JP2008153485A - Manufacturing method of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component, capable of achieving high airtightness and performing manufacture at a low cost. <P>SOLUTION: The manufacturing method of the electronic component configured to house the component inside a package 57 and airtightly seal it by a lid body includes: a pre-process of forming at least the package; a mounting process of joining the component inside the package; and a lid body welding process of welding the lid body 40 to the package. In the lid body welding process, a part of the peripheral edge of the lid body is left and a residual region is seam-welded to the package. A sealing process of performing degassing by heating inside a vacuum atmosphere, irradiating the partial region left without being welded in the lid body welding process with a heating beam and airtightly sealing it is provided thereafter. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an improvement in a manufacturing method of an electronic component such as a piezoelectric device in which a component such as a piezoelectric vibrating piece is accommodated in a package.

  Electronic components are used in small information devices such as HDDs (hard disk drives), mobile computers, IC cards, mobile communication devices such as mobile phones, car phones, and paging systems, and measuring devices such as gyro sensors. For example, piezoelectric devices such as piezoelectric vibrators and piezoelectric oscillators are widely used as electronic components in which components such as a piezoelectric vibrating piece are accommodated in an airtight package.

That is, a configuration in which an electronic component is accommodated in a package is known. In particular, in Patent Document 1, the following method is used to hermetically seal a package.
That is, the lid 30 is placed on the peripheral portion of the package 10 containing the electronic component 90, and the lid 30 is welded by irradiating laser light from an oblique direction over the entire circumference of the lid 30 (Patent Document 1, (See FIGS. 3 and 4).

  However, in such a method, since laser light must be irradiated along the entire circumference of the lid 30, the laser light irradiation is continued for a long time, and thus unevenness occurs and welding is insufficient. There is a problem of causing a leak.

Therefore, the method shown in Patent Document 2 is also conceivable.
That is, in Patent Document 2, the lid 39 is joined to the package by using highly reliable seam welding or the like, and the internal gas is supplied from the through hole 45 formed in the package body 36 in advance. After that, the metal spheres 48a placed in the through holes 45 are instantaneously melted by pulse irradiation with laser light to close the through holes (see Patent Document 2 and FIG. 11).
As a result, the degree of vacuum in the package body 36 can be increased, and the lid 39 can also be reliably joined, and leakage is unlikely to occur.
JP 2004-172206 A JP 2004-289238 A

However, in the method of Patent Document 2, after the lid is seam welded in the atmosphere, the process of sealing the through hole 45 in the vacuum as described above is performed to outgas the package, Is hermetically sealed by hole sealing in which the metal sphere is melted and filled into the through hole 45.
For this reason, there are the following disadvantages.
(1) In the previous step, it is necessary to provide a through hole in the package in advance, which increases the cost of package manufacture.
(2) Many metal spheres used for hole sealing, such as gold-tin, are expensive, which increases the manufacturing cost.
(3) Since a complicated hole sealing step is performed, it takes a long time for manufacturing.

  An object of the present invention is to provide a method of manufacturing an electronic component that can realize high airtightness and can be manufactured at low cost.

  According to the first aspect of the present invention, there is provided a method of manufacturing an electronic component having a configuration in which a component is accommodated in a package and hermetically sealed by a lid, and at least a pre-process for forming the package; A mounting step for joining the components inside the package, and a lid welding step for welding the lid to the package. In the lid welding step, a part of the periphery of the lid is formed. The remaining area is seam welded to the package, and then heated in a vacuum atmosphere to degas, and the heated beam is irradiated to the partial area left unwelded in the lid welding process. And it is achieved by the manufacturing method of an electronic component provided with the sealing process sealed airtightly.

