JP2013051557A

JP2013051557A - Piezoelectric device

Info

Publication number: JP2013051557A
Application number: JP2011188481A
Authority: JP
Inventors: Koji Sato; 光司佐藤
Original assignee: Kyocera Crystal Device Corp
Current assignee: Kyocera Crystal Device Corp
Priority date: 2011-08-31
Filing date: 2011-08-31
Publication date: 2013-03-14
Anticipated expiration: 2031-08-31
Also published as: JP5797978B2

Abstract

PROBLEM TO BE SOLVED: To reduce secular changes in a piezoelectric device.SOLUTION: A piezoelectric device 100 includes: a flat-shaped piezoelectric vibration element 30; and a plurality of support members 20 each having holding portions 20a for supporting side surfaces of the piezoelectric vibration element 30 through brazing fillers 40 and that sandwich and support the piezoelectric vibration element 30. The brazing fillers 40 are formed so as to become narrower, in a planar view, from the piezoelectric vibration element 30 toward the respective holding portions 20a of the support members 20.

Description

本発明は、圧電振動素子を有する圧電デバイスに関するものである。 The present invention relates to a piezoelectric device having a piezoelectric vibration element.

従来から、圧電デバイスは、例えば、通信機器、計測機器に使用される基準周波数発生源として使用されており、過酷な条件下においても経年変化のない安定した周波数出力が長期に亘って得られるような性能が求められている。ここでは、圧電デバイスの例として圧電振動素子が金属ベース上に縦方向に支持された圧電振動子について説明する。 Conventionally, a piezoelectric device has been used as a reference frequency generation source used in, for example, communication equipment and measurement equipment, so that a stable frequency output without secular change can be obtained over a long period of time even under severe conditions. Performance is required. Here, as an example of a piezoelectric device, a piezoelectric vibrator in which a piezoelectric vibration element is supported in a vertical direction on a metal base will be described.

圧電振動子は、二本の支持部材と、二本の支持部材の保持部によって左右両端部を２点支持された圧電振動素子とを備えている。圧電振動素子は、圧電基板の主面に設けられた励振電極と、圧電基板の主面に設けられており励振電極に電気的に接続されかつ圧電基板の左右両端部にそれぞれ延びる端子電極とを含んでいる。そして、圧電振動子は、端子電極がろう材によって支持部材の保持部に接合されることで、機械的に接合されるとともに電気的に接続され、支持部材に支持される。このときのろう材は約３００度で加熱されて溶融することで支持部材と圧電振動素子とを接合し、冷却されて凝固することで両者は固定保持される。 The piezoelectric vibrator includes two support members and piezoelectric vibration elements that are supported at two left and right end portions by holding portions of the two support members. The piezoelectric vibration element includes an excitation electrode provided on the main surface of the piezoelectric substrate, and terminal electrodes provided on the main surface of the piezoelectric substrate and electrically connected to the excitation electrode and extending to both left and right ends of the piezoelectric substrate. Contains. The piezoelectric vibrator is mechanically joined and electrically connected and supported by the support member by joining the terminal electrode to the holding portion of the support member by the brazing material. At this time, the brazing material is heated and melted at about 300 degrees to join the support member and the piezoelectric vibration element, and is cooled and solidified to be fixedly held.

特開２００６−１８６８３９号公報JP 2006-186839 A

しかしながら、従来の圧電振動子においては、一般的に支持部材の幅の方が圧電振動素子の厚みよりも大きいことから、その間のろう材の平面視における幅は、圧電振動素子側の方が支持部材に設けられた保持部側よりも小さいため、ろう材の冷却速度に違いが出てきていた。つまり、圧電振動素子側の方が保持部側よりもろう材の量が少ないため、圧電振動素子側は短時間で冷却され凝固するのも早い。一方、ろう材の量が多い保持部側は、冷却されるのが遅く凝固するのも遅いという現象が起きることとなる。また、支持部材と圧電振動素子の熱膨張係数の違いによりそれぞれの熱収縮などに差がでてくることとあいまって、圧電振動素子に大きな応力を残すこととなる。したがって、圧電振動素子に残った応力が、時間の経過とともに開放されて周波数変動が起きる現象の要因となっている。 However, in the conventional piezoelectric vibrator, since the width of the support member is generally larger than the thickness of the piezoelectric vibration element, the width in the plan view of the brazing material therebetween is supported by the piezoelectric vibration element side. Since it is smaller than the holding part side provided in the member, a difference has appeared in the cooling rate of the brazing material. That is, since the amount of brazing material is smaller on the piezoelectric vibration element side than on the holding portion side, the piezoelectric vibration element side is quickly cooled and solidified in a short time. On the other hand, on the holding part side where the amount of the brazing material is large, a phenomenon occurs that the cooling is slow and the solidification is slow. In addition, due to the difference in thermal contraction due to the difference in thermal expansion coefficient between the support member and the piezoelectric vibration element, a large stress remains in the piezoelectric vibration element. Therefore, the stress remaining in the piezoelectric vibration element is released as time passes, causing a phenomenon in which frequency fluctuation occurs.

