JP2013030314A - Wiring connection tool between substrates, device having wiring structure, and chassis type switch - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid increase of the number of substrate layers for insulating wirings crossing with each other.SOLUTION: A wiring connection tool between substrates electrically connects a plurality of first wirings formed on a first substrate to a plurality of second wirings formed on a second substrate and paired with the plural first wirings. The wiring connection tool comprises plural sets including first connection parts, second connection parts and intermediate parts electrically connecting the first connection parts and the second connection parts corresponding to the plural pairs, respectively. The plural sets are mutually insulated. In the wiring connection tool, when the first substrate is physically connected to the second substrate, each first connection part is electrically connected to corresponding one of the plural first wirings, and each second connection part is electrically connected to one of the plural second wirings paired with one of the plural first wirings.

Description

  The present invention relates to a wiring connector between substrates, a device having a wiring structure, and a chassis type switch.

In the field of communication devices, there is a chassis type device (referred to as a chassis type switch) in which a plurality of plug-in units (PIUs) are housed in a housing called a shelf. The shelf has a plurality of slots for accommodating each PIU, and a connector for electrically connecting the PIU and a back board (BWB) mounted on the shelf is provided in each slot. It has been.

  The PIU is a printed board on which a device having a predetermined function is mounted. The PIU applied to the chassis type switch includes, for example, an interface unit (IF unit) that accommodates a communication line and a switch unit (SW unit) that performs switching for signals transmitted and received between the IF units.

  The PIU (IF unit) and SW unit mounted on the shelf by the connector are electrically connected via the BWB. Signals transmitted from each PIU (IF unit) are collected in the SW unit and transferred to the target IF unit by the switching function of the SW unit. A wiring configuration in which each PIU (IF unit) is connected to the SW unit with the SW unit as a center is called a star-type wiring.

  A plurality of devices (switching devices) for switching signals from each PIU (IF unit) are often mounted on the SW unit. This is because the switching capacity required for processing signals from all PIUs (IF units) may not be secured. This is also because the number of pins that the switching device has is limited.

  When a SW unit having a plurality of switching devices and a plurality of PIUs (IF units) are connected, each PIU (IF unit) is connected to each switching device by a star wiring.

JP 2003-288134 A Japanese Utility Model Publication No. 61-186268 JP 2005-175124 A

  As described above, when each switching device and each PIU (IF unit) are connected in a star shape via the BWB, a cross portion of the wiring is generated between the star type wirings in a plan view state. The cross portion increases as the number of switching devices mounted on the SW unit increases.

Generally, a PIU (IF unit and SW unit) is realized by a printed circuit board on which a plurality of semiconductor circuits (semiconductor circuit chips) that realize required functions are mounted. The BWB is also realized by a printed circuit board on which a wiring pattern that is electrically connected to the IF unit and the SW unit is formed.

  Accordingly, the wiring connecting the IF unit and the SW unit is realized by a wiring pattern formed on the printed circuit board, not a wire material such as a cable. For this reason, avoidance of physical contact between the wirings in the cross portion described above can be realized by applying a multilayer printed board to the SW unit or BWB and ensuring an insulation state between the wirings in the cross portion.

  However, an increase in the number of layers of the SW unit or BWB causes an increase in the manufacturing cost of the SW unit or BWB. In addition, an increase in the number of SW unit layers leads to an increase in the size of the SW unit, which may be a factor that hinders downsizing of the chassis type switch (chassis type device).

  An object of one embodiment of the present invention is to provide a technique capable of avoiding an increase in the number of substrate layers for insulating between crossed wirings.

According to one embodiment of the present invention, a plurality of first wirings formed on a first substrate and a plurality of second wirings formed on a second substrate and respectively paired with the plurality of first wirings are electrically connected. A wiring connector between connected boards,
A plurality of sets including a first connection portion, a second connection portion, and an intermediate portion that electrically connects the first connection portion and the second connection portion, each corresponding to the plurality of pairs,
The plurality of sets are insulated from each other;
At the time of physical connection between the first substrate and the second substrate, the first connection portions are electrically connected to one of the corresponding first wirings, and the second connection portions are A wiring connector between substrates that is electrically connected to one of the plurality of second wirings paired with one of the plurality of first wirings.

  According to one embodiment of the present invention, an increase in the number of substrate layers for insulating between crossed wirings can be avoided.

