JP2013038114A - Mounting component inspection device and mounting component inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting component inspection device and a method which allow an inexperienced operator to promptly understand a cause and take steps when inspection results indicating mounting failure are consecutively shown in one component mounting position.SOLUTION: When an operator selects a plot mark P displayed on a component mounting position map 79, a mounting failure detailed image 83 is displayed on a touch panel 64. At the time of the display, whether or not a decision rate of mounting failure exceeds a predetermined threshold is determined for each component mounting position and the words "estimated failure cause: imperfect disposition of lower receiving pins" are displayed when it is determined that the decision rate of mounting failure exceeds the threshold. Thus, an inexperienced operator can easily and promptly understand that the mounting failure is due to the imperfect disposition of lower receiving pins 26 and 46 and take steps such as newly adding the lower receiving pins 26 and 46 to the vicinity of a print position or the vicinity of the component mounting position of cream solder Pt where the imperfect disposition is pointed out.

Description

  The present invention relates to a mounted component inspection apparatus and a mounted component inspection method for inspecting a component mounted board mounted by a component mounting apparatus for mounting components on a substrate.

  In mounting components such as electronic components on a substrate, the lower surface of the substrate is supported by a plurality of backup support members such as receiving pins, and the components are mounted at a plurality of component mounting positions provided on the upper surface of the substrate. The method is widely known. Although the arrangement of the receiving pins is changed according to the type of the board, as a conventional technique, an image corresponding to a state in which the component is mounted on the back surface of the board by the image projection device as seen through from the front side of the board. Is projected onto the support surface of the support plate to which the lower receiving pin is attached, so that an operator can place the lower receiving pin on a component that does not interfere with the component on the supporting surface while viewing the projected image ( For example, see Patent Document 1). Thereafter, the mounting board on which the components are mounted is inspected by the inspection device for the quality of mounting at each component mounting position of the board, and the inspection result is displayed by a display means such as a monitor.

Japanese Patent Laid-Open No. 2004-221165

  In the mounting quality inspection, there may be a continuous mounting failure inspection result at a certain component mounting position on the board. However, if the worker handling the component mounting apparatus is an inexperienced person, it is difficult to understand what the cause is even if the inspection result is seen. As a result, it has been impossible to take quick measures against mounting defects, resulting in a problem that the productivity of the mounting board is lowered.

  Therefore, the present invention provides a mounting component inspection apparatus and a mounting component inspection method that enable even an inexperienced worker to take quick measures against mounting failures when a mounting failure is continuously detected at a certain component mounting position on the substrate. The purpose is to provide.

  According to a first aspect of the present invention, there is provided a component mounting apparatus for performing a component mounting operation on a plurality of component mounting positions set on a substrate whose lower surface is supported by a backup support member. A mounting component inspection apparatus for inspecting a mounting state for a component mounted board that has been mounted by a component mounting system including a device for mounting, and an imaging unit that images a component mounting position on the substrate after component mounting; A determination unit that determines whether the mounting state is good or not based on an imaging result of the imaging unit and outputs a determination result; a storage unit that accumulates and stores the determination result for each component mounting position for a plurality of component-mounted boards; Component mounting position map display means for visually displaying a component mounting position on a component mounted board as a component mounting position map, and on the component mounting position map Determination result accumulation display means for displaying the determination result accumulated and stored for each component mounting position, and whether or not the ratio or the number of times that the determination means determines that the mounting is defective satisfies a predetermined condition for each component mounting position. Check the placement status of the backup support members around the component mounting position for the component mounting position for which the determination unit determines that the ratio or number of times the mounting is determined to be defective satisfies the predetermined condition. An informing means for informing the effect is provided.

  According to a second aspect of the present invention, there is provided a component mounting inspection method for performing component mounting on a plurality of component mounting positions set on a substrate whose lower surface is supported by a backup support member. A mounting component inspection method for inspecting a mounting state on a component-mounted board that has been mounted by a component mounting system including a device for an imaging, the imaging step for imaging a component mounting position on the substrate after component mounting; A determination step of determining whether the mounting state is good or not based on an imaging result in the imaging step and outputting a determination result; a storage step of accumulating and storing the determination result for each component mounting position for a plurality of component-mounted boards; Component mounting position map display step for visually displaying a component mounting position on a component mounted board as a component mounting position map, and the component mounting position map In each component mounting position, a determination result accumulation display step for displaying the determination result accumulated and stored for each component mounting position and whether or not the ratio or the number of times determined as defective mounting in the determination step satisfies a predetermined condition. For the component mounting position for which it is determined that the determination step for determining and the ratio or number of times determined as mounting failure in the determination step satisfy a predetermined condition, the arrangement status of the backup support members around the component mounting position is confirmed. A notification step of performing notification to the effect.

  According to the present invention, when there is a component mounting position in which the ratio or number of times determined to be mounting failure satisfies a predetermined condition, the notification that the arrangement status of the backup support members around the component mounting position is confirmed. Therefore, even workers with little experience in the component mounting field can accurately understand the cause of mounting failure, and a new backup support member can be added around the component mounting position. It is possible to take measures against mounting defects. As a result, it is possible to improve the productivity of the mounting substrate by suppressing the generation of the mounting defective substrate.

The top view of the component mounting line of one embodiment of this invention Sectional drawing of the printing apparatus of one embodiment of this invention The perspective view of the board | substrate support mechanism provided in the printing apparatus of one mounting form of this invention, and a component mounting apparatus The top view of the component mounting apparatus of one embodiment of this invention Sectional drawing of the component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention BRIEF DESCRIPTION OF THE DRAWINGS (a) Top view (b) Side view of mounting component inspection apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the mounted component inspection apparatus of one embodiment of this invention The figure which shows the image displayed on the touchscreen of the mounting component inspection apparatus of one embodiment of this invention (A) Plan view of a multi-sided board to be mounted in the component mounting apparatus according to one embodiment of the present invention (b) (c) Mounting operation performed by the component mounting apparatus according to one embodiment of the present invention Explanatory drawing when component mounting work is performed on the target multi-sided board The figure which shows the state which added the receiving pin and has arrange | positioned to the lower surface of the multi-sided board | substrate used as the object of mounting operation in the component mounting apparatus of one embodiment of this invention. The flowchart of the mounting component inspection method of one embodiment of this invention The flowchart of the mounting component inspection method of one embodiment of this invention

  First, a component mounting system including a component mounting inspection apparatus according to the present invention will be described with reference to FIG. A component mounting line 1 forming this component mounting system includes a component mounted substrate (hereinafter referred to as “a component mounting board”) in which an electronic component 4 as a component is mounted on each of electrodes 3 as a plurality of component mounting positions set on the substrate 2. Each device for manufacturing and inspecting a mounting substrate 5 ”) is connected.

