JP2013016657A5 - - Google Patents

Description

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
[Application Example 1]
In the method for manufacturing an electronic device package of the present invention, the base member and the lid member are connected via an annular joining member while forming an internal space in which an electronic component is accommodated between the base member and the lid member. A method of manufacturing an electronic device package to be joined,
The joint surface of the joint member with the lid member is formed with a groove that communicates the internal space with the outside .
Joining the base member and the lid member,
A first joining step of joining a portion excluding a portion corresponding to the groove, of a planned joining portion of the base member and the lid member, by seam welding;
And a second bonding step of bonding a portion corresponding to the groove in the planned bonding portion.

Claims (10)

A method for manufacturing an electronic device package that joins the base member and the lid member via an annular joining member while forming an internal space in which an electronic component is housed between the base member and the lid member. ,
The joint surface of the joint member with the lid member is formed with a groove that communicates the internal space with the outside .
Joining the base member and the lid member,
A first joining step of joining a portion excluding a portion corresponding to the groove, of a planned joining portion of the base member and the lid member, by seam welding;
A method for manufacturing an electronic device package, comprising: a second bonding step of bonding a portion corresponding to the groove of the planned bonding portion.   The electronic device package manufacturing method according to claim 1, wherein the joining in the second joining step is performed by energy beam welding.   The method for manufacturing an electronic device package according to claim 1, wherein the joining in the second joining step is performed by brazing using a brazing material. The outline of the lid member in plan view is rectangular,
The groove is provided at a position corresponding to a corner portion in plan view of the lid member,
The method for manufacturing a package for an electronic device according to any one of claims 1 to 3, wherein in the first joining step, seam welding is performed along each side of the lid member in plan view.   The method of manufacturing a package for an electronic device according to claim 1, wherein a cross section of the wall surface of the groove has a curved shape. When the width of the groove is L1, and the depth of the groove is L2,
The manufacturing method of the package for electronic devices in any one of Claim 1 thru | or 5 satisfy | filling the relationship of L1> L2.   The method for manufacturing an electronic device package according to claim 1, wherein the second bonding step is performed under reduced pressure or in an inert gas atmosphere.   The method for manufacturing an electronic device package according to any one of claims 1 to 7, wherein the lid member is formed so that an outline thereof overlaps the joint member over a whole periphery in a plan view. An electronic device package manufactured using the manufacturing method according to claim 1;
An electronic device comprising: an electronic component housed in the electronic device package.   An electronic apparatus comprising the electronic device according to claim 9.