JP2013051384A - Aggregate wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an aggregate wiring board which prevents the reduction of the number of electronic components which are simultaneously manufactured from one aggregate wiring board and thereby solving problems such as the deterioration of the work efficiency and the cost increase, which stably supplies an electronic device having a structure that a semiconductor element is mounted on a flat wiring board and mounted to another circuit board in a good manner.SOLUTION: An aggregate wiring board 30 includes: multiple wiring boards 10, each of which has a mounting part 8, on which a semiconductor element 15 is mounted, at a center part on an upper surface; and a frame 20 having multiple through holes 24 of a size that encloses the mounting part 8. The aggregate wiring board 30 is formed by joining peripheral parts on the upper surfaces of the wiring boards 10 to peripheral parts of the through holes 24 of the frame 20 so that the mounting parts 8 are exposed from the through holes 24.

Description

  The present invention relates to a collective wiring board in which a plurality of small wiring boards having a mounting portion on which a semiconductor element is mounted are joined to a frame having a through hole surrounding the mounting portion.

  Conventionally, a collective wiring board has been used as a form for simultaneously manufacturing a large number of small wiring boards for mounting semiconductor elements. This collective wiring board is formed by arranging a plurality of small-sized wiring boards in an integrated manner vertically and horizontally with a cutting region therebetween. Then, after mounting a semiconductor element on each wiring board through, for example, solder bumps, sealing is performed with a sealing resin. Thereafter, a large number of electronic devices each having a semiconductor element mounted on each wiring board are manufactured by cutting along the cutting region.

  Such an assembly wiring board is subjected to electrical inspection and appearance inspection of each wiring board before mounting a semiconductor element, and the wiring board judged to be defective is marked or position information is recorded. To do. This avoids mounting a semiconductor element on the wiring board determined to be defective.

JP-A-10-189829

  As described above, in the conventional collective wiring board, the inspection is performed before mounting the semiconductor elements to avoid mounting the semiconductor elements on the defective wiring board. However, in recent years, as the circuit of the wiring board is miniaturized and multilayered, the processing becomes complicated and the degree of difficulty becomes high, and the proportion of non-defective wiring boards in the collective wiring board tends to decrease. For this reason, the number of electronic devices that can be manufactured simultaneously from a single collective wiring board is reduced, resulting in problems such as reduced work efficiency and increased cost.

Further, in the conventional collective wiring board, when sealing with the sealing resin, after heating to cure the sealing resin, and returning to room temperature, the thermal expansion coefficient of the sealing resin increases the thermal expansion of the wiring board. Since the coefficient is larger than the coefficient, the sealing resin is thermally contracted more than the wiring substrate, and as a result, warpage occurs such that the upper surface side of the wiring substrate becomes a concave surface. When such warpage is large, it becomes difficult to mount individual electronic devices formed by cutting the assembly wiring board on other circuit boards.

  The present invention has been devised in view of these problems, and the problem to be solved is to simultaneously manufacture a single collective wiring board by increasing the proportion of non-defective products in the collective wiring board. This can prevent the decrease in the number of electronic devices that can be used, thereby solving problems such as a reduction in work efficiency and an increase in cost, and the use of the warpage of electronic devices caused by the heat treatment process during sealing with a sealing resin. A collective wiring board capable of stably supplying an electronic device that is suppressed by reducing the resin, whereby a semiconductor element is mounted on a flat wiring board and can be satisfactorily mounted on another circuit board Is to provide.

  A collective wiring board of the present invention includes a plurality of wiring boards having a mounting portion on which a semiconductor element is mounted at the center of the upper surface, and a frame having a plurality of through holes sized to surround the mounting portion. The upper surface peripheral edge part and the through hole peripheral part of the frame are joined so as to expose the mounting part from the through hole.

  According to the collective wiring board of the present invention, since a single collective wiring board is formed by joining a plurality of individual wiring boards to the frame, only the non-defective wiring board is selected and joined to the frame. A collective wiring board with a very high non-defective product ratio can be obtained. Therefore, it is possible to prevent a decrease in the number of electronic devices that can be manufactured simultaneously from one collective wiring board, and to solve problems such as a reduction in work efficiency and an increase in cost.