According to the configuration of the first invention, in the step of welding the lid to the package, the remaining area is seam welded to the package, leaving a part of the periphery of the lid. Since this process can be performed in the atmosphere, for example, not only the process is easy, but also it is possible to realize the joining of the lid body by a reliable method that is unlikely to cause a leak portion or the like.
Further, degassing from the inside of the package is performed by heating in a vacuum atmosphere using a part of the peripheral edge left unwelded in the lid welding process. As a result, the degree of vacuum in the package can be increased, and an optimum package environment is formed for components operating in the vacuum.
Furthermore, a slight gap left between the lid and the package can be completely closed by applying a heating beam to a part of the peripheral edge left without welding.
Thus, compared to the case where welding is performed by irradiating laser light along the entire circumference of the lid body, since most of the entire circumference is welded by seam welding with higher stability, leakage is less likely to occur. Since there is no hole sealing process, the manufacturing process and the sealing process of the package are simplified, and the manufacturing cost is reduced.
Of course, the partial region of the peripheral edge left without welding may be one place and a plurality of places.

According to a second invention, in the configuration of the first invention, a piezoelectric device is manufactured by using a piezoelectric vibrating piece as the component.
According to the structure of 2nd invention, it can be set as the package sealing technique suitable for the vibration environment of a piezoelectric vibrating piece.

According to a third invention, in the configuration of the first or second invention, a laser beam is used as the heating beam.
According to the configuration of the third aspect of the invention, spot welding can be performed very easily.

According to a fourth aspect of the present invention, in the configuration according to any one of the first to third aspects, the welding process is a seam welding using an electrode roller that is rolled while being in contact with the lid body. At least a pair of the electrode rollers to be used are arranged so as to be shifted back and forth along the traveling direction thereof, thereby forming a partial region not to be welded.
According to the configuration of the fourth aspect of the invention, at least a pair of the electrode rollers are arranged to be shifted back and forth along the traveling direction thereof. When this is reached, an unwelded area remains at the tip of the other electrode roller, and this remaining area can be used as a partial area of the peripheral edge of the lid. That is, it is easy to make such a partial unwelded part.

According to a fifth aspect of the invention, in the configuration of any one of the first to third aspects, the welding process is a seam welding using an electrode roller that rolls in contact with the lid, and in the seam welding, As the electrode roller to be used, a part of the outer periphery of the roller is used to form a partial region not to be welded.
According to the configuration of the fifth invention, by using the electrode roller used in seam welding from which a part of the outer periphery of the roller is removed, the removed part of the outer periphery of the roller during welding is Does not touch the lid. By leaving this non-abutting part unwelded, this remaining area can be used as a partial area of the peripheral edge of the lid. That is, it is easy to make such a partial unwelded part.

1 and 2 show a piezoelectric device as an example of an electronic component to which an embodiment of the present invention is applied. FIG. 1 is a schematic plan view thereof, and FIG. 2 is an end view taken along line AA of FIG. It is.
In the figure, the piezoelectric device 30 shows an example in which a crystal resonator is configured. The piezoelectric device 30 accommodates a piezoelectric vibrating piece 32 as a (accommodating) component in a package 57 as an accommodating container. The package 57 is, for example, a rectangular box that is slightly long in one direction, as can be understood with reference to FIGS. 1 and 2.
The package 57 is formed, for example, by sequentially laminating a plurality of substrates 54, 55, and 56 formed by molding an aluminum oxide ceramic green sheet as an insulating material, and then sintering. The third substrate 56 is formed so as to form a predetermined hole by removing the material inside thereof, thereby forming a predetermined internal space S on the inner side when stacked. This internal space S is a housing space for housing the piezoelectric vibrating piece 32.

  In addition, with respect to the second substrate 55, a rectangular recess 23 is formed by removing the material of the substrate in a region corresponding to the lower portion of the tip of the vibrating arm of the piezoelectric vibrating piece 32 described later. For this reason, the tip of the vibrating arm is prevented from colliding with the inner bottom surface of the package 57 and being damaged when the tip of the vibrating arm swings downward as shown by the arrow in FIG. ing.