本発明の一つの態様によれば、圧電デバイスは、平板形状の圧電振動素子と、ろう材を介して該圧電振動素子の側面を支持する保持部をそれぞれ有しており、圧電振動素子を挟むようにして支持している複数の支持部材とを備えており、ろう材は、平面視において圧電振動素子から支持部材の保持部に向かって狭まるように形成されている。 According to one aspect of the present invention, the piezoelectric device includes a flat plate-shaped piezoelectric vibration element and a holding portion that supports the side surface of the piezoelectric vibration element via the brazing material, and sandwiches the piezoelectric vibration element. The brazing material is formed so as to narrow from the piezoelectric vibration element toward the holding portion of the support member in plan view.

本発明の一つの態様による圧電デバイスは、ろう材が平面視において圧電振動素子より複数の支持部材の保持部の方が狭いことにより、複数の支持部材の保持部の方が圧電振動素子の方より速くろう材が凝固することとなる。そのため、圧電振動素子側のろう材には保持部側のろう材が凝固する際の応力が加わり難くなり、圧電振動素子に応力が残りにくい状態となる。 In the piezoelectric device according to one aspect of the present invention, the holding portion of the plurality of support members is narrower than the piezoelectric vibration element in the plan view in the brazing material. The brazing material will solidify faster. For this reason, it is difficult for the brazing material on the piezoelectric vibration element side to be subjected to stress when the brazing material on the holding portion side solidifies, and it is difficult for stress to remain in the piezoelectric vibration element.

本発明の第１の実施形態における圧電デバイスを示す透視正面図である。1 is a perspective front view showing a piezoelectric device according to a first embodiment of the present invention. 図１に示された圧電デバイスのＡ−Ａにおける横断面図の一部分を示している。FIG. 2 shows a part of a cross-sectional view taken along the line AA of the piezoelectric device shown in FIG. 1. （ａ）は本発明の第２の実施形態における圧電デバイスの一部分の構成を示す正面図であり、（ｂ）は（ａ）に示された構成のＢ−Ｂにおける横断面図である。(A) is a front view which shows the structure of a part of piezoelectric device in the 2nd Embodiment of this invention, (b) is a cross-sectional view in BB of the structure shown by (a). （ａ）は本発明の第２の実施形態における圧電デバイスの変形例の一部分の構成を示す正面図であり、（ｂ）は（ａ）に示された構成のＣ−Ｃにおける横断面図である。(A) is a front view which shows the structure of a part of the modification of the piezoelectric device in the 2nd Embodiment of this invention, (b) is a cross-sectional view in CC of the structure shown by (a). is there. （ａ）は本発明の第３の実施形態における圧電デバイスの一部分の構成を示す正面図であり、（ｂ）は（ａ）に示された構成のＤ−Ｄにおける横断面図である。(A) is a front view which shows the structure of a part of piezoelectric device in the 3rd Embodiment of this invention, (b) is a cross-sectional view in DD of the structure shown by (a). （ａ）は本発明の第４の実施形態における圧電デバイスの一部分の構成を示す正面図であり、（ｂ）は（ａ）に示された構成のＥ−Ｅにおける横断面図である。(A) is a front view which shows the structure of a part of piezoelectric device in the 4th Embodiment of this invention, (b) is a cross-sectional view in EE of the structure shown by (a).

本発明を実施するためのいくつかの例示的な実施形態について、適宜図面を参照しながら詳細に説明する。 Several exemplary embodiments for carrying out the present invention will be described in detail with reference to the drawings as appropriate.

（第１の実施形態）
図１および図２に示されているように、本発明の第１の実施形態における圧電デバイス１００は、金属ベース１０と、金属ベース１０に固定された複数の金属ピン１１と、複数の金属ピン１１にそれぞれ固定された複数の支持部材２０と、ろう材４０によって複数の支持部材２０に固定された圧電振動素子３０と、圧電振動素子３０を覆って気密封止するように金属ベース１０に固定された蓋部材５０とを含んでいる。 (First embodiment)
As shown in FIGS. 1 and 2, the piezoelectric device 100 according to the first embodiment of the present invention includes a metal base 10, a plurality of metal pins 11 fixed to the metal base 10, and a plurality of metal pins. 11 are fixed to the metal base 10 so as to cover the piezoelectric vibration element 30 and to be hermetically sealed. The cover member 50 is included.

金属ベース１０は、支持部材２０を固定し、蓋部材５０とともに圧電振動素子３０を気密封止する空間を形成するためのものである。例えば鉄−コバルト−ニッケル合金（Ｆｅ−Ｃｏ−Ｎｉ），銅（Ｃｕ），ステンレス，これらの複合材等の金属材料よりなり、貫通孔を有する直方体の形状であり、平面視において短辺部が半円形状に形成されている。 The metal base 10 is for fixing the support member 20 and forming a space for hermetically sealing the piezoelectric vibration element 30 together with the lid member 50. For example, it is made of a metal material such as iron-cobalt-nickel alloy (Fe-Co-Ni), copper (Cu), stainless steel, or a composite material thereof, and has a rectangular parallelepiped shape having a through hole. It is formed in a semicircular shape.