  Further, according to the collective wiring board of the present invention, the rigidity is enhanced by the frame, and the peripheral edge of the upper surface of the wiring board is connected from the through hole to the lower surface of the peripheral part of the through hole formed in the frame. By bonding so as to be exposed, it is possible to suppress the amount of the sealing resin to a minimum and prevent the upper surface side of the wiring board from being deformed into a concave shape. As a result, it is possible to provide a collective wiring board capable of stably supplying an electronic device in which a semiconductor element is mounted on a flat wiring board and can be satisfactorily mounted on another circuit board.

FIGS. 1A and 1B are a cross-sectional view and a top view for explaining an example of an embodiment of the collective wiring board of the present invention. 2A and 2B are a cross-sectional view and a top view for explaining an example of the wiring board in the collective wiring board of the present invention. 3A and 3B are a cross-sectional view and a top view for explaining an example of a frame in the collective wiring board of the present invention. FIG. 4 is a cross-sectional view for explaining an example of the embodiment of the collective wiring board of the present invention. FIG. 5 is a cross-sectional view for explaining an example of the embodiment of the collective wiring board of the present invention. FIG. 6 is a cross-sectional view for explaining an example of the embodiment of the collective wiring board of the present invention. FIG. 7 is a cross-sectional view for explaining an example of the embodiment of the collective wiring board of the present invention. FIG. 8 is a cross-sectional view for explaining an example of the embodiment of the collective wiring board of the present invention. FIG. 9 is a cross-sectional view for explaining an example of the embodiment of the collective wiring board of the present invention. FIG. 10 is a cross-sectional view for explaining an example of the embodiment of the collective wiring board of the present invention. FIG. 11 is a cross-sectional view for explaining an example of the embodiment of the collective wiring board of the present invention. FIG. 12 is a cross-sectional view for explaining an example of the embodiment of the collective wiring board of the present invention.

  Next, an example of the embodiment of the collective wiring board of the present invention will be described in detail with reference to FIGS. 1, 2, 3, 4, 5, 6, 6, 7, and 9. FIG. In these drawings, reference numeral 10 denotes a wiring board, and 20 denotes a frame. The assembly wiring board 30 of this example is mainly constituted by these.

  In the collective wiring board 30 of this example, as shown in FIG. 1, a plurality of small wiring conductors 10 for mounting the semiconductor elements 15 are bonded to the lower surface of the frame 20 for supporting these wiring boards 10. It consists of

  As shown in FIGS. 2A and 2B, the wiring substrate 10 is formed on, for example, an insulating substrate 1 in which insulating layers 1b are stacked one above the other on the insulating plate 1a, and on the insulating plate 1a and the insulating layer 1b. A formed conductor layer 2 and a protective solder resist layer 3 are provided. A mounting portion 8 on which the semiconductor element 15 is mounted is formed at the center of the upper surface of the wiring substrate 10.

  The insulating plate 1a constituting the insulating substrate 1 is made of an electrically insulating material in which a glass fiber is impregnated with a thermosetting resin such as epoxy resin or bismaleimide triazine resin, and a plurality of through holes 4 penetrating vertically are formed by drilling. Has been. A through-hole conductor 2a is formed on the side wall of the through-hole 4, thereby establishing conduction between the upper and lower conductor layers 2 of the insulating plate 1a.

  The insulating layers 1b laminated on the upper and lower sides of the insulating plate 1a are made of an electrically insulating material containing a thermosetting resin such as an epoxy resin or a polyimide resin, and a plurality of via holes 5 penetrating from the upper surface to the lower surface are formed by laser processing. ing. The via hole 5 is filled with a via conductor 2b, thereby establishing conduction between the upper and lower conductor layers 2 of the insulating layer 1b.

  The conductor layer 2 is a wiring formed of a metal such as a copper plating layer or copper foil, and is formed by, for example, a known subtractive method or semi-additive method. The conductor layer 2 functions as a path for supplying power to the semiconductor element 15 and inputting / outputting signals.

  The solder resist layer 3 is made of a thermosetting resin having photosensitivity such as an acrylic-modified epoxy resin, and has openings 3c, 3d, and 3e for exposing a part of the conductor layer 2. The solder resist layer 3 has a function of keeping the electrical insulation of the conductor layer 2 well and protecting the conductor layer 2.