A piezoelectric vibrating piece 32 is mounted inside the package 57 and hermetically sealed with a lid 40. Here, the lid body 40 is formed of a conductive metal and is suitable for the thermal expansion coefficient approximate to that of the package 57, and is preferably a Kovar plate body made of an alloy of iron and cobalt. is there. It should be noted that a through-hole is provided in any part of the package 57 other than the lid 40 and a window such as Kovar glass (borosilicate glass) is provided to form a light transmitting region so that laser light can be externally packaged. It is also possible to irradiate inside. In this case, when the metal film for weight formed on the vibrating arm of the piezoelectric vibrating piece 32 to be described later is evaporated with the laser light, the frequency by the mass reduction method becomes possible (not shown).
Unlike the conventional case, the bottom portion of the package 57 is not provided with a through hole 27 for hole sealing.

As shown in FIG. 2, two electrode portions 31 are formed at the bottom of the inner surface of the package 57 so as to be exposed to the internal space S.
The electrode portions 31 extend long along the length method at both ends in the width direction of the package. The electrode portions 31 and 31 can be formed by, for example, nickel plating and gold plating on tungsten metallization, and are formed on the bottom surface of the package 57 by being drawn out of the package or by providing a conductive through hole (not shown). Are connected to the mounting terminals 41 and 41 respectively.

Thus, the electrode parts 31 and 31 are connected to the outside and supply a driving voltage. As shown in FIGS. 1 and 2, for example, conductive bonding is performed on the electrode parts 31 and 31. Agents 43 and 43 are applied, and a support arm for a piezoelectric vibrating piece, which will be described later, is placed on the conductive adhesives 43 and 43, and the conductive adhesive is cured to be bonded. It has become.
In addition, as the conductive adhesives 43 and 43, a synthetic resin agent as an adhesive component exhibiting bonding strength can be used which contains conductive particles such as silver fine particles. A system-based or polyimide-based conductive adhesive or the like can be used.
Or when not using a conductive adhesive, you may make it join using metal bumps, such as a gold bump.
Further, a seam ring 58 as a metal brazing material is preformed on the joint surface of the package 57, for example. The seam ring 58 may be preformed on the lid 40 side.

In the present embodiment, the piezoelectric vibrating piece 32 as a component housed in the package is configured as shown in FIG. 1 in order to reduce the size and obtain the required performance.
That is, the piezoelectric vibrating piece 32 is made of, for example, quartz, and a piezoelectric material such as lithium tantalate or lithium niobate can be used in addition to the quartz. As shown in FIG. 1, the piezoelectric vibrating piece 32 includes a base 51 and a pair of vibrating arms 35 and 36 that extend in parallel from the one end (left end in the figure) to the right. It has.
Long grooves 33 and 34 extending in the length direction are preferably formed on the front and back of the main surfaces of the vibrating arms 35 and 36, respectively, and excitation electrodes 37 and 38, which are driving electrodes, are provided in the long grooves. ing.

Further, the piezoelectric vibrating reed 32 has a base 51 at the other end (left end in the figure) separated from the one end where the vibrating arm of the base 51 is formed by a predetermined distance BL (base length + cut portion length) in FIG. And extending in parallel with these vibrating arms 35 and 36 in the extending direction of each vibrating arm 35 and 36 (rightward in FIG. 1) at positions on both outer sides of the vibrating arms 35 and 36. Supporting arms 61 and 62 are provided.
The tuning fork-shaped outer shape of the piezoelectric vibrating piece 32 and the long groove provided in each vibrating arm are formed by wet etching or dry etching a material such as a quartz wafer with a hydrofluoric acid solution or the like, as will be described later. It can be formed precisely.

The excitation electrodes 37 and 38 are formed in the long grooves 33 and 34 and on the side surfaces of the vibrating arms, and the electrodes in the long grooves and the electrodes provided on the side surfaces of each vibrating arm are paired. The excitation electrodes 37 and 38 are routed around the supporting arms 61 and 62 as extraction electrodes 37a and 38a, respectively. As a result, when the piezoelectric device 30 is mounted on a mounting substrate or the like, an external driving voltage is applied from the mounting terminals 41 and 41 to the support arms 61 and 62 of the piezoelectric vibrating piece 32 via the electrode portions 31 and 31. Are transmitted to the extraction electrodes 37a and 38a, and are transmitted to the excitation electrodes 37 and 38, respectively.
Then, by applying a driving voltage to the excitation electrodes in the long grooves 33 and 34, the electric field efficiency inside the region where the long grooves of the respective vibrating arms are formed can be increased during driving.

