫通させるとともに前記ねじ頭部を係止するねじ穴を備え、前記ねじ穴と前記光源基板の貫通孔とが連通するとともに前記裏面が前記光源基板の貫通孔の周囲の実装面と当接するように配置される当接部品と
を備え、
前記固定ねじは、
前記ねじ軸部が前記当接部品のねじ穴と前記光源基板の貫通孔とを貫通し、前記おねじ部が前記めねじ部と螺合することにより、前記当接部品を前記光源基板の実装面に押し付けて前記光源基板を前記基板取付面に固定することを特徴とする。
The lighting fixture according to the present invention is:
A light source substrate having a mounting surface on which a light source is mounted and a non-mounting surface which is a back surface of the mounting surface, and a light source substrate provided with a through hole;
A substrate mounting surface to which the light source substrate is mounted, a substrate mounting surface to which heat generated by the light source is transferred from a non-mounting surface of the light source substrate, and a recess provided in the substrate mounting surface, the light source substrate A recess provided at a position corresponding to the through-hole of the above, and a screw portion provided at the bottom of the recess, and a heat dissipating part that dissipates heat transferred to the substrate mounting surface,
A fixing screw having a screw head and a screw shaft portion having a male screw portion;
A plate-shaped contact component formed of an insulating material and having a front surface and a back surface, the screw contact portion penetrating the screw shaft portion and locking the screw head, the screw hole and the light source substrate An abutting part arranged so that the through-hole communicates with the mounting surface around the through-hole of the light source substrate,
The fixing screw is
The screw shaft portion passes through the screw hole of the contact component and the through hole of the light source substrate, and the male screw portion is screwed with the female screw portion, so that the contact component is mounted on the light source substrate. The light source substrate is fixed to the substrate mounting surface by pressing against a surface.

本発明にかかる照明器具によれば、固定ねじのねじ軸部が当接部品のねじ穴と光源基板の貫通孔とを貫通し、固定ねじのおねじ部が凹部のめねじ部と螺合することにより、当接部品を光源基板の実装面に押し付けて光源基板を基板取付面に固定するので、固定ねじと光源基板との絶縁距離、放熱部と光源基板との絶縁距離が確保できるとともに、光源基板と放熱部との密着性を高めることができる。   According to the lighting apparatus of the present invention, the screw shaft portion of the fixing screw passes through the screw hole of the contact part and the through hole of the light source substrate, and the screw portion of the fixing screw is screwed with the female screw portion of the recess. By pressing the abutting component against the mounting surface of the light source board and fixing the light source board to the board mounting surface, an insulation distance between the fixing screw and the light source board, an insulation distance between the heat radiation part and the light source board can be secured, The adhesion between the light source substrate and the heat radiating part can be enhanced.

実施の形態1に係る照明器具100の斜視図である。1 is a perspective view of a lighting fixture 100 according to Embodiment 1. FIG. 実施の形態1に係る照明器具100の分解斜視図である。1 is an exploded perspective view of a lighting fixture 100 according to Embodiment 1. FIG. 実施の形態1に係る照明器具100において、絶縁シート120を基板取付面111に取り付ける取付構造を示す図である。FIG. 3 is a diagram showing an attachment structure for attaching an insulating sheet 120 to a substrate attachment surface 111 in the lighting apparatus 100 according to Embodiment 1. 実施の形態1に係る照明器具100において、基板取付面111にLED基板130を取り付ける取付構造を示す図である。FIG. 3 is a diagram showing an attachment structure for attaching an LED substrate 130 to a substrate attachment surface 111 in the lighting fixture 100 according to Embodiment 1. 実施の形態1に係る照明器具100において、基板取付面111に絶縁シート120及びLED基板130が取り付けられた状態を示す図である。FIG. 5 is a diagram showing a state where an insulating sheet 120 and an LED substrate 130 are attached to a substrate attachment surface 111 in the lighting fixture 100 according to Embodiment 1. 実施の形態1に係る照明器具100におけるブッシュ132及び基板取付ねじ131の斜視図である。3 is a perspective view of a bush 132 and a board mounting screw 131 in the lighting fixture 100 according to Embodiment 1. FIG. 実施の形態1に係る照明器具100におけるブッシュ132を示す図であり、(a)がブッシュ132をQ1方向(図6参照)から見た図、(b)がブッシュ132をQ2方向(図6参照)から見た図である。It is a figure which shows the bush 132 in the lighting fixture 100 which concerns on Embodiment 1, (a) is the figure which looked at the bush 132 from Q1 direction (refer FIG. 6), (b) is the bush 132 direction Q2 (refer FIG. 6). ). 図5のA−A断面の部分拡大図である。It is the elements on larger scale of the AA cross section of FIG. (a)が基板取付面111に形成された凹部112を光の照射方向側から見た図、(b)がLED基板130に設けられた基板貫通孔133を光の照射方向側から見た図である。(A) The figure which looked at the recessed part 112 formed in the board | substrate attachment surface 111 from the light irradiation direction side, (b) The figure which looked at the board | substrate through-hole 133 provided in the LED board 130 from the light irradiation direction side. It is. ブッシュ132の当接部132aの形状のバリエーション(a)(b)を示す図である。It is a figure which shows the variation (a) (b) of the shape of the contact part 132a of the bush 132. FIG. LED基板130の周辺部を押さえる押さえ枠150の取付構造を示す図である。It is a figure which shows the attachment structure of the holding frame 150 which hold | suppresses the peripheral part of LED board 130. FIG. 実施の形態1に係る照明器具100を光の照射方向から見た図である。It is the figure which looked at the lighting fixture 100 which concerns on Embodiment 1 from the irradiation direction of light. LED140を覆うカバ−160の取付構造を示す図である。It is a figure which shows the attachment structure of the cover 160 which covers LED140.

実施の形態1.
図1は、本実施の形態に係る照明器具100の斜視図である。図2は、本実施の形態に係る照明器具100の分解斜視図である。図1及び図2を用いて、本実施の形態に係る照明器具100の全体構成について説明する。
Embodiment 1 FIG.
FIG. 1 is a perspective view of a lighting fixture 100 according to the present embodiment. FIG. 2 is an exploded perspective view of the lighting fixture 100 according to the present embodiment. The whole structure of the lighting fixture 100 which concerns on this Embodiment is demonstrated using FIG.1 and FIG.2.

図1に示す照明器具100は、例えば、天井などの取付面に埋め込まれた状態で使用される天井埋め込み型の照明器具(ダウンライト)である。   A lighting fixture 100 shown in FIG. 1 is, for example, a ceiling-embedded lighting fixture (downlight) used in a state of being embedded in a mounting surface such as a ceiling.

図2に示すように、照明器具100は、放熱部110、絶縁シート120、LED基板130、押さえ枠150、カバー160、反射部170を備える。   As shown in FIG. 2, the luminaire 100 includes a heat dissipating unit 110, an insulating sheet 120, an LED substrate 130, a holding frame 150, a cover 160, and a reflecting unit 170.

放熱部110は、LED基板130が取り付けられる基板取付面111を備える。放熱部110は、基板取付面111に取り付けられたLED基板130に実装されたLED140から発せられる熱を放熱するヒートシンクである。基板取付面111の裏側には、LED140から発せられる熱を効率よく放熱するための放熱フィン119が設けられる。放熱部110は、熱を伝達する金属、例えば、アルミニウムにより形成される。   The heat dissipation part 110 includes a board attachment surface 111 to which the LED board 130 is attached. The heat dissipating unit 110 is a heat sink that dissipates heat generated from the LEDs 140 mounted on the LED substrate 130 attached to the substrate attachment surface 111. On the back side of the board mounting surface 111, heat radiating fins 119 for efficiently radiating heat generated from the LEDs 140 are provided. The heat radiating part 110 is formed of a metal that transfers heat, for example, aluminum.

絶縁シート120は、LED基板130と基板取付面111との間に配置される。絶縁シート120は、LED基板130の周縁の断面から露出する金属部分と基板取付面111との間を電気的に絶縁する。絶縁シート120は、LED基板130の周縁の断面から露出する金属部分と基板取付面111との絶縁距離を確保するため、LED基板130よりも大きく形成される。   The insulating sheet 120 is disposed between the LED board 130 and the board mounting surface 111. The insulating sheet 120 electrically insulates between the metal part exposed from the peripheral cross section of the LED substrate 130 and the substrate mounting surface 111. The insulating sheet 120 is formed larger than the LED substrate 130 in order to secure an insulating distance between the metal portion exposed from the cross section of the peripheral edge of the LED substrate 130 and the substrate mounting surface 111.

LED基板130は、光源であるLED140が実装される実装面134と、実装面134の裏側の面である非実装面135(図8参照)とを有する。LED基板130は、例えば、アルミニウム基板である。   The LED substrate 130 has a mounting surface 134 on which the LED 140 that is a light source is mounted, and a non-mounting surface 135 (see FIG. 8) that is the back surface of the mounting surface 134. The LED substrate 130 is, for example, an aluminum substrate.

基板取付ねじ131(固定ねじ)は、LED基板130の所定の箇所を基板取付面111に固定するためのねじである。基板取付ねじ131は、経年劣化が少なく信頼性の高い金属性のねじである。ブッシュ132は、絶縁材により形成されており、基板取付ねじ131の一部を覆って、基板取付ねじ131の絶縁(絶縁距離)を確保するための部材である。   The board mounting screw 131 (fixing screw) is a screw for fixing a predetermined portion of the LED board 130 to the board mounting surface 111. The board mounting screw 131 is a highly reliable metal screw with little deterioration over time. The bush 132 is formed of an insulating material, and is a member that covers a part of the board mounting screw 131 and secures insulation (insulation distance) of the board mounting screw 131.

