JP2013016660A5 - Electronic device package manufacturing method, electronic device manufacturing method, electronic device, and electronic apparatus - Google Patents
Electronic device package manufacturing method, electronic device manufacturing method, electronic device, and electronic apparatus Download PDFInfo
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- JP2013016660A5 JP2013016660A5 JP2011148692A JP2011148692A JP2013016660A5 JP 2013016660 A5 JP2013016660 A5 JP 2013016660A5 JP 2011148692 A JP2011148692 A JP 2011148692A JP 2011148692 A JP2011148692 A JP 2011148692A JP 2013016660 A5 JP2013016660 A5 JP 2013016660A5
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- electronic device
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- package
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- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 238000005304 joining Methods 0.000 claims description 25
- 238000003466 welding Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 2
Description
本発明は、電子デバイス用パッケージの製造方法、電子デバイスの製造方法、電子デバイスおよび電子機器に関するものである。 The present invention relates to an electronic device package manufacturing method, an electronic device manufacturing method, an electronic device, and an electronic apparatus.
本発明の目的は、低コスト化を図るとともに、高品質な気密封止を実現することができる電子デバイス用パッケージの製造方法、電子デバイスの製造方法および電子デバイスを提供すること、また、かかる電子デバイスを備える信頼性の高い電子機器を提供することにある。 An object of the present invention is to provide an electronic device package manufacturing method , an electronic device manufacturing method, and an electronic device capable of realizing cost reduction and realizing high-quality hermetic sealing, and also provides such an electronic device. An object is to provide a highly reliable electronic device including a device.
本発明は、上述の課題の少なくとも一部を解決するためになされたものであり、以下の形態または適用例として実現することが可能である。
［適用例１］
本発明の電子デバイス用パッケージの製造方法は、ベース部材と蓋部材との間に電子部品が収納される内部空間を形成しつつ、前記ベース部材と前記蓋部材とを接合する電子デバイス用パッケージの製造方法であって、
前記ベース部材と前記蓋部材との接合予定部位の一部をシーム溶接により接合する第１の接合工程と、
前記ベース部材と前記蓋部材の接合予定部位の残部をエネルギー線溶接により接合する第２の接合工程とを有することを特徴とする。
SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
[Application Example 1]
The method for manufacturing an electronic device package according to the present invention includes an electronic device package that joins the base member and the lid member while forming an internal space in which an electronic component is accommodated between the base member and the lid member. A manufacturing method comprising:
A first joining step of joining a part of the joining part of the base member and the lid member by seam welding;
It has the 2nd joining process which joins the remainder of the joining plan site | part of the said base member and the said cover member by energy beam welding, It is characterized by the above-mentioned.
［適用例９］
本発明の電子デバイスの製造方法は、ベース部材と蓋部材との間に電子部品が収納される内部空間を形成しつつ、前記ベース部材と前記蓋部材とを接合する電子デバイスの製造方法であって、
前記内部空間に電子部品を収容する工程と、
前記ベース部材と前記蓋部材との接合予定部位の一部をシーム溶接により接合する第１の接合工程と、
前記ベース部材と前記蓋部材の接合予定部位の残部をエネルギー線溶接により接合する第２の接合工程とを有することを特徴とする。
［適用例１０］
本発明の電子デバイスは、本発明の製造方法を用いて製造された電子デバイス用パッケージと、
前記電子デバイス用パッケージ内に収納された電子部品とを有することを特徴とする。
このような電子デバイスによれば、低コスト化を図るとともに、高品質な気密封止を実現することができる。
［適用例１１］
本発明の電子機器は、本発明の電子デバイスを備えることを特徴とする。
このような電子機器によれば、低コスト化を図るとともに、信頼性を優れたものとすることができる。
[Application Example 9]
The electronic device manufacturing method of the present invention is an electronic device manufacturing method in which the base member and the lid member are joined while forming an internal space in which an electronic component is accommodated between the base member and the lid member. And
A step of accommodating electronic components in the internal space;
A first joining step of joining a part of the joining part of the base member and the lid member by seam welding;
It has the 2nd joining process which joins the remainder of the joining plan site | part of the said base member and the said cover member by energy beam welding, It is characterized by the above-mentioned.