Here, the excitation electrodes 37 and 38 are formed by forming an electrode layer with a metal having excellent conductivity on the base metal layer.
In this embodiment, a chromium (Cr) layer is formed as a base metal layer, and a gold (Au) layer is formed as an electrode layer, and the method shown in FIG. The electrode is formed in such a shape.
In this case, each film formation of the base layer and the electrode layer (not shown) is performed by sputtering or vapor deposition. In the badge process for forming a large number of piezoelectric vibrating pieces from a quartz wafer or the like, the film is formed by vapor deposition. Is preferred.

Further, as shown in FIG. 1, preferably, the base 51 is partially reduced in width in the width direction of the base 51 at both side edges at a position sufficiently away from the end of the base 51 on the vibrating arm side. The recessed part or notch | incision part 71,72 formed in this way is provided.
Thereby, when the vibrating arms 35 and 36 are bent and vibrated, it is possible to suppress vibration leakage from leaking to the base 51 side and propagating to the supporting arms 61 and 62, and to reduce the CI value.
When the strength permits, a through hole (not shown) is formed near the center of the base 51, for example, and stress is concentrated near the periphery of the through hole, so that vibration leakage is caused by the supporting arms 61 and 62. Can be suppressed and the CI value can be kept low.

In FIG. 1, the joint between the support arms 61 and 62 and the package 57 is, for example, a part corresponding to the center of gravity G of the length of the piezoelectric vibrating piece 32 with respect to one support arm 61. You can select only one. However, as shown in FIG. 1, it is preferable to join and select two points that are equidistant from the center of gravity position across the center of gravity position G because the joint structure is further strengthened and stabilized.
The piezoelectric vibrating reed as the housing component of the package 57 is not limited to the one shown in the figure, and for example, a so-called tuning fork type piezoelectric vibrating reed in which a pair of resonating arms extend in parallel from the base can be used. Then, the piezoelectric material is cut into a thin plate shape and is cut into a rectangular shape or a rectangular shape, a convex-type piezoelectric vibration piece, a mesa-type or reverse-mesa-type piezoelectric vibration piece, a SAW chip, and a gyro sensor element A piezoelectric vibrating piece or the like for forming the film can be used.
Further, the number of components to be accommodated is not limited to one, and the present invention can also be applied to a case where a piezoelectric oscillator in which an integrated circuit chip combined with the piezoelectric vibrating piece is accommodated in one package is configured.

(Method for manufacturing electronic components (piezoelectric devices))
Next, an embodiment of a method for manufacturing the piezoelectric device 30 will be described as an example of a method for manufacturing an electronic component.
FIG. 3 is a simple flowchart for explaining an embodiment of the method for manufacturing the piezoelectric device 30 of the present embodiment.
(pre-process)
The piezoelectric vibrating piece 32, the package 57, and the lid 40 of the piezoelectric device 30 are separately manufactured as a pre-process (ST11).
As already described, the lid 40 is formed of a conductive metal. In this embodiment, for example, a Kovar plate is processed into a predetermined size and nickel-plated.

As described above, the package 57 is formed by laminating a plurality of substrates formed by molding an aluminum oxide ceramic green sheet and then sintering. At the time of molding, each of the plurality of substrates can form a predetermined internal space S on the inner side when they are stacked by forming a predetermined hole on the inner side thereof by pressing or the like.
Further, for example, a conductive paste such as silver paste is applied to the regions of the electrode portions 31 and 31 and the mounting terminals 41 and 41 described in FIG. A metal film such as an electrode portion can be formed.