LED基板130は、ブッシュ132と基板取付ねじ131のねじ軸部131b(ねじ棒)とを貫通させる基板貫通孔133を中央部に有する。本実施の形態では、LED基板130の中央部分を基板取付面111に固定する場合について説明するが、LED基板130の中央部分以外の箇所を基板取付面111に固定してもよい。基板取付面111に固定するLED基板130上の位置に関わらず、本実施の形態を適用することができる。   The LED substrate 130 has a substrate through-hole 133 in the center portion through which the bush 132 and the screw shaft portion 131b (screw rod) of the substrate mounting screw 131 are passed. In the present embodiment, a case where the central portion of the LED substrate 130 is fixed to the substrate mounting surface 111 will be described. However, portions other than the central portion of the LED substrate 130 may be fixed to the substrate mounting surface 111. The present embodiment can be applied regardless of the position on the LED substrate 130 that is fixed to the substrate mounting surface 111.

また、LED基板130上の複数の箇所で基板取付面111に固定してもよい。一カ所の固定箇所につき1つのブッシュ及び1つの基板取付ねじが必要であるため、複数の箇所で固定するためには、複数のブッシュ132と複数の基板取付ねじ131とが必要になる。   Moreover, you may fix to the board | substrate attachment surface 111 in several places on the LED board 130. FIG. Since one bush and one board mounting screw are required for one fixing point, a plurality of bushes 132 and a plurality of board mounting screws 131 are required to fix at a plurality of points.

LED基板130は、実装面134にLED140(光源)を実装する。LED基板130の非実装面135は、基板取付面111と面接触するように取り付けられる。本実施の形態では、非実装面135は、絶縁シート120を介して放熱部110の基板取付面111に当接(面接触)する。   The LED board 130 mounts the LED 140 (light source) on the mounting surface 134. The non-mounting surface 135 of the LED substrate 130 is attached so as to come into surface contact with the substrate attachment surface 111. In the present embodiment, the non-mounting surface 135 comes into contact (surface contact) with the substrate mounting surface 111 of the heat radiating portion 110 via the insulating sheet 120.

上述したように、絶縁シート120は、LED基板130の周縁の断面から露出する金属部分と基板取付面111との絶縁距離を確保するために用いられる。しかし、例えば、LED基板130の周縁の断面から金属部分が露出しないようにコーティングする等の加工を施すことにより、絶縁シート120を省くことができる場合がある。以下の説明において、「非実装面135と基板取付面111とが面接触する」、「非実装面135と基板取付面111とが当接する」、「非実装面135と基板取付面111とが密着する」等と記載した場合には、非実装面135と基板取付面111との間に絶縁シート120が配置されている場合もある。非実装面135と基板取付面111との間は、絶縁シート120あるいはコーティング加工等により絶縁されていることが前提である。   As described above, the insulating sheet 120 is used to secure an insulating distance between the metal portion exposed from the cross section of the peripheral edge of the LED substrate 130 and the substrate mounting surface 111. However, for example, the insulating sheet 120 may be omitted by performing processing such as coating so that the metal portion is not exposed from the cross section of the peripheral edge of the LED substrate 130. In the following description, “the non-mounting surface 135 and the board mounting surface 111 are in surface contact”, “the non-mounting surface 135 and the board mounting surface 111 are in contact”, “the non-mounting surface 135 and the board mounting surface 111 are In the case of “contacting” or the like, the insulating sheet 120 may be disposed between the non-mounting surface 135 and the board mounting surface 111. It is assumed that the non-mounting surface 135 and the board mounting surface 111 are insulated by the insulating sheet 120 or a coating process.

LED基板130の非実装面135と放熱部110の基板取付面111とは、面接触するとともに熱接続している。基板取付面111は、LED基板130に実装されているLED140から発生する熱を受け取る。そして、基板取付面111で受け取られた熱は、放熱部110の放熱フィン119から放熱される。このとき、基板取付面111がLED140から発生する熱を効率よく受け取ることができるように、基板取付面111とLED基板130の非実装面135とはできるだけ密着させることが好ましい。絶縁シート120を介して非実装面135と基板取付面111とが取り付けられている場合には、非実装面135と絶縁シート120とを密着させるとともに絶縁シート120と基板取付面と111とを密着させ、非実装面135から基板実装面111への熱伝導の伝導効率を向上させることが好ましい。   The non-mounting surface 135 of the LED substrate 130 and the substrate mounting surface 111 of the heat dissipating part 110 are in surface contact and thermally connected. The board mounting surface 111 receives heat generated from the LEDs 140 mounted on the LED board 130. The heat received by the board mounting surface 111 is radiated from the radiating fins 119 of the radiating unit 110. At this time, it is preferable that the board mounting surface 111 and the non-mounting surface 135 of the LED board 130 are as close as possible so that the board mounting surface 111 can efficiently receive the heat generated from the LEDs 140. When the non-mounting surface 135 and the substrate mounting surface 111 are attached via the insulating sheet 120, the non-mounting surface 135 and the insulating sheet 120 are brought into close contact with each other, and the insulating sheet 120 and the substrate mounting surface and 111 are brought into close contact with each other. It is preferable to improve the conduction efficiency of heat conduction from the non-mounting surface 135 to the substrate mounting surface 111.

押さえ枠150は、LED基板130のLED140が配置される開口部を有するリング状(環状)の枠である。押さえ枠150は、LED基板130の実装面134の周縁近傍を基板取付面111方向に押し付けながら基板取付面111に固定される。これにより、LED基板130の周縁近傍を基板取付面111に固定させる。押さえ枠150は、開口部にLED140が位置するようにLED140の周囲に配置される。   The holding frame 150 is a ring-shaped (annular) frame having an opening in which the LED 140 of the LED substrate 130 is disposed. The holding frame 150 is fixed to the board mounting surface 111 while pressing the vicinity of the periphery of the mounting surface 134 of the LED board 130 toward the board mounting surface 111. As a result, the vicinity of the periphery of the LED substrate 130 is fixed to the substrate mounting surface 111. The holding frame 150 is disposed around the LED 140 so that the LED 140 is positioned in the opening.

カバー160は、押さえ枠150の開口部に位置するLED140を覆うように基板取付面111に固定される。   The cover 160 is fixed to the board mounting surface 111 so as to cover the LED 140 located at the opening of the holding frame 150.

反射部170は、光の照射方向に広がって形成される反射板175と、光の照射方向の反対側に形成された開口(底部開口174)と、反射板175の光の照射方向側の端部に設けられた化粧枠176とを備える。また、反射部170は、放熱部110を固定する放熱部固定部173と、照明器具100を天井面等に設けられた取り付け孔に固定するための板バネ171及び止め具172とを備える。   The reflection unit 170 includes a reflection plate 175 formed so as to spread in the light irradiation direction, an opening (bottom opening 174) formed on the opposite side of the light irradiation direction, and an end of the reflection plate 175 on the light irradiation direction side. And a decorative frame 176 provided in the section. Moreover, the reflection part 170 is provided with the heat radiating part fixing | fixed part 173 which fixes the heat radiating part 110, and the leaf | plate spring 171 and the stopper 172 for fixing the lighting fixture 100 to the attachment hole provided in the ceiling surface etc.

次に、図3〜図8を用いて、LED基板130を放熱部110の基板取付面111に取り付ける取付構造について説明する。   Next, an attachment structure for attaching the LED substrate 130 to the substrate attachment surface 111 of the heat radiating portion 110 will be described with reference to FIGS.

図3は、本実施の形態に係る照明器具100において、絶縁シート120を基板取付面111に取り付ける取付構造を示す図である。図4は、本実施の形態に係る照明器具100において、基板取付面111にLED基板130を取り付ける取付構造を示す図である。図5は、本実施の形態に係る照明器具100において、基板取付面111に絶縁シート120及びLED基板130が取り付けられた状態を示す図である。   FIG. 3 is a diagram showing a mounting structure for mounting the insulating sheet 120 to the board mounting surface 111 in the lighting fixture 100 according to the present embodiment. FIG. 4 is a diagram showing an attachment structure for attaching the LED substrate 130 to the substrate attachment surface 111 in the luminaire 100 according to the present embodiment. FIG. 5 is a diagram showing a state where the insulating sheet 120 and the LED board 130 are attached to the board attachment surface 111 in the lighting fixture 100 according to the present embodiment.

図3に示すように、絶縁シート120の中央部には、ブッシュ132(図2参照)及び基板取付ねじ131(図2参照)を通過させるためのシートねじ孔122が形成される。絶縁シート120の周縁近傍には、絶縁シート120を基板取付面に取り付ける際の位置決めに用いるシート位置決め孔121が設けられる。   As shown in FIG. 3, a sheet screw hole 122 for allowing the bush 132 (see FIG. 2) and the board mounting screw 131 (see FIG. 2) to pass through is formed in the central portion of the insulating sheet 120. In the vicinity of the periphery of the insulating sheet 120, a sheet positioning hole 121 used for positioning when the insulating sheet 120 is attached to the substrate mounting surface is provided.