金属ピン１１は、金属ベース１０の貫通孔にガラス等の絶縁性接合部材によって固定されており、支持部材２０が接合され圧電デバイスの外部と圧電振動素子３０とを電気的に接続するためのものである。金属ピン１１は、例えば、鉄−コバルト−ニッケル合金（Ｆｅ−Ｃｏ−Ｎｉ）等の金属製のものである。 The metal pin 11 is fixed to the through hole of the metal base 10 by an insulating bonding member such as glass, and the support member 20 is bonded to electrically connect the outside of the piezoelectric device and the piezoelectric vibration element 30. It is. The metal pin 11 is made of a metal such as an iron-cobalt-nickel alloy (Fe—Co—Ni), for example.

支持部材２０は、一端が金属ピン１１に接合され、他端が圧電振動素子３０に接合されて、圧電振動素子３０を支持するとともに、圧電振動素子３０と金属ピン１１とを電気的に接続するためのものである。支持部材２０は、例えば、リン青銅、ニッケル（Ｎｉ）、等の金属材料よりなり、支持部材２０の上部は、圧電振動素子３０にろう材４０を介して接続される保持部２０ａとリード部２０ｂとで形成されている。また、支持部材２０は、横断面視において、四角形状に形成されている。 The support member 20 has one end joined to the metal pin 11 and the other end joined to the piezoelectric vibration element 30 to support the piezoelectric vibration element 30 and to electrically connect the piezoelectric vibration element 30 and the metal pin 11. Is for. The support member 20 is made of, for example, a metal material such as phosphor bronze, nickel (Ni), and the upper portion of the support member 20 is connected to the piezoelectric vibration element 30 via the brazing material 40 and the lead portion 20b. And is formed. Further, the support member 20 is formed in a quadrangular shape in a cross sectional view.

保持部２０ａは、圧電振動素子３０が金属ベース１０から離間して固定される高さ位置に設けられている。また、保持部２０ａの圧電振動素子３０を接続する位置の幅（以下、保持部幅２０ｃという）は、圧電振動素子３０の側面の幅（以下、圧電振動素子側面幅３０ａという）よりも小さく形成されている。 The holding portion 20 a is provided at a height position where the piezoelectric vibration element 30 is fixed apart from the metal base 10. Also, the width of the holding portion 20a where the piezoelectric vibration element 30 is connected (hereinafter referred to as the holding portion width 20c) is formed smaller than the width of the side surface of the piezoelectric vibration element 30 (hereinafter referred to as the piezoelectric vibration element side surface width 30a). Has been.

リード部２０ｂは、保持部２０ａの圧電振動素子３０を接続する面と相対する面に設けられており、保持部幅２０ｃと同一の幅で形成されている。 The lead portion 20b is provided on the surface of the holding portion 20a that faces the surface to which the piezoelectric vibration element 30 is connected, and is formed with the same width as the holding portion width 20c.

支持部材２０の保持部２０ａと圧電振動素子３０とがろう材４０により接合されることで、圧電振動素子３０は、支持部材２０によって金属ベース１０上に固定されるとともに、金属ピン１１と電気的に接続される。 The holding portion 20 a of the support member 20 and the piezoelectric vibration element 30 are joined by the brazing material 40, so that the piezoelectric vibration element 30 is fixed on the metal base 10 by the support member 20 and electrically connected to the metal pin 11. Connected to.

ろう材４０は、例えばＡｕ−Ｇｅ合金よりなり、支持部材２０と圧電振動素子３０とのろう付に用いられる接合材である。 The brazing material 40 is made of, for example, an Au—Ge alloy and is a bonding material used for brazing the support member 20 and the piezoelectric vibration element 30.

圧電振動素子３０は、例えば水晶のような圧電材料よりなり、平面視で円形状を有する平板状の圧電基板３１と、圧電基板３１を挟んで対向するように圧電基板３１の両主面の中央部にそれぞれ設けられた円形状の励振電極３２ａおよび３２ｂと、圧電基板３１の両主面にそれぞれ設けられ、励振電極３２ａおよび３２ｂに電気的に接続されて圧電基板３１の左右両端部にそれぞれ延びる端子電極３３ａおよび３３ｂとを含んでいる。 The piezoelectric vibration element 30 is made of, for example, a piezoelectric material such as quartz, and a flat plate-like piezoelectric substrate 31 having a circular shape in plan view and the center of both main surfaces of the piezoelectric substrate 31 so as to face each other with the piezoelectric substrate 31 interposed therebetween. The circular excitation electrodes 32a and 32b provided in the respective portions and the main surfaces of the piezoelectric substrate 31 are provided respectively, and are electrically connected to the excitation electrodes 32a and 32b and extend to the left and right ends of the piezoelectric substrate 31, respectively. Terminal electrodes 33a and 33b are included.