FIG. 1 schematically shows a wiring topology between substrates or circuits of a chassis type switch which is an example of a chassis type device (plug-in unit accommodating device) according to the first embodiment. FIG. 2A schematically shows a front view of a chassis type switch that accommodates the SW unit and PIU (IF unit) shown in FIG. FIG. 2B schematically shows a state in which the SW unit and the PIUs (# 1 to # 8) are removed from the state shown in FIG. 2A. FIG. 3A is an explanatory diagram of the BWB, SW unit, and cross-resolving plate (wiring connection adjusting plate: inter-board connector) according to the first embodiment. FIG. 3B is an explanatory diagram of the BWB, the SW unit, and the cross elimination plate (wiring connection adjusting plate: inter-board connector) according to the first embodiment. FIG. 3C schematically shows a state in which the connector C21 and the connector C1 are partially enlarged. FIG. 4 shows the cross release plate and the connector C21 cut along a horizontal plane including the pins P1 and P11, while the connectors C11, BWB13, and the connector C1 are at the same height as the cross release plate (pins P1 and P11). It is the figure which planarly viewed the cut surface when cut | disconnecting according to a position. FIG. 5A is a plan view of the state when the connector C21 shown in FIG. 4 is fitted (connected) to the connector C11, and FIG. It is the figure which looked at a part of BWB in the state of) from the front. FIG. 5B is a view of the cross section taken along the line FF in FIG. 5A as viewed from the front of the cross release plate. 6A shows a state when a cross section of the BWB shown in FIG. 5A (B) is cut along the line AA including the pins P1 to P4 when viewed from the right side (the connectors C11 to C18 are illustrated). (Omitted). FIG. 6B shows an enlarged view of the vicinity of the connector C21 in FIG. 6A. FIG. 7A shows a state in which a cross section when the BWB shown in FIG. 5B is cut along the line BB including the pins P11 to P14 is viewed from the right side (the connectors C11 to C18 are illustrated). (Omitted). FIG. 7B shows an enlarged view of the vicinity of the connector C21 of FIG. 7A. FIG. 8 shows a state of wiring connection between the BWB and the SW unit in a state where the connectors C11 to C18 of the SW unit are fitted into the connectors C1 to C8 of the BWB. FIG. 9 schematically shows a state in which a part of the cut surface along the line CC shown in FIG. FIG. 10 schematically shows a state in which a part of the cut surface along the line DD shown in FIG. 8 is viewed from the front of the BWB. FIG. 11 schematically shows a state in which a part of the cut surface along the line EE shown in FIG. 8 is viewed from the front of the cross release plate. FIG. 12A shows a bonding structure example 1 between the BWB and the cloth release plate. FIG. 12B shows a bonding structure example 1 between the BWB and the cloth release plate. FIG. 13A shows a joint structure example 2 between the BWB and the cloth release plate. FIG. 13B shows a joint structure example 2 between the BWB and the cloth release plate. FIG. 14A shows a bonding structure example 3 between the BWB and the cloth release plate. FIG. 14B shows a joint structure example 3 between the BWB and the cloth release plate. FIG. 15A shows a joint structure example 4 of the BWB and the cloth release plate. FIG. 15B shows a joint structure example 4 of the BWB and the cross release plate. FIG. 16A shows a bonding structure example 5 between the BWB and the cloth release plate. FIG. 16B shows a bonding structure example 5 between the BWB and the cloth release plate. FIG. 17 is a comparative example (reference diagram) of the first embodiment and shows an example in which wiring from the BWB as shown in FIG. 2B is directly connected to the SW unit. FIG. 18 is a reference diagram for explaining the effect of the first embodiment. FIG. 19 is a diagram for explaining the effect of the first embodiment. FIG. 20 is a reference diagram showing a wiring arrangement in which no crossing occurs between device wirings. FIG. 21 is a reference diagram showing a wiring cross in BWB. FIG. 22A shows a state of the cross release structure in the second embodiment, that is, the structure of the cross release plate joined to the SW unit, as viewed from the right side surface of the chassis type switch. FIG. 22B schematically shows the state shown in FIG. 22A as viewed from the bottom.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The configuration of the embodiment is an exemplification, and the present invention is not limited to the configuration of the embodiment.

[First Embodiment]
FIG. 1 schematically shows a wiring topology between substrates or circuits of a chassis type switch which is an example of a chassis type device (plug-in unit accommodating device) according to the first embodiment. The first embodiment exemplifies a chassis type switch that houses one SW unit 11 and eight IF units 12 (# 1 to # 8) in a casing (shelf) as a plug-in unit (PIU). In the following description, the IF unit may be referred to as “PIU”. The SW unit is a kind of PIU, but the notation “SW unit” is used. The PIU is a functional module having a plate-like or card-like outer shape on which an electric / electronic circuit group (IC, LSI, ASIC, etc.) for realizing a function required for a printed board is mounted.

  Each PIU (IF unit) 12 accommodates one or more communication lines, and transmits and receives signals to and from the outside of the chassis type switch. Each PIU 12 transmits a signal received from the outside to the SW unit 11 according to the destination of the signal. The SW unit 11 executes a switching process for signals received from each PIU 12. For this reason, the SW unit 11 includes a plurality of switching devices (hereinafter also simply referred to as “devices”) D1 to D4 which are semiconductor circuit chips that realize a switching function. However, the plurality of switching devices may be physically integrated into one or more chips.

  Each PIU 12 (# 1 to # 8) is star-connected to each device D1 to D4 mounted on the SW unit 11. However, FIG. 1 illustrates only the star wiring of the PIU 12 (# 1 to # 8) for the devices D1 and D2. Each device D1 to D4 transfers a signal received from each PIU 12 to the PIU 12 corresponding to the destination of the signal.

  A star-shaped connection (star-shaped wiring) centering on each device D1 to D4 causes a plurality of cross portions between the star-shaped wirings for each switching device. For example, paying attention to the PIU 12 (# 2) shown in FIG. 1, no cross portion occurs in the wiring connecting the PIU 12 (# 2) and the device D1. However, the wiring connecting the PIU 12 (# 2) and the device D2 crosses between each wiring connecting the PIU 12 (# 1, # 5, # 6) and the device D1. Hereinafter, a configuration or mechanism for ensuring insulation between wirings in such a cross portion will be described.

  Note that the wirings connecting the PIUs 12 and the devices D1 to D4 as shown in FIG. 1 are actually bundles of wirings. However, in order to simplify the description, in the following description, it is assumed that there is one wiring for transmitting a signal from each PIU 12 to each of the devices D1 to D4.

  In FIG. 1, a chassis type switch 10 that can accommodate one SW unit having four devices D1 to D4 and eight PIUs (IF units) is shown as an example. The number of SW units mounted on one chassis type switch, the maximum accommodation number of IF units, and the number of switching devices mounted on one SW unit can be set as appropriate. Moreover, it is not prevented that the chassis type switch 10 accommodates PIUs (for example, control units) other than the IF unit and the SW unit.

  FIG. 2A schematically shows a front view of the chassis type switch 10 that houses the SW unit 11 and the PIU (IF unit) 12 shown in FIG. In FIG. 2A, the rectangle of the outer frame portion indicated by reference numeral 10 </ b> A indicates a housing (shelf) 10 </ b> A of the chassis type switch 10. The shelf 10 </ b> A has a plurality of slots that accommodate the SW unit 11 PIU (IF unit) 12. The SW unit 11 and the PIU 12 are printed boards on which a plurality of semiconductor circuit chips that realize required functions are mounted. Since the external shape of the SW unit 11 and the PIU (IF unit) 12 is a card type, the SW unit 11 and the IF unit may be referred to as a SW card and an IF card, respectively.

FIG. 2B schematically shows a state where the SW unit 11 and the PIUs 12 (# 1 to # 8) are removed from the state shown in FIG. 2A. As shown in FIG. 2B, a backboard (BWB) 13 for electrically connecting each PIU 12 to the SW unit 11 is disposed on the back side of the shelf 10A. A straight broken line shown inside the outer frame rectangle indicating the shelf 10A indicates a slot into which the SW unit 11 and each PIU 12 are inserted. BWB13 is the first
The SW unit 11 is an example of a second substrate.