When the tuning-fork type piezoelectric vibrating piece 32 is formed using a quartz wafer or the like, the piezoelectric vibrating piece 32 is cut out from, for example, a single crystal of quartz.
When this quartz wafer is cut out from a single crystal of quartz, it is several degrees clockwise around the Z axis in an orthogonal coordinate system comprising an X axis that is an electrical axis, a Y axis that is a mechanical axis, and a Z axis that is an optical axis. It is obtained by cutting and polishing a crystal Z plate rotated and cut in a range of a predetermined thickness.

Next, a mask pattern (not shown) is formed by, for example, a corrosion-resistant film so as to conform to the outer shape including each vibrating arm and base, and the outer shape of the piezoelectric vibrating piece 32 is formed by wet etching using a hydrofluoric acid solution or the like ( (See FIG. 1). Then, a necessary corrosion-resistant film (not shown) is provided, used as a mask, and the portions of the long grooves 33 and 34 of the vibrating arm are formed by half etching using a hydrofluoric acid solution or the like.
Next, an excitation electrode as a drive electrode is formed.
That is, a metal film to be an electrode is formed on the outer surface after etching. This metal film can be formed, for example, by depositing gold with a technique such as vapor deposition or sputtering with chromium as a base.
Thereafter, each electrode as described in FIG. 1 is formed by a photolithography technique.
That is, the piezoelectric vibrating piece 32 is completed by forming excitation electrodes on each surface of the vibrating arms 35 and 36 of the piezoelectric vibrating piece 32 by a photolithography technique.
Preferably, metal coatings 21 and 21 serving as frequency adjusting weights are formed on the tip portions of the vibrating arms 35 and 36 of the piezoelectric vibrating piece 32 with the same structure as the excitation electrodes when the excitation electrodes are formed. can do.

(Mounting process)
After the above pre-process is executed, the completed piezoelectric vibrating piece 32 is joined.
Specifically, the conductive adhesives 43 and 43 are applied on the electrode portions 31 and 31 in FIG. 2 (four locations). As shown in FIG. 1, the corresponding supporting arms 61 and 62 are placed on these and lightly loaded.
In this state, the piezoelectric vibrating piece 32 is joined by heating in a belt furnace or the like to cure the conductive adhesive (ST12).

Note that the piezoelectric vibrating piece 32 may be joined by a metal bump or the like instead of the conductive adhesive, and in this case, a curing step is not necessary.
Subsequently, cleaning is performed with pure water, and then the whole is heated through a heating furnace or the like, thereby evaporating moisture and sufficiently evaporating the solvent from the conductive adhesive.
Further, preferably, in a state in which the lid 40 is not joined, a part of the frequency adjusting weights 21 and 21 of the vibrating arms 35 and 36 of the piezoelectric vibrating piece 32 is evaporated by irradiating laser light from above in FIG. Thus, frequency adjustment by a mass reduction method is performed (not shown).

(Cover body welding process)
Next, the lid 40 is joined to the package 57 (ST13).
FIG. 4 is a diagram for briefly explaining the lid welding method, and illustration of the piezoelectric vibrating piece in the package 57 is omitted.
As illustrated, the lid 40 is placed on the package 57.
A seam ring 58, which is a metal brazing material, is interposed between the package 57 and the lid body 40.
In this state, a pair of electrode rollers 22 and 22 serving as welding electrodes are applied to both sides of one end portion of the lid body 40 to flow a welding current. Then, the electrode rollers 22 are rotated to the other end of the lid 40 while rotating in the arrow direction. In this figure, the electrode rollers 22, 22 move in the direction behind the paper. As a result, a welding current is applied from each of the electrode rollers 22 and 22 in the direction of the arrow (and in the opposite direction), and the seam ring 58 is melted by Joule heat due to electrical resistance at that time.
As a result, the boundary between the lid 40 and the package 57 is welded evenly over the entire circumference as compared with welding using only laser light, so that an extremely high hermetic sealing property can be obtained.