圧電基板３１の一方の主面に形成された励振電極３２ａに接続された端子電極３３ａと、圧電基板３１の他方の主面に形成された励振電極３２ｂに接続された端子電極３３ｂとは、圧電基板３１の互いに反対側の端部へ延びており、さらにそれぞれ圧電基板３１の相対する主面まで引き回されている。 The terminal electrode 33a connected to the excitation electrode 32a formed on one main surface of the piezoelectric substrate 31 and the terminal electrode 33b connected to the excitation electrode 32b formed on the other main surface of the piezoelectric substrate 31 are piezoelectric. The substrates 31 extend to opposite ends of the substrate 31, and are further routed to the opposing main surfaces of the piezoelectric substrate 31.

圧電振動素子３０が固定された金属ベース１０に蓋部材５０を接合して気密封止することで圧電デバイス１００となる。蓋部材５０は、例えば、金属ベース１０と同様の金属材料よりなり、一方が塞がれた筒形状を有している。蓋部材５０と金属ベース１０との接合は、例えば、蓋部材５０の開口部周囲に設けた鍔部と金属ベース１０の上面外周部とを冷間圧接等の接合方法によって接合することで行なわれる。 The piezoelectric device 100 is obtained by bonding the lid member 50 to the metal base 10 to which the piezoelectric vibration element 30 is fixed and hermetically sealing it. The lid member 50 is made of, for example, a metal material similar to that of the metal base 10 and has a cylindrical shape in which one side is closed. The lid member 50 and the metal base 10 are joined by, for example, joining a flange provided around the opening of the lid member 50 and the outer peripheral portion of the upper surface of the metal base 10 by a joining method such as cold welding. .

本発明の第１の実施形態における圧電デバイス１００は、圧電振動素子側面幅３０ａよりも支持部材２０に設けられた保持部幅２０ｃの方が小さく形成されていることにより、
ろう材４０が平面視において圧電振動素子３０の側面から支持部材２０に設けられた保持部２０ａに向かって狭まるように形成される。また、支持部材２０に設けられた保持部２０ａと圧電振動素子３０の側面がろう材４０によって固定される場合に、平面視において支持部材２０に設けられた保持部２０ａの方が圧電振動素子３０の側面よりもろう材４０の量が少ないこととなり、圧電振動素子３０の側面のろう材４０より支持部材２０に設けられた保持部２０ａのろう材４０の方が放熱により凝固する時間が早くなる。そのため、圧電振動素子３０側のろう材４０には保持部２０ａ側のろう材４０が凝固する際の応力が加わり難くなり、圧電振動素子３０に応力が残りにくくなる。したがって、本発明の第１の実施形態における圧電デバイス１００は、時間の経過とともに応力が開放されて周波数変動が起きる現象に関して向上されている。 In the piezoelectric device 100 according to the first embodiment of the present invention, the holding portion width 20c provided in the support member 20 is formed to be smaller than the piezoelectric vibration element side surface width 30a.
The brazing material 40 is formed so as to narrow from the side surface of the piezoelectric vibration element 30 toward the holding portion 20 a provided in the support member 20 in plan view. In addition, when the holding portion 20a provided on the support member 20 and the side surface of the piezoelectric vibration element 30 are fixed by the brazing material 40, the holding portion 20a provided on the support member 20 in the plan view is more piezoelectric. The amount of the brazing material 40 is smaller than that of the side surface of the piezoelectric vibration element 30, and the brazing material 40 of the holding portion 20a provided on the support member 20 is solidified faster by heat dissipation than the brazing material 40 of the side surface of the piezoelectric vibration element 30. . Therefore, it is difficult to apply stress to the brazing material 40 on the piezoelectric vibration element 30 side when the brazing material 40 on the holding portion 20 a side solidifies, and it is difficult for stress to remain in the piezoelectric vibration element 30. Therefore, the piezoelectric device 100 according to the first embodiment of the present invention is improved with respect to a phenomenon in which stress is released with time and a frequency fluctuation occurs.

なお、図１および図２に示した例では、支持部材２０はその長さ方向の全体にわたって幅が小さいものであるが、圧電振動素子３０と接合される、保持部２０ａが設けられた部分だけ幅が小さい形状であってもよい。このようにすると、保持部２０ａが設けられた部分以外の支持部材２０の部分の幅を大きくすることができるので、支持部材２０のばね性を大きくして、圧電振動素子３０を挟むようにして支持する力を大きくして、製造時の圧電振動素子３０のズレを少なくすることができる。 In the example shown in FIGS. 1 and 2, the support member 20 has a small width in the entire length direction, but only the portion provided with the holding portion 20 a that is joined to the piezoelectric vibration element 30. A shape with a small width may be used. In this way, the width of the portion of the support member 20 other than the portion provided with the holding portion 20a can be increased, so that the spring property of the support member 20 is increased and the piezoelectric vibration element 30 is sandwiched and supported. The force can be increased to reduce the displacement of the piezoelectric vibration element 30 during manufacturing.