  The BWB 13 includes connectors CN1 to CN8 for making a physical and electrical connection with the PIU 12 inserted into each slot. The BWB 13 includes connectors C1 to C8 for performing physical and electrical connection with the SW unit 11 inserted into the slot.

  Each of the connectors CN1 to CN8 has four electrical contacts (corresponding to output ports) for transmitting signals transmitted from the PIU 12 to the devices D1 to D4. A connector to be connected to any one of the connectors CN1 to CN8 is provided at the end of the PIU 12 on the slot insertion side, and the PIU 12 is connected to the front side of the BWB 13 in a state perpendicular to the BWB 13 plane by inter-connector connection. Physically fixed connection. At this time, the electrical contact (terminal group) provided in the connectors CN1 to CN8 comes into contact with the terminal group included in the PIU 12, whereby the PIU 12 and the BWB 13 are electrically connected.

  In the first embodiment, female connectors are applied to the connectors CN1 to CN8 and C1 to C8 of the BWB 13, and male connectors are applied to the connectors provided in the SW unit 11 and the PIU 12. However, the male and female connectors may be reversed.

  As shown in FIG. 2B, in the BWB 13, the following wiring is formed between the connectors CN1 to CN8 and the connectors C1 to CN8. That is, a wiring group L1 is formed between the connector CN2 and the connector C1, and a wiring group L2 is formed between the connector CN3 and the connector C2. In addition, a wiring group L3 is formed between the connector CN1 and the connector C3, and a wiring group L4 is formed between the connector CN4 and the connector C4. Similarly, a wiring group L5 is formed between the connector CN5 and the connector C5, and a wiring group L6 is formed between the connector CN6 and the connector C6. Further, a wiring group L7 is formed between the connector CN7 and the connector C7, and a wiring group L8 is formed between the connector CN8 and the connector C8. Each of the wiring groups L1 to L8 includes signal lines S1 to S4 corresponding to four electrical contacts provided on the connectors CN1 to CN8, respectively. The signal lines S1 to S4 are used for transmission of signals output toward the devices D1 to D4. In FIG. 2B, the wiring groups L5 to L8 are illustrated with the signal lines S1 to S4 simplified by a single broken line. The combination of CN1 to CN8 and C1 to C8 is an example. If the wiring does not cross on the BWB 13, for example, a wiring group is set between CN2 and C2, and between CN3 and C1. A wiring group may be set. The signal lines S1 to S4 are examples of the first wiring.

  3A and 3B are explanatory diagrams of the BWB 13, the SW unit 11, and the cross cancellation plate 14 according to the first embodiment. The cloth elimination plate 14 is an example of a connection tool (wiring connection adjustment plate) between the substrates. In the first embodiment, physical connection between the SW unit 11 and the BWB 13 is performed by connection between connectors. On the other hand, the electrical connection between the SW unit 11 and the BWB 13 is performed via the cross cancellation plate 14.

  3A shows the arrangement relationship between the SW units 11, BWB 13 and the cross release plate 14 when the BWB 13 is viewed from the front, and FIG. 3B shows the arrangement relationship between the BWB 13 and the cross release plate 14 when the BWB 13 is viewed from the back. This is shown schematically.

As shown in FIG. 3A, the SW unit 11 includes connectors CN11 to CN18 (male type) corresponding to a plurality of connectors C1 to C8 (female type) arranged in series in the vertical direction of the BWB 13 on the front surface of the BWB13. Yes. When the connectors CN11 to CN18 are fitted into the connectors C1 to C8, respectively, the SW unit 11 is fixedly connected to the BWB 13 vertically.

  On the other hand, on the back surface of the BWB 13, connectors C 11 to C 18 (female type) for connecting to the cross release plate 14 at positions corresponding to the connectors C 1 to C 8 (positions overlapping the connectors C 1 to C 8 in a plan view of the BWB 13). Is provided (FIG. 3B).

  The cross release plate 14 is a printed circuit board that is provided to prevent the BWB 13 or the SW unit 11 from securing insulation of the cross portion between the wirings generated by the star-type connection of the plurality of PIUs 12 to the plurality of switching devices. It is. Connectors C21 to C28 corresponding to the connectors C11 to C18 are provided on the front surface of the cross release plate 14. When the connectors C21 to C28 are fitted into the connectors C11 to C18, the cross release plate 14 is fixedly arranged in a state parallel to the BWB 13.

  FIG. 3C schematically shows a state in which the connector C21 and the connector C1 are partially enlarged. The connector C21 includes connector pins (pins) P1 to P4 arranged side by side in the vertical direction of the cross release plate 14, and connector pins (pins) P11 to P14 arranged in parallel with the pins P1 to P4. Similarly to the connector C21, the connectors C22 to C28 also have pins P1 to P4 and P11 to P14.

  The pins P1 to P4 are shorter than the pins P11 to P14, and the tips of the pins P1 to P4 stop in the BWB 13 in a state where the connector C21 is normally fitted into the connector C11 (FIG. 3B) ((A) in FIG. 5A). reference). The pins P1 to P4 are electrically connected to a wiring group from the PIU connector formed on the BWB 13. For example, the pins P1 to P4 of the connector C21 are electrically connected to the wiring group L2 (signal lines S1 to S4) from the connector CN2 for the PIU 12 (FIG. 2B) in the BWB 13, respectively.

  On the other hand, the pins P11 to 14 are the through holes 17 (FIG. 4) formed in the connectors C11 and BWB13 and the connector C1 shown in FIG. 3C when the connector C21 is normally fitted in the connector C11. It protrudes into the connector C1 through the hole 15 ((A) of FIG. 5A). Each of the pins P11 to P14 is insulated inside the connectors C11 and BWB13 and the connector C1, and is electrically connected to each of the devices D1 to D4 provided in the connector CN11 of the SW unit 11 fitted in the connector C1. Connected to. The configurations related to the other connectors C22 to C28 and the corresponding connectors C2 to C8 are the same as the configurations related to the connector C21.

  FIG. 4 shows the cross release plate 14 and the connector C21 cut along a horizontal plane including the pins P1 and P11, while the connectors C11, BWB13, and the connector C1 are separated from the cross release plate 14 (pins P1 and P11). It is the figure which planarly viewed the cut surface when cut | disconnecting according to a position.