基板取付面111は、絶縁シート120のシートねじ孔122に対応する位置に、凹部112を備える。また、基板取付面111は、絶縁シート120のシート位置決め孔121に対応する位置に、シート位置決め孔121に挿入されるシート位置決め突起113を備える。   The board mounting surface 111 includes a recess 112 at a position corresponding to the sheet screw hole 122 of the insulating sheet 120. Further, the board mounting surface 111 includes a sheet positioning protrusion 113 inserted into the sheet positioning hole 121 at a position corresponding to the sheet positioning hole 121 of the insulating sheet 120.

図4に示すように、絶縁シート120は、シート位置決め孔121に基板取付面111のシート位置決め突起113が挿入されることにより、基板取付面111上で位置決めされる。そして、位置決めされた絶縁シート120の上面(表面)にLED基板130が配置される。   As shown in FIG. 4, the insulating sheet 120 is positioned on the substrate mounting surface 111 by inserting the sheet positioning protrusion 113 of the substrate mounting surface 111 into the sheet positioning hole 121. Then, the LED substrate 130 is disposed on the upper surface (front surface) of the positioned insulating sheet 120.

LED基板130の実装面134には、複数のLED140が略正方形をなすように配置される(図12参照)。また、LED基板130の実装面134には、電源装置などと接続するためのコネクタ136が配置される。   A plurality of LEDs 140 are arranged on the mounting surface 134 of the LED substrate 130 so as to form a substantially square shape (see FIG. 12). A connector 136 for connecting to a power supply device or the like is disposed on the mounting surface 134 of the LED substrate 130.

LED基板130の中央部には、ブッシュ132及び基板取付ねじ131を通過させるための基板貫通孔133が形成される。LED基板130は、ブッシュ132に挿入された基板取付ねじ131により基板取付面111に固定される。   A substrate through hole 133 for allowing the bush 132 and the substrate mounting screw 131 to pass therethrough is formed at the center of the LED substrate 130. The LED board 130 is fixed to the board mounting surface 111 by board mounting screws 131 inserted into the bush 132.

図5に示すように、絶縁シート120とLED基板130との形状は概ね相似関係をなす。上述したように、LED基板130の周縁の断面139には金属部分が露出しており、LED基板130の周縁の断面139と基板取付面111とは絶縁距離を確保する必要がある。そこで、図5に示すように、絶縁シート120は、LED基板130の周縁から所定の長さ以上はみ出すように形成される。所定の長さとは、LED基板130の周縁と基板取付面111との絶縁距離が確保できる最短の長さであり、想定される動作電圧や必要な絶縁強度等により規定される長さである。   As shown in FIG. 5, the shapes of the insulating sheet 120 and the LED substrate 130 are generally similar. As described above, the metal portion is exposed at the cross section 139 at the periphery of the LED substrate 130, and it is necessary to ensure an insulation distance between the cross section 139 at the periphery of the LED substrate 130 and the substrate mounting surface 111. Therefore, as shown in FIG. 5, the insulating sheet 120 is formed so as to protrude beyond a predetermined length from the peripheral edge of the LED substrate 130. The predetermined length is the shortest length that can secure an insulation distance between the peripheral edge of the LED substrate 130 and the substrate mounting surface 111, and is a length defined by an assumed operating voltage, necessary insulation strength, and the like.

図5に示すように、LED基板130の全周囲に、絶縁シート120が所定の長さ以上はみ出している部分(シートはみ出し部123)が存在する。シートはみ出し部123が存在することにより、LED基板130の周縁の断面139と基板取付面111(放熱部110)との絶縁距離が確保されている。   As shown in FIG. 5, there is a portion (sheet protruding portion 123) where the insulating sheet 120 protrudes over a predetermined length around the entire periphery of the LED substrate 130. The presence of the sheet protruding portion 123 ensures an insulation distance between the cross section 139 of the peripheral edge of the LED substrate 130 and the substrate mounting surface 111 (heat radiation portion 110).

図6は、本実施の形態に係る照明器具100におけるブッシュ132及び基板取付ねじ131の斜視図である。図7は、(a)がブッシュ132をQ1方向(図6参照)から見た平面図、(b)がブッシュ132をQ2方向(図6参照)から見た底面図である。図8は、図5のA−A断面の部分拡大図である。図9は、(a)が基板取付面111に形成された凹部112を光の照射方向側から見た図、(b)がLED基板130に設けられた基板貫通孔133を光の照射方向側から見た図である。   FIG. 6 is a perspective view of the bush 132 and the board mounting screw 131 in the lighting fixture 100 according to the present embodiment. 7A is a plan view of the bush 132 viewed from the Q1 direction (see FIG. 6), and FIG. 7B is a bottom view of the bush 132 viewed from the Q2 direction (see FIG. 6). FIG. 8 is a partially enlarged view of the AA cross section of FIG. 9A is a view of the concave portion 112 formed on the substrate mounting surface 111 as viewed from the light irradiation direction side, and FIG. 9B is a light irradiation direction side of the substrate through-hole 133 provided in the LED substrate 130. It is the figure seen from.

まず、図6及び図7を用いて、ブッシュ132及び基板取付ねじ131の構成について説明する。   First, the configuration of the bush 132 and the board mounting screw 131 will be described with reference to FIGS. 6 and 7.

図6に示すように、ブッシュ132は、突出部132cを有する円板形状の当接部132a(当接部品)と、孔が形成された柱形状(筒状)のスペーサー部132b(スペーサー)とを備える。また、基板取付ねじ131は、ねじ頭部131aと、ねじ軸部131bと、おねじ部131cとを備える。おねじ部131cは、ねじ軸部131bの先端部に形成されているが、ねじ軸部131bの外面全体に形成されていてもよい。   As shown in FIG. 6, the bush 132 includes a disk-shaped contact portion 132a (contact component) having a protruding portion 132c, and a columnar (cylindrical) spacer portion 132b (spacer) in which holes are formed. Is provided. The board mounting screw 131 includes a screw head 131a, a screw shaft portion 131b, and a male screw portion 131c. The male screw portion 131c is formed at the tip of the screw shaft portion 131b, but may be formed on the entire outer surface of the screw shaft portion 131b.

当接部132a(当接部品)は、絶縁材により形成され、当接部表面132i(表面)と当接部裏面132f(裏面)とを有する円板状である。当接部132aは、ねじ軸部131bを貫通させるとともにねじ頭部131aを係止する円板貫通孔132j(ねじ穴)を有する。円板貫通孔132jの径は、ねじ頭部131aの外径よりも小さく、ねじ軸部131bの外径よりも大きい。   The contact portion 132a (contact component) is formed of an insulating material and has a disk shape having a contact portion surface 132i (front surface) and a contact portion back surface 132f (back surface). The contact portion 132a has a disk through hole 132j (screw hole) that allows the screw shaft portion 131b to pass therethrough and locks the screw head portion 131a. The diameter of the disc through hole 132j is smaller than the outer diameter of the screw head 131a and larger than the outer diameter of the screw shaft portion 131b.

スペーサー部132b(スペーサー)は、筒状であり、絶縁材により形成され、内部にねじ軸部131bを挿入するとともにねじ軸部131bを貫通させる挿入孔132kを有する。挿入孔132kの径は、円板貫通孔132jの径と略同一である。   The spacer part 132b (spacer) is cylindrical and is formed of an insulating material. The spacer part 132b (spacer) has an insertion hole 132k for inserting the screw shaft part 131b and penetrating the screw shaft part 131b. The diameter of the insertion hole 132k is substantially the same as the diameter of the disc through hole 132j.

スペーサー部132bは、基板取付ねじ131のねじ軸部131bの外周面を覆って、基板取付ねじ131のねじ軸部131bの絶縁距離を確保する。LED基板130の基板貫通孔133の縁部は、断面となっており金属(例えば、アルミニウム等)が露出する。この基板貫通孔133の縁部断面を孔断面133aとする(図8参照)。スペーサー部132bは、基板貫通孔133を貫通するねじ軸部131bの外周面を覆って、基板取付ねじ131のねじ軸部131bとLED基板130の基板貫通孔133の縁部断面(孔断面133a)との絶縁を確保する。   The spacer part 132 b covers the outer peripheral surface of the screw shaft part 131 b of the board mounting screw 131 and secures an insulation distance of the screw shaft part 131 b of the board mounting screw 131. The edge of the substrate through-hole 133 of the LED substrate 130 has a cross-section, and a metal (for example, aluminum) is exposed. An edge cross section of the substrate through hole 133 is a hole cross section 133a (see FIG. 8). The spacer portion 132b covers the outer peripheral surface of the screw shaft portion 131b that passes through the substrate through hole 133, and the edge cross section (hole cross section 133a) of the screw shaft portion 131b of the substrate mounting screw 131 and the substrate through hole 133 of the LED substrate 130. Ensure insulation with.

スペーサー部132bは、円板貫通孔132jと挿入孔132kとが連通するように、一端部が当接部裏面132fに連結されている。スペーサー部132bの他端部(端部132d)の端面は、挿入孔132kに連通する孔を有する。当接部132aとスペーサー部132bとは別部品でもよいし、一体成形されていてもよい。一体成形されていることにより、部品の点数を減らすことができるとともに、作業者が扱いやすく作業性が向上する。   One end of the spacer portion 132b is connected to the contact portion back surface 132f so that the disc through-hole 132j and the insertion hole 132k communicate with each other. The end surface of the other end portion (end portion 132d) of the spacer portion 132b has a hole communicating with the insertion hole 132k. The contact part 132a and the spacer part 132b may be separate parts or may be integrally formed. By being integrally formed, the number of parts can be reduced, and the operator can easily handle and workability is improved.