（第２の実施形態）
本発明の第２の実施形態における圧電デバイス１００について、図３（ａ）および（ｂ）を参照して説明する。本発明の第２の実施形態における圧電デバイス１００において、第１の実施形態における圧電デバイス１００と異なる構成は支持部材２１の形状である。その他の構成については、第１の実施形態における圧電デバイス１００と同様である。支持部材２１は、平面視において四角形のリード部２１ｂと四角形のリード部２１ｂに凸部形状の保持部２１ａが圧電振動素子３０側に設けられた形状を有しており、保持部幅２１ｃは圧電振動素子側面幅３０ａよりも小さく形成されている。すなわち、第１の実施形態における支持部材２０は保持部２０ａの幅とリード部２０ｂの幅が同じで、支持部材２０の上部の全体の幅が圧電振動素子側面幅３０ａよりも小さいのに対して、保持部幅２０ｃのみが圧電振動素子側面幅３０ａよりも小さくなっている。 (Second Embodiment)
A piezoelectric device 100 according to a second embodiment of the present invention will be described with reference to FIGS. 3 (a) and 3 (b). In the piezoelectric device 100 according to the second embodiment of the present invention, the configuration different from the piezoelectric device 100 according to the first embodiment is the shape of the support member 21. About another structure, it is the same as that of the piezoelectric device 100 in 1st Embodiment. The support member 21 has a shape in which a square-shaped lead portion 21b and a square-shaped lead portion 21b are provided with a convex holding portion 21a on the piezoelectric vibration element 30 side in plan view, and a holding portion width 21c is a piezoelectric portion. It is formed smaller than the vibration element side face width 30a. That is, in the support member 20 in the first embodiment, the width of the holding portion 20a and the width of the lead portion 20b are the same, and the entire width of the upper portion of the support member 20 is smaller than the piezoelectric vibration element side surface width 30a. Only the holding portion width 20c is smaller than the piezoelectric vibration element side surface width 30a.

本発明の第２の実施形態における支持部材２１は、平面視において四角形のリード部２１ｂと四角形のリード部２１ｂに凸部形状の保持部２１ａが設けられた形状を有しており、圧電振動素子側面幅３０ａよりも保持部幅２１ｃの方が小さく形成されていることによって、平面視において保持部２１ａに付着するろう材４０の量が圧電振動素子３０の側面に付着するろう材４０の量よりも少ない量となり、圧電振動素子３０の側面に付着するろう材４０より支持部材２１に設けられた保持部２１ａに付着するろう材４０の方が放熱により凝固する時間が早くなる。また、圧電デバイス１００は、支持部材２１に設けられたリード部２１ｂを有していることにより、支持部材２１に設けられたリード部２１ｂが外気に触れる表面積が増えることとなる。そのため、支持部材２１に設けられたリード部２１ｂの放熱効果が向上し、支持部材２１に設けられた保持部２１ａの方が圧電振動素子３０の側面の方よりもろう材４０がさらに早く固まることとなる。したがって、圧電振動素子３０に応力が残りにくくなり、時間の経過とともに応力が開放されて周波数変動が起きる現象に関してもさらに向上されている。 The support member 21 in the second embodiment of the present invention has a shape in which a square lead portion 21b and a convex shape holding portion 21a are provided on a square lead portion 21b in a plan view, and a piezoelectric vibration element By forming the holding portion width 21c smaller than the side width 30a, the amount of the brazing material 40 adhering to the holding portion 21a in plan view is larger than the amount of the brazing material 40 adhering to the side surface of the piezoelectric vibration element 30. Therefore, the brazing material 40 attached to the holding portion 21a provided on the support member 21 is solidified faster by heat dissipation than the brazing material 40 attached to the side surface of the piezoelectric vibration element 30. In addition, since the piezoelectric device 100 includes the lead portion 21b provided on the support member 21, the surface area where the lead portion 21b provided on the support member 21 comes into contact with outside air increases. Therefore, the heat radiation effect of the lead portion 21b provided on the support member 21 is improved, and the brazing material 40 is hardened more quickly on the holding portion 21a provided on the support member 21 than on the side surface of the piezoelectric vibration element 30. It becomes. Therefore, the stress is less likely to remain in the piezoelectric vibration element 30, and the phenomenon in which the stress is released with time and the frequency variation occurs is further improved.

なお、図３に示した例では、凸部を支持部材２１の長さ方向の全体にわたって設けているが、圧電振動素子３０と接合される、保持部２１ａのみに凸部を設けてもよい。このようにすると、支持部材２１のばね性が大きくなりすぎることがないので、圧電振動素子３０に加わる応力を低減することができる。 In the example shown in FIG. 3, the convex portion is provided over the entire length direction of the support member 21. However, the convex portion may be provided only on the holding portion 21 a that is joined to the piezoelectric vibration element 30. In this way, the spring property of the support member 21 does not become too large, so that the stress applied to the piezoelectric vibration element 30 can be reduced.