As shown in FIG. 4, the connector C11 is formed with through holes 16 and 17 through which the pins P1 and P11 pass. Further, the BWB 13 is formed with a through hole (via) 18 into which the pin P1 is inserted and a through hole (via) 19 through which the pin P11 passes. Although not shown, through holes 16 and 17 into which pins P2 to P4 and pins P12 to P14 are inserted, and vias 18 and 19 are also formed. A through hole 15 through which only the pin P11 passes is formed in the connector C1. The inner surface of the via 18 is covered with a metal film, and the metal film is in contact with an appropriate wiring pattern formed on the BWB 13. When the metal film and the pins P1 (P2 to P4) are in contact, the BWB 13 and the cross release plate 14 are electrically connected. On the other hand, the via 19 is a simple through hole, and the inner surface of the via 19 is not covered with a metal film. That is, the pins P11 (P12 to P14) inserted into the vias 19 are insulated from the wiring pattern of the BWB 13. However, as long as the insulation of the via 19 is ensured, the inner surface of the via 19 may be covered with a metal film.

  5A is a plan view of the state when the connector C21 shown in FIG. 4 is fitted (connected) to the connector C11, and FIG. 5A is a diagram (B) of FIG. It is the figure which looked at a part of BWB13 in the state of A) from the front. FIG. 5B is a view of the cut surface taken along line FF in FIG. As shown in FIG. 5B, each of the connectors C21 to C28 has pins P1 to P4 and P11 to P14 arranged in parallel to the vertical direction of the cross release plate 14, respectively.

  As shown in FIG. 5A, when the connector C21 is fitted into the connector C11, the pins P1 (P2 to P4) are inserted into the vias 18, and the pins P11 (P12 to P14) are inserted into the vias 19. The tip of the pin P1 (P2 to P4) comes into contact with the via 18 and stops in the via 18 (BWB 13). On the other hand, the pin P11 (P12 to P14) passes through the through hole 17, the via 19 and the through hole 15, and protrudes into the connector C1.

  6A shows a state when the cross section when the BWB 13 shown in FIG. 5B is cut along the line AA including the pins P1 to P4 is viewed from the right side (the connectors C11 to C18 are illustrated). (Omitted). FIG. 6B shows an enlarged view of the vicinity of the connector C21 in FIG. 6A. FIG. 7A shows a state when the cross section when the BWB 13 shown in FIG. 5B is cut along the line BB including the pins P11 to P14 is viewed from the right side (the connectors C11 to C18 are illustrated). (Omitted). FIG. 7B shows an enlarged view of the vicinity of the connector C21 of FIG. 7A.

  As shown in FIGS. 6A and 6B, the tips (one ends) of the pins P1 to P4 of the connectors C21 to C28 are inserted into the BWB 13. The other end side of the pins P <b> 1 to P <b> 4 reaches the inside of the cross cancellation plate 14. On the other hand, as shown to FIG. 7A and FIG. 7B, the front-end | tip (one end) of pin P11-P14 of each connector C21-C28 will be in the state protruded in connector C1-C8.

  FIG. 8 shows a state of wiring connection between the BWB 13 and the SW unit 11 in a state where the connectors CN11 to CN18 of the SW unit 11 are fitted into the connectors C1 to C8 of the BWB 13. As shown in FIG. 8, pins P11 to P14 projecting into the connectors C1 to C8 by connection between the connectors C1 to C8 and the connectors CN11 to CN18, and signal lines provided in the connectors CN11 to CN18 are provided. Electrically connected.

  Wirings S11 to S18 for receiving signals from the PIU 12 (# 1 to # 8) are connected to the devices D1 to D4 mounted on the SW unit 11 (signals corresponding to the devices D3 and D4). The reference numerals of the lines S11 to S18 are omitted). The signal lines S11 to S18 corresponding to the devices D1 to D4 are formed in a wiring arrangement that does not cross on the plane of the SW unit 11. Each signal line S11 to S18 is connected to one of the corresponding pins P11 to P14 extending from the cross cancellation plate 14.

  For example, the pins P11 to P14 inserted into the connector CN11 are electrically connected to the signal lines S11 to S14 of the device D1, respectively. The pins P11 to P14 inserted into the connector CN12 are electrically connected to the signal lines S15 to S18 of the device D1, respectively. Each of the pins P11 to P14 connected to the connectors CN11 and CN12 transmits a signal from the corresponding PIU 12. As a result, signals from each PIU 12 are collected in the device D1.

Similarly, the pins P11 to P14 inserted into the connector CN13 are electrically connected to the signal lines S11 to S14 of the device D2, respectively. Further, the pins P11 to P14 inserted into the connector CN14 are electrically connected to the signal lines S15 to S18 of the device D2, respectively. Each of the pins P11 to P14 connected to the connectors CN13 and CN14 transmits a signal from the corresponding PIU 12. As a result, signals from each PIU 12 are collected in the device D2.

  The connection relationship between the pins P11 to P14 inserted into the connectors CN15 and CN16 and the signal lines S11 to S18 of the device D3, the pins P11 to P14 inserted into the connectors CN17 and CN18, and the signal lines S11 to S18 of the device D4 Is the same as the connection relationship related to the devices D1 and D2. Each of the signal lines S11 to S14 and the signal lines S15 to S18 is an example of the second wiring.

  FIG. 9 schematically shows a state in which a part of the cut surface along the line CC shown in FIG. As shown in FIG. 9, the pin P <b> 1 is inserted into the via 18 in the BWB 13. The via 18 is electrically connected to the signal line S1 from the PIU 12 formed in the BWB 13. The pin P1 and the pin P11 are electrically connected via a relay line 21 formed on the cross cancellation plate 14. The pin P11 is electrically connected to the via 23 formed in the SW unit 11 through the connector wiring 22 provided in the connector CN11. The signal line S11 from the device D1 is electrically connected to the via 23. The pin P11 is insulated in the BWB 13.