  A part of the conductor layer 2 exposed from the opening 3 c of the solder resist layer 3 in the mounting portion 8 forms a semiconductor element connection pad 6. The electrodes 16 of the semiconductor element 15 are connected to the semiconductor element connection pads 6 via, for example, solder bumps. A part of the conductor layer 2 exposed from the opening 3d of the solder resist layer 3 on the lower surface forms an external connection pad 9. The external connection pads 9 are connected to the wiring conductors of the external electric circuit board through, for example, solder balls. Furthermore, in this example, a part of the conductor layer 2 is exposed from the opening 3 e of the solder resist layer 3 at the peripheral edge of the upper surface of the wiring substrate 10. A part exposed from the opening 3 e forms a frame connection pad 7 for electrical connection with the frame 20. The frame connection pad 7 is connected to a conductive conductor 22 of the frame 20 described later.

  As shown in FIG. 3A, the frame 20 includes an insulating plate 21, a conductive conductor 22 that penetrates the insulating plate 21, and solder resist layers 23 formed above and below the insulating plate 21. The frame 20 functions as a support body that supports the plurality of wiring boards 10 in a predetermined arrangement, and penetrates in a size that surrounds the mounting portion 8 of the wiring board 10 at a position corresponding to the arrangement of the wiring boards 10 to be supported. It has a mouth 24. A conductive conductor 22 is formed around the through hole 24 at a position corresponding to the frame connection pad 7 described above.

  The insulating plate 21 is made of an electrically insulating material obtained by impregnating a glass fiber with a thermosetting resin such as an epoxy resin or a bismaleimide triazine resin. The through hole 24 is formed by router processing, for example. A plurality of through holes 25 for forming the conductive conductors 22 are formed around the through holes 24 by drilling. This insulating plate 21 has a function as a core material that gives the strength of the frame 20, and suppresses warping that occurs when the sealing operation is performed after the semiconductor element 15 is mounted on the collective wiring substrate 30 of this example. In order to maintain rigidity, the thickness is desirably 0.3 mm or more.

  The conductive conductor 22 is made of, for example, copper plating, and is formed by depositing a metal such as copper on the side wall of the through hole 25 by a plating method or the like. The conductive conductor 22 is connected to the frame connection pad 7 of the wiring board 10, so that other electronic components, a heat sink and the like are electrically connected to the conductor layer 2 of the wiring board 10 on the upper surface of the frame 20. Make it possible.

  The solder resist layer 23 is made of an electrically insulating material containing a thermosetting resin such as an epoxy resin or a polyimide resin, and has openings 23 a and 23 b that expose the upper and lower ends of the conductive conductor 22.

  A plurality of wiring boards 10 are joined to the lower surface of the frame 20 so that the mounting portion 8 is exposed in the through-holes 24 and the frame connection pads 7 and the conductive conductors 22 are electrically connected. Thus, the collective wiring board 30 of this example shown in FIG. 1 is formed. For joining the wiring board 10 and the frame 20, a plurality of conductive conductors 22 formed at the periphery of the through-hole 24 of the frame 20 and a corresponding frame connection pad 7 formed at the peripheral edge of the upper surface of the wiring board 10 are connected. This is performed by bonding through the bonding material 35. For example, solder is used as the bonding material 35, and solder bumps (not shown) are formed on the frame connection pads 7 by a printing method, and the corresponding conductive conductors 22 are placed on the solder bumps and the frame 20 and the wiring board 10. The wiring board 10 and the frame 20 are joined by performing a reflow process under conditions of 220 ° C. to 260 ° C. in a state where the two are superposed.

  In addition to the above-described solder, an anisotropic conductive material such as an anisotropic conductive film or an anisotropic conductive paste may be used for the bonding material 35. This is a mixture of conductive particles such as a resin subjected to gold plating in a thermosetting resin such as an epoxy resin or a synthetic rubber resin, and an anisotropic conductive material on the frame connection pad 7. And the corresponding conductive conductor 22 is placed on an anisotropic conductive material, and the frame 20 and the wiring board 10 are overlapped and bonded by thermocompression bonding under conditions of 100 to 200 ° C. and 3 to 5 MPa.