(変形例)
以下、本発明の第２の実施形態における圧電デバイス１００の変形例として図４（ａ）および（ｂ）を参照して説明する。 (Modification)
Hereinafter, a modification of the piezoelectric device 100 according to the second embodiment of the present invention will be described with reference to FIGS.

図４（ａ）および（ｂ）に示されているように、図３（ａ）および（ｂ）の形状の支持部材２１であれば、ろう材４０は保持部２１ａの圧電振動素子３０側の端面だけでなく、リード部２１ｂから圧電振動素子３０側へ延びる側面まで回り込んで接合されていてもよい。この場合でもろう材４０の形状は圧電振動素子３０から支持部材２１の保持部２１ａに向かって狭まる形状となるので、圧電振動素子３０に応力が残り難くなる。さらに、ろう材４０と支持部材２１との接合面が３次元かつ大面積になるので、圧電振動素子３０より幅を小さくしても接合強度を大きいものとすることができる。 As shown in FIGS. 4 (a) and 4 (b), if the supporting member 21 has the shape shown in FIGS. 3 (a) and 3 (b), the brazing material 40 is located on the piezoelectric vibration element 30 side of the holding portion 21a. Not only the end face but also a side face extending from the lead portion 21b to the piezoelectric vibration element 30 side may be joined. Even in this case, since the shape of the brazing material 40 becomes narrower from the piezoelectric vibration element 30 toward the holding portion 21 a of the support member 21, stress hardly remains in the piezoelectric vibration element 30. Furthermore, since the joining surface between the brazing material 40 and the support member 21 has a three-dimensional and large area, the joining strength can be increased even if the width is smaller than that of the piezoelectric vibration element 30.

（第３の実施形態）
本発明の第３の実施形態における圧電デバイス１００について、図５（ａ）および（ｂ）を参照して説明する。本発明の第３の実施形態における圧電デバイス１００において、第１の実施形態における圧電デバイス１００と異なる構成は支持部材２２の形状である。その他の構成については、第１の実施形態における圧電デバイス１００と同様である。支持部材２２は、平面視において四角形のリード部２２ｂと四角形のリード部２２ｂの一辺に半円形状の保持部２２ａが設けられた形状を有している。すなわち、第２の実施形態における保持部２１ａの平面視の形状が四角形であるのに対して、第３の実施形態における保持部２２ａの平面視の形状が半円形状となり、保持部２２ａのリード部２２ｂ側の幅がリード部２２ｂの幅と同じになっている。 (Third embodiment)
A piezoelectric device 100 according to a third embodiment of the present invention will be described with reference to FIGS. 5 (a) and 5 (b). In the piezoelectric device 100 according to the third embodiment of the present invention, the configuration different from the piezoelectric device 100 according to the first embodiment is the shape of the support member 22. About another structure, it is the same as that of the piezoelectric device 100 in 1st Embodiment. The support member 22 has a shape in which a square lead portion 22b and a semicircular holding portion 22a are provided on one side of the square lead portion 22b in plan view. That is, while the shape of the holding portion 21a in the second embodiment in a plan view is a quadrangle, the shape of the holding portion 22a in the third embodiment in a plan view is a semicircular shape, and the lead of the holding portion 22a. The width on the portion 22b side is the same as the width of the lead portion 22b.

本発明の第３の実施形態における支持部材２２は、平面視において保持部２２ａが半円形状に形成されていることにより、保持部２２ａと圧電振動素子３０の側面とに付着するろう材４０の幅は、圧電振動素子側面幅３０ａより保持部幅２２ｃの方が小さい幅となる。そのため、平面視において保持部２２ａに付着するろう材４０の量が圧電振動素子３０の側面に付着するろう材４０の量よりも少ない量となり、圧電振動素子３０の側面に付着するろう材４０より支持部材２２に設けられた保持部２２ａに付着するろう材４０の方が放熱により凝固する時間が早くなる。また、圧電デバイス１００は、支持部材２２に設けられたリード部２２ｂを有していることにより、支持部材２２に設けられたリード部２２ｂが外気に触れる表面積が増えることとなる。そのため、支持部材２２に設けられたリード部２２ｂの放熱効果とあいまって支持部材２２に設けられた保持部２２ａの方が圧電振動素子３０の側面よりもろう材４０が早く固まることとなる。したがって、圧電振動素子３０に応力がさらに残りにくくなり、時間の経過とともに応力が開放されて周波数変動が起きる現象に関して向上されている。 In the support member 22 according to the third embodiment of the present invention, the holding portion 22a is formed in a semicircular shape in plan view, so that the brazing material 40 attached to the holding portion 22a and the side surface of the piezoelectric vibration element 30 is fixed. The width of the holding portion width 22c is smaller than the width 30a of the piezoelectric vibration element. For this reason, the amount of the brazing material 40 adhering to the holding portion 22 a in a plan view is smaller than the amount of the brazing material 40 adhering to the side surface of the piezoelectric vibration element 30, and the brazing material 40 adhering to the side surface of the piezoelectric vibration element 30. The brazing material 40 adhering to the holding portion 22a provided on the support member 22 has a faster time to solidify due to heat dissipation. In addition, since the piezoelectric device 100 includes the lead portion 22b provided on the support member 22, the surface area where the lead portion 22b provided on the support member 22 comes into contact with the outside air is increased. Therefore, the brazing material 40 hardens faster than the side surface of the piezoelectric vibration element 30 in the holding portion 22 a provided in the support member 22 in combination with the heat radiation effect of the lead portion 22 b provided in the support member 22. Therefore, the stress is less likely to remain in the piezoelectric vibration element 30, and the phenomenon is improved with respect to a phenomenon in which the stress is released with time and the frequency variation occurs.