  With such a configuration, the signal flowing through the signal line S1 that is the first wiring reaches the cross cancellation plate 14 via the pin P1 that is the first connection part, and is connected to the second connection via the relay line 21 that is the intermediate part. Flows through the pin P11. The signal flowing through the pin P11 flows through the signal line S11 which is the second wiring paired with the first wiring via the connector internal wiring 22 and the via 23, and reaches the device D1. In the cross release plate 14, each of the pins P1 to P4, one of the corresponding pins P11 to P14, and the relay line 21 connecting the corresponding pins form one set, and each set is insulated from each other. It is in a state.

  FIG. 10 schematically shows a state in which a part of the cut surface along the line DD shown in FIG. 8 is viewed from the front of the BWB 13. FIG. 11 schematically shows a state in which a part of the cut surface along the line EE shown in FIG.

  As shown in FIG. 10, signal lines S <b> 1 to S <b> 4 from the corresponding PIU 12 are connected to the pins P <b> 1 to P <b> 4 of the connectors C <b> 21 to C <b> 28 of the cross cancellation plate 14. As shown in FIG. 11, the pin P1 of the connector C21 is connected to the pin P11 of the connector C21 via the relay line 21. The pin P1 of the connector C25 is connected to the pin P12 of the connector C21 via the relay line 21. The pin P1 of the connector C24 is connected to the pin P13 of the connector C21 via the relay line 21. Pin P1 of connector C23 is connected to pin P14 of connector C21 via relay line 21 (the legend shown in FIG. 8 also applies to FIG. 10).

  The pin P1 of the connector C22 is connected to the pin P11 of the connector C22 via the relay line 21. The pin P1 of the connector C26 is connected to the pin P12 of the connector C22 via the relay line 21. The pin P1 of the connector C27 is connected to the pin P13 of the connector C22 via the relay line 21. The pin P1 of the connector C28 is connected to the pin P14 of the connector C22 via the relay line 21.

In this way, the signal lines S1 from the PIUs 12 (# 1 to # 8) are connected to the pins P11 to P14 of the connectors C21 and C22 close to the device D1, respectively. As a result, as shown in FIG. 8, the signal lines S11 to S18 for the device D1 of the SW unit 11 are laid out on the SW unit 11 without crossing the signal lines S11 to S18 for other devices. Can do.

  The cross release plate 14 is formed using a printed circuit board having a plurality of layers so that the relay lines 21 shown in FIG. 11 are insulated from each other. In other words, the plurality of relay lines 21 forming the intermediate portion are formed by a wiring pattern of a printed board having a plurality of layers constituting the cross elimination plate 14.

  In FIG. 11, only the wiring structure related to the signal line S1 corresponding to the device D1 is illustrated. However, the same wiring structure is applied to the signal lines S2 to S4 corresponding to the other devices D2 to D4. That is, the signal line S2 of each PIU 12 corresponding to the device D2 is connected to the pins P11 to P14 of the connectors C23 and C24 via the cross cancellation plate 14, and is connected to the signal lines S11 to S18 of the device D2.

  Further, the signal line S3 of each PIU 12 corresponding to the device D3 is connected to the pins P11 to P14 of the connectors C25 and C26 via the cross cancellation plate 14, and is connected to the signal lines S11 to S18 of the device D3. Further, the signal line S4 of each PIU 12 corresponding to the device D4 is connected to the pins P11 to P14 of the connectors C27 and C28 via the cross cancellation plate 14, and is connected to the signal lines S11 to S18 of the device D4.

  In this way, by connecting the wiring between the BWB 13 and the SW unit 11 via the cross resolution plate 14, it is avoided (resolved) that crossing of wiring between devices occurs in the BWB 13 or the SW unit 11. Yes.

<Joint structure example 1 of BWB and cloth release plate>
Hereinafter, an example of a joint structure between the above-described BWB 13 and the cross release plate 14 will be described. FIG. 12A and FIG. 12B show a bonding structure example 1 between the BWB and the cloth release plate. 12A shows a plan view of the joint structure example 1, and FIG. 12B shows a front view of the joint structure example 1. FIG. FIG. 12A is a plan view of the cut surface of the X1-X1 line in FIG. 12B from above.

  As shown in FIGS. 12A and 12B, the cross release plate 14 and the BWB 13 have a structure similar to the structure shown in FIGS. 5A and 5B, but differ in the following points.

  That is, the structural example 1 includes the connector C20 corresponding to each of the connectors C21 to C24. The connector C20 has a pin group P41 corresponding to the pins P11 to P14 and a pin group P31 corresponding to the pins P1 to P4. One end of the pin group P31 is embedded in the cross release plate 14, and is connected to one of the pin groups 41 via a relay line 21 (not shown). One end of the pin group P41 is embedded in the cross release plate 14, and penetrates the connector C20 and protrudes from the connector C20.

  The BWB 13 includes a plurality of vias in which a connector C10 corresponding to each of the connectors C11 to C18 (such as FIG. 5A), a connector C0 corresponding to the connectors C1 to C8, and an inner surface into which the pin group P31 is inserted are covered with a metal film. 18 and a plurality of vias 19 into which the pin group P41 is inserted. The outer diameters of the pin groups P31 and P41 are formed to be approximately the same as the inner diameters of the plurality of vias 18 and 19, the connector C20 and the connector C10 are connected, and the pin groups P31 and P41 are inserted into the BWB 13 As a result, the cross release plate 14 is fixedly connected to the BWB 13. Pin group P31 is connected to a wiring pattern for transmitting a signal from PIU 12 formed in BWB 13 through via 18. The pin group P41 passes through the BWB and protrudes into the connector C0, and is connected to the wiring of the SW unit 11.

<Example 2 of the bonding structure between the BWB and the cloth release plate>
13A and 13B show a bonding structure example 2 between the BWB and the cloth release plate. FIG. 13A shows a plan view of the joint structure example 2, and FIG. 13B shows a front view of the joint structure example 2. FIG. FIG. 13A is a plan view of the cut surface of line X2-X2 in FIG. 13B from above.

  The joint structure example 2 corresponds to a modification of the joint structure example 1. In the joint structure example 2, the connector between the BWB 13 and the cross release plate 14 is omitted. As illustrated in FIG. 13A, in the bonding structure example 2, a plurality of vias 43 instead of the pin group P31 are formed at positions corresponding to the pin group P31 in the bonding structure example 1 of the cross release plate 14. Further, a plurality of vias 44 corresponding to the respective pins forming the pin group P41 are formed at positions corresponding to the pin group P41 of the cross canceling plate 14. The inner surfaces of each via 43 and each via 44 are covered with a metal film and are connected to an appropriate wiring pattern (relay line 21) formed in the cross release plate 14.