本実施の形態では、ブッシュ132は、当接部132aとスペーサー部132bとが一体成形されているものとする。当接部132aの円板貫通孔132jとスペーサー部132bの挿入孔132kとが連通してできた孔をブッシュねじ挿入孔132eとする。   In the present embodiment, it is assumed that the bush 132 is integrally formed with the contact portion 132a and the spacer portion 132b. A hole formed by communicating the disc through hole 132j of the contact portion 132a and the insertion hole 132k of the spacer portion 132b is referred to as a bush screw insertion hole 132e.

図6及び図7(a)に示すように、当接部132aは、ブッシュねじ挿入孔132eの周囲の当接部表面132iが環状に突き出て形成された突出部132cを備える。本実施の形態では、突出部132cは、当接部表面132iの周縁近傍に形成されているが、周縁よりも内側に形成されていてもよい。例えば、図7(a)に2点鎖線で記載した位置に突出部132c’を設けても構わない。   As shown in FIGS. 6 and 7A, the contact portion 132a includes a protruding portion 132c formed by protruding the contact portion surface 132i around the bush screw insertion hole 132e in an annular shape. In the present embodiment, the protrusion 132c is formed in the vicinity of the periphery of the contact surface 132i, but may be formed inside the periphery. For example, the protrusion 132c 'may be provided at a position indicated by a two-dot chain line in FIG.

また、図7(b)に示すように、スペーサー部132bは、外周面の一部が縦に切りかかれている。スペーサー部132bの断面は、円形ではなく、円周のうちの対向する円弧部分132l’,132m’が切り欠かれた形状となっている。スペーサー部132bの外周面の切り欠かれた部分を、切り欠き部132l,132mとする。切り欠き部132lと切り欠き部132mとは中心線lに対して線対称に設けられる。   Moreover, as shown in FIG.7 (b), as for the spacer part 132b, a part of outer peripheral surface is cut vertically. The cross section of the spacer portion 132b is not circular, but has a shape in which arc portions 132l 'and 132m' facing each other on the circumference are notched. The notched portions of the outer peripheral surface of the spacer portion 132b are referred to as notched portions 132l and 132m. The notch portion 132l and the notch portion 132m are provided symmetrically with respect to the center line l.

次に、図8を用いて、LED基板130の取付構造の詳細について説明する。   Next, the details of the mounting structure of the LED substrate 130 will be described with reference to FIG.

上述したように、LED基板130は、LED140が実装される実装面134と実装面134の裏側の面である非実装面135とを有し、略中央部に基板貫通孔133を有する。   As described above, the LED substrate 130 has the mounting surface 134 on which the LEDs 140 are mounted and the non-mounting surface 135 that is the back surface of the mounting surface 134, and has the substrate through-hole 133 in the substantially central portion.

図8に示すように、放熱部110の基板取付面111には、絶縁シート120が載置され、その上にLED基板130が載置される。基板取付面111は、LED基板130の非実装面135と絶縁シート120を介して面接触する。なお、上述したように、絶縁シート120は省略可能である。   As shown in FIG. 8, the insulating sheet 120 is placed on the board attachment surface 111 of the heat radiating section 110, and the LED board 130 is placed thereon. The substrate mounting surface 111 is in surface contact with the non-mounting surface 135 of the LED substrate 130 via the insulating sheet 120. As described above, the insulating sheet 120 can be omitted.

基板取付面111には、LED140で発生する熱が伝熱される。基板取付面111に伝熱された熱は、上述した放熱フィン119(図5参照)から放熱される。LED140で発生する熱を効率よく放熱するためには、LED基板130と基板取付面111との密着性を高め、LED基板130から放熱部110に効率よく伝熱することが必要となる。   Heat generated by the LED 140 is transferred to the board mounting surface 111. The heat transferred to the board mounting surface 111 is radiated from the above-described radiating fin 119 (see FIG. 5). In order to efficiently dissipate the heat generated in the LED 140, it is necessary to improve the adhesion between the LED substrate 130 and the substrate mounting surface 111 and to efficiently transfer heat from the LED substrate 130 to the heat dissipating unit 110.

図8に示すように、凹部112は、LED基板130の基板貫通孔133に対応する位置に設けられる。凹部112は、基板取付面111上に形成された円形の凹部開口112cから略半球状に凹んで形成される。凹部112の内面(凹部内面112d)は略半球形状(椀形状)をなす。凹部開口112cは、基板貫通孔133より大きく当接部132aよりも小さい。   As shown in FIG. 8, the recess 112 is provided at a position corresponding to the substrate through hole 133 of the LED substrate 130. The recess 112 is formed in a substantially hemispherical shape from a circular recess opening 112 c formed on the substrate mounting surface 111. The inner surface of the recess 112 (the recess inner surface 112d) has a substantially hemispherical shape (a bowl shape). The recess opening 112c is larger than the substrate through-hole 133 and smaller than the contact portion 132a.

凹部112の底部には、ブッシュ132のスペーサー部132bの端部132dを嵌め込む凹みであるブッシュ位置決め部112bが形成される。また、ブッシュ位置決め部112bの底面には、スペーサー部132bの端部132dから露出する基板取付ねじ131のおねじ部131cと螺合するめねじ部112aが設けられる。めねじ部112aは、ブッシュ位置決め部112bの底面の略中央部に形成された円柱形の凹みの内面に、ねじ切りを設けることにより形成される。   A bush positioning portion 112b, which is a recess into which the end portion 132d of the spacer portion 132b of the bush 132 is fitted, is formed at the bottom of the recess 112. In addition, a female screw portion 112a is provided on the bottom surface of the bush positioning portion 112b. The female screw portion 112a is screwed with the male screw portion 131c exposed from the end portion 132d of the spacer portion 132b. The female thread portion 112a is formed by providing threading on the inner surface of a cylindrical recess formed at the substantially central portion of the bottom surface of the bush positioning portion 112b.

LED基板130は、基板貫通孔133が凹部開口112cに対応するように、絶縁シート120の表面(上面)に載置される。そして、ブッシュ132は、スペーサー部132bの端部132dが基板貫通孔133と絶縁シート120のシートねじ孔122とを貫通し、凹部112の底部に形成されたブッシュ位置決め部112bに嵌め込まれる。   The LED substrate 130 is placed on the surface (upper surface) of the insulating sheet 120 so that the substrate through hole 133 corresponds to the recess opening 112c. The bush 132 is fitted into a bush positioning portion 112 b formed at the bottom of the recess 112, with the end portion 132 d of the spacer portion 132 b passing through the substrate through hole 133 and the sheet screw hole 122 of the insulating sheet 120.

ここで、ブッシュ132の位置決め構造、及びLED基板130の位置決め構造について説明する。   Here, the positioning structure of the bush 132 and the positioning structure of the LED substrate 130 will be described.

図9(a)は、凹部112を光の照射方向側から見た図である。基板取付面111には円形の凹部開口112cが形成され、凹部開口112cから底部に向かって凹部内面112dが半球状を形成するように凹んでいる。   FIG. 9A is a view of the recess 112 as seen from the light irradiation direction side. A circular recess opening 112c is formed in the substrate mounting surface 111, and the recess inner surface 112d is recessed from the recess opening 112c toward the bottom so as to form a hemispherical shape.

凹部112は、底部に、ブッシュ132のスペーサー部132bの断面形状と略同一形状に凹んだブッシュ位置決め部112bを備える。ブッシュ位置決め部112bは、スペーサー部132bの断面形状と略同一形状の凹みであるが、スペーサー部132bの端部132dを嵌め込むことができる程度にスペーサー部132bの断面形状よりやや大きく形成される。   The recessed portion 112 includes a bush positioning portion 112b that is recessed in a shape substantially the same as the cross-sectional shape of the spacer portion 132b of the bush 132 at the bottom. The bush positioning portion 112b is a recess having substantially the same shape as the cross-sectional shape of the spacer portion 132b, but is slightly larger than the cross-sectional shape of the spacer portion 132b to such an extent that the end portion 132d of the spacer portion 132b can be fitted.

スペーサー部132bの断面形状は、図7(b)に示したように、円形の一部がカットされた切り欠き部132l,132mを備える形状なので、同一形状のブッシュ位置決め部112bに嵌め込まれるとブッシュ132の先端(スペーサー部132bの端部132d)がブッシュ位置決め部112bの内部で回転することがなく、固定される。これにより、ブッシュ132が回転することなく位置決めされる。   As shown in FIG. 7B, the cross-sectional shape of the spacer portion 132b is a shape including notches 132l and 132m in which a part of the circle is cut. Therefore, when the spacer portion 132b is fitted into the bush positioning portion 112b having the same shape, the bush The tip of 132 (the end 132d of the spacer portion 132b) is fixed without rotating inside the bush positioning portion 112b. Thereby, the bush 132 is positioned without rotating.

スペーサー部132bの断面形状は、回転しないような形状であれば、その他の形状でもよい。例えば、キー溝つき、楕円、長円、その他の形状でもよい。スペーサー部132bの断面形状は、ブッシュ位置決め部112b内で回転しないような形状であることで、ブッシュ132を取り付ける方向が定まり(ブッシュの取付の方向性が発生し)、組み立て性の向上及び誤取付の防止が可能となる。   The cross-sectional shape of the spacer portion 132b may be other shapes as long as it does not rotate. For example, it may have a key groove, an ellipse, an ellipse, or other shapes. The cross-sectional shape of the spacer portion 132b is such that it does not rotate within the bush positioning portion 112b, so that the direction in which the bush 132 is attached is determined (the direction of attachment of the bush occurs), the assembly is improved, and the erroneous attachment Can be prevented.

