JP5320554B2 - Lamp apparatus and lighting apparatus - Google Patents

Description

  The present invention relates to a lamp device and a lighting fixture that use an LED as a light source.

  Conventionally, for example, there is a lamp device using a GX53 type base. This lamp device is generally flat and has a base GX53 on the upper surface side, and a metal cover on which a flat fluorescent lamp is disposed as a light source on the lower surface side. A translucent cover is disposed over the fluorescent lamp. A pair of lamp pins protrudes from the upper surface of the base part, and a lighting device that turns on the fluorescent lamp by receiving power from the lamp pins is housed inside the base part. And the heat which arises by lighting of a fluorescent lamp is thermally radiated outside from a metal cover, and the thermal influence on a lighting device etc. is controlled (for example, refer to patent documents 1).

JP 2008-140606 A (page 5-9, FIG. 1-3)

  Since the light source generates heat when the lamp device is turned on, heat dissipation is necessary. In particular, when an LED that generates a larger amount of heat than the discharge lamp is used as the light source, if sufficient heat dissipation is not performed, the temperature of the LED itself increases, causing the LED to thermally deteriorate and shorten the life. End up.

  In the lamp device using the GX53 type base, a fluorescent lamp is used as a light source. However, simply using an LED instead of a fluorescent lamp does not ensure sufficient heat dissipation, and supports high output of the LED. There is a problem that cannot be done.

  This invention is made | formed in view of such a point, and it aims at providing the lamp device and lighting fixture which can improve heat dissipation.

The lamp device according to claim 1 has a substrate on which an LED is mounted on one surface side; an outer peripheral portion, and a substrate mounting portion in the middle of the outer peripheral portion in the vertical direction inside the outer peripheral portion, and on the upper side of the outer peripheral portion Radiating fins are formed, the height of the outer periphery is smaller than the outermost diameter of the outer periphery, the other surface of the substrate is in thermal contact with the lower surface of the substrate mounting portion, and the outer periphery A metal cover provided with a metal cover side heat conduction part on the lower side of the metal cover; and a translucent cover side heat conduction part fitted so as to be in thermal contact with the metal cover side heat conduction part. those that include a; and, over the metallic cover disposed the board and the translucent cover made of resin is disposed.

  The board | substrate is flat shape, for example, and should just have the one surface side in which LED is mounted, and the other surface side which can contact a metal cover thermally. An LED chip is directly mounted on the substrate, and wire bonding processing is performed. Either a COB (Chip On Board) type or an SMD (Surface Mount Device) type on which an LED element with a connection terminal on which an LED chip is mounted may be used.

  The metal cover may be made of a metal excellent in heat conduction such as aluminum, formed in a cylindrical shape or a disk shape, and may be in thermal contact with the other surface side of the substrate in surface contact. A plurality of fins may be provided on the outer peripheral surface portion of the metal cover to improve heat dissipation, or a communication hole that can communicate with the inside thereof may be formed. The metal cover-side heat conduction part may be any structure that can fit the light-transmitting cover-side heat conduction part, such as a groove, a protrusion, or a screw structure.

  The translucent cover is made of a translucent resin material such as acrylic. The translucent cover-side heat conducting portion may be any structure that can be fitted so as to be in thermal contact with the metallic cover-side heat conducting portion, such as a protrusion, a groove, or a screw structure.

  You may mix the heat conductive filler for improving heat dissipation in a translucent cover. If this filler has a high light diffusibility, the light diffusing performance of the translucent cover can be improved.

  According to a second aspect of the present invention, there is provided the lamp device according to the first aspect, further comprising heat conduction connecting means for connecting the metal cover side heat conduction portion and the translucent cover side heat conduction portion so as to allow heat conduction. It is what.

  The heat conduction connecting means is a heat conduction member such as silicone resin or grease interposed between the metal cover side heat conduction part and the light transmission cover side heat conduction part, the metal cover side heat conduction part and the light transmission cover. Any of a screwing structure and screwing that are in close contact with the side heat conducting portion so as to be able to conduct heat may be used.

  A lighting fixture according to a third aspect includes the lamp device according to the first or second aspect.

  The lighting fixture may include a fixture body, a socket device to which the lamp device is mounted, and the like.