本実施の形態においても、圧電振動素子３０と接合される保持部２２ａのみに凸部を設けてもよい。 Also in the present embodiment, a convex portion may be provided only on the holding portion 22 a joined to the piezoelectric vibration element 30.

（第４の実施形態）
本発明の第４の実施形態における圧電デバイス１００について、図６（ａ）および（ｂ）を参照して説明する。本発明の第４の実施形態における圧電デバイス１００において、第１の実施形態における圧電デバイス１００と異なる構成は支持部材２３の形状および表面処理方法である。その他の構成については、第１の実施形態における圧電デバイス１００と同様である。 (Fourth embodiment)
A piezoelectric device 100 according to a fourth embodiment of the present invention will be described with reference to FIGS. 6 (a) and 6 (b). In the piezoelectric device 100 according to the fourth embodiment of the present invention, the configuration different from the piezoelectric device 100 according to the first embodiment is the shape of the support member 23 and the surface treatment method. About another structure, it is the same as that of the piezoelectric device 100 in 1st Embodiment.

支持部材２３の幅は平面視において圧電振動素子側面幅３０ａより大きいが、保持部２３ａは、圧電振動素子側面幅３０ａより小さい幅で、ろう材４０に対し濡れ性の良い表面処理された領域となっている。表面処理としては、例えば、ろう材４０がＡｕ−Ｇｅ合金の場合であれば、支持部材２３をＡｕ−Ｇｅ合金のろう材４０に対して濡れ性の悪いＮｉ合金で作製し、保持部２３ａとなる領域にＡｕ−Ｇｅ合金のろう材４０に対し濡れ性のよいＡｕ、Ａｇ等の金属からなる膜を形成すればよい。膜の形成は、めっきや蒸着等で行えばよい。 The width of the support member 23 is larger than the piezoelectric vibration element side face width 30a in plan view, but the holding portion 23a is smaller than the piezoelectric vibration element side face width 30a and has a surface-treated region with good wettability to the brazing material 40. It has become. As the surface treatment, for example, if the brazing material 40 is an Au—Ge alloy, the support member 23 is made of a Ni alloy having poor wettability with respect to the brazing material 40 of the Au—Ge alloy, and the holding portion 23 a A film made of a metal such as Au or Ag having good wettability to the brazing material 40 made of Au—Ge alloy may be formed in the region. The film may be formed by plating or vapor deposition.

本発明の第４の実施形態における支持部材２３は、平面視において圧電振動素子３０の側面より大きい四角形状を有しており、圧電振動素子側面幅３０ａより狭く、かつろう材４０に対し濡れ性の良い表面処理が保持部２３ａにされていることによって、平面視において保持部２３ａに付着するろう材４０の量が圧電振動素子３０の側面に付着するろう材４０の量よりも少ない量となり、圧電振動素子３０の側面に付着するろう材４０より保持部２３ａに付着したろう材４０の方が放熱により凝固する時間が早くなる。また、支持部材２３は、圧電振動素子３０の側面より大きい形状であり、かつろう材４０が付着していない部分の表面積が大きいため放熱効果が向上し、支持部材２３に設けられた保持部２３ａの方が圧電振動素子３０の側面よりもろう材４０がさらに早く固まることとなる。したがって、本発明の第４の実施形態における支持部材２３は、従来までの機械的特性を大きく変えることなくさらに圧電振動素子３０に応力が残り難い状態にすることができており、時間の経過とともに応力が開放されて周波数変動が起きる現象に関してもさらに向上されている。 The support member 23 according to the fourth embodiment of the present invention has a rectangular shape larger than the side surface of the piezoelectric vibration element 30 in plan view, is narrower than the piezoelectric vibration element side surface width 30a, and wettability to the brazing material 40. Since the good surface treatment is performed on the holding portion 23a, the amount of the brazing material 40 adhering to the holding portion 23a in plan view is smaller than the amount of the brazing material 40 adhering to the side surface of the piezoelectric vibration element 30. The brazing material 40 adhering to the holding portion 23a is faster to solidify by heat dissipation than the brazing material 40 adhering to the side surface of the piezoelectric vibration element 30. Further, the support member 23 has a larger shape than the side surface of the piezoelectric vibration element 30 and the surface area of the portion where the brazing material 40 is not attached is large, so that the heat dissipation effect is improved, and the holding portion 23 a provided on the support member 23. In this case, the brazing material 40 hardens faster than the side surface of the piezoelectric vibration element 30. Therefore, the support member 23 according to the fourth embodiment of the present invention can be made in a state in which no stress remains in the piezoelectric vibration element 30 without greatly changing the conventional mechanical characteristics, and with the passage of time. It is further improved with respect to the phenomenon in which stress is released and frequency fluctuation occurs.