  As shown in FIG. 1, the component mounting line 1 includes a printing device M1, a printing state inspection device M2, a plurality of component mounting devices M3 to M5, and a mounting component inspection device M6 from the upstream side (left side in FIG. 1). , And connected in the X direction, which is the substrate transport direction. The printing apparatus M1 has a function of printing cream solder Pt (see FIG. 2) as a bonding material on the plurality of electrodes 3 set on the substrate 2 for component mounting. The printing state inspection device M2 has a function of inspecting the printing state of the substrate 2 on which the cream solder Pt is printed on the electrode 3. The component mounting apparatuses M3 to M5 have a function of mounting the electronic component 4 on the substrate 2 on which the cream solder Pt is printed. The mounting component inspection apparatus M6 has a function of inspecting the mounting state of the electronic component 4 for the mounting substrate 5 on which the electronic component 4 is mounted. Each of these devices is connected to a management computer 7 via a communication network 6, and the management computer 7 controls the mounting / inspection work by each device on the component mounting line 1 in an integrated manner.

  As shown in FIG. 1, the printing state inspection device M2, the component mounting devices M3 to M5, and the mounting component inspection device M6 according to the present embodiment each have a pair of transport conveyors described later on the front side and the rear side of each device, respectively. A first conveyor line L1 formed by connecting one conveyor on the front side (lower side in FIG. 1) of each apparatus, and another conveyor on the rear side (upper side in FIG. 1) of each apparatus. Predetermined operations in the respective apparatuses can be performed simultaneously on the second transport line L2 formed by being connected. By adopting such a configuration, the productivity of the mounting substrate can be improved.

  Next, the printing apparatus M1 will be described with reference to FIGS. A first printing mechanism 11A and a second printing mechanism 11B that are individually controlled and can perform printing operations individually on the upper surface of the base 10 are arranged in the Y direction orthogonal to the X direction that is the transport direction of the substrate 2. They are arranged side by side. 2, the printing mechanisms 11A and 11B mainly include a mask plate 13 extended on the mask frame 12 and a squeegee head 14 disposed above the mask plate 13 (for convenience, the squeegee head 14 in FIG. Is omitted). A pattern hole 13a is formed in the mask plate 13 corresponding to the shape and position of the electrode 3 on the substrate 2 to be printed, and the upper surface of the mask plate 13 is creamed by a cream solder supply device (not shown). Solder Pt is supplied.

  In FIG. 2, the squeegee head 14 has a configuration in which a squeegee raising / lowering mechanism 17 for raising and lowering a squeegee holder 16 to which a plate-like squeegee member 15 is attached is disposed on a horizontal frame 18. The squeegee lifting mechanism 17 disposed on the upper surface of the frame 18 has a lifting shaft 17a extending downward from the lower portion, and a squeegee holder 16 is fixed to the lower end portion of the lifting shaft 17a.

  In FIG. 2, a pair of substrate transport conveyors 19 for transporting the substrate 2 in the X direction is provided above the base 10 and below the mask plate 13. A pair of board | substrate conveyance conveyors 19 are supported by the pair of conveyor support member 21 provided facing the Y-axis direction on the support stand 20, and the board | substrate 2 is pinched | interposed into the upper end of each conveyor support member 21 from both sides A clamp member 22 is provided.

  In a state where the substrate 2 is held on the pair of substrate transfer conveyors 19, a substrate support mechanism 23 is disposed below the substrate 2. The substrate support mechanism 23 has a configuration in which a plurality of support pins 26 are erected on a support base 25 that is lifted and lowered by a first lift drive unit 24 provided on the support base 20.

  In FIG. 3, a plurality of pin holding holes 25a are formed in a predetermined regular arrangement on the upper surface of the lower receiving base 25 coupled to the raising / lowering shaft 24a of the first raising / lowering driving part 24. By inserting the receiving pin 26, the lower receiving pin 26 is held on the lower receiving base 25 in a vertical posture. The lower receiving pin 26 is detachable from the lower receiving base 25. When starting the printing operation, the worker selectively inserts the receiving pin 26 into any pin holding hole 25a among the plurality of pin holding holes 25a according to the arrangement of the electrodes 3 on the substrate 2.

  In FIG. 2, an X table 27X and a Y table 27Y for moving the support table 20 in the X and Y directions are provided in a stacked state on the base 10, and the support table 20 is provided on the upper X table 27X. A second elevating drive unit 28 is provided for elevating and lowering.

  Next, the printing operation will be described. The substrate 2 carried in by a pair of substrate transport conveyors 29A (see FIG. 1) provided on the upstream side of the printing apparatus M1 is transferred to the substrate transport conveyor 19 and then transported to a predetermined printing position. The substrate 2 transported to a predetermined printing position is held by the lower receiving base 25 as the lower receiving base 25 is raised from below the substrate 2 by the first elevating drive unit 24 (arrow a in FIG. 2). It is received by the receiving pin 26. That is, the lower receiving pin 26 serves as a backup support member that supports the substrate 2 from the lower surface.

  Thereafter, when the substrate 2 is further raised to a predetermined height, the substrate 2 is sandwiched from both sides by the clamp member 22. The upper surface of the substrate 2 and the upper surface of the clamp member 22 are made to have the same height by further raising the receiving base 25 while sandwiching the substrate 2. Thereafter, the upper surface of the substrate 2 is brought into contact with the lower surface of the mask plate 13 by raising the support base 20 with respect to the base 10 by the second elevating drive unit 28 (arrow b in FIG. 2). In this state, the two squeegee members 15 are slid in the Y direction by squeegee moving means (not shown) on the mask plate 13 to which the cream solder Pt is supplied, whereby each electrode 3 of the substrate 2 is passed through the pattern hole 13a. The cream solder Pt is transferred (printed) thereon.