  According to the lamp device of the first aspect, the metal cover side heat conducting portion is provided along the peripheral portion of the metal cover disposed in thermal contact with the substrate on the inner side on the one surface side, and the metal A light-transmitting cover side heat conduction part fitted to a resin light-transmitting cover arranged on one side of the made cover so as to be in thermal contact with the metal cover side heat conduction part Because the heat generated by the LED is conducted from the substrate to the metal cover and can be dissipated to the atmosphere, the surface area exposed to the outside through the metal cover side heat conduction part and the translucent cover side heat conduction part By efficiently conducting heat to a translucent cover having a large thickness, heat can be radiated from the translucent cover to the atmosphere, heat dissipation can be improved, and high output of the LED can be supported.

  According to the lamp device of the second aspect, in addition to the effect of the lamp device of the first aspect, the metal cover side heat conduction part and the translucent cover side heat conduction part are heated by the heat conduction connecting means. Since it connects so that conduction | electrical_connection is possible, the heat conductivity from a metal cover side heat conductive part to a translucent cover side heat conductive part can be improved, and heat dissipation can be improved more.

  According to the lighting fixture of Claim 3, a lamp device can provide the lighting fixture with a long lifetime.

It is sectional drawing of the lamp device which shows the 1st Embodiment of this invention. It is a perspective view of the decomposition | disassembly state of a lamp device same as the above. It is a perspective view of a lamp device and a socket device same as the above. It is sectional drawing of a part of metal cover and translucent cover of the lamp device which shows 2nd Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 3 show a first embodiment, in which FIG. 1 is a sectional view of the lamp device, FIG. 2 is a perspective view of the lamp device in an exploded state, and FIG. 3 is a perspective view of the lamp device and the socket device.

  As shown in FIG. 3, the lighting fixture includes a fixture main body (not shown) such as a downlight, a socket device 11 attached to the fixture main body, and a flat lamp device 12 attached to the socket device 11. In the following, the directional relationship such as the vertical direction is based on the state in which the lamp device 12 is mounted horizontally, with the base side that is one side of the lamp device 12 being the upper side and the light source side that is the other side being the lower side. explain.

  The socket device 11 corresponds to the GX53 type base, and has a cylindrical socket device body 21 made of an insulating synthetic resin, and an insertion hole 22 is formed in the center of the socket device body 21 in the vertical direction. Is formed through.

  A pair of socket portions 24 are formed on the lower surface of the socket device body 21 at symmetrical positions with respect to the center of the socket device body 21. These socket portions 24 are formed with connection holes 25, and a receiving member (not shown) for supplying power to the inside of the connection holes 25 is disposed. The connection hole 25 is an arc-shaped long hole that is concentric with the center of the socket device main body 21, and a diameter-expanded portion 26 is formed at one end of the long hole.

  As shown in FIGS. 1 to 3, the lamp device 12 includes a base 31 disposed on the upper surface side, a metal cover 32 for attaching the base 31 to the upper surface side, and a thermal treatment on the lower surface side of the metal cover 32. A substrate 33 that is an LED module substrate that is attached in contact with the substrate 33, a reflector 34 that is attached to the metal cover 32 via the substrate 33, and a translucent cover 35 that is a glove that is attached to cover the lower surface of the metal cover 32 And a lighting device 36 disposed in the base 31, each of which is formed in a thin shape having a small dimension in the height direction.

  The base 31 has, for example, a base structure of GX53 type, and includes a base case 38 made of synthetic resin having insulating properties and a pair of lamp pins 39 protruding from the upper surface of the base case 38. The outer diameter of the base 31 is about 70 to 75 mm.

  The base case 38 is a flat disk-shaped (annular) substrate portion 40, a cylindrical protrusion 41 protruding upward from the center of the upper surface of the substrate portion 40, and protruding downward from the periphery of the substrate portion 40. The annular fitting portion 42 is integrally formed. A pair of attachment bosses 43 for attaching a pair of lamp pins 39 and a plurality of insertion holes 44 are formed in the substrate portion 40. Then, the fitting part 42 is fitted into the metal cover 32, and a plurality of screws (not shown) are screwed into the metal cover 32 from the outside of the board part 40 through the insertion holes 44, whereby the base case 38 is made of metal. The cover 32 is fixed.

  The pair of lamp pins 39 protrudes from the upper surface of the substrate portion 40 of the base case 38 at a symmetrical position with respect to the center of the lamp device 12. A large diameter portion 45 is formed at the tip of the lamp pin 39. The large-diameter portion 45 of each lamp pin 39 is inserted from the enlarged-diameter portion 26 of each connection hole 25 of the socket device 11, and the lamp device 12 is rotated at a predetermined angle, for example, about 10 °, whereby the lamp pin 39 is The lamp pin 39 moves from the enlarged diameter portion 26 to the connection hole 25, and is electrically connected to a receiver disposed inside the connection hole 25, and the large diameter portion 45 is caught on the edge of the connection hole 25, so that the lamp The device 12 is held by the socket device 11.