  By the way, the electrical inspection and the appearance inspection are performed before the wiring board 10 is joined to the frame 20, and only the non-defective wiring board 10 is joined to the frame 20. Thereby, it can be set as the collective wiring board 30 in which the non-defective product ratio of the wiring board 10 is very high. Thereafter, the semiconductor element 15 is mounted on the mounting portion 8 of each bonded wiring board 10 on the collective wiring board 30. In order to mount the semiconductor element 15, for example, a solder ball is mounted on the semiconductor element connection pad 6, and the electrode 16 of the corresponding semiconductor element 15 is overlaid on the solder ball and reflow treatment is performed at a temperature of about 220 ° C. to 260 ° C. Connect by so-called flip chip technology. After mounting the semiconductor element 15, a sealing resin made of a thermosetting resin is injected into the through-hole 24, and then the semiconductor element 15 is sealed by thermosetting the sealing resin. For example, the resin is injected by a printing method in which the resin is applied using a printing mask. At this time, according to the collective wiring board 30 of the present invention, since the side wall of the through-hole 24 has a role of preventing the sealing resin from flowing out, a mold for injecting the sealing resin, which is conventionally required, becomes unnecessary. . Further, by keeping the size of the through-hole 24 to the minimum size necessary for sealing, the sealing resin to be injected can be reduced. The thermosetting of the sealing resin is performed at a temperature of 150 to 250 ° C. At this time, since the rigidity of the assembly wiring board 30 is enhanced by the frame 20, deformation of the wiring board 10 due to thermal contraction of the sealing resin can be suppressed.

  After completion of the sealing operation, for example, another electronic component or a heat sink is mounted on the frame 20. A form in which another electronic component is mounted on the frame 20 is called a so-called PoP (Package on Package). The embodiment will be described with reference to FIG. In this case, by connecting the conductive conductor 22 exposed from the opening 23a provided in the frame 20 and the electrode 42 of the other electronic component 41 via a conductive bonding material such as solder, the other electronic component is obtained. Mounting is possible in a state where 41 is electrically connected to the wiring board 10. When a heat sink made of metal is mounted on the frame 20, the heat sink and the conductive conductor 22 are bonded via a conductive bonding material such as solder. The heat sink is preferably connected to a ground potential.

  After the semiconductor elements 15 and other electronic components are mounted on the collective wiring board 30, the individual electronic devices are completed by cutting, for example, with a dicing device along the cutting area between the wiring boards 10.

  As described so far, the collective wiring board 30 is selected and bonded only to the non-defective wiring board 10 to the frame 20 to prevent a reduction in the number of electronic components that can be manufactured simultaneously from one collective wiring board 30 and to improve work efficiency. Problems such as reduction and cost increase can be solved. Further, the rigidity of the frame 20 is increased, and the sealing resin when sealing the semiconductor element 15 mounted on the wiring board 10 is minimized, so that the thermal expansion between the sealing resin and the wiring board 10 can be reduced. Deformation due to the difference can be suppressed. As a result, it is possible to provide a collective wiring substrate 30 that can stably supply an electronic device in which the semiconductor element 15 is mounted on the flat wiring substrate 10 and can be satisfactorily mounted on another circuit substrate.

  In addition, this invention is not limited to an example of above-mentioned embodiment, A various change is possible if it is a range which does not deviate from the summary of this invention. For example, in the above-described embodiment, the frame 20 includes the conductive conductor 22, and another electronic component or a heat sink is mounted on the frame 20 so as to be electrically connected to the conductive conductor 22. However, the frame 20 does not necessarily include the conductive conductor 22, and it is not always necessary to mount another electronic component or a heat sink on the frame 20.

  Furthermore, the collective wiring board of the present invention can be applied to an electronic device having a built-in capacitor or resistor, for example. The embodiment will be described with reference to FIG. In the case of this example, for example, a wiring board 56 with built-in components incorporating passive components 54 a and 54 b is joined to the frame 20. The passive component 54a is embedded in the wiring board 56. The passive component 54 b is mounted on the upper surface of the wiring board 56 at a position corresponding to the frame 20. The frame 20 is formed with a recess capable of accommodating the passive component 54b at a position corresponding to the passive component 54b. Then, the frame connection pad 55 at the upper end of the wiring board 56 and the conductive conductor 22 exposed from the opening 23b are bonded to the frame 20 via a conductive bonding material. Thereafter, the semiconductor element 53 is mounted on the upper surface of the wiring substrate 56 by, for example, the above-described flip chip technique. Further, a sealing resin is injected into the through hole 24 of the frame 20 and a metal heat sink 51 is joined so as to close the through hole 24. At this time, the heat radiating plate 51 is preferably electrically connected to the ground conductor of the wiring board 56 through the conductive conductor 22 of the frame 20. In addition, it is preferable that the semiconductor element 53 and the heat dissipation plate 51 be thermally connected by interposing a connection layer 52 such as an epoxy resin containing thermal grease or heat conductive particles. By adopting such an aspect, it is possible to efficiently and stably provide an electronic device with a small warpage provided with a passive component at a high non-defective ratio.