  When the cream solder Pt is transferred onto each electrode 3, the base 2 is released from the mask plate 13 by lowering the receiving base 25 with respect to the mask plate 13. Thereafter, the substrate 2 on which the cream solder Pt is transferred onto each electrode 3 is transferred to a pair of substrate conveying conveyors 29B (see FIG. 1) provided on the downstream side of the printing apparatus M1, and the downstream printing state inspection apparatus. Transported to M2.

  Next, the printing state inspection apparatus M2 will be described with reference to FIG. The printing state inspection device M2 includes a Y-axis movement table 31 extending in the Y-axis direction on the base 30, two X-axis movement tables 32 movable in the Y direction with respect to the Y-axis movement table 31, and an X-axis movement A print state having a head moving mechanism composed of two plates 33 movable in the X-axis direction with respect to the table 32, and each plate 33 of the head moving mechanism having an inspection camera with the imaging field of view directed downward Each inspection head 34 is provided. In addition, in the center of the upper surface of the base 30, a part of the first transport line L <b> 1 and the second transport line L <b> 2 is configured and the substrate 2 delivered from the printing apparatus M <b> 1 is transported in the substrate transport direction (X direction). A pair of board | substrate conveyance conveyors 35 are each provided before and after the printing condition inspection apparatus M2.

  The printing state inspection apparatus M2 conveys and positions the substrate 2 delivered from the upstream printing apparatus M1 by the substrate conveying conveyor 35, moves the inspection camera by the head moving mechanism, and moves the electrodes 3 on the substrate 2 to each other. Take an image from above. Then, image recognition is performed based on the captured image of each electrode 3, and a print state inspection is performed to determine whether or not the cream solder Pt is normally printed on each electrode 3.

  Next, the configuration of the component mounting apparatuses M3 to M5 will be described with reference to FIGS. Since the component mounting apparatuses M3 to M5 have the same structure, the component mounting apparatus M3 will be described as a representative. 4 and 5, in the center of the upper surface of the base 40, a pair of board transfer conveyors 41 constituting the first transfer line L1 and the second transfer line L2 and extending in the X direction are on the front side of the component mounting apparatus M3.・ Each is provided on the rear side. The pair of substrate transport conveyors 41 are supported by a pair of conveyor support members 42 provided on the base 40 so as to face each other in the Y-axis direction. At the upper end of each conveyor support member 42, a pair of substrate end pressing members 42 a are provided so as to protrude over the substrate transfer conveyor 41.

  As shown in FIG. 5, a substrate support mechanism 43 is disposed below the substrate 2 in a state where the substrate 2 is held on a pair of substrate transport conveyors 41. The substrate support mechanism 43 has the same configuration as the substrate support mechanism 23 of the printing apparatus M1 described above, and has a configuration in which a plurality of lower receiving pins 46 are erected on a lower receiving base 45 that is lifted and lowered by a lifting drive unit 44. ing. As shown in FIG. 3, a plurality of pin holding holes 45 a are formed in a predetermined regular arrangement on the upper surface of the lower receiving base 45 coupled to the lifting shaft 44 a of the lifting drive unit 44. By inserting the lower receiving pin 46, the lower receiving pin 46 is held in a vertical posture on the lower receiving base 45. The lower receiving pin 46 is detachable from the lower receiving base 45. When starting the component mounting work, the worker selectively inserts the receiving pin 46 into any pin holding hole 45a among the plurality of pin holding holes 45a according to the arrangement of the electrodes 3 on the upper surface of the substrate 2. When a component is mounted on the lower surface of the substrate 2, the receiving pin 46 is disposed so as not to interfere with the component.

  As shown in FIG. 5, when the elevating drive unit 44 is driven to raise the lower receiving base 45 from below with respect to the substrate 2 (arrow c), the lower surface 2a of the substrate 2 is placed on the upper ends of the plurality of receiving pins 46. And the lower receiving base 45 is further raised, the substrate 2 stops at a position where the upper surface thereof contacts the lower surface of the substrate end pressing member 42a. Thereby, the board | substrate 2 is hold | maintained in the mounting work height position. That is, the lower receiving pin 46 is a backup support member for supporting the substrate 2 from the lower surface, like the lower receiving pin 26 in the printing apparatus M1 described above.

  In FIG. 4, a plurality of tape feeders 47 as component supply units are mounted on both sides of the component mounting apparatus M3. The tape feeder 47 has a function of feeding the electronic component 4 to the component extraction position 47a by pitch-feeding a carrier tape (not shown) holding the electronic component 4.

  4 and 5, on the base 40, a Y-axis movement table 48 extending in the Y-axis direction, two X-axis movement tables 49 movable in the Y direction with respect to the Y-axis movement table 48, and X A head moving mechanism 51 composed of two plates 50 that are movable in the X-axis direction with respect to the axis moving table 49 is disposed, and a mounting head 52 is mounted on each of the two plates 50. The mounting head 52 is a multiple-type head including a plurality of holding heads, and suction nozzles 52a capable of sucking and holding the electronic component 4 and individually moving up and down are attached to lower end portions of the respective holding heads. The mounting head 52 is mounted with a substrate recognition camera 53 that is located on the lower surface side of the X-axis moving table 49 and moves integrally therewith. Further, a component recognition camera 54 that captures an image of the electronic component 4 sucked and held by the suction nozzle 52 a is provided between the tape feeder 47 and the substrate transport conveyor 41.

  Next, the configuration of the control system will be described with reference to FIG. The control unit 55 provided in the component mounting apparatus M3 controls the following units constituting the component mounting apparatus M3. The control unit 55 controls the head moving mechanism 51, the mounting head 52, and the tape feeder 47, so that the component mounting operation is performed on the substrate 2 conveyed by the substrate conveying conveyor 41. In addition, the control unit 55 controls the substrate support mechanism 43 to perform a substrate support operation for raising the lower support pins 46 and supporting the substrate 2 from the lower surface.