  Further, the metal cover 32 is integrally formed in a flat and substantially cylindrical shape with a metal material having excellent thermal conductivity such as aluminum, and an outer peripheral portion 47 having a substantially cylindrical shape is formed. A plurality of radiating fins 48 are formed in the upper half of the upper side of the base 47.

  A disc-shaped substrate mounting portion 49 is formed in the middle of the outer peripheral portion 47 in the middle in the vertical direction, and is partitioned by the substrate mounting portion 49 so that the fitting portion 42 of the base case 38 is formed on the upper surface side of the metal cover 32. Is formed, and a light source side space 51 in which the substrate 33 and the reflector 34 are disposed is formed on the lower surface side. An attachment hole 49a for screwing the reflector 34 is formed at the center of the substrate attachment portion 49. An attachment screw 52 is inserted into the attachment hole 49a from the base case 38 side of the substrate attachment portion 49, and the attachment screw 52 is screwed to the central portion of the reflector 34 to fix the reflector 34. The substrate 33 positioned by fitting with the inner shape of the reflector 34 is fixed so as to be sandwiched by the reflector 34 and is in contact with the substrate attachment portion 49. In addition, a wiring hole 49b for connecting the substrate 33 and the lighting device 36 with a lead wire is formed in the substrate attaching portion 49.

  A metal cover side heat conducting portion 47a is formed along the peripheral portion of the metal cover 32 so as to be fitted so that the translucent cover 35 is in thermal contact. The metal cover side heat conducting portion 47 a is formed by an annular inner surface portion facing the light source side space 51 of the outer peripheral portion 47.

The outermost diameter D of the outer peripheral portion 47 of the metal cover 32 and the translucent cover 35 is 80 to 150 mm, preferably 85 to 100 mm, and a specific example is about 90 mm. The height h of the outer peripheral portion 47 of the metal cover 32 is 5 to 25 mm, preferably 10 to 20 mm, and a specific example is about 17 mm. Furthermore, 2π (D / 2) h / W, which is the area of the outer peripheral surface of the outer peripheral portion 47 per total input power W to the lamp device 12, is in the range of 200 to 800 mm ² / W.

  The substrate 33 has a substrate body 55 that is flat and made of a metal material having excellent thermal conductivity, such as aluminum, and an insulating layer is formed on the lower surface of the substrate body 55. A wiring pattern is formed on the wiring pattern, and LEDs 56, which are LED elements as a plurality of surface mounting components, are electrically and mechanically connected and arranged on the wiring pattern. The board body 55 is brought into surface contact with the lower surface of the board mounting portion 49 of the metal cover 32 by being sandwiched between the metal cover 32 and the reflector 34 screwed to the metal cover 32. It is attached so that heat conduction is possible.

  The reflector 34 is formed of a synthetic resin material, for example, and is formed on a reflective surface having a high reflection efficiency such as a mirror surface having a white surface. A cylindrical frame portion 58 is formed in the peripheral portion of the reflector 34, and a partition portion 59 for partitioning each LED 56 is formed radially inside the frame portion 58. On the inner side of each LED 56 divided by the frame portion 58 and the partition portion 59, an opening 60 through which the LED 56 is inserted and the light from the LED 56 facing the LED 56 are reflected in a desired direction according to the light distribution. A reflecting surface 61 is formed.

  The reflector 34 is disposed on the lower surface of the metal cover 32 with the substrate 33 interposed therebetween, and the mounting screw 52 is screwed from the upper surface side of the metal cover 32 to the center of the reflector 34 through the mounting hole 49a. The metal cover 32 is fastened and fixed. By tightening and fixing the reflector 34 to the metal cover 32, the substrate 33 is sandwiched between the reflector 34 and the metal cover 32, and the substrate 33 is brought into close contact with the substrate mounting portion 49 of the metal cover 32. Yes.

  The translucent cover 35 is integrally formed of a synthetic resin material such as acrylic having translucency and being transparent or light diffusing. The translucent cover 35 has a disk-shaped front surface portion 63 and a cylindrical side surface portion 64 provided around the front surface portion 63. The side surface portion 64 has an outer peripheral portion 47 of the metal cover 32. A fitting portion 65 that is fitted and fixed inside is formed.

