JP2013022804A5 - - Google Patents

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Publication number
JP2013022804A5
JP2013022804A5 JP2011158723A JP2011158723A JP2013022804A5 JP 2013022804 A5 JP2013022804 A5 JP 2013022804A5 JP 2011158723 A JP2011158723 A JP 2011158723A JP 2011158723 A JP2011158723 A JP 2011158723A JP 2013022804 A5 JP2013022804 A5 JP 2013022804A5
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JP
Japan
Prior art keywords
space
thermoplastic resin
composite material
base material
wall surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011158723A
Other languages
English (en)
Japanese (ja)
Other versions
JP5974429B2 (ja
JP2013022804A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2011158723A external-priority patent/JP5974429B2/ja
Priority to JP2011158723A priority Critical patent/JP5974429B2/ja
Priority to CN201510420058.6A priority patent/CN105126940B/zh
Priority to US14/131,730 priority patent/US9610750B2/en
Priority to PCT/JP2012/003939 priority patent/WO2013011629A1/en
Priority to EP12731185.0A priority patent/EP2734361B1/en
Priority to CN201280034743.XA priority patent/CN103702826B/zh
Priority to IN261DEN2014 priority patent/IN2014DN00261A/en
Publication of JP2013022804A publication Critical patent/JP2013022804A/ja
Publication of JP2013022804A5 publication Critical patent/JP2013022804A5/ja
Publication of JP5974429B2 publication Critical patent/JP5974429B2/ja
Application granted granted Critical
Priority to US15/444,906 priority patent/US10414118B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011158723A 2011-07-20 2011-07-20 複合材料構造物及びその製造方法 Expired - Fee Related JP5974429B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2011158723A JP5974429B2 (ja) 2011-07-20 2011-07-20 複合材料構造物及びその製造方法
IN261DEN2014 IN2014DN00261A (https=) 2011-07-20 2012-06-15
US14/131,730 US9610750B2 (en) 2011-07-20 2012-06-15 Composite structure and manufacturing method therefor
PCT/JP2012/003939 WO2013011629A1 (en) 2011-07-20 2012-06-15 Composite structure and manufacturing method therefor
EP12731185.0A EP2734361B1 (en) 2011-07-20 2012-06-15 Composite structure and manufacturing method therefor
CN201280034743.XA CN103702826B (zh) 2011-07-20 2012-06-15 复合结构体及其制造方法
CN201510420058.6A CN105126940B (zh) 2011-07-20 2012-06-15 复合结构体和用于分析微粒子的微芯片
US15/444,906 US10414118B2 (en) 2011-07-20 2017-02-28 Microchip manufactured with thermocompression

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011158723A JP5974429B2 (ja) 2011-07-20 2011-07-20 複合材料構造物及びその製造方法

Publications (3)

Publication Number Publication Date
JP2013022804A JP2013022804A (ja) 2013-02-04
JP2013022804A5 true JP2013022804A5 (https=) 2014-07-31
JP5974429B2 JP5974429B2 (ja) 2016-08-23

Family

ID=46420487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011158723A Expired - Fee Related JP5974429B2 (ja) 2011-07-20 2011-07-20 複合材料構造物及びその製造方法

Country Status (6)

Country Link
US (2) US9610750B2 (https=)
EP (1) EP2734361B1 (https=)
JP (1) JP5974429B2 (https=)
CN (2) CN103702826B (https=)
IN (1) IN2014DN00261A (https=)
WO (1) WO2013011629A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108393103A (zh) * 2018-03-03 2018-08-14 北京工业大学 一种可实现液滴尺寸不依赖流量的微流控芯片
US11665929B2 (en) * 2019-06-13 2023-05-30 Intel Corporation Micro light-emitting diode displays with improved power efficiency

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0524516Y2 (https=) * 1987-04-21 1993-06-22
JPH03156888A (ja) * 1989-08-28 1991-07-04 Toshiba Corp 分散型ｅｌパネル及びその製造方法
GB8926294D0 (en) * 1989-11-21 1990-01-10 British Gas Plc Method of jointing hollow members by fusion
US5427663A (en) * 1993-06-08 1995-06-27 British Technology Group Usa Inc. Microlithographic array for macromolecule and cell fractionation
GB9418981D0 (en) 1994-09-21 1994-11-09 Univ Glasgow Apparatus and method for carrying out analysis of samples
JP3388392B2 (ja) * 1999-06-02 2003-03-17 日精樹脂工業株式会社 Ｉｃカード製造装置
WO2002028532A2 (en) * 2000-10-06 2002-04-11 Protasis Corporation Microfluidic substrate assembly and method for making same
US6564475B2 (en) * 2000-12-22 2003-05-20 K-Swiss Inc. Footwear with enhanced temperature control
CN101158695A (zh) 2002-12-04 2008-04-09 斯宾克斯公司 流体的可程控微量控制用方法
JP4074921B2 (ja) * 2003-03-14 2008-04-16 日本電気株式会社 質量分析システムおよび分析方法
JP4695851B2 (ja) * 2003-07-10 2011-06-08 シチズンホールディングス株式会社 マイクロ化学チップ温度調節装置
JP4304120B2 (ja) * 2004-04-30 2009-07-29 ベイバイオサイエンス株式会社 生物学的粒子をソーティングする装置及び方法
CN1687766A (zh) 2005-04-21 2005-10-26 复旦大学 一种纤维电泳芯片及其制备方法
EP1893336A2 (en) * 2005-05-19 2008-03-05 Koninklijke Philips Electronics N.V. Functional assembly and method of obtaining it
JP4695977B2 (ja) * 2005-12-21 2011-06-08 東ソー・クォーツ株式会社 マイクロチップ及びその製造方法
JP2007263706A (ja) * 2006-03-28 2007-10-11 Aisin Seiki Co Ltd バイオアッセイ用マイクロチップ
US8312646B2 (en) * 2006-05-25 2012-11-20 Nike, Inc. Article of footwear incorporating a tensile element
EP1972909A1 (en) 2007-03-23 2008-09-24 Koninklijke Philips Electronics N.V. Luminescence sensor
US7880108B2 (en) * 2007-10-26 2011-02-01 Becton, Dickinson And Company Deflection plate
JP2009243965A (ja) * 2008-03-28 2009-10-22 Sumitomo Bakelite Co Ltd 流路デバイス、外装ケース付き流路デバイス、流路デバイスの使用方法
JP4572973B2 (ja) * 2008-06-16 2010-11-04 ソニー株式会社 マイクロチップ及びマイクロチップにおける送流方法
JP5487638B2 (ja) 2009-02-17 2014-05-07 ソニー株式会社 微小粒子分取のための装置及びマイクロチップ

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