  Further, in the above-mentioned 26th paragraph, the explanation was made that the entire inside of the through-hole 24 of the frame 20 to which the wiring board 10 is bonded is filled with the sealing resin. The present invention can also be applied to an electronic device in which only a necessary portion is filled with a sealing resin. The embodiment will be described with reference to FIG. In the case of this example, first, the wiring board 61 is formed by connecting the frame connection pad 63 at the upper end of the wiring board 61 and the conductive conductor 22 exposed from the opening 23b on the lower surface side of the frame 20 through a conductive bonding material. 20 is joined. Thereafter, the semiconductor elements 62a and 62b are mounted on the upper surface of the wiring board 61 via a conductive bonding material. Next, a sealing resin 66 made of a thermosetting resin is injected into the junction between the wiring board 61 and the frame 20 or the junction between the wiring board 61 and the semiconductor elements 62a and 62b using, for example, an air nozzle. At this time, if an enclosure for preventing the sealing resin 66 from flowing out is formed around the semiconductor element with a solder resist or the like, the injection becomes easy. The filling of the sealing resin 66 is completed by thermosetting the sealing resin 66 at a temperature of 150 to 250 ° C. Next, the second wiring board 64 is electrically conductive so that the electrode 65 at the lower end of the second wiring board 64 and the through conductor 22 exposed from the opening 23a on the upper surface side of the frame 20 are connected. It joins to the frame 20 through the joining material. In this way, by reducing the amount of the sealing resin filled in the through-hole 24, the warpage of the electronic device 60 that occurs due to the difference in the thermal expansion coefficient between the wiring board and the sealing resin described above can be further suppressed. Is possible.

  Further, the collective wiring board of the present invention can be applied to, for example, an electronic device that mounts a high electronic component on the wiring board. The embodiment will be described with reference to FIG. In the case of this example, first, the wiring board 71 is connected to the frame connection pad 73 at the upper end portion of the wiring board 71 and the conductive conductor 22 exposed from the opening 23b on the lower surface side of the frame 20 through a conductive bonding material. Join the frame 20. Thereafter, the electronic component 72 is mounted on the upper surface of the wiring board 71 via a conductive bonding material. Next, the second wiring board 74 is electrically conductive so that the electrode 75 at the lower end of the second wiring board 74 and the through conductor 22 exposed from the opening 23a on the upper face side of the frame 20 are connected. It joins to the frame 20 through the joining material. At this time, the second wiring board 74 at a position corresponding to the electronic component 72 is formed with an opening 76 that can accommodate the electronic component 72 protruding from the frame 20. The opening 76 is formed by a router device or the like. By adopting such an aspect, the electronic component 72 can be prevented from buffering with the second wiring board 74, and the electronic device 70 can be efficiently and stably at a high non-defective product ratio without increasing the thickness of the electronic device 70. Can be provided. Furthermore, a variable resistance component can be mounted as the electronic component 72 of this example, and the present invention can be applied to an electronic device that can operate the variable portion using the opening 76.