  The fitting portion 65 is configured as a translucent cover-side heat conduction portion 65a that is fitted so as to be in thermal contact with the metal cover-side heat conduction portion 47a. The translucent cover side heat conducting portion 65a is formed by the annular outer surface portion of the fitting portion 65 that fits into the inner surface portion facing the light source side space portion 51 of the outer peripheral portion 47 of the metal cover 32.

  The metal cover side heat conduction part 47a and the translucent cover side heat conduction part 65a are connected by the heat conduction connection means 68 so that they can conduct heat. The heat conduction connecting means 68 is composed of a heat conduction material 69 such as silicone resin or grease interposed between the metal cover side heat conduction part 47a and the translucent cover side heat conduction part 65a.

  The lighting device 36 includes a circuit board and a plurality of lighting circuit components mounted on the circuit board (not shown), and is disposed inside the protrusion 41 of the base case 38. The power input portion of the lighting device 36 and the pair of lamp pins 39 are electrically connected by lead wires (not shown), and the output portion of the lighting device 36 and the substrate 33 are connected by lead wires (not shown) through the wiring holes 49b of the metal cover 32. Electrically connected.

  Then, in order to attach the thus configured lamp device 12 to the socket device 11, each lamp pin 39 of the lamp device 12 is inserted into the enlarged diameter portion 26 of each connection hole 25 of the socket device 11 from below. Then, by rotating the lamp device 12 in the mounting direction and moving each lamp pin 39 from each enlarged diameter portion 26 to each connection hole 25, each lamp pin 39 is brought into electrical contact with the receptacle of the socket device 11. At the same time, the large-diameter portion 45 of each lamp pin 39 is hooked on the edge of each connection hole 25, and the lamp device 12 can be attached to the socket device 11.

  In a state where the lamp device 12 is mounted on the socket device 11, the protrusion 41 of the lamp device 12 is inserted into the insertion hole 22 of the socket device 11. At this time, if the end face of the projecting portion 41 and the metal cover 32 are in close contact with a tool body (not shown) so as to conduct heat, the heat of the lamp device 12 can be released to the tool body.

  Further, when the LED 56 of the lamp device 12 is lit, the heat generated by the LED 56 is thermally conducted from the substrate 33 to the substrate attachment portion 49 of the metal cover 32 and from the substrate attachment portion 49 to the outer peripheral portion 47. The heat conducted to the outer peripheral portion 47 of the metal cover 32 is efficiently radiated from the outer peripheral surface of the outer peripheral portion 47 to the atmosphere. In particular, since the heat dissipating fins 48 are provided on the outer peripheral portion 47, the surface area of the outer peripheral portion 47 is increased compared to a flat surface, and the heat dissipation efficiency can be improved. If the heat dissipation performance is satisfactory, the outer peripheral portion 47 may be provided with a flat side surface without providing the heat dissipation fins 48.

  Further, since the translucent cover side heat conducting portion 65a of the translucent cover 35 is fitted along the metal cover side heat conducting portion 47a of the metal cover 32 so as to be in thermal contact, these Through the metal cover side heat conduction part 47a and the light transmissive cover side heat conduction part 65a, heat is efficiently conducted from the metal cover 32 to the light transmissive cover 35, and the heat conducted to the light transmissive cover 35 is translucent. The heat can be radiated from the side surface portion 64 and the front surface portion 63 of the protective cover 35 to the atmosphere.

  Therefore, in the lamp device 12, the heat generated by the LED 56 can be conducted from the substrate 33 to the metal cover 32 to be dissipated to the atmosphere, and the metal cover side heat conduction part 47a and the translucent cover side heat conduction part 65a. Through this, heat can be efficiently conducted from the metal cover 32 to the translucent cover 35. The translucent cover 35 is formed in a flat shape with a dimension of the outermost diameter D in the range of 80 to 150 mm, and its peripheral surface and front surface are exposed to the outside and the surface area is relatively large. The heat of the LED 56 can be dissipated into the atmosphere via the conductive cover 35, the heat dissipation of the entire lamp device 12 can be improved, and the high output of the LED 56 can be accommodated.

  In order to improve the heat dissipation of the entire lamp device 12, the surface temperature of the metal cover 32 can be maintained at 80 ° C. or lower, and the surface temperature of the translucent cover 35 can be maintained at 70 ° C. or lower.

  In addition, since the translucent cover 35 is made of resin, it has better heat dissipation than conventional glass, and the translucent cover side heat conducting portion 65a is shaped along the metal cover side heat conducting portion 47a. There are excellent advantages such as easy formation.