  In the joint structure example 2, the pin group P31 is omitted, and the pin group P41 has one end portion implanted by inserting the BWB 13 into the via 19 and the other end portion protruding from the connector C0. Similar to the via 18, a metal film is formed on the inner surface of the via 19 in the bonding structure example 2. The electrical connection between the BWB 13 and the cross release plate 14 is performed by soldering the via 44 and the via 19 by soldering with the solder ball 45, and soldering the via 43 and the via 18 with the solder ball 46. Are respectively connected by electrical connection.

  When the via 43 and the via 18 are electrically connected by the solder ball 46, the pin group P31 and each via 18 are electrically connected to each other. On the other hand, when the via 44 and the via 19 are electrically connected by the solder ball 45, the same electrical connection relationship as that of the pin group P41 in the bonding structure example 1 is generated. In the joint structure example 2, the connectorless structure is adopted, so that the number of parts of the BWB 13 and the cross release plate 14 can be reduced.

<Joint structure example 3 of BWB and cloth release plate>
14A and 14B show a bonding structure example 3 between the BWB and the cloth release plate. 14A shows a plan view of the joint structure example 3, and FIG. 14B shows a front view of the joint structure example 3. FIG. 14A is a plan view of the cut surface along line X3-X3 in FIG. 14B as viewed from above.

  The joint structure example 3 corresponds to a modification of the joint structure example 2. In the bonding structure example 3, the cross release plate 14 and the BWB 13 are coupled using the connection plate 48 sandwiched between the cross release plate 14 and the BWB 13. The connection plate 48 includes a plurality of shafts 49 protruding from both surfaces of the connection plate 48 and a plurality of shafts 50.

  At the time of joining the BWB 13 and the cross release plate 14, the connection plate 48 is disposed between them, and the shafts 49 are inserted into the vias 43 and 18, while the shafts 50 are inserted into the vias 44 and 19. (Double press fit structure).

  Each shaft 49 and 50 is formed using a conductor, and the via 43 and the via 18 and the via 44 and the via 19 are electrically connected. Since the other structure of the joining structure example 3 is the same as that of the joining structure example 2, the description is omitted. Using the connection plate 48 having a plurality of shafts 49 and 50 as in the joining structure example 3 and fitting both ends of the shafts 49 and 50 into the corresponding vias, the BWB 13 and the cross release plate 14 are firmly connected. On the other hand, the required electrical connection can be ensured.

<Example 4 of bonding structure between BWB and cross release plate>
15A and 15B show a joint structure example 4 of the BWB and the cloth release plate. 15A shows a plan view of the joint structure example 4, and FIG. 15B shows a front view of the joint structure example 4. FIG. FIG. 15A is a plan view of the cut surface of the X4-X4 line in FIG. 15B from above.

  The junction structure example 4 corresponds to a modification of the junction structure example 3. A difference from the bonding structure example 3 will be described. In the junction structure example 4, as in the junction structure example 3, the cloth elimination plate 14 having a plurality of vias 43 and a plurality of vias 44 is applied. However, in the joint structure example 4, the connection plate 48 is not applied. One end of each pin group P41 is fitted into a corresponding via 44 and fixed. On the other hand, the other end of each pin group P41 protrudes from the connector C0 through the via 19 of the BWB 13. On the other hand, the via 43 and the via 18 are electrically connected using a shaft (pin) 51 having one end fitted into the via 43 and the other end fitted into the via 18. By omitting the connection plate 48, there is a cost reduction effect by reducing the number of parts.

<Joint structure example 5 of BWB and cloth release plate>
16A and 16B show a bonding structure example 5 between the BWB and the cloth release plate. FIG. 16A shows a plan view of the joining structure example 5, and FIG. 16B shows a front view of the joining structure example 5. FIG. FIG. 16A is a plan view of the cut surface taken along line X5-X5 in FIG. 16B from above.

  The junction structure example 5 corresponds to a modification of the junction structure example 4. In the bonding structure example 5, the cloth elimination plate 14 is disposed on the front side of the BWB 13. In the junction structure example 5, one end of each pin forming the pin group P41 is inserted into the via 19 formed in the BWB 13. One end of each pin passes through a via 44 formed in the cross release plate 14 and protrudes from a connector C0 disposed on the front surface (front side) of the cross release plate 14. On the other hand, each via 18 formed in the BWB 13 is electrically connected to the corresponding via 43 via the shaft 51 (double press-fit structure). In this manner, a structure in which the cross release plate 14 is disposed on the front surface of the BWB can be employed.

  In any of the bonding structure examples 1 to 5 described above, the signal from each PIU 12 flowing through the BWB 13 is routed through the relay line 21 of the cross release plate 14 so that a cross between device wirings does not occur in the SW unit 11. Can be connected to appropriate pins of the pin group P41.

[Effects of First Embodiment]
In the chassis type switch 10 according to the first embodiment described above, the star type connection between each PIU 12 and each device D1 to D4 of the SW unit 11 is not a direct wiring connection between the BWB 13 and the SW unit 11, but a cross resolving plate. 14, the occurrence of a cross between device wirings generated in the SW unit 11 is avoided.

  FIG. 17 is a comparative example (reference diagram) of the first embodiment, and shows an example in which the wiring from the BWB 13 as shown in FIG. 2B is directly connected to the SW unit. In FIG. 17, the connector CN-1 connects signal lines (signal lines P2-D1, P2-D2, P2-D3, P2-D4) from the PIU 12 (# 2) to the devices D1 to D4 to the SW unit 111. To do. On the other hand, the connector CN-8 connects the signal lines (signal lines P8-D1, P8-D2, P8-D3, P8-D4) from the PIU 12 (# 8) to the devices D1 to D4 to the SW unit 111. In this case, as shown in FIG. 17, in the SW unit 111, crossing of wiring between devices occurs. In order to ensure mutual insulation of the wiring between devices, it is required to apply a printed circuit board having a plurality of layers as the SW unit 111.