  Further, the collective wiring board of the present invention can be applied to, for example, an electronic device that requires efficient cleaning of a flux residue adhering to the wiring substrate inside the electronic device. The embodiment will be described with reference to FIG. In the case of this example, first, the wiring board 81 is connected to the frame connection pad 83 at the upper end portion of the wiring board 81 and the conductive conductor 22 exposed from the opening 23b on the lower surface side of the frame 20 through a conductive bonding material. Join the frame 20. Thereafter, the semiconductor element 82 is mounted on the upper surface of the wiring substrate 81 via a conductive bonding material. Next, the second wiring board 84 is made conductive so that the electrode 85 at the lower end of the second wiring board 84 and the conductive conductor 22 exposed from the opening 23a on the upper face side of the frame 20 are connected. It joins through the joining material. Here, the opening width of the through hole 24 is formed larger than the width of the second wiring board 84 so that the through hole 24 is not completely blocked when the second wiring board 84 is joined to the frame 20. Leave the opening open and use it as an inlet and outlet for the flux residue cleaning solution. At this time, in the frame 20, a plurality of through holes 86 and a plurality of grooves 87 are formed at positions corresponding to the joints between the wiring substrate 81 and the second wiring substrate 84. In the second wiring substrate 84, second through holes 88 are formed at positions corresponding to the through holes 86 and the grooves 87. The through hole 86 is formed by a drill device and has a diameter of about 0.08 to 0.5 mm. The groove 87 is formed by a router device, and has a width of about 0.03 to 1 mm and a depth of about 0.5 to 10 μm. The second through-hole 88 is formed by a drill device and has a diameter of about φ0.1 to 1 mm. With these through holes 86, grooves 87, and second through holes 88, a sufficient amount of cleaning liquid is also distributed to the gaps at the joints between the frame 20 and the wiring board 81 or between the frame 20 and the second wiring board 84. Thus, the flux residue adhering to the surface of the wiring board inside the electronic device can be efficiently cleaned.

  The collective wiring board of the present invention can also be applied to, for example, an electronic device that requires a plurality of semiconductor elements and electronic components to be mounted on both main surfaces of the wiring board. The embodiment will be described with reference to FIG. In the case of this example, first, the wiring board 91 is formed by connecting the frame connection pad 93 at the upper end of the wiring board 91 and the conductive conductor 22 exposed from the opening 23b on the lower surface side of the frame 20 through the conductive bonding material. 20 is joined. Thereafter, the semiconductor element 92 and the first electronic component 94 are mounted on a portion surrounded by the frame 20 on the upper surface side of the wiring substrate 91 via a conductive bonding material. Next, the electrode 95 on the lower surface of the wiring board 91 and the second electronic component 96 are mounted via a conductive bonding material. Next, the conductive conductor 22 exposed from the opening 23a on the upper surface side of the frame 20 is connected to the external electronic circuit board 97 via a conductive bonding material as an external connection pad. In this manner, by interposing the frame 20 between the wiring board 91 and the external electronic circuit board 97, a space is created at a location surrounded by the frame 20 on the upper surface side of the wiring board 91, and the semiconductor element 92 and the first electronic circuit board 97 are formed. The electronic component 94 can be mounted, and the second electronic component 96 can be mounted on the lower surface side of the wiring board 91. Thereby, a plurality of semiconductor elements and electronic components can be mounted on both main surfaces of the wiring board.

  In addition, the collective wiring board of the present invention is an electronic device in which, for example, generation of warping of the wiring board due to heat of reflow processing when electronic components are mounted on the wiring board via solder and dropping of the wiring board from the frame are suppressed. It is also applicable to. The embodiment will be described with reference to FIG. In the case of this example, in the collective wiring board 100, the wiring board 101 and the frame 20 are joined via both the solder 104 and the adhesive material 105 made of resin. In order to form such a collective wiring substrate 100, first, a solder paste is printed on the frame connection pads 103 formed on the upper surface of the wiring substrate 101. Next, the adhesive material 105 is applied to the peripheral edge of the upper surface of the wiring board 101 at the outer periphery of the frame connection pad 103 to which the solder paste is applied. As the adhesive material 105, for example, a material containing an ultraviolet curable resin such as an acrylic resin is used. Thereafter, a reflow process is performed to join the conductive conductor 22 on the lower surface side of the frame 20 and the frame connection pad 103 via the solder 104. At this time, the adhesive material 105 applied to the peripheral edge of the upper surface of the wiring substrate 101 contacts the lower surface of the frame 20. In this state, the adhesive material 105 is cured by irradiating the adhesive material 105 with ultraviolet rays, and the wiring substrate 101 and the frame 20 are bonded. As a result, the frame 20 and the wiring board 101 can be joined together by both solder and resin. Next, the electronic component 102 is mounted on the upper surface of the wiring board 101 by soldering through a reflow process. At this time, the solder 104 that joins the wiring substrate 101 and the frame 20 may be remelted by heat during the reflow process. However, since both are joined also by the adhesive material 105, the wiring conductor 101 and the frame 20 are firmly fixed by the adhesive material 105. Therefore, it is possible to provide an electronic device that can prevent the wiring substrate 101 from being greatly warped by heat or dropping the wiring substrate 101 from the frame 20 even if the solder 104 is melted. Instead of an adhesive material containing an ultraviolet curable resin, a material containing a thermosetting resin such as an epoxy resin that is cured by heat during reflow treatment may be used. In this case, for example, after the solder paste is printed and applied, the adhesive material is applied onto the wiring board 101, and the frame 20 and the wiring board 101 are subjected to reflow processing, whereby the adhesive material is cured together with the solder paste, and the frame 20 The wiring board 101 can be bonded with both solder and adhesive material.