図9(b)は、LED基板130に設けられた基板貫通孔133を光の照射方向側から見た図である。基板貫通孔133の形状は、スペーサー部132bの断面形状と略同一である。基板貫通孔133は、スペーサー部132bの断面形状と略同一の孔であるが、スペーサー部132bを貫通させることができる程度にスペーサー部132bの断面形状よりやや大きく形成される。   FIG. 9B is a view of the substrate through hole 133 provided in the LED substrate 130 as viewed from the light irradiation direction side. The shape of the substrate through hole 133 is substantially the same as the cross-sectional shape of the spacer portion 132b. The substrate through-hole 133 is substantially the same as the cross-sectional shape of the spacer portion 132b, but is formed slightly larger than the cross-sectional shape of the spacer portion 132b to the extent that the spacer portion 132b can be penetrated.

図4に示すように、作業者がLED基板130を基板取付面111に配置する場合には、位置決めされた絶縁シート120のシートねじ孔122の位置や、コネクタ136の位置などを目安に、絶縁シート120にLED基板130を載置する。そして、作業者は、ブッシュ132のスペーサー部132bをLED基板130の基板貫通孔133に貫通させ、ブッシュ132の端部132dをブッシュ位置決め部112bに嵌め込む。   As shown in FIG. 4, when the operator places the LED board 130 on the board mounting surface 111, the insulation is performed with reference to the position of the sheet screw hole 122 of the positioned insulating sheet 120 and the position of the connector 136. The LED substrate 130 is placed on the sheet 120. Then, the operator passes the spacer portion 132b of the bush 132 through the substrate through hole 133 of the LED substrate 130, and fits the end portion 132d of the bush 132 into the bush positioning portion 112b.

ブッシュ132の端部132dをブッシュ位置決め部112bに嵌め込むためには、作業者がブッシュ132を押し込む押力を与える動作をしなければならない。作業者がこの動作を行うことにより、ブッシュ132の端部132dがブッシュ位置決め部112bに嵌め込まれたかどうかを目視することができないが、作業者の手の感触等によりブッシュ132の端部132dがブッシュ位置決め部112bに嵌め込まれたかどうかを知ることができる。   In order to fit the end portion 132d of the bush 132 into the bush positioning portion 112b, an operator must perform an operation of applying a pressing force for pushing the bush 132. By performing this operation, the operator cannot visually check whether the end 132d of the bush 132 is fitted into the bush positioning portion 112b. However, the end 132d of the bush 132 is It can be known whether or not it is fitted in the positioning portion 112b.

図9(b)に示すように、基板貫通孔133の形状は、スペーサー部132bの断面形状と略同一形状である。基板貫通孔133を貫通したスペーサー部132bは、基板貫通孔133内で回転することができない形状であるので、スペーサー部132bが固定されれば、スペーサー部132bが貫通するLED基板130も固定される。   As shown in FIG. 9B, the shape of the substrate through hole 133 is substantially the same as the cross-sectional shape of the spacer portion 132b. Since the spacer part 132b penetrating the substrate through-hole 133 cannot be rotated in the substrate through-hole 133, if the spacer part 132b is fixed, the LED substrate 130 through which the spacer part 132b passes is also fixed. .

以上のように、ブッシュ132の端部132dがブッシュ位置決め部112bに嵌め込まれて位置決めされることにより、LED基板130も位置決めされる。   As described above, the end portion 132d of the bush 132 is fitted into the bush positioning portion 112b and positioned, whereby the LED substrate 130 is also positioned.

図8に戻り、LED基板130の取付構造の説明を続ける。ブッシュ132が基板貫通孔133を貫通し、絶縁シート120のシートねじ孔122を貫通し、スペーサー部132bの端部132dは凹部112の底部に形成された凹みであるブッシュ位置決め部112bに嵌め込まれると、当接部裏面132fがLED基板130の実装面134の基板貫通孔133の周囲の面に当接する。   Returning to FIG. 8, the description of the mounting structure of the LED substrate 130 will be continued. When the bush 132 passes through the board through-hole 133 and the sheet screw hole 122 of the insulating sheet 120, the end 132 d of the spacer portion 132 b is fitted into the bush positioning portion 112 b which is a recess formed at the bottom of the recess 112. The contact portion back surface 132 f contacts the surface around the substrate through-hole 133 of the mounting surface 134 of the LED substrate 130.

その後、基板取付ねじ131がブッシュねじ挿入孔132eに挿入される。基板取付ねじ131は、おねじ部131cがブッシュねじ挿入孔132eを貫通しめねじ部112aと螺合することにより、当接部裏面132fがLED基板130の実装面134の基板貫通孔133の周囲の面を押し付けながら、LED基板130を基板取付面111に固定する。   Thereafter, the board mounting screw 131 is inserted into the bush screw insertion hole 132e. In the board mounting screw 131, the male screw part 131c passes through the bush screw insertion hole 132e and is screwed with the female screw part 112a, so that the contact part back surface 132f is around the board through hole 133 of the mounting surface 134 of the LED board 130. The LED substrate 130 is fixed to the substrate mounting surface 111 while pressing the surface.

図8に示すように、基板取付ねじ131のねじ軸部131bが、ブッシュねじ挿入孔132eを貫通した場合、ねじ軸部131bの先端のおねじ部131cの最大露出長はL5の長さであるとする。おねじ部131cとめねじ部112aとが螺合することにより、ねじ頭部131aがブッシュ132の当接部132aを光源基板側に押し付けるためには、めねじ部112aの深さL6は、おねじ部131cの最大露出長L5よりも深く形成する必要がある。   As shown in FIG. 8, when the screw shaft portion 131b of the board mounting screw 131 passes through the bush screw insertion hole 132e, the maximum exposed length of the male screw portion 131c at the tip of the screw shaft portion 131b is the length of L5. And In order for the screw head 131a to press the contact portion 132a of the bush 132 against the light source board side by screwing the male screw portion 131c and the female screw portion 112a, the depth L6 of the female screw portion 112a is It is necessary to form deeper than the maximum exposure length L5 of the part 131c.

また、ねじ頭部131aがブッシュ132の当接部132aを押し付け過ぎると、LED基板130の基板貫通孔133近傍が変形するおそれがある。LED基板130が変形すると、変形した部分周辺のLED基板130と基板取付面111との密着性が低下してしまう。   Further, if the screw head 131a presses the contact portion 132a of the bush 132 too much, the vicinity of the substrate through hole 133 of the LED substrate 130 may be deformed. When the LED substrate 130 is deformed, the adhesion between the LED substrate 130 around the deformed portion and the substrate mounting surface 111 is lowered.

そこで、ねじ頭部131aがブッシュ132の当接部132aを押し付けすぎてしまわないように、スペーサー部132bの高さL7を調整する。スペーサー部132bの高さL7は、LED基板130の実装面134からブッシュ位置決め部112bの底面までの長さL8と略同一であることが好ましい。ここで、スペーサー部132bの高さL7と実装面134からブッシュ位置決め部112bの底面までのL8とが略同一長であるとすると、スペーサー部132bがつっかえ棒となってしまい、基板取付ねじ131を押し込むことができなくなるとも考えられる。しかし、ブッシュ132は、例えば、ナイロンやポリカーボネード等の樹脂であるため、弾力性を有しており、基板取付ねじ131を多少押し込むことができるとともに、押し込みすぎを防止することができる。   Therefore, the height L7 of the spacer portion 132b is adjusted so that the screw head portion 131a does not press the contact portion 132a of the bush 132 too much. The height L7 of the spacer portion 132b is preferably substantially the same as the length L8 from the mounting surface 134 of the LED substrate 130 to the bottom surface of the bush positioning portion 112b. Here, if the height L7 of the spacer portion 132b and L8 from the mounting surface 134 to the bottom surface of the bush positioning portion 112b are substantially the same length, the spacer portion 132b becomes a refill rod, and the board mounting screw 131 is attached. It may be impossible to push in. However, since the bush 132 is made of a resin such as nylon or polycarbonate, for example, the bush 132 has elasticity, so that the board mounting screw 131 can be pushed in a little while preventing excessive push-in.

なお、スペーサー部132bの高さL7を、実装面134からブッシュ位置決め部112bの底面までの長さL8よりやや短くしてもよい。この場合、図8に示すように、基板取付ねじ131を締め込んでいない状態では、ブッシュ位置決め部112bの底面に微小な隙間190が生じる。この隙間190が埋まるくらいに基板取付ねじ131を締め込むことにより、必要以上に基板取付ねじ131で当接部132aを押し付けることなく、LED基板130と基板取付面111との密着性を高めることができる。   The height L7 of the spacer portion 132b may be slightly shorter than the length L8 from the mounting surface 134 to the bottom surface of the bush positioning portion 112b. In this case, as shown in FIG. 8, when the board mounting screw 131 is not tightened, a minute gap 190 is generated on the bottom surface of the bush positioning portion 112b. By tightening the board mounting screw 131 to such an extent that the gap 190 is filled, the adhesion between the LED board 130 and the board mounting surface 111 can be improved without pressing the contact portion 132a with the board mounting screw 131 more than necessary. it can.