[Application Example 10]
An electronic device of the present invention includes an electronic device package manufactured using the manufacturing method of the present invention,
And an electronic component housed in the electronic device package.
According to such an electronic device, it is possible to reduce the cost and realize high-quality hermetic sealing.
[Application Example 11 ]
An electronic apparatus according to the present invention includes the electronic device according to the present invention.
According to such an electronic device, the cost can be reduced and the reliability can be improved.
以下、本発明の電子デバイス用パッケージ、電子デバイスの製造方法、電子デバイスおよび電子機器を添付図面に示す実施形態に基づいて詳細に説明する。なお、以下では、本発明の電子デバイスをセンサーデバイスに適用した場合を例に説明する。
＜第１実施形態＞
まず、本発明の第１実施形態について説明する。
Hereinafter, an electronic device package, an electronic device manufacturing method, an electronic device, and an electronic apparatus according to the present invention will be described in detail based on embodiments shown in the accompanying drawings. Hereinafter, a case where the electronic device of the present invention is applied to a sensor device will be described as an example.
<First Embodiment>
First, a first embodiment of the present invention will be described.
以上、本発明の電子デバイス用パッケージの製造方法、電子デバイスの製造方法、電子デバイスおよび電子機器について、図示の実施形態に基づいて説明したが、本発明は、これらに限定されるものではない。
また、本発明の電子デバイスおよび電子機器では、各部の構成は、同様の機能を発揮する任意の構成のものに置換することができ、また、任意の構成を付加することもできる。
As mentioned above, although the manufacturing method of the package for electronic devices of this invention, the manufacturing method of an electronic device , the electronic device, and the electronic device were demonstrated based on embodiment of illustration, this invention is not limited to these.
In the electronic device and the electronic apparatus of the present invention, the configuration of each part can be replaced with any configuration that exhibits the same function, and any configuration can be added.
Claims (11)
前記ベース部材と前記蓋部材との接合予定部位の一部をシーム溶接により接合する第１の接合工程と、
前記ベース部材と前記蓋部材の接合予定部位の残部をエネルギー線溶接により接合する第２の接合工程とを有することを特徴とする電子デバイス用パッケージの製造方法。 A method for manufacturing an electronic device package that joins the base member and the lid member while forming an internal space in which an electronic component is housed between the base member and the lid member,
A first joining step of joining a part of the joining part of the base member and the lid member by seam welding;
A method for manufacturing a package for an electronic device, comprising: a second joining step of joining the remaining part of the base member and the lid member to be joined by energy beam welding.
前記第１の接合工程では、前記接合予定部位のうち、前記蓋部材の平面視での輪郭の少なくとも１つの角部を除いて各辺に沿った部分をシーム溶接し、
前記第２の接合工程では、前記接合予定部位のうち、前記少なくとも１つの角部に対応した部分をエネルギー線溶接する請求項１に記載の電子デバイス用パッケージの製造方法。 The outline of the lid member in plan view has a pair of first sides extending along a first direction and a pair extending along a second direction intersecting the first direction. A shape having a second side of
In the first joining step, seam welding is performed on a portion along each side except for at least one corner portion of the outline of the lid member in plan view, among the planned joining portions,
2. The method for manufacturing an electronic device package according to claim 1, wherein, in the second joining step, energy beam welding is performed on a portion corresponding to the at least one corner portion of the joint portions to be joined.
前記第１の接合工程で行うシーム溶接は、軸線まわりに回転するローラー電極を用いるものであり、
前記シーム溶接時における前記ローラー電極と前記蓋部材との前記軸線方向での重なり長さをｄとし、前記Ｒ面取りの曲率半径をＲとしたとき、ｄ＜（１−１／√２）Ｒなる関係を満たす請求項１または２に記載の電子デバイス用パッケージの製造方法。 R corner chamfering is applied to each corner of the outline of the lid member in plan view,
The seam welding performed in the first joining step uses a roller electrode that rotates around an axis,
D <(1-1 / √2) R, where d is the overlapping length of the roller electrode and the lid member in the axial direction during seam welding and R is the radius of curvature of the R chamfer. The manufacturing method of the package for electronic devices of Claim 1 or 2 which satisfy | fills a relationship.