  The collective wiring board of the present invention can also be applied to an electronic device that needs to be fixed with screws without deforming or damaging the electronic device in a housing such as an electronic device. The embodiment will be described with reference to FIG. In this example, the collective wiring board 110 includes a wiring board 111, a frame 20, and a second wiring board 114. In the collective wiring board 110, first, the wiring board 111 is bonded to the frame 20. The both are joined by joining the frame connection pad 113 at the upper end of the wiring substrate 111 and the conductive conductor 22 on the lower surface side of the frame 20 with a conductive bonding material. Thereafter, the electronic component 112 is mounted on the upper surface of the wiring board 111. Next, the second wiring board 114 is bonded to the frame 20. The two are joined by joining the electrode 115 at the lower end of the second wiring substrate 114 and the conductive conductor 22 on the upper surface side of the frame 20 via a conductive joining material.

In this example, screw holes 116 are formed in the frame 20.
The screw holes 116 are used when an electronic device obtained by dividing the collective wiring board 110 is fixed to the casing 118 of the electronic device via the screws 119. Further, the wiring board 111 and the second wiring board 114 have screw holes 116 and openings 117 a and 117 b that expose the periphery thereof at positions corresponding to the screw holes 116. These screw holes 116 and openings 117a and 117b are formed by a drill device or the like.

  On the other hand, the casing 118 of the electronic device is provided with a cylindrical support 118 a that is inserted into the opening 117 a of the wiring board 111 and supports the periphery of the screw hole 116 on the lower surface of the frame 20. . The support body 118 a has an inner diameter through which the screw 119 can be inserted, and has a length that allows the lower surface of the wiring board 111 to be disposed without contacting the housing 118. Further, a screw hole 118b that can be screwed with the screw 119 is formed in the bottom surface portion in the support body 118. Then, the screw 119 is inserted into the screwing hole 116 from the opening 117 b formed in the wiring board 114 and fixed to the screw hole 118 b formed in the housing 118. By adopting such a configuration, only the frame 20 is supported by the support body 118a and fixed to the housing 118, and the wiring board 111 and the second wiring board 114 are not subjected to a load due to tightening of the screws 119. Thereby, when the electronic device obtained by dividing the collective wiring board 110 of this example is fixed to the electronic device or the like with the screw 119, it is possible to provide an electronic device that is not deformed or damaged. Note that when the gap between the electronic component 112 and the wiring board 111 or the gap between the frame 20 and the wiring board 111 and the second wiring board 114 is sealed with a sealing resin, the sealing resin is inserted into the screw holes 116. In order to prevent inflow, for example, bank-like protrusions 3a and 23a are formed on the solder resist layers 3 and 23 around the screw holes 116, or openings are formed on the upper surface of the wiring board 111 and the lower surface of the frame 20. An annular electrode 113a surrounding 117a may be formed and the two may be joined with a sealing material 113b such as solder.

  The collective wiring board of the present invention can also be applied to an electronic device that needs to inspect the electrical connection state at the joint between the frame and the wiring board, for example. The embodiment will be described with reference to FIG. In this example, the collective wiring board 120 includes a wiring board 121, a frame 20, and a second wiring board 124. In such a collective wiring board 120, first, the wiring board 121 is bonded to the frame 20. The two are joined by joining the frame connection pad 123 at the upper end of the wiring board 121 and the conductive conductor 22 on the lower surface side of the frame 20 via a conductive bonding material. Thereafter, the electronic component 122 is mounted on the upper surface of the wiring board 121. Next, the second wiring board 124 is bonded to the upper surface of the frame 20. The two are joined by joining the electrode 125 at the lower end of the second wiring board 124 and the conductive conductor 22 on the upper surface side of the frame 20 via a conductive joining material.