(変形例)
支持部材２３の形状および表面処理については、支持部材２３をろう材４０に対して濡れ性のよい金属で作製し、保持部２３ａの周囲に、ろう材４０に対し濡れ性の悪い材料からなる表面処理してもよい。例えば、ろう材４０がＡｕ−Ｇｅ合金の場合であれば、支持部材２３をＡｕ−Ｇｅ合金のろう材４０に対して濡れ性のよいリン青銅等の合金で作製し、保持部２３ａの周囲に、Ｎｉ等の金属、酸化アルミニウム等の無機絶縁物等のＡｕ−Ｇｅ合金のろう材４０に対して濡れ性の悪い材料からなる膜を形成すればよい。この膜の幅を、圧電振動素子３０の側面に位置する端子電極３３ａおよび３３ｂの幅、即ち圧電振動素子側面幅３０ａと同等か一回り大きいものとすれば、圧電振動素子３０と支持部材２３とをろう材４０で接合する際に、これらの間に挟まれたろう材４０が溶融したときに、膜の外側に濡れ拡がらずに幅の小さい保持部２３ａ内に留まりやすくなり、ろう材４０が平面視において圧電振動素子３０の側面から支持部材２３に設けられた保持部２３ａに向かって狭まるように形成される。したがって、本発明の第４の実施形態の変形例における支持部材２３は、従来までの機械的特性を大きく変えることなくさらに圧電振動素子３０に応力が残り難い状態にすることができており、時間の経過とともに応力が開放されて周波数変動が起きる現象に関してもさらに向上されている。 (Modification)
Regarding the shape and surface treatment of the support member 23, the support member 23 is made of a metal having good wettability with respect to the brazing material 40, and a surface made of a material with poor wettability with respect to the brazing material 40 around the holding portion 23a. It may be processed. For example, if the brazing material 40 is an Au—Ge alloy, the support member 23 is made of an alloy such as phosphor bronze that has good wettability with respect to the brazing material 40 of the Au—Ge alloy, and around the holding portion 23 a. A film made of a material having poor wettability may be formed with respect to the brazing material 40 of an Au—Ge alloy such as a metal such as Ni or an inorganic insulator such as aluminum oxide. If the width of this film is equal to or slightly larger than the width of the terminal electrodes 33a and 33b located on the side surface of the piezoelectric vibration element 30, that is, the side width 30a of the piezoelectric vibration element, the piezoelectric vibration element 30 and the support member 23 When the brazing material 40 is joined with the brazing material 40, the brazing material 40 sandwiched between them melts easily and does not spread out outside the film and stays in the holding portion 23 a having a small width. In plan view, the piezoelectric vibration element 30 is formed so as to narrow toward the holding portion 23 a provided on the support member 23. Therefore, the support member 23 in the modified example of the fourth embodiment of the present invention can be made in a state in which no stress remains in the piezoelectric vibration element 30 without greatly changing the conventional mechanical characteristics. With respect to the phenomenon, the stress is released with the passage of time and the phenomenon of frequency fluctuation is further improved.

１００圧電デバイス
１０金属ベース
１１金属ピン
２０，２１，２２，２３支持部材
２０ａ，２１ａ，２２ａ，２３ａ保持部
２０ｂ，２１ｂ，２２ｂ，２３ｂリード部
２０ｃ，２１ｃ，２２ｃ，２３ｃ保持部幅
３０圧電振動素子
３０ａ圧電振動素子側面幅
３１圧電基板
３２ａ，３２ｂ励振電極
３３ａ，３３ｂ端子電極
４０ろう材
５０蓋部材 DESCRIPTION OF SYMBOLS 100 Piezoelectric device 10 Metal base 11 Metal pin 20, 21, 22, 23 Support member 20a, 21a, 22a, 23a Holding part 20b, 21b, 22b, 23b Lead part 20c, 21c, 22c, 23c Holding part width 30 Piezoelectric vibration element 30a Piezoelectric vibration element side surface width 31 Piezoelectric substrate 32a, 32b Excitation electrode 33a, 33b Terminal electrode 40 Brazing material 50 Lid member

Claims

A plate-shaped piezoelectric vibration element;
Each having a holding portion for supporting the side surface of the piezoelectric vibration element via a brazing material, and a plurality of support members supporting the piezoelectric vibration element so as to sandwich the piezoelectric vibration element,
The brazing material has a shape narrowed from the piezoelectric vibration element toward the holding portion of the support member in plan view.

The piezoelectric device according to claim 1, wherein a width of the holding portion of the plurality of support members is smaller than a width of the side surface of the piezoelectric vibration element.

2. The piezoelectric device according to claim 1, wherein each of the plurality of support members has a lead portion having a width larger than a width of the holding portion.