  Furthermore, if the translucent cover 35 is made of glass, the difference in thermal expansion from the metal cover 32 is large, so that the clearance of the fitting portion with the metal cover 32 is considered in consideration of breakage such as glass breakage. As a result, the heat transfer efficiency from the metal cover 32 to the translucent cover 35 is reduced. However, if the translucent cover 35 is made of resin, the metal cover is less than glass. Since the difference in thermal expansion from 32 is small and it can flexibly cope with deformation, the clearance of the fitting part with the metal cover 32 may be small, and the resin is excellent in moldability, so both heat conduction It is easy to make a joining or fitting structure that increases the contact area between the parts. As a result, the heat transfer efficiency from the metal cover 32 to the translucent cover 35 can be increased.

In addition, it is preferable that the substantial contact area between both the heat conduction parts 47a and 65a in this Embodiment is 600-2000 mm < ² >, and the said contact area per total input electric power shall be 15-150 mm < ² > / W. .

  In addition, since the metal cover side heat conduction part 47a and the translucent cover side heat conduction part 65a are connected by the heat conduction connection means 68 so as to be able to conduct heat, the metal cover side heat conduction part 47a is connected to the translucent cover side. The heat conductivity to the heat conduction part 65a can be improved, and the heat dissipation can be further improved.

  In particular, by using a heat conducting material 69 such as silicone resin or grease interposed between the metal cover side heat conducting portion 47a and the light transmitting cover side heat conducting portion 65a as the heat conduction connecting means 68, Adhesion between the metal cover side heat conduction part 47a and the translucent cover side heat conduction part 65a can be enhanced, and the heat conduction efficiency can be enhanced.

  Note that the minimum distance a between the LED 56 and the inner surface of the translucent cover 35 is in the range of 3 to 15 mm, preferably 5 to 10 mm in consideration of the heat resistance of the resin and the thinning of the lamp device 12.

  FIG. 4 shows a second embodiment, and FIG. 4 is a sectional view of a part of a metal cover and a translucent cover of the lamp device.

  As the metal cover side heat conduction part 47a of the metal cover 32, an annular groove part 71 opened on the lower surface side of the outer peripheral part 47, and as the light transmission cover side heat conduction part 65a of the light transmission cover 35, An annular protrusion 72 that protrudes perpendicularly from the upper end surface of the side face 64 and fits into the groove 71 is used.

  By fitting the groove 71 and the protrusion 72, the metal cover 32 and the translucent cover 35 come into contact with each other so as to be able to conduct heat. In the case of this structure, since the contact area between the groove 71 and the protrusion 72 can be increased, the heat conduction efficiency can be increased. Further, by interposing the heat conducting material 69 between the groove 71 and the protrusion 72, the adhesion between the metal cover side heat conducting portion 47a and the light transmitting cover side heat conducting portion 65a is improved, The conduction efficiency can be further increased.

  The heat conduction connecting means 68 is not limited to the configuration in which the heat conduction material 69 is interposed between the metal cover side heat conduction part 47a and the translucent cover side heat conduction part 65a, but the metal cover side heat conduction part. 47a and the translucent cover side heat conduction part 65a may be screwed together, or the metal cover side heat conduction part 65a and the translucent cover side heat conduction part 65a may be mutually connected by screws. You may tighten so that it may closely_contact | adhere.

12 Lamp device
31 clasp
32 metal cover
33 Board
35 Translucent cover
47 outer periphery
47a Heat conduction part on the metal cover side
48 heat dissipation fins
49 Board mounting part
56 LED
65a Translucent cover side heat conduction part
68 Thermal conduction connection

Claims (3)

A board on which LEDs are mounted on one side;
There is a substrate mounting part in the middle of the outer peripheral part and the outer peripheral part in the vertical direction inside the outer peripheral part, a radiation fin is formed on the upper side of the outer peripheral part, and the height of the outer peripheral part is the outermost outer diameter dimension A metal cover that is smaller and disposed on the lower surface side of the substrate mounting portion in thermal contact with the other surface side of the substrate and provided with a metal cover side heat conduction portion on the lower side of the outer peripheral portion ;
A base disposed on the upper side of the metal cover;
Has light-transmitting cover-side heat conduction part to be fitted in thermal contact along the metal cover side conductive portion, the resin which is disposed over a base plate arranged metal cover Translucent cover made of;
A lamp device comprising: The lamp device according to claim 1, further comprising heat conduction connecting means for connecting the metal cover side heat conduction part and the translucent cover side heat conduction part so as to allow heat conduction. A lighting apparatus comprising the lamp device according to claim 1.

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