  In this example, for example, continuity test pads 26a and 26b for inspecting the electrical connection state at the joint between the frame 20 and the wiring substrate 121 and the second wiring substrate 124 are formed on the upper and lower surfaces of the frame 20. Has been. These continuity test pads 26 a and 26 b are electrically connected to the through conductor 22. Conductive test pads 126 a and 126 b are formed on the upper and lower surfaces of the wiring board 121. These continuity test pads 126 a and 126 b are electrically connected to the frame connection pad 123. Furthermore, continuity test pads 127 a and 127 b are formed on the upper and lower surfaces of the second wiring board 124. These continuity test pads 127 a and 127 b are electrically connected to the electrode 125.

  Of these continuity test pads, the continuity test pads 26a, 26b, 126a, 127b located inside the assembly wiring board 120 can be externally contacted. As described above, the opening 128 is formed in the frame 20, the wiring board 121, and the wiring board 124 that face each continuity test pad. For example, when inspecting the electrical connection state at the joint between the second wiring board 124 and the frame 20, one probe of the continuity test device is applied to the continuity test pad 127 a and the other probe is opened. What is necessary is just to pass to the pad 26a for a continuity test in the back through the part 128. FIG. In this way, the continuity test pads that can be contacted from the outside are formed on the frame 20, the wiring board 121, and the second wiring board 124, so that the electrical connection at the junction between the frame 20, the wiring board 121, and the second wiring board 124 is performed. Thus, it is possible to provide a collective wiring board 120 capable of easily inspecting a general connection state. The continuity test pad can be contacted from the outside, in addition to a configuration in which an opening is provided at a position facing the continuity test pad, on one part of the frame or the wiring board, and from the other to the outside. It is good also as a form which provides the protrusion part which protrudes and forms the pad for a continuity test in the said protrusion part.

2 Conductor layer 7 Frame connection pad 8 Mounting part 10 Wiring board 15 Semiconductor element 20 Frame 22 Conductive conductor 24 Through-hole 30 Collective wiring board

Claims (10)

  A plurality of wiring boards having a mounting portion on which a semiconductor element is mounted at a central portion on the upper surface; and a frame having a plurality of through holes of a size surrounding the mounting portion; A collective wiring board, wherein the peripheral portion of the through-hole of the frame is joined so that the mounting portion is exposed from the through-hole.   A plurality of conductive conductors penetrating both main surfaces of the frame are formed in the periphery of the through-hole of the frame, and a conductor layer formed on the wiring substrate is formed on the peripheral edge of the upper surface of the wiring substrate. 2. The collective wiring board according to claim 1, wherein a plurality of frame connection pads are formed, and the corresponding conductive conductors and the frame connection pads are electrically connected.   3. The collective wiring board according to claim 1, wherein a semiconductor element is mounted on the mounting portion of the wiring board.   Resin is filled in either or both of the gap between the wiring board and the frame, the gap between the wiring board and the semiconductor element mounted on the wiring board, or both. The collective wiring board according to claim 1.   An electronic component having a height protruding from the upper surface of the frame is mounted on the upper surface of the wiring board in the through hole, and protrudes from the frame of the electronic component at a position corresponding to the electronic component on the upper surface of the frame. 5. The collective wiring board according to claim 1, wherein a second wiring board having an opening or a recess capable of accommodating a portion to be bonded is joined. 6.   At least one of a plurality of through holes and grooves is formed at a position corresponding to the joint portion of the frame with the wiring board, and a position corresponding to the through hole and the groove is formed on the upper surface of the frame. 6. The collective wiring board according to claim 1, wherein a second wiring board having a second through hole is bonded to the second wiring board without completely closing the through hole.   5. The collective wiring board according to claim 1, further comprising an external connection pad to which an external electric circuit board is connected on a surface of the frame opposite to a joint surface with the wiring board.   8. The collective wiring board according to claim 1, wherein the frame and the wiring board are joined together by both solder and resin.   9. The collective wiring board according to claim 1, wherein screw holes that are exposed from the wiring board are formed in the frame.   10. The collective wiring board according to claim 1, wherein continuity test pads that can be contacted from outside are formed on both main surfaces of the frame and the wiring board.

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