  A communication unit 56, a touch panel 57 as an input / output unit, and a storage unit 58 are connected to the control unit 55. The communication unit 56 exchanges control signals and data with other devices via the management computer 7 shown in FIG. The touch panel 57 is used for operation input for operating the apparatus, input of production data, and the like, and displays output information from the control unit 55. The storage unit 58 stores a mounting program and production information necessary for executing a board transfer operation and a component mounting operation.

  Next, the operation in the component mounting apparatus M3 will be described. When the control unit 55 of the component mounting apparatus M3 detects that the board 2 has been sent from the upstream apparatus, the board transfer conveyor 41 is operated to receive and transfer the board 2, and the board 2 is moved to a predetermined component mounting position. Positioning. Next, the control unit 55 drives the elevating drive unit 44 to raise the lower receiving base 45 to which the lower receiving pins 46 are attached from below with respect to the substrate 2 (arrow c in FIG. 5). The upper end of the lower receiving pin 46 is brought into contact with 2a. When the lower receiving base 45 further rises in this state, the substrate 2 stops at a position where the upper surface abuts against the lower surface of the substrate end pressing member 42a while the lower surface 2a is supported by the lower receiving pins 46. When the upper surface of the substrate 2 stops at a position where it contacts the lower surface of the substrate end pressing member 42a, the control unit 55 drives the head moving mechanism 51 to move the substrate recognition camera 53 above the substrate 2. The board | substrate 2 is imaged and the position shift of the board | substrate 2 is detected.

  After imaging the substrate 2, the control unit 55 moves the mounting head 52 onto the component extraction position 47 a of the tape feeder 47, and lowers the adsorption nozzle 52 a on the component extraction position 47 a to place the electronic component 4 on the adsorption nozzle 52 a. Adsorb and hold. Next, the control unit 55 moves the mounting head 52 holding the electronic component 4 above the component recognition camera 54 (see FIG. 4), and images the electronic component 4 sucked and held by the suction nozzle 52a by the component recognition camera 54. Then, the positional deviation of the electronic component 4 with respect to the suction nozzle 52a is detected.

  After detecting the misalignment, the control unit 55 moves the mounting head 52 above the substrate 2 to align it, and lowers the suction nozzle 52 a relative to the substrate 2 to mount the electronic component 4 on the substrate 2. At this time, the control unit 55 performs mounting position correction in consideration of the recognition result of the electronic component 4 by the component recognition camera 54 and the recognition result of the substrate 2 by the substrate recognition camera 53 to place the electronic component 4 on the electrode 3 of the substrate 2. To implement. The mounting substrate 5 that has been mounted by the component mounting apparatus M5 disposed at the most downstream of the component mounting apparatuses M3 to M5 is transported to the downstream mounting component inspection apparatus M6.

  Next, the mounting component inspection apparatus M6 will be described with reference to FIGS. 7 and 8, the mounting component inspection apparatus M6 includes a base 60, a pair of substrates that are provided on the base 60, transport the mounting substrate 5 on which the electronic component 4 is mounted, and position the mounting substrate 5 at the inspection position. The conveyance conveyor 61, the head moving mechanism 62 provided in the base 60, and the mounting state inspection head 63 moved by the head moving mechanism 62 are provided. The base 60 is provided with a touch panel 64 as an input / output device.

  The pair of board transfer conveyors 61 are provided on the front side and the rear side of the mounting component inspection apparatus M6 in a state extending in the X direction, and each board transfer conveyor 61 has a first transfer line L1 and a second transfer line L2, respectively. Part of it. The head moving mechanism 62 includes a Y-axis moving table 65 extending on the base 60 in the Y-axis direction, two X-axis moving tables 66 that are movable in the Y direction with respect to the Y-axis moving table 65, and an X-axis moving table. It consists of two plates 67 that are movable in the X-axis direction with respect to 66. The mounting state inspection head 63 is attached to each plate 67 and includes an inspection camera 63a with the imaging field of view facing downward. For this reason, the mounting state inspection head 63 moves the X-axis movement table 66 in the Y direction relative to the Y-axis movement table 65 constituting the head movement mechanism 62 and moves the plate 67 in the X direction relative to the X-axis movement table 66. It can be moved in the horizontal plane by combining with movement.

  The operation of transporting the mounting substrate 5 by the substrate transporting conveyor 61 is performed by the mechanism control unit 69 included in the control unit 68 included in the mounting component inspection apparatus M6 performing operation control of a substrate transporting conveyor driving unit including an actuator (not shown). Similarly, the movement operation of the mounting state inspection head 63 is performed by the mechanism control unit 69 controlling the operation of the head movement mechanism 62 described above.

  Next, the configuration of the control system of the mounted component inspection apparatus M6 will be described with reference to FIG. The control unit 68 includes a mechanism control unit 69, an inspection processing unit 70, and a storage unit 71. The inspection processing unit 70 includes an image processing unit 70a, a pass / fail inspection unit 70b, a count unit 70c, a statistical processing unit 70d, a determination unit 70e, and a display processing unit 70f. The storage unit 71 includes a program storage unit 72, an inspection data storage unit 73, an inspected mounting board target number storage unit 74, a mounting failure cumulative data storage unit 75, and a mounting failure determination ratio threshold value storage unit 76. .

  The above-described touch panel 64 is connected to the control unit 68, an input signal from the touch panel 64 is input to the control unit 68, and output information from the control unit 68 is displayed on the touch panel 64. That is, the output operation of the touch panel 64 is controlled by the control unit 68.