次に、ブッシュ132の当接部132aを用いて、ねじ頭部131aとLED基板130の実装面134との絶縁距離を確保する構造について説明する。なお、器具の高出力化に伴いLED140の数が増加し、実装面134における導体パターンの配設密度が高いことから、ねじ頭部131aと実装面134との絶縁距離を確保するものとする。   Next, a structure for securing an insulation distance between the screw head 131a and the mounting surface 134 of the LED substrate 130 using the abutting portion 132a of the bush 132 will be described. In addition, since the number of LEDs 140 increases with the increase in the output of the instrument and the arrangement density of the conductor pattern on the mounting surface 134 is high, the insulation distance between the screw head 131a and the mounting surface 134 is ensured.

ねじ頭部131aと実装面134との絶縁距離を確保するためには、ねじ頭部131aと実装面134との空間距離を、絶縁(絶縁距離)を確保することができる最短の距離以上とする必要がある。ここで、2点間の絶縁距離を確保するための空間距離とは、沿面距離を含むものとする。   In order to ensure the insulation distance between the screw head 131a and the mounting surface 134, the spatial distance between the screw head 131a and the mounting surface 134 is set to be equal to or greater than the shortest distance that can ensure insulation (insulation distance). There is a need. Here, the spatial distance for securing the insulation distance between two points includes the creepage distance.

図8に示すように、ねじ頭部131aのP1点と実装面134のP4点とが、ねじ頭部131aと実装面134とを結ぶ最短の点であるとする。ここで、ねじ頭部131aのP1点と実装面134のP4点との絶縁距離を確保するための空間距離とは、沿面距離を含むものとする。ねじ頭部131aのP1点と実装面134のP4点との間の空間距離(沿面距離を含む)は、(P1−P2間の距離)+(P2−P3間の距離(沿面距離))+(P3−P4間の距離(沿面距離))=L2(P1−P4間の空間距離(沿面距離を含む))である。絶縁(絶縁距離)を確保することができる最短の空間距離(沿面距離を含む)(所定の距離)は、想定される動作電圧や必要な絶縁強度等により様々な規格値が規定されている。   As shown in FIG. 8, it is assumed that the point P1 of the screw head 131a and the point P4 of the mounting surface 134 are the shortest points connecting the screw head 131a and the mounting surface 134. Here, the spatial distance for securing the insulation distance between the point P1 of the screw head 131a and the point P4 of the mounting surface 134 includes a creepage distance. The spatial distance (including creepage distance) between the point P1 of the screw head 131a and the point P4 of the mounting surface 134 is (distance between P1 and P2) + (distance between P2 and P3 (creepage distance)) + (Distance between P3 and P4 (creeping distance)) = L2 (Space distance between P1 and P4 (including creepage distance)). Various standard values are defined for the shortest spatial distance (including creepage distance) (predetermined distance) that can ensure insulation (insulation distance) depending on an assumed operating voltage, necessary insulation strength, and the like.

図8に示すように、本実施の形態に係るブッシュ132の当接部132aは、突出部132cを備えているため、突出部132cのない平板状の当接部の場合よりも、(P1−P2間の距離)−(L4の距離)分の空間距離を増加させることができる。   As shown in FIG. 8, the abutting portion 132a of the bush 132 according to the present embodiment is provided with the protruding portion 132c, so that (P1- The spatial distance corresponding to (distance between P2)-(distance of L4) can be increased.

また、本実施の形態に係るブッシュ132の当接部132aは、突出部132cを備えているため、突出部132cのない平板状の当接部の場合よりも、L3の距離分の空間距離(沿面距離)を増加させることができる。   Moreover, since the contact part 132a of the bush 132 which concerns on this Embodiment is provided with the protrusion part 132c, the spatial distance (distance of L3) compared with the case of the flat contact part without the protrusion part 132c ( Creepage distance) can be increased.

なお、当接部132aの面積を大きくするなどして空間距離を増加させることもできるが、当接部132aの面積を大きくすると、実装面134上において、LED140を実装できない領域が増加し、LED140の配置に偏りが生じてしまい、配光にムラが生じる等の虞がある。本実施の形態に係るブッシュ132によれば、当接部132aの面積を小さくして空間距離を増加させることができるので、LED140の配置に与える影響が少ない。   Although the spatial distance can be increased by increasing the area of the contact portion 132a, the area where the LED 140 cannot be mounted increases on the mounting surface 134 when the area of the contact portion 132a is increased. There is a risk that the arrangement of the light will be biased and unevenness in the light distribution will occur. According to the bush 132 according to the present embodiment, the area of the contact portion 132a can be reduced and the spatial distance can be increased, so that the influence on the arrangement of the LEDs 140 is small.

図10は、ブッシュ132の形状のバリエーション(a)(b)を示す図である。   FIG. 10 is a view showing variations (a) and (b) of the shape of the bush 132.

図10(a)は、当接部132aの当接部表面132iが、中央から周縁に向かって、徐々に高くなっていく(徐々に当接部132aの厚さが厚くなっていく)ように形成されている。このように形成することにより、厚さが一定の平板状の当接部の場合よりも、P1−P5間の空間距離を長くすることができる。また、突出部などを形成していないので、製造が容易である。   FIG. 10A shows that the contact part surface 132i of the contact part 132a gradually increases from the center toward the periphery (the thickness of the contact part 132a gradually increases). Is formed. By forming in this way, the spatial distance between P1 and P5 can be made longer than in the case of a flat contact portion having a constant thickness. In addition, since no protrusions are formed, manufacturing is easy.

図10(b)では、当接部132aの当接部表面132iのブッシュねじ挿入孔132eの部分が高く、中央から周縁に向かって、徐々に低くなる(徐々に当接部の厚さが薄くなる)ように、山型、円錐形に形成される。このように形成することにより、厚さが一定の平板状の当接部の場合よりも、P1−P5間の空間距離を長くすることができる。また、図10(b)に示すように、LED140からの光を当接部表面132iが反射するので、反射板としても機能し、発光効率の向上や配光のムラの減少に貢献する。   In FIG. 10B, the bush screw insertion hole 132e portion of the contact portion surface 132i of the contact portion 132a is high and gradually decreases from the center toward the periphery (the thickness of the contact portion gradually decreases). It is formed in a mountain shape and a cone shape. By forming in this way, the spatial distance between P1 and P5 can be made longer than in the case of a flat contact portion having a constant thickness. Further, as shown in FIG. 10B, since the contact portion surface 132i reflects the light from the LED 140, it also functions as a reflector, contributing to improvement in light emission efficiency and reduction in unevenness of light distribution.

また、図7(a)に示すように、当接部表面132iに、突出部132cと突出部132c’との2つの突出部を形成してもよい。これにより、当接部132aの面積を大きくすることなく、空間距離(沿面距離を含む)を増加させることができる。   Further, as shown in FIG. 7A, two protrusions of a protrusion 132c and a protrusion 132c 'may be formed on the contact surface 132i. As a result, the spatial distance (including creepage distance) can be increased without increasing the area of the contact portion 132a.

次に、基板貫通孔133を形成する縁部である孔断面133a(図8参照)と、放熱部110との絶縁距離の確保について説明する。LED基板130の基板貫通孔133を形成する孔断面133aのP6点と凹部内面112dのP7点とを結ぶ距離が、孔断面133aと凹部内面112dとの最短の空間距離であるものとする。   Next, securing the insulation distance between the hole cross section 133a (see FIG. 8), which is the edge forming the substrate through-hole 133, and the heat radiating section 110 will be described. The distance connecting the point P6 of the hole cross section 133a forming the substrate through-hole 133 of the LED substrate 130 and the point P7 of the concave inner surface 112d is the shortest spatial distance between the hole cross section 133a and the concave inner surface 112d.

孔断面133aのP6点と凹部内面112dのP7点との空間距離L1は、孔断面133aと凹部内面112dとの絶縁距離を確保することができる最短の距離以上とする必要がある。この空間距離L1が絶縁距離を確保することができる最短の距離は、器具の出力等により異なる規格値が規定されている。   The spatial distance L1 between the point P6 of the hole cross section 133a and the point P7 of the inner surface 112d of the recess needs to be equal to or longer than the shortest distance that can secure the insulation distance between the hole cross section 133a and the inner surface 112d of the recess. The shortest distance at which the spatial distance L1 can secure the insulation distance is defined as a different standard value depending on the output of the instrument.

凹部112は、孔断面133aのP6点と凹部内面112dのP7点との空間距離L1が、孔断面133aと凹部内面112dとの絶縁を確保することができる最短の距離以上となるように形成される。   The recess 112 is formed such that the spatial distance L1 between the point P6 of the hole cross section 133a and the point P7 of the recess inner surface 112d is equal to or greater than the shortest distance that can ensure insulation between the hole cross section 133a and the recess inner surface 112d. The

本実施の形態では、凹部112の形状は半球状であるが、孔断面133aと凹部内面112dとの最短の空間距離が、絶縁を確保することができる最短の距離以上となることが確保できるような形状であれば、他の形状でもよい。例えば、直方体形状、立方体形状、角錐形状、円錐形状等でもよい。   In the present embodiment, the shape of the recess 112 is hemispherical, but it is possible to ensure that the shortest spatial distance between the hole cross section 133a and the recess inner surface 112d is equal to or greater than the shortest distance that can ensure insulation. Any other shape may be used as long as it is a simple shape. For example, a rectangular parallelepiped shape, a cubic shape, a pyramid shape, a conical shape, or the like may be used.