前記フランジの幅をｍとしたときに、ｍ＜（１−１／√２）Ｒなる関係を満たす請求項３に記載の電子デバイス用パッケージの製造方法。 The lid member has a recess for storing the electronic component, and a flange is formed on the outer periphery of the opening of the recess,
The manufacturing method of the package for electronic devices of Claim 3 satisfy | filling the relationship of m <(1-1 / (root) 2) R when the width | variety of the said flange is set to m.
前記第１の接合工程で行うシーム溶接は、軸線まわりに回転するローラー電極を用いるものであり、
前記シーム溶接時における前記ローラー電極と前記蓋部材との前記軸線方向での重なり長さをｄとし、前記Ｃ面取りの面取り寸法をＣとしたとき、ｄ＜Ｃ／２なる関係を満たす請求項１または２に記載の電子デバイス用パッケージの製造方法。 Each corner of the outline of the lid member in plan view is chamfered,
The seam welding performed in the first joining step uses a roller electrode that rotates around an axis,
2. The relationship of d <C / 2 is satisfied, where d is the overlap length in the axial direction of the roller electrode and the lid member during seam welding, and C is the chamfer dimension of the C chamfer. Or the manufacturing method of the package for electronic devices of 2.
前記フランジの幅をｍとしたときに、ｍ＜Ｃ／２なる関係を満たす請求項５に記載の電子デバイス用パッケージの製造方法。 The lid member has a recess for storing the electronic component, and a flange is formed on the outer periphery of the opening of the recess,
The manufacturing method of the package for electronic devices of Claim 5 which satisfy | fills the relationship of m <C / 2 when the width | variety of the said flange is set to m.
前記蓋部材は、平面視で、前記接合部材に重なるように輪郭が形成されている請求項１ないし７のいずれかに記載の電子デバイス用パッケージの製造方法。 The lid member is joined to the base member via a joining member made of a metal material,
The method of manufacturing a package for an electronic device according to claim 1, wherein the lid member is contoured so as to overlap the joining member in a plan view.
前記内部空間に電子部品を収容する工程と、 A step of accommodating electronic components in the internal space;
前記ベース部材と前記蓋部材との接合予定部位の一部をシーム溶接により接合する第１の接合工程と、 A first joining step of joining a part of the joining part of the base member and the lid member by seam welding;
前記ベース部材と前記蓋部材の接合予定部位の残部をエネルギー線溶接により接合する第２の接合工程とを有することを特徴とする電子デバイスの製造方法。 A method for manufacturing an electronic device, comprising: a second joining step for joining the remaining part of the base member and the lid member to be joined by energy beam welding.
前記電子デバイス用パッケージ内に収納された電子部品とを有することを特徴とする電子デバイス。 An electronic device package manufactured using the manufacturing method according to claim 1;
An electronic device comprising: an electronic component housed in the electronic device package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011148692A JP2013016660A (en) | 2011-07-04 | 2011-07-04 | Manufacturing method of package for electronic device, electronic device, and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011148692A JP2013016660A (en) | 2011-07-04 | 2011-07-04 | Manufacturing method of package for electronic device, electronic device, and electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013016660A JP2013016660A (en) | 2013-01-24 |
| JP2013016660A5 true JP2013016660A5 (en) | 2014-08-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011148692A Withdrawn JP2013016660A (en) | 2011-07-04 | 2011-07-04 | Manufacturing method of package for electronic device, electronic device, and electronic apparatus |
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| Country | Link |
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| JP (1) | JP2013016660A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5836796B2 (en) * | 2011-12-28 | 2015-12-24 | 日本特殊陶業株式会社 | Ceramic package |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH042165A (en) * | 1990-04-18 | 1992-01-07 | Canon Inc | Electric component unit |
| JP2004266054A (en) * | 2003-02-28 | 2004-09-24 | Fujimaru Kogyo Kk | Small-sized electronic device |
| JP2008153485A (en) * | 2006-12-19 | 2008-07-03 | Epson Toyocom Corp | Manufacturing method of electronic component |
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- 2011-07-04 JP JP2011148692A patent/JP2013016660A/en not_active Withdrawn
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