  Next, the storage unit 71 will be described. The program storage unit 72 stores a processing program for an inspection operation by the head moving mechanism 62 and the mounting state inspection head 63. The inspection data storage unit 73 stores component mounting position data 73a, mounting component data 73b, and inspection threshold data 73c. The component mounting position data 73a is data indicating the coordinate position on the board 2 of the component mounting position where the electronic component 4 is mounted on the board 2. The mounted component data 73b is data indicating the type of the electronic component 4 mounted at each component mounting position. The inspection threshold data 73c is data that defines an allowable positional deviation amount with respect to the normal position of the electronic component 4. The inspected mounting board target number storage unit 74 stores the target number of inspected mounting boards 5 necessary for the calculation of a mounting defect determination ratio described later. The mounting failure accumulation data storage unit 75 stores mounting failure accumulation data at each component mounting position subjected to statistical processing by the statistical processing unit 70d. The mounting failure determination ratio threshold value storage unit 76 stores a threshold value as to whether or not to display an estimated failure factor in a mounting failure detail image 83 to be described later.

  Next, the mechanism control unit 69 will be described. The mechanism control unit 69 executes inspection processing of a substrate transport conveyor 61, a head moving mechanism 62, a mounting state inspection head 63 including an inspection camera 63a, and a CCU (camera control unit) 77 that performs imaging control of the mounting state inspection head 63. The mechanism 78 to be provided is controlled.

  Next, the inspection processing unit 70 will be described. The image processing unit 70a receives the image data of the mounting board 5 imaged by the mounting state inspection head 63 via the CCU 77, and performs predetermined image processing such as detection of positional deviation of the electronic component 4 with respect to a predetermined component mounting position. The pass / fail inspection unit 70b compares the image processing result processed by the image processing unit 70a with each data stored in the inspection data storage unit 73 to determine whether or not the electronic component 4 is normally mounted on the electrode 3. The quality of the component mounting state is determined, and the determination result is output to the statistical processing unit 70d. Specifically, if the amount of deviation of the electronic component 4 from the predetermined component mounting position exceeds the threshold value stored in the inspection threshold value data 73c, it is determined that the mounting is defective. That is, the image processing unit 70a and the quality inspection unit 70b are determination units that determine the quality of the mounting state based on the imaging result of the imaging unit and output the determination result.

  When the determination result is output by this determination means, not only the mounting failure is determined but also the type of mounting failure is output together. Specifically, the determination means determines “component position deviation NG” when the mounting position of the electronic component 4 deviates from the normal position, and “parts” when the electronic component 4 is not mounted at the component mounting position. If the electronic component 4 is mounted upside down, it is determined as “reversed NG”, and if the electronic component 4 is mounted in the wrong mounting direction, “polarity NG” is determined. If foreign matter is mixed in the component mounting position, it is judged as “foreign matter NG”.

  The counting unit 70c counts the number of inspected mounting boards 5 that have been determined by the determination unit to determine whether the mounting is good or not, and the number of inspected mounting boards 5 is the number stored in the inspected mounting board target number storage unit 74. When it is determined that it has been reached, the statistical processing unit 70d is instructed to calculate a mounting failure determination ratio described later.

  The statistical processing unit 70d accumulates and aggregates the determination results for each mounting board 5 by the determination unit, and performs predetermined statistical processing. Specifically, the number of times that mounting failure is determined for each component mounting position is counted, and the ratio of the type of mounting failure at each component mounting position for each mounting substrate 5 is calculated. Further, the statistical processing unit 70d receives a command from the counting unit 70c, outputs the statistical processing result to the mounting failure accumulated data storage unit 75, calculates the proportion determined to be mounting failure at each component mounting position, and calculates the result. Is output to the mounting failure accumulation data storage unit 75. The mounting failure determination ratio is calculated by dividing the number of mounted substrates 5 that have been inspected from the number of mounting failures determined at each component mounting position. That is, the statistical processing unit 70d serves as a mounting failure determination ratio calculation unit that calculates a ratio determined as a mounting failure by the determination unit for each component mounting position.

  The determination unit 70e determines whether or not the mounting failure determination rate at each component mounting position calculated by the statistical processing unit 70d exceeds the threshold value stored in the mounting failure determination rate threshold storage unit 76. to decide. When it is determined that the mounting defect determination ratio exceeds the threshold value, the display processing unit 70f is instructed to perform a display process of an estimated defect factor described later on the component mounting position determined to exceed the threshold value. Put out. That is, the determination unit 70e is a determination unit that determines, for each component mounting position, whether or not the ratio determined to be defective by the determination unit satisfies a predetermined condition.

  The display processing unit 70 f displays on the touch panel 64 an image indicating the component mounting position of the mounting board 5 that has been inspected. Further, the statistical processing data at each component mounting position stored in the mounting failure accumulation data storage unit 75 is displayed and output to the touch panel 64. Further, an estimated defect factor display process, which will be described later, is performed on the component mounting position at which the determination unit 70e determines that the mounting defect determination ratio has exceeded a predetermined threshold.

  FIG. 9 shows an image displayed on the touch panel 64 by display processing of the data stored in the mounting failure accumulation data storage unit 75 by the display processing unit 70f. The image displayed on the touch panel 64 includes a component mounting position map 79 that displays, for each component mounting position, a portion determined to be defective on the board 2.

  The display method of the mounting failure location in the component mounting position map 79 performed by the control unit 68 will be described in detail. When the operator operates the cumulative display button 80 displayed on the touch panel 64, the display processing unit 70f is mounted on the component mounting position where the mounting defect has occurred on the image of the mounting board displayed on the component mounting position map 79. Display defect determination data. In the present embodiment, as a method for displaying mounting failure determination data, display is made using a plot mark P at a component mounting position determined as a mounting failure in the component mounting position map 79, and plotting is performed according to a mounting failure determination ratio. The color of the mark P is made different. The color assignment of the plot mark P can be confirmed by the color reference column 81 displayed on the touch panel 64. Thus, the worker can visually know the mounting failure determination ratio by comparing the color of the plot mark P displayed on the component mounting position map 79 with the color reference field 81.

  The color of the plot mark P assigned in accordance with the mounting failure determination ratio, the range of numerical values to which the color of the plot mark P is assigned, etc. can be arbitrarily set. When the cumulative reset button 82 displayed on the touch panel 64 is operated by the worker, the control unit 68 resets the stored mounting failure cumulative data, and newly starts the cumulative storage of the determination result from that point. .