凹部開口112cの大きさは、当接部132aの大きさよりも小さいことが好ましいが、器具の出力量によっては、孔断面133aと凹部内面112dとの空間距離L1を長く確保する大きい凹部112を設けなければならない場合がある。すると、凹部開口112cが当接部132aよりも大きくなってしまう場合がある。このような場合であっても、スペーサー部132bにより、基板取付ねじ131の過剰な押し込みを防止することができるので、充分に空間距離を確保した凹部112を形成することができる。   The size of the recess opening 112c is preferably smaller than the size of the contact portion 132a. However, depending on the output amount of the instrument, a large recess 112 is provided to ensure a long spatial distance L1 between the hole cross section 133a and the recess inner surface 112d. You may have to. Then, the recess opening 112c may be larger than the contact portion 132a. Even in such a case, the spacer portion 132b can prevent the substrate mounting screw 131 from being excessively pushed, so that the concave portion 112 having a sufficient spatial distance can be formed.

図11は、LED基板130の周辺部を押さえる押さえ枠150の取付構造を示す図である。図12は、本実施の形態に係る照明器具100を光の照射方向から見た図である。図13は、LED140を覆うカバ−160の取付構造を示す図である。   FIG. 11 is a view showing a mounting structure of a holding frame 150 that holds the periphery of the LED substrate 130. FIG. 12 is a view of the luminaire 100 according to the present embodiment as seen from the light irradiation direction. FIG. 13 is a view showing a mounting structure of a cover 160 that covers the LED 140.

図11に示すように、押さえ枠150は、枠開口154と、基板押さえ部155と、ねじ挿入孔152とを備える。押さえ枠150は、ブッシュ132及び基板取付ねじ131により基板取付面111にLED基板130が取り付けられ、LED基板130のコネクタ136に必要なリード線137等が接続された後に、基板取付面111に取り付けられる。押さえ枠150は、LED基板130に実装されているLED140の周囲を押さえて固定するための部材である。   As shown in FIG. 11, the pressing frame 150 includes a frame opening 154, a substrate pressing portion 155, and a screw insertion hole 152. The holding frame 150 is attached to the board attachment surface 111 after the LED board 130 is attached to the board attachment surface 111 by the bush 132 and the board attachment screw 131, and the necessary lead wires 137 and the like are connected to the connector 136 of the LED board 130. It is done. The holding frame 150 is a member for pressing and fixing the periphery of the LED 140 mounted on the LED substrate 130.

押さえ枠150により、LED基板130の周辺部が基板取付面111に押し付けられ、上述したブッシュ132及び基板取付ねじ131により、LED基板130の中央部が基板取付面111に押し付けられるので、LED基板130と基板取付面111との密着性が向上する。   The peripheral portion of the LED substrate 130 is pressed against the substrate mounting surface 111 by the holding frame 150, and the central portion of the LED substrate 130 is pressed against the substrate mounting surface 111 by the bush 132 and the substrate mounting screw 131 described above. And the substrate mounting surface 111 are improved in adhesion.

押さえ枠150は、枠取付ねじ151により、基板取付面111に取り付けられる。押さえ枠150は、枠取付ねじ151の軸部を貫通させるとともに枠取付ねじ151の頭部を係止する貫通孔であるねじ挿入孔152を備える。   The holding frame 150 is attached to the board attachment surface 111 with a frame attachment screw 151. The holding frame 150 includes a screw insertion hole 152 that is a through hole that allows the shaft portion of the frame mounting screw 151 to pass therethrough and locks the head of the frame mounting screw 151.

また、基板取付面111は、押さえ枠150のねじ挿入孔152に対応する位置に、枠取付ねじ151の軸部と螺合する枠取付孔114を備える。本実施の形態では、押さえ枠150は、4本の枠取付ねじ151により取り付けられる。4本の枠取付ねじ151の各々に対応する4つの枠取付孔114は、絶縁シート120の周縁近傍の基板取付面111に設けられる。   The board mounting surface 111 includes a frame mounting hole 114 that is screwed with the shaft portion of the frame mounting screw 151 at a position corresponding to the screw insertion hole 152 of the presser frame 150. In the present embodiment, the holding frame 150 is attached by four frame attachment screws 151. Four frame mounting holes 114 corresponding to each of the four frame mounting screws 151 are provided in the substrate mounting surface 111 near the periphery of the insulating sheet 120.

基板押さえ部155は、枠開口154の周縁から中央に張り出して、LED基板130のLED140近傍を基板取付面111側に押さえ付ける部材である。   The board pressing portion 155 is a member that protrudes from the periphery of the frame opening 154 to the center and presses the vicinity of the LED 140 of the LED board 130 toward the board mounting surface 111 side.

図11に示すように、LED基板130に実装されたLED140は、略正方形をなすように配置されている。   As shown in FIG. 11, the LEDs 140 mounted on the LED substrate 130 are arranged so as to form a substantially square shape.

図12は、本実施の形態に係る照明器具100を光の照射方向から見た図であるが、説明のため、カバー160は省略している。図12に示すように、基板押さえ部155は、枠開口154の円周の4カ所から中央に張り出しており、枠開口154の形状を略正方形としている。押さえ枠150は、略正方形に配置されたLED140の周囲を、略正方形の枠開口154の周縁で押さえることができる。これにより、LED基板130のLED140が配置されている領域をより確実に放熱部110に密着させることができる。   FIG. 12 is a view of the luminaire 100 according to the present embodiment as viewed from the light irradiation direction, but the cover 160 is omitted for the sake of explanation. As shown in FIG. 12, the substrate pressing portion 155 protrudes from the circumference of the frame opening 154 to the center, and the shape of the frame opening 154 is substantially square. The holding frame 150 can hold the periphery of the LED 140 arranged in a substantially square shape with the periphery of the substantially square frame opening 154. Thereby, the area | region where LED140 of LED board 130 is arrange | positioned can be stuck to the thermal radiation part 110 more reliably.

図13は、LED140を覆うカバ−160の取付構造を示す図である。図13に示すように、カバー160は、押さえ枠150の枠開口154の奥に配置されているLED140を覆うように取り付けられる。カバー160は、カバー取付ねじ161とカバー取付ワッシャー162とにより、基板取付面111に取り付けられる。カバー160は、カバー取付ねじ161の軸部を貫通させるとともにカバー取付ねじ161の頭部を係止する貫通孔であるねじ挿入孔163を備える。   FIG. 13 is a view showing a mounting structure of a cover 160 that covers the LED 140. As shown in FIG. 13, the cover 160 is attached so as to cover the LED 140 disposed behind the frame opening 154 of the presser frame 150. The cover 160 is attached to the board attachment surface 111 by a cover attachment screw 161 and a cover attachment washer 162. The cover 160 includes a screw insertion hole 163 that is a through hole that allows the shaft portion of the cover mounting screw 161 to pass therethrough and locks the head of the cover mounting screw 161.

図11に示すように、基板取付面111は、カバー160のねじ挿入孔163に対応する位置に、カバー取付ねじ161と螺合するねじ受け部117を備える。押さえ枠150は、ねじ受け部117を貫通させる貫通孔153を備える。   As shown in FIG. 11, the board mounting surface 111 includes a screw receiving portion 117 that is screwed with the cover mounting screw 161 at a position corresponding to the screw insertion hole 163 of the cover 160. The holding frame 150 includes a through hole 153 through which the screw receiving portion 117 passes.

図13に示すように、押さえ枠150にカバー160を被せ、カバー取付ねじ161の軸部をカバー取付ワッシャー162、ねじ挿入孔163に挿入し、押さえ枠150の貫通孔153を貫通したねじ受け部117と螺合させるとにより、カバー160を基板取付面111に取り付ける。   As shown in FIG. 13, a cover 160 is placed on the presser frame 150, the shaft portion of the cover mounting screw 161 is inserted into the cover mounting washer 162 and the screw insertion hole 163, and the screw receiving portion that penetrates the through hole 153 of the presser frame 150. The cover 160 is attached to the board attachment surface 111 by being screwed with 117.

以上のように、本実施の形態に係る照明器具100によれば、器具が高出力化し、LED基板130が大きくなったとしても、LED基板130と金属のねじ(基板取付ねじ131)との絶縁距離、及びLED基板130と放熱部110との絶縁距離を確保しながらLED基板130のさまざまな箇所を基板取付ねじ131で固定することができる。そのため、LED基板130と放熱部110との密着性が向上し、放熱効率が向上し、LED140の長寿命化が実現できる。   As described above, according to the lighting fixture 100 according to the present embodiment, even if the output of the fixture is increased and the LED board 130 is enlarged, the LED board 130 is insulated from the metal screw (board mounting screw 131). Various portions of the LED board 130 can be fixed with the board mounting screws 131 while ensuring the distance and the insulation distance between the LED board 130 and the heat radiation part 110. For this reason, the adhesion between the LED substrate 130 and the heat radiating part 110 is improved, the heat radiation efficiency is improved, and the life of the LED 140 can be extended.

また、本実施の形態に係る照明器具100によれば、当接部132a(当接部品)は、円板貫通孔132j(ねじ穴)の周囲の当接部表面132iが突き出した突出部132cを備えるので、当接部132aの面積を大きくすることなく、ねじ頭部131aと実装面134との空間距離(沿面距離)を増加させることができる。したがって、LED140の配置に影響を及ぼすことなく、LED基板130のさまざまな箇所を基板取付ねじ131で固定することができる。   Moreover, according to the lighting fixture 100 which concerns on this Embodiment, the contact part 132a (contact part) has the protrusion part 132c which the contact part surface 132i around the disc through-hole 132j (screw hole) protruded. Thus, the spatial distance (creeping distance) between the screw head 131a and the mounting surface 134 can be increased without increasing the area of the contact portion 132a. Therefore, various portions of the LED board 130 can be fixed by the board mounting screws 131 without affecting the arrangement of the LEDs 140.

