JP2013038628A5 - - Google Patents
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- Publication number
- JP2013038628A5 JP2013038628A5 JP2011173694A JP2011173694A JP2013038628A5 JP 2013038628 A5 JP2013038628 A5 JP 2013038628A5 JP 2011173694 A JP2011173694 A JP 2011173694A JP 2011173694 A JP2011173694 A JP 2011173694A JP 2013038628 A5 JP2013038628 A5 JP 2013038628A5
- Authority
- JP
- Japan
- Prior art keywords
- lens
- imaging sensor
- driving unit
- receiving surface
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000003384 imaging method Methods 0.000 claims 11
- 238000007789 sealing Methods 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 5
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011173694A JP2013038628A (ja) | 2011-08-09 | 2011-08-09 | カメラモジュール、製造装置、及び製造方法 |
| US13/565,246 US9191559B2 (en) | 2011-08-09 | 2012-08-02 | Camera module, manufacturing apparatus, and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011173694A JP2013038628A (ja) | 2011-08-09 | 2011-08-09 | カメラモジュール、製造装置、及び製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013038628A JP2013038628A (ja) | 2013-02-21 |
| JP2013038628A5 true JP2013038628A5 (enExample) | 2014-09-18 |
Family
ID=47677324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011173694A Abandoned JP2013038628A (ja) | 2011-08-09 | 2011-08-09 | カメラモジュール、製造装置、及び製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9191559B2 (enExample) |
| JP (1) | JP2013038628A (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015016009A1 (ja) * | 2013-07-30 | 2015-02-05 | 富士フイルム株式会社 | 撮像モジュール及び電子機器 |
| JP5919439B2 (ja) * | 2013-08-01 | 2016-05-18 | 富士フイルム株式会社 | 撮像モジュール |
| WO2015016002A1 (ja) * | 2013-08-01 | 2015-02-05 | 富士フイルム株式会社 | 撮像モジュール及び電子機器 |
| US9241097B1 (en) * | 2013-09-27 | 2016-01-19 | Amazon Technologies, Inc. | Camera module including image sensor die in molded cavity substrate |
| CN107690594B (zh) * | 2015-06-03 | 2020-12-04 | Lg伊诺特有限公司 | 透镜镜筒和包括该透镜镜筒的相机模块 |
| CN113382140B (zh) | 2015-08-17 | 2023-04-18 | Lg伊诺特有限公司 | 摄像机模块 |
| KR102528490B1 (ko) * | 2015-10-30 | 2023-05-04 | 엘지이노텍 주식회사 | 렌즈의 온도 제어가 가능한 히터가 증착된 카메라 모듈 |
| JP6829259B2 (ja) * | 2016-02-18 | 2021-02-10 | ニンボー サニー オプテック カンパニー,リミテッド | 一体パッケージングプロセスベースのカメラモジュール、その一体ベース部品、およびその製造方法 |
| EP3429181B1 (en) | 2016-03-12 | 2024-10-16 | Ningbo Sunny Opotech Co., Ltd. | Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device |
| US10925160B1 (en) | 2016-06-28 | 2021-02-16 | Amazon Technologies, Inc. | Electronic device with a display assembly and silicon circuit board substrate |
| CN110649047A (zh) * | 2018-06-26 | 2020-01-03 | 三赢科技(深圳)有限公司 | 感光芯片封装结构及其形成方法 |
| US10880462B2 (en) * | 2019-01-30 | 2020-12-29 | Audio Technology Switzerland S.A. | Miniature video recorder |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020106199A1 (en) * | 1998-05-27 | 2002-08-08 | Osamu Ikeda | Image signal recording/reproduction apparatus, method employed therein, and image signal recording apparatus |
| US6483101B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
| JP3607160B2 (ja) * | 2000-04-07 | 2005-01-05 | 三菱電機株式会社 | 撮像装置 |
| JP2004296453A (ja) | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
| JP2006081006A (ja) * | 2004-09-10 | 2006-03-23 | Konica Minolta Photo Imaging Inc | 振れ補正機構付きカメラ |
| US7084391B1 (en) * | 2005-04-05 | 2006-08-01 | Wen Ching Chen | Image sensing module |
| WO2007010813A1 (ja) * | 2005-07-15 | 2007-01-25 | Matsushita Electric Industrial Co., Ltd. | レンズ鏡筒及びそのレンズ鏡筒を備えた撮像装置 |
| JP4413956B2 (ja) * | 2007-08-21 | 2010-02-10 | 新光電気工業株式会社 | カメラモジュール及び携帯端末機 |
| US9350906B2 (en) * | 2008-10-02 | 2016-05-24 | Omnivision Technologies, Inc. | Encapsulant module with opaque coating |
| JP5532881B2 (ja) * | 2009-04-10 | 2014-06-25 | 株式会社リコー | 撮像装置、車載撮像装置、撮像装置の製造方法及び製造装置 |
| JP2010283597A (ja) * | 2009-06-04 | 2010-12-16 | Toshiba Corp | 半導体撮像装置 |
| KR101069289B1 (ko) * | 2009-08-10 | 2011-10-05 | 주식회사 하이닉스반도체 | 이미지 센서 모듈 및 이미지 센서 모듈의 제조 방법 |
| JP5079049B2 (ja) * | 2009-11-17 | 2012-11-21 | 台湾東電化股▲ふん▼有限公司 | レンズ駆動装置 |
-
2011
- 2011-08-09 JP JP2011173694A patent/JP2013038628A/ja not_active Abandoned
-
2012
- 2012-08-02 US US13/565,246 patent/US9191559B2/en active Active
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