  On the other hand, in 1st Embodiment, the cross cancellation | release board 14 is applied and it suppresses that the number of layers of SW unit 11 increases. That is, it is possible to avoid an increase in the number of substrate layers for insulating between crossed wirings.

Moreover, according to 1st Embodiment, reduction of manufacturing cost can be aimed at. That is, the area of the plane of the cross release plate 14 can be made smaller than the area of the plane of the SW unit 11. One of the reasons why the area can be reduced is that the PIU such as the SW unit requires components (semiconductor chips such as switching devices, electrical / electronic circuit components, connectors, etc.) to achieve the required functions. On the other hand, it is mentioned that the cross release plate 14 does not need to be mounted with any components other than the connector.

  In general, as the number of circuit board units that can be allocated to a basic board having a predetermined manufacturing board area increases, the manufacturing cost of the printed board decreases. That is, the smaller the area, the more circuit board units that can be manufactured from one basic board. For this reason, the amount of basic substrates (materials) required when manufacturing the cross release plate 14 having the same number of layers as the SW unit 11 is smaller than that when the SW unit 11 is manufactured.

More specifically, for example, a SW unit having a printed circuit board (PT board) having four layers and an area of 1 m × 0.5 m is assumed. When the manufacturing board area of the PT board specified by the PWB manufacturer is 1m x 1m, the same SW unit circuit pattern for 2 sheets per layer is formed in the 1m x 1m manufacturing board, and it is created for 4 layers To do. Next, the four layers are stacked and cut into a unit size to complete a four-layer printed circuit board. The SW unit material cost in this case is the manufacturing substrate unit price × 4 (layers) / 2 (sheets). It becomes. If this is the same four layers, but the area of the cross release plate designed to be small for the above reasons is 0.5 m x 0.5 m, the cross release plate material cost will be the unit cost of manufacturing substrate x 4 (layers) / 4 (sheets). The material cost of the SW unit when the number of SW unit layers can be reduced to 1 by providing the cross release plate is the manufacturing substrate unit price × 1 (layer) / 2 (sheets). The ratio of the material cost of the 4-layer SW unit to the 1-layer SW unit + 4-layer cross release plate is 2: 1.5. As described above, since the material cost is reduced by the application of the cloth release plate, the manufacturing cost can be reduced.

  Moreover, an increase in the thickness of the SW unit can be avoided by reducing the number of layers of the SW unit. As shown in the reference diagram of FIG. 18, the SW unit 111 shown in FIG. 17 is assumed to have a slot width W1 in consideration of the mounted components 31 and 32.

  On the other hand, as shown in FIG. 19, when the cross elimination plate 14 is applied, the thickness of the SW unit 11 can be reduced, so that the slot width W2 can be made smaller than the slot width W1. Thereby, the enlargement of the chassis type device (chassis type device) can be suppressed. In addition, in a state where the slot width W2 and the slot width W1 are equivalent, a component 31A having a thickness (height) greater than the component 31 can be applied as a component mounted on the SW unit 11.

[Second Embodiment]
Next, a second embodiment will be described. Since the second embodiment has common points with the first embodiment, differences will be mainly described, and the same components are denoted by the same reference numerals and description thereof is omitted.

  In the first embodiment, the cloth elimination plate 14 joined to the BWB 13 has been described. In the second embodiment, a cloth canceling plate joined to the SW unit will be described. Instead of the wiring arrangement in which crossing occurs between device wirings as shown in FIG. 17, a wiring arrangement in which no crossing occurs between device wirings can be considered as shown in the reference diagram of FIG. In the example of FIG. 20, the wiring from the device D1 is connected to the connectors CN-1 and CN-2, that is, the wiring arrangement similar to that of the SW unit 11 in the first embodiment is used, so that the device in the SW unit The cross between wiring is avoided. However, when such a wiring is directly connected to the BWB, a cross of the wiring in the BWB occurs as shown in the reference diagram of FIG.

  FIG. 22A shows a state of the cross release structure in the second embodiment, that is, the structure of the cross release plate joined to the SW unit, as viewed from the right side surface of the chassis type switch 10. FIG. 22B schematically shows the state shown in FIG. 22A as viewed from the bottom.

  The BWB 13A according to the second embodiment has a wiring structure that connects the connectors CN1 to CN8 and the connectors C1 to C8 as shown in FIG. 2B. However, pins 91 to 94 that are respectively connected to the signal lines S1 to S4 from any of the connectors CN1 to CN8 protrude from the connectors C1 to C8 in the second embodiment.

  Specifically, the pins 91 to 94 protruding from the connector C1 are connected to the signal lines S1 to S4 of the PIU 12 (# 2). The pins 91 to 94 protruding from the connector C2 are connected to the signal lines S1 to S4 of the PIU 12 (# 3). The pins 91 to 94 protruding from the connector C3 are connected to the signal lines S1 to S4 of the PIU 12 (# 1). The pins 91 to 94 protruding from the connector C4 are connected to the signal lines S1 to S4 of the PIU 12 (# 4). The pins 91 to 94 protruding from the connector C5 are connected to the signal lines S1 to S4 of the PIU 12 (# 5). The pins 91 to 94 protruding from the connector C6 are connected to the signal lines S1 to S4 of the PIU 12 (# 6). The pins 91 to 94 protruding from the connector C7 are connected to the signal lines S1 to S4 of the PIU 12 (# 7). The pins 91 to 94 protruding from the connector C8 are connected to the signal lines S1 to S4 of the PIU 12 (# 8).

  The pins 91 to 94 of each of the connectors C1 to C8 are connected to the in-connector wiring provided in the corresponding connector when connected to the corresponding connector (any one of the connectors CN11 to CN18) of the SW unit 11A.

  The cross release plate 14A has connectors 81 to 88 corresponding to the connectors C21 to C28 (FIG. 3A). Connectors 81-88 are connected to connectors 101-108 provided on SW unit 11A (only connector 108 is shown in FIG. 22B). Each of the connectors 81 to 88 has pins P1 to P4 and pins P11 to P14, as in the first embodiment. Pins P1 to P4 are electrically connected to pins 91 to 94 connected to corresponding connectors (any of connectors CN11 to C18).

