JP2013026284A - 実装基板用放熱積層材の製造方法 - Google Patents

実装基板用放熱積層材の製造方法 Download PDF

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Publication number
JP2013026284A
JP2013026284A JP2011156985A JP2011156985A JP2013026284A JP 2013026284 A JP2013026284 A JP 2013026284A JP 2011156985 A JP2011156985 A JP 2011156985A JP 2011156985 A JP2011156985 A JP 2011156985A JP 2013026284 A JP2013026284 A JP 2013026284A
Authority
JP
Japan
Prior art keywords
mass
less
laminated material
aluminum foil
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011156985A
Other languages
English (en)
Japanese (ja)
Inventor
Daiki Higashiyama
大樹 東山
Masataka Saruwatari
昌隆 猿渡
Hisanaga Kato
久詠 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Aluminum KK
Original Assignee
Toyo Aluminum KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Aluminum KK filed Critical Toyo Aluminum KK
Priority to JP2011156985A priority Critical patent/JP2013026284A/ja
Priority to PCT/JP2012/067263 priority patent/WO2013011845A1/ja
Priority to CN201280035203.3A priority patent/CN103650647B/zh
Priority to KR1020137025568A priority patent/KR20140041454A/ko
Priority to TW101125274A priority patent/TWI616123B/zh
Publication of JP2013026284A publication Critical patent/JP2013026284A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
JP2011156985A 2011-07-15 2011-07-15 実装基板用放熱積層材の製造方法 Pending JP2013026284A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011156985A JP2013026284A (ja) 2011-07-15 2011-07-15 実装基板用放熱積層材の製造方法
PCT/JP2012/067263 WO2013011845A1 (ja) 2011-07-15 2012-07-06 実装基板用放熱積層材の製造方法
CN201280035203.3A CN103650647B (zh) 2011-07-15 2012-07-06 安装基板用散热层叠材料的制造方法
KR1020137025568A KR20140041454A (ko) 2011-07-15 2012-07-06 실장 기판용 방열 적층재의 제조 방법
TW101125274A TWI616123B (zh) 2011-07-15 2012-07-13 安裝基板用放熱積層材之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011156985A JP2013026284A (ja) 2011-07-15 2011-07-15 実装基板用放熱積層材の製造方法

Publications (1)

Publication Number Publication Date
JP2013026284A true JP2013026284A (ja) 2013-02-04

Family

ID=47558023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011156985A Pending JP2013026284A (ja) 2011-07-15 2011-07-15 実装基板用放熱積層材の製造方法

Country Status (5)

Country Link
JP (1) JP2013026284A (zh)
KR (1) KR20140041454A (zh)
CN (1) CN103650647B (zh)
TW (1) TWI616123B (zh)
WO (1) WO2013011845A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105679905A (zh) * 2016-01-19 2016-06-15 上海万寅安全环保科技有限公司 一种半导体芯片

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110696A (ja) * 1986-10-28 1988-05-16 東芝コンポ−ネンツ株式会社 プリント配線板の製造方法
JPS63265486A (ja) * 1987-04-23 1988-11-01 Matsushita Electric Ind Co Ltd 印刷配線板
JPH01133395A (ja) * 1987-11-19 1989-05-25 Denki Kagaku Kogyo Kk 金属ベース回路基板の多量製造方法
WO2009145109A1 (ja) * 2008-05-29 2009-12-03 電気化学工業株式会社 金属ベース回路基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005096184A (ja) * 2003-09-24 2005-04-14 Fuji Photo Film Co Ltd 平版印刷版用支持体および平版印刷版原版
CN100483763C (zh) * 2007-11-02 2009-04-29 长春市北方电子有限责任公司 铜膜加厚的覆铜陶瓷基板的制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110696A (ja) * 1986-10-28 1988-05-16 東芝コンポ−ネンツ株式会社 プリント配線板の製造方法
JPS63265486A (ja) * 1987-04-23 1988-11-01 Matsushita Electric Ind Co Ltd 印刷配線板
JPH01133395A (ja) * 1987-11-19 1989-05-25 Denki Kagaku Kogyo Kk 金属ベース回路基板の多量製造方法
WO2009145109A1 (ja) * 2008-05-29 2009-12-03 電気化学工業株式会社 金属ベース回路基板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JPN6012047800; 社団法人日本アルミニウム協会標準化総合委員会: '表２．３　ＪＩＳ規格アルミニウム展伸材の化学成分-３０００系-Ａｌ-Ｍｎ系' アルミニウムハンドブック（第７版） , 20070131, 第１６ページ, 社団法人日本アルミニウム協会 *

Also Published As

Publication number Publication date
KR20140041454A (ko) 2014-04-04
TW201309137A (zh) 2013-02-16
CN103650647B (zh) 2017-08-08
CN103650647A (zh) 2014-03-19
WO2013011845A1 (ja) 2013-01-24
TWI616123B (zh) 2018-02-21

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