本実施の形態に係る照明器具100によれば、LED基板130の中央部をブッシュ132及び基板取付ねじ131により放熱部110に固定してから押さえ枠150を取り付けることができるので、作業性が向上する。また、LED140の実装面134側から、LED基板130の中央部をブッシュ132及び基板取付ねじ131により放熱部110に固定する構造であるので、組み立てが容易である。   According to the luminaire 100 according to the present embodiment, since the center portion of the LED substrate 130 can be fixed to the heat radiating portion 110 with the bush 132 and the substrate mounting screw 131, the pressing frame 150 can be attached, so that workability is improved. To do. Further, since the central portion of the LED substrate 130 is fixed to the heat radiating portion 110 by the bush 132 and the substrate mounting screw 131 from the mounting surface 134 side of the LED 140, assembly is easy.

100 照明器具、110 放熱部、111 基板取付面、112 凹部、112a めねじ部、112b ブッシュ位置決め部、112c 凹部開口、112d 凹部内面、113 シート位置決め突起、114 枠取付孔、117 ねじ受け部、119 放熱フィン、120 絶縁シート、121 シート位置決め孔、122 シートねじ孔、123 シートはみ出し部、130 LED基板、131 基板取付ねじ、131a ねじ頭部、131b ねじ軸部、131c おねじ部、132 ブッシュ、132a 当接部、132b スペーサー部、132c 突出部、132d 端部、132e ブッシュねじ挿入孔、132f 当接部裏面、132h 連結部、132i 当接部表面、132j 円板貫通孔、132k 挿入孔、132l,132m 切り欠き部、133 基板貫通孔、133a 孔断面、134 実装面、135 非実装面、136 コネクタ、137 リード線、140 LED、150 押さえ枠、151 枠取付ねじ、152 ねじ挿入孔、153 貫通孔、154 枠開口、155 基板押さえ部、160 カバー、161 カバー取付ねじ、162 カバー取付ワッシャー、163 ねじ挿入孔、170 反射部、171 板バネ、172 止め具、173 放熱部固定部、174 底部開口、175 反射板、176 化粧枠、190 隙間。   DESCRIPTION OF SYMBOLS 100 Lighting fixture, 110 Heat radiation part, 111 Substrate attachment surface, 112 Concave part, 112a Female thread part, 112b Bush positioning part, 112c Concave opening, 112d Concave inner surface, 113 Sheet positioning protrusion, 114 Frame attachment hole, 117 Screw receiving part, 119 Radiation fin, 120 Insulating sheet, 121 Sheet positioning hole, 122 Sheet screw hole, 123 Sheet protruding part, 130 LED board, 131 Board mounting screw, 131a Screw head, 131b Screw shaft part, 131c Male thread part, 132 Bush, 132a Contact part, 132b Spacer part, 132c Projection part, 132d End part, 132e Bush screw insertion hole, 132f Contact part back surface, 132h Connection part, 132i Contact part surface, 132j Disc through hole, 132k insertion hole, 132l, 132m out Notch, 133 Substrate through hole, 133a Hole cross section, 134 Mounting surface, 135 Non-mounting surface, 136 Connector, 137 Lead wire, 140 LED, 150 Holding frame, 151 Frame mounting screw, 152 Screw insertion hole, 153 Through hole, 154 Frame opening, 155 Substrate pressing part, 160 cover, 161 cover mounting screw, 162 cover mounting washer, 163 screw insertion hole, 170 reflection part, 171 leaf spring, 172 stopper, 173 heat radiation part fixing part, 174 bottom part opening, 175 reflection Board, 176 decorative frame, 190 gap.

Claims (8)

光源が実装される実装面と前記実装面の裏側の面である非実装面とを有する光源基板であって、貫通孔が設けられた光源基板と、
前記光源基板が取り付けられる基板取付面であって前記光源基板の非実装面から前記光源で発生する熱が伝熱される基板取付面と、前記基板取付面に設けられた凹部であって前記光源基板の貫通孔に対応する位置に設けられた凹部と、前記凹部の底部に設けられためねじ部とを備え、前記基板取付面に伝熱される熱を放熱する放熱部と、
ねじ頭部と、おねじ部を備えるねじ軸部とを備える固定ねじと、
絶縁材により形成され、表面と裏面とを有する板状の当接部品であって、前記ねじ軸部を貫通させるとともに前記ねじ頭部を係止するねじ穴を備え、前記ねじ穴と前記光源基板の貫通孔とが連通するとともに前記裏面が前記光源基板の貫通孔の周囲の実装面と当接するように配置される当接部品と
を備え、
前記固定ねじは、
前記ねじ軸部が前記当接部品のねじ穴と前記光源基板の貫通孔とを貫通し、前記おねじ部が前記めねじ部と螺合することにより、前記当接部品を前記光源基板の実装面に押し付けて前記光源基板を前記基板取付面に固定する
ことを特徴とする照明器具。
A light source substrate having a mounting surface on which a light source is mounted and a non-mounting surface which is a back surface of the mounting surface, and a light source substrate provided with a through hole;
A substrate mounting surface to which the light source substrate is mounted, a substrate mounting surface to which heat generated by the light source is transferred from a non-mounting surface of the light source substrate, and a recess provided in the substrate mounting surface, the light source substrate A recess provided at a position corresponding to the through-hole of the above, and a screw portion provided at the bottom of the recess, and a heat dissipating part that dissipates heat transferred to the substrate mounting surface,
A fixing screw having a screw head and a screw shaft portion having a male screw portion;
A plate-shaped contact component formed of an insulating material and having a front surface and a back surface, the screw contact portion penetrating the screw shaft portion and locking the screw head, the screw hole and the light source substrate An abutting part arranged so that the through-hole communicates with the mounting surface around the through-hole of the light source substrate,
The fixing screw is
The screw shaft portion passes through the screw hole of the contact component and the through hole of the light source substrate, and the male screw portion is screwed with the female screw portion, so that the contact component is mounted on the light source substrate. A lighting apparatus, wherein the light source substrate is fixed to the substrate mounting surface by being pressed against a surface.
前記当接部品は、
前記ねじ穴の周囲の前記表面から突き出した突出部を備えることを特徴とする請求項1に記載の照明器具。
The contact part is
The lighting fixture according to claim 1, further comprising a protruding portion protruding from the surface around the screw hole.
前記照明器具は、さらに、
絶縁材により形成され、前記当接部品のねじ穴を貫通した前記ねじ軸部を内部に挿入する挿入孔を有する筒状のスペーサーであって、前記当接部品のねじ穴と前記挿入孔とが連通するように、一端部が前記光源基板の貫通孔を貫通して前記当接部品の裏面に連結されるスペーサーを備え、
前記おねじ部は、
前記当接部品のねじ穴と前記スペーサーの挿入孔とを貫通し、前記めねじ部と螺合する
ことを特徴とする請求項1または2に記載の照明器具。
The lighting apparatus further includes:
A cylindrical spacer formed of an insulating material and having an insertion hole for inserting the screw shaft portion penetrating the screw hole of the contact part into the inside, wherein the screw hole of the contact part and the insertion hole are One end is provided with a spacer that is connected to the back surface of the abutting component through the through-hole of the light source substrate so as to communicate with each other.
The male screw part is
3. The lighting apparatus according to claim 1, wherein the lighting fixture passes through a screw hole of the abutting part and an insertion hole of the spacer and is screwed into the female screw portion.
前記スペーサーは、
他端部の外周面の一部が切り欠かれた切り欠き部を備え、
前記凹部は、
前記スペーサーの他端部を挿入し、前記切り欠き部と係合して前記スペーサーの位置決めをする位置決め部を底部に備えることを特徴とする請求項3に記載の照明器具。
The spacer is
Provided with a cutout part in which a part of the outer peripheral surface of the other end is cut out,
The recess is
The lighting device according to claim 3, further comprising: a positioning portion that inserts the other end portion of the spacer and engages the notch portion to position the spacer at a bottom portion.
前記当接部品と前記スペーサーとは、一体成形されていることを特徴とする請求項3または4に記載の照明器具。   The lighting device according to claim 3 or 4, wherein the contact part and the spacer are integrally formed. 前記固定ねじは、金属であることを特徴とする請求項1〜5のいずれかに記載の照明器具。   The lighting fixture according to claim 1, wherein the fixing screw is a metal. 前記ねじ頭部と前記光源基板の実装面との空間距離は、前記ねじ頭部と前記光源基板の実装面との絶縁を確保することができる最短の距離以上であることを特徴とする請求項1〜6のいずれかに記載の照明器具。   The spatial distance between the screw head and the mounting surface of the light source board is equal to or greater than the shortest distance that can ensure insulation between the screw head and the mounting surface of the light source board. The lighting fixture in any one of 1-6. 前記光源基板の貫通孔を形成する断面と前記凹部の内面との空間距離は、前記光源基板の貫通孔を形成する断面と前記凹部の内面との絶縁を確保することができる最短の距離以上であることを特徴とする請求項1〜7のいずれかに記載の照明器具。   The spatial distance between the cross section forming the through hole of the light source substrate and the inner surface of the recess is equal to or longer than the shortest distance that can ensure insulation between the cross section forming the through hole of the light source substrate and the inner surface of the recess. The lighting apparatus according to claim 1, wherein the lighting apparatus is provided.
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