  In addition, each of the pins P1 to P4 is electrically connected to any of the pins P11 to P14 in the same or another connector (any of the connectors 81 to 88) via the relay line 21. The pins P11 to P14 of each connector 81 to 88 are connected to any one of the signal lines S11 to S18 formed for each of the devices D1 to D4. The signal lines S11 to S18 corresponding to the devices D1 to D4 are arranged so as not to cross the other signal lines S11 to S18.

  In the example shown in FIG. 22A, the pin P1 of the connector 81 is connected to the pin P11 of the connector 81 via the relay line 21. The pin P1 of the connector 85 is connected to the pin P12 of the connector 81 via the relay line 21. The pin P1 of the connector 84 is connected to the pin P13 of the connector 81 via the relay line 21. The pin P1 of the connector 83 is connected to the pin P14 of the connector 81 via the relay line 21. The pins P11 to P14 of the connector 81 are connected to signal lines S11 to S14 connected to the device D1. In the cross release plate 14A, any of the pins P1 to P4, the corresponding pins P11 to P14, and the relay line 21 connecting the two make a set, and each set is insulated from each other.

The pin P1 of the connector 82 is connected to the pin P11 of the connector 82 via the relay line 21. The pin P1 of the connector 86 is connected to the pin P12 of the connector 82 via the relay line 21. The pin P1 of the connector 87 is connected to the pin P13 of the connector 82 via the relay line 21. The pin P1 of the connector 88 is connected to the pin P14 of the connector 82 via the relay line 21. The pins P11 to P14 of the connector 82 are connected to the signal lines S15 to S18 connected to the device D1. In this way, the signal line S1 of each PIU 12 (# 1 to # 8) is star-connected to the device D1 via the cross cancellation plate 14A.

  Similarly, the device D2 is connected to pins P11 to P14 of the connectors 83 and 84 via signal lines S11 to S18. The device D3 is connected to pins P11 to P14 of the connectors 85 and 86 via signal lines S11 to S18. Device D4 is connected to pins P11 to P14 of connectors 87 and 88 via signal lines S11 to S18.

  Also in the second embodiment described above, as in the first embodiment, the manufacturing cost can be reduced compared to the case where the SW unit and the BWB are formed of a plurality of layers. The advantage that the slot width can be reduced by bonding the cross release plate 14A in parallel to the SW unit 11A is inferior to that of the first embodiment. However, the depth size of the shelf can be made smaller than in the first embodiment.

  In the first and second embodiments, the wiring for transmitting the signal from each PIU 12 to each device D1 to D4 has been described. However, the wiring for transmitting the signal from each device D1 to D4 to each PIU 12 is described. A similar configuration is applied. In the first and second embodiments, the BWB and SW unit in which the plurality of signal lines S1 to S4 and S11 to S18 are each formed in one layer have been described. However, a BWB or SW unit having a plurality of layers is applied. It is not prevented from being done.

C0, C1-C8, CN1-CN8, C10, C11-C18, CN11-CN18, C20, C21-C28, 81-88, 101-108 ... Connectors D1-D4 ... Switching devices L1-L4 ...・ Wiring groups P1 to P4, P11 to P14, 91 to 94... Connector pins P31, P41... Pin groups S1 to S4, S11 to S18. Shelf 11, 11A ... Switch unit (SW unit)
12 ... PIU (IF unit)
13, 13A ... Back wiring board (BWB)
14, 14A: Cross-dissolving plates 15, 16, 17 ... through holes 18, 19, 23, 43, 44 ... via 21 ... relay line (intermediate portion)
22 ... Connector wiring 45,46 ... Solder balls 49,50,51 ... Shaft (pin)

Claims (7)

Wiring connection between substrates for electrically connecting a plurality of first wirings formed on the first substrate and a plurality of second wirings formed on the second substrate and respectively paired with the plurality of first wirings Tools,
A plurality of sets including a first connection portion, a second connection portion, and an intermediate portion that electrically connects the first connection portion and the second connection portion, each corresponding to the plurality of pairs,
The plurality of sets are insulated from each other;
At the time of physical connection between the first substrate and the second substrate, the first connection portions are electrically connected to one of the corresponding first wirings, and the second connection portions are A wiring connector between substrates that is electrically connected to one of the plurality of second wirings paired with one of the plurality of first wirings. The wiring connector is attached to the surface of the second substrate opposite to the attachment surface to the first substrate,
The first connection portion is connected to the first wiring on the opposite surface side,
2. The wiring between substrates according to claim 1, wherein the second connection portion is connected to the second wiring by using a through hole that connects the opposite surface formed on the first substrate and the mounting surface. Connection tool. The wiring connector between substrates according to claim 1, which is interposed between the first substrate and the second substrate. The first substrate is a back wiring board to which a plurality of interface unit substrates are connected,
The plurality of first wires are connected to the interface unit substrates,
The second substrate is a switch unit substrate on which a plurality of switching devices that perform switching with respect to a signal from the interface unit substrate are mounted.
2. The wiring connector between substrates according to claim 1, wherein the plurality of second wirings are wirings used by the switching devices to transmit and receive signals to and from the interface unit substrates. The wiring connector between substrates according to claim 1, which is mounted on the second substrate. A first substrate on which a plurality of first wirings are formed;
A second substrate on which a plurality of second wirings each paired with the plurality of first wirings are formed;
A plurality of sets each including a first connection portion, a second connection portion, and an intermediate portion that electrically connects the first connection portion and the second connection portion, each of which corresponds to the plurality of pairs. The first connection portion is electrically connected to one of the first wirings when the first substrate and the second substrate are physically connected, and the second substrate A device having a wiring structure, including a wiring connector in which a connecting portion is electrically connected to one of the second wirings. A back wiring board to which a plurality of interface units and a switch unit having a plurality of switching devices to be star-connected to each interface unit are connected;
A first connection portion connected to the back wiring board or the switch unit and connected to a first wiring group electrically connected to the interface units formed on the back wiring board, formed on the switch unit. A second connection portion connected to a second wiring group connected to each of the switching devices, and an intermediate portion for electrically connecting each of the first wiring groups to the corresponding second wiring group. A wiring connector including a wiring connector having a plane area smaller than that of the back wiring board or the switch unit, and the intermediate portion formed of a wiring pattern of a printed circuit board having a plurality of layers. switch.

Images