  In the above configuration, the mounting failure accumulation data storage unit 75 is a storage unit that accumulates and stores the determination results for each component mounting position for a plurality of mounting boards 5, and the display processing unit 70 f and the touch panel 64 are the components on the mounting board 5. Component mounting position map display means for visually displaying the mounting position as a component mounting position map 79 is provided. The statistical processing unit 70d and the display processing unit 70f constitute a determination result accumulation display unit that displays the determination result accumulated and stored for each component mounting position on the component mounting position map 79.

  When the operator selects a plot mark P displayed on the component mounting position map 79, the control unit 68 displays a mounting defect detailed image 83 on the touch panel 64, which displays detailed information on the mounting defect in the plot mark P. . In the mounting failure detailed image 83, a “board No.” indicating the type of the mounting board 5 to be inspected displayed on the component mounting position map 79, and a pattern to which the component mounting position belongs in the case of a multi-sided board. “Pattern No.”, “Block No.” indicating the mounting order of the electronic component 4 mounted at the selected component mounting position on the substrate 2, and the component mounting apparatus that has performed the mounting operation of the electronic component 4 at the selected component mounting position Mounted at a selected component mounting position among the plurality of suction nozzles 52a provided in the component mounting apparatuses M3 to M5 indicated by “Mounting Machine No.” indicating M3 to M5 and “Mounting Machine No.”. “Use nozzle No.” indicating the suction nozzle 52a used for the mounting operation of the electronic component 4, and the tape cartridge supplied with the electronic component 4 mounted at the selected component mounting position. "Supply Feeder No." indicating the feeder 47, "Failure content" indicating the specific content of the mounting failure, such as misalignment of the electronic component 4 at the selected component mounting position or no component, etc., and "Estimated failure factor: subordinate It includes the phrase “incomplete pin placement”.

  Regarding the “defect content” in the detailed mounting defect image 83 described above, since the content of the mounting defect at the selected component mounting position may be different for each unit mounting board, “component misalignment NG”, “no component NG”. , “Inversion NG”, “Polarity NG”, and “Foreign matter mixed NG” occurrence ratios are displayed as a pie chart. Thereby, it is possible to easily grasp the details of the mounting failure at each component mounting position. Further, the phrase “estimated failure factor: inadequate placement of the receiving pin” means that the proportion of component mounting positions where the plot mark P is displayed is determined to be mounting failure in the mounting failure determination rate threshold storage unit 76. Displayed for the component mounting position determined by the determination unit 70e that the stored threshold value has been exceeded. For example, when the determination unit 70e determines that the mounting failure determination ratio at a certain component mounting position exceeds 41%, the determination unit 70e outputs the determination result to the display processing unit 70f, and the display processing unit 70f outputs the determination result. Based on the above, the above-mentioned wording is displayed on the touch panel 64. The threshold value may be arbitrarily set by the worker.

  As described above, in electronic component mounting in which the electronic component 4 is mounted on the substrate 2 to manufacture the mounting substrate 5, mounting NG can occur at a plurality of component mounting positions. Also, the frequency of mounting NG at each component mounting position and the specific content of the defect are various. The occurrence of such mounting NG has a significant effect on the quality of the mounting board 5. Therefore, when a component mounting position with a high generation ratio of mounting NG occurs, the worker quickly identifies the cause of mounting NG. It is necessary to take measures. Here, the reason that the estimated defect factor is displayed in the mounting defect detailed image 83 by the control unit 68 is that the arrangement state of the receiving pins 46 is considered to be one of the causes determined to be mounting defects. An inexperienced worker cannot easily understand the cause and cannot take concrete measures, and an operator who comes in contact with the display of the above words promptly arranges the receiving pin 46. Measures can be taken in consideration of deficiencies. In the following, the contents of mounting failures that may occur due to the poor placement of the receiving pins 46 and countermeasures for them will be described.

  FIGS. 10A, 10 </ b> B, and 10 </ b> C show an example of a state in which mounting NG occurs due to improper placement of the receiving pins 46. The substrate 90 illustrated in FIG. 10A is a multi-sided substrate in which a plurality of unit substrates 90a are formed on a single substrate. The unit substrate 90a is divided in advance by dividing slits 90b, and each unit substrate 90a is coupled to the main body of the substrate 90 only by a partially formed bridge portion 90c.

  As shown in FIG. 10 (b), when the receiving pins 46 are arranged on the substrate 90 at locations other than the lower surface of the unit substrate 90a, the unit substrate 90a may be bent into a concave shape by its own weight. Here, since the descending distance (arrow d) of the suction nozzle 52a with respect to the unit substrate 90a is determined on the assumption that the substrate is flat without deflection, the electronic component 4 remains in a state where the unit substrate 90a is bent in a concave shape. When the electronic component 4 is mounted, the electronic component 4 sucked by the suction nozzle 52a is released from the suction by the suction nozzle 52a with a gap corresponding to the amount of deflection between the electronic component 4 and the electrode 90d formed on the unit substrate 90a. As a result, there may occur a situation in which mounting is caused by a positional shift.

  Further, as shown in FIG. 10C, even when the unit substrate 90a is not bent into a concave shape, the electronic component 4 is mounted at a component mounting position where the lower surface of the unit substrate 90a is not supported by the lower receiving pins 46. In this case, the unit substrate 90a is bent in a concave shape by the downward pressing force of the electronic component 4 against the unit substrate 90a (arrow e), and the electronic component 4 is mounted with a positional shift due to the bending. Can occur.

  As described above, when the mounting operation of the electronic component 4 is continued even though the placement of the receiving pins 46 is not appropriate, mounting defects may continuously occur at the component mounting position. Note that the mounting failure due to the insufficient placement of the support pins 46 is not limited to the case where a multi-sided substrate such as the above-described substrate 90 is used. For example, an electronic component is formed on an extremely thin resin substrate. A case similar to the above can also occur when mounting.

  When the control unit 68 displays “Estimated failure factor: insufficient placement of the receiving pin” on the mounting defect detail image 83, the worker displays “Mounting machine No.” and “Use nozzle” on the mounting defect detail image 83. No. ”,“ Supply Feeder No. ”, etc., the mounting work location where the receiving pin 46 that has been pointed out of inadequate placement is specified is identified, and the actual position of the receiving pin 46 is determined. Check the placement status. If the arrangement of the lower receiving pins 46 is not appropriate, the worker changes the arrangement of the lower receiving pins 46 and inserts additional lower receiving pins 46A as shown in FIG. 11 as necessary.

  In the above-described configuration, the touch panel 64 and the control unit 68 that controls the touch panel 64 are arranged with respect to the component mounting position in which the ratio determined to be mounting failure by the determination unit satisfies a predetermined condition, It is an informing means for informing that it is confirmed.

  Next, a mounting component inspection execution flow will be described with reference to FIGS. First, the control unit 68 acquires inspection data of the predetermined number of mounting boards 5 necessary for calculating the mounting failure determination ratio (ST1). An execution flow for acquiring inspection data of the mounting board 5 will be described with reference to FIG.

  As shown in FIG. 13, first, the mechanism control unit 69 controls the board transport conveyor 61 to carry the mounting board 5 into the mounting component inspection apparatus M6 (ST11). Next, the mechanism control unit 69 drives the head moving mechanism 62 to move the mounting state inspection head 63 onto the mounting substrate 5, and the inspection camera 63a includes one or a plurality included in the imaging range of the inspection camera 63a. The mounting component image of the mounting substrate 5 is acquired by imaging the component mounting position (ST12). That is, the mounting state inspection head 63 serves as an imaging unit that images the component mounting position on the substrate 2 after component mounting. The mounted component image is subjected to image processing by the image processing unit 70a, and based on the processing result, the pass / fail inspection unit 70b performs a pass / fail inspection of the mounting state at the component mounting position (ST13).

  Then, the pass / fail inspection unit 70b determines whether the mounting state of the component mounting position is good (ST14). If it is determined that the mounting is defective, the pass / fail inspection unit 70b determines whether the mounting substrate 5 includes the component mounting position and the content of the mounting failure. The inspection data is output to the statistical processing unit 70d (ST15). Then, the control unit 68 determines whether or not the pass / fail inspection for all the component mounting positions on one mounting board 5 is completed (ST16), and if the pass / fail inspection for all the component mounting positions is not ended. Returning to (ST12), mounting component images at other component mounting positions that have not yet been checked for pass / fail are acquired and similar processing is executed. If the control unit 68 determines that the quality inspection for all component mounting positions has been completed, the control unit 68 carries the mounting board 5 out of the mounting component inspection apparatus M6 (ST17). The carried-out mounting board 5 is counted by the counting unit 70c, and whether or not the statistical processing unit 70d has acquired the inspection data for the predetermined number of mounting boards 5 stored in the inspected mounting board target number storage unit 74. Judgment is made (ST18). If the predetermined number of sheets has not been reached, the process returns to ST11 and the inspection of the mounting board 5 is continued. By repeatedly executing the inspection process of the mounting board 5 in this way, the statistical processing unit 70d acquires the inspection data of the predetermined number of mounting boards.

  As shown in FIG. 12, when the count unit 70c determines that the statistical processing unit 70d has acquired inspection data for a predetermined number of mounting boards 5, each component mounting of the mounting board 5 on the statistical processing unit 70d is performed. A command is issued to calculate a mounting failure determination ratio at the position. In response to this instruction, the statistical processing unit 70d calculates a mounting failure determination ratio (ST2), calculates the mounting failure determination ratio at each component mounting position, the number of mounting failures at each component mounting position, and the mounting at each component mounting position. The statistically processed mounting failure cumulative data including the proportion of types of failures is output to the mounting failure cumulative data storage unit 75, and the mounting failure cumulative data storage unit 75 stores this. Then, the display processing unit 70 f displays an image of the mounting board 5 including the component mounting position on the component mounting position map 79 based on the data stored in the mounting failure accumulation data storage unit 75.

  When the operator operates the cumulative display button 80 displayed on the touch panel 64, the display processing unit 70f uses the plot mark P to store the data stored in the mounting failure cumulative data storage unit 75 on the component mounting position map 79. Display processing. When the operator operates the plot mark P displayed on the component mounting position map 79, the above-described mounting failure detailed image 83 is displayed on the touch panel 64 by the display processing unit 70f.

  In the display processing of the mounting failure detailed image 83 by the display processing unit 70f, it is determined whether or not the mounting failure determination ratio at the component mounting position where the plot mark P is displayed by the determination unit 70e exceeds a predetermined threshold value. When it is determined for each component mounting position (ST3) and the determination unit 70e determines that the threshold value is exceeded, the determination result is output to the display processing unit 70f. Then, the display processing unit 70f receives the determination result and performs a process of displaying the estimated failure factor in the mounting failure detailed image 83 (ST4).

  When the above-mentioned wording is notified on the mounting failure detailed image 83, the worker confirms the arrangement state of the receiving pins 46 in the component mounting apparatuses M3 to M5 that have been pointed out that the receiving pins 46 are not properly arranged. Then, the worker takes measures such as newly adding and setting the support pin 46 according to the situation. The mounting board 5 in which the mounting component inspection has been completed and no defect has been detected is carried into a reflow device 91 (see FIG. 1) connected to the downstream side, where the mounting board 5 is heated to thereby form the board 2 and the electronic component. 4 is soldered.

  In the component mounting line 1, the printing state inspection device M2 may not be provided due to the convenience of the equipment area. In such a case, since the component mounting operation is performed in the component mounting apparatuses M3 to M5 without performing the inspection of the printing state, the cause of the mounting failure that has occurred is inadequate arrangement of the receiving pins 46 in the component mounting apparatuses M3 to M5. Instead, it may be caused by printing failure of the cream solder Pt caused by improper arrangement of the receiving pins 26 in the printing apparatus M1. Therefore, when the above-mentioned estimated failure factor is displayed in the inspection of the mounting board 5 manufactured by the component mounting line 1 that does not include the printing state inspection device M2, the arrangement state of the receiving pins 26 in the printing device M1 is also confirmed. If the deficiency is confirmed, measures such as newly arranging the receiving pin 26 are taken.

  In the above configuration, the printing device M1 and the component mounting devices M3 to M5 are for mounting components at a plurality of component mounting positions set on the substrate 2 of the substrate 2 whose lower surface 2a is supported by the backup support member. It is a component mounting device that performs work. The mounting component inspection apparatus M6 inspects the mounting state of the mounting substrate 5 mounted by the component mounting system including the component mounting apparatus.

  Then, the mounting operation is performed by a component mounting system including a component mounting apparatus that performs a component mounting operation on a plurality of component mounting positions set on the substrate whose lower surface is supported by the backup support member. In the mounting component inspection method for inspecting the mounting state of a broken component-mounted board, the mounting state is imaged based on the imaging process of imaging the component mounting position on the board after mounting the component and the imaging result in the imaging process. A determination step of determining the output and outputting a determination result, a storage step of accumulating the determination results for each component mounting position for a plurality of substrates, and a component that visually displays the component mounting position on the substrate as a component mounting position map The mounting position map display process and the determination result accumulation that displays the determination result accumulated and stored for each component mounting position on the component mounting position map. A display step, a determination step for determining, for each component mounting position, whether or not a ratio determined as a mounting defect in the determination step satisfies a predetermined condition, and a ratio determined as a mounting defect in the determination unit satisfies a predetermined condition. For the component mounting position that is determined to be satisfied, a notification step of notifying that the setting state of the measurement points near the component mounting position is confirmed is included.

  As a result, even a worker who has little experience in the component mounting field can easily and quickly understand the specific cause of the mounting failure, and lower the position around the component mounting position where the poor placement of the receiving pins 26 and 46 is pointed out. Measures such as newly adding the receiving pins 26 and 46 can be taken promptly. As a result, it is possible to improve the productivity of the mounting substrate by suppressing the generation of the mounting defective substrate.

  Then, by analyzing the tendency of occurrence of mounting defects, it is possible to estimate the cause of mounting defects based on empirical data and set the receiving pins 26 and 46 more appropriately. That is, it is possible to effectively utilize the inspection result information obtained in the mounting component inspection, and to improve the usefulness of the component mounting state inspection.

  In the present embodiment described above, the display of the estimated failure factor in the mounting failure detailed image 83 is performed when the ratio determined to be mounting failure at the component mounting position where the plot mark P is displayed satisfies a predetermined condition. However, it may be performed when the number of times determined as mounting failure satisfies a predetermined condition. That is, if the count unit 70c determines that the number of inspected mounting boards 5 has reached the number stored in the inspected mounting board target number storage unit 74, each component mounting position statistically processed by the statistical processing unit 70d. The determination unit 70e determines whether or not the number of times the mounting failure is determined exceeds the predetermined threshold value. If the determination unit 70e determines that the mounting threshold value is exceeded, the display processing unit 70f The detailed image 83 is used to display the estimated failure factor. That is, the determination means (determination step) according to the present invention is configured to determine, for each component mounting position, whether or not the ratio or the number of times determined as mounting failure satisfies a predetermined condition, and also provides notification means (notification step). Is for confirming the setting status of the measurement points in the vicinity of the component mounting position for the component mounting position where it is determined that the ratio or the number of times determined as defective mounting in the determining means (determination step) satisfies a predetermined condition. It is configured to perform notification.

  The mounting component inspection apparatus and the mounting component inspection method of the present invention can effectively utilize the inspection result information obtained in the mounting component inspection to correct the placement defect of the backup support member and improve the usability of the mounting component inspection. This is useful in the field of inspecting the mounting state of components mounted on a board.

2 Substrate 4 Electronic component 5 Mounting substrate 26, 46 Bottom receiving pin 63 Mounting state inspection head 68 Control unit 70 Inspection processing unit 70a Image processing unit 70b Pass / fail inspection unit 70c Count unit 70d Statistical processing unit 70e Judgment unit 70f Display processing unit 75 Mounting Defect accumulation data storage unit 79 Component mounting position map 83 Detailed mounting defect image M3 to M5 Component mounting device M6 Mounting component inspection device

Claims (2)

The mounting operation was performed by a component mounting system including a component mounting apparatus that performs a component mounting operation on a plurality of component mounting positions set on the substrate whose lower surface is supported by the backup support member. A mounting component inspection apparatus for inspecting a mounting state on a component-mounted board,
Imaging means for imaging the component mounting position on the substrate after component mounting;
A determination unit that determines the quality of the mounting state based on an imaging result of the imaging unit and outputs a determination result;
Storage means for accumulating and storing the determination results for each component mounting position for a plurality of component mounted boards;
Component mounting position map display means for visually displaying the component mounting position on the component mounted board as a component mounting position map;
Determination result accumulation display means for displaying the determination result accumulated and stored for each component mounting position on the component mounting position map;
A determination unit that determines, for each component mounting position, whether or not the ratio or the number of times determined as mounting failure in the determination unit satisfies a predetermined condition;
Notification for notifying the component mounting position where it is determined that the ratio or the number of times determined as defective mounting satisfies the predetermined condition in the determination means to confirm the arrangement status of the backup support members around the component mounting position A mounting component inspection apparatus characterized by comprising means. The mounting operation was performed by a component mounting system including a component mounting apparatus that performs a component mounting operation on a plurality of component mounting positions set on the substrate whose lower surface is supported by the backup support member. A mounting component inspection method for inspecting a mounting state on a component-mounted board,
An imaging process for imaging the component mounting position on the substrate after component mounting;
A determination step of determining the quality of the mounting state based on the imaging result in the imaging step and outputting the determination result;
A storage step of accumulating and storing the determination result for each component mounting position for a plurality of component-mounted boards,
A component mounting position map display step for visually displaying a component mounting position on a component mounted board as a component mounting position map;
A determination result accumulation display step of displaying a determination result accumulated and stored for each component mounting position on the component mounting position map;
A determination step of determining, for each component mounting position, whether or not the ratio or number of times determined as mounting failure in the determination step satisfies a predetermined condition;
Notification for notifying the component mounting position where it is determined that the ratio or the number of times determined as mounting failure in the determining step satisfies a predetermined condition to confirm the arrangement status of the backup support members around the component mounting position The mounting component inspection method characterized by including a process.

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