Here, in the present embodiment, as shown in FIG. 5, a part of the periphery of the lid body 40 is left and the remaining region is seam welded to the package 57.
That is, a part where seam welding is not performed partially is formed. Such a place where seam welding is not performed may be one place, two places, or more, but if it is too many, subsequent operations become complicated. Moreover, it is preferable to make small the location which is not welded so that the package 57 and the exterior can be ventilated.
For example, in FIG. 5, two locations P <b> 1 and P <b> 2 corresponding to the corners of the lid 40 remain as seam welded portions, i.e., unwelded locations, even after the lid welding process described in FIG. 4 is finished. Has been.

FIG. 6 is an explanatory diagram simply showing one of the techniques for performing the lid welding process for leaving an unwelded portion as shown in FIG.
In the figure, a pair of electrode rollers 22-1 and 22-1 arranged in parallel with each other are used as the electrode rollers. In this case, one electrode roller and the other electrode roller are arranged slightly shifted back and forth along the traveling direction indicated by the arrow. Then, unwelded locations P1 and P2 are formed at the start end and the end end according to the shift amount.
That is, if the electrode roller positioned later in the traveling direction is placed at the start end, an unwelded portion P1 is formed by the preceding distance of the preceding electrode roller, and when the preceding electrode roller reaches the end, The unwelded portion P2 remains at the tip of the rear electrode roller. In this way, it is very easy to create unwelded locations P1, P2.

FIG. 7 is an explanatory view simply showing another one of the methods for executing the lid welding process for leaving an unwelded portion.
One or a pair of electrode rollers may be used. The electrode roller 22-2 to be used is formed with a notch 25 from which a part of the outer periphery is removed. The cutout portion 25 is preferably one location. As described with reference to FIG. 4, when the outer periphery of the electrode roller 22-2 is brought into contact with the upper end portion of the lid body 40 and is rolled, the contact with the lid body 40 is applied at a location corresponding to the notch portion 25. No contact is made. Thereby, the unwelded location P3 is easily formed in the non-contact location.

Next, an appearance inspection is performed on the welded state (ST14), and the welded state is transferred to an airtight chamber (ST15).
Here, the package 57 in which the lid 40 is seam-welded in the lid welding process is accommodated in a vacuum / heating chamber or the like and heated with a predetermined temperature profile (ST16).
Due to this heat, moisture on the inner surface of the package 57, a solvent component of the conductive adhesive 43, and the like are sufficiently vaporized. The gas generated by this process is discharged to the outside through the unwelded locations P1 and P2, and thereby sufficient gas is discharged or degassed. The inside of the package 57 is, for example, about 1 × 10 −2 Pa. A high degree of vacuum is assumed.

Subsequently, as shown in FIG. 5, the unwelded locations P1 and P2 are irradiated with a heating beam to perform sealing (ST17).
Here, the heating beam is used to fill a slight gap by irradiating an unwelded portion of the lid 40 and heating it in a spot manner to melt the corresponding portion of the seam ring 58 that is a brazing material. . Therefore, as long as it is suitable for such an application, anything such as an electron beam or a halogen light beam can be used. However, the irradiation position can be controlled here, and a laser suitable for concentrating high energy locally is used. A light beam is used. The laser beam can also be used for frequency adjustment.

  Here, if a light transmission region is partially formed in the lid 40, one of the frequency adjusting weights 21, 21 of the vibrating arms 35, 36 of the piezoelectric vibrating piece 32 is obtained using the light beam. By evaporating the part, the frequency can be adjusted by the mass reduction method. Since this is frequency adjustment performed after sealing, the frequency of the product can be finally adjusted to high accuracy.

Finally, an appearance inspection is performed (ST18).
Thereby, a piezoelectric device is completed.
As described above, according to this embodiment, in the lid welding process (ST13) to the package 57, a part of the periphery of the lid 40 is left and the remaining region is seam welded to the package 57. Yes. Since this step (ST13) can be performed in the atmosphere, for example, not only is the step easy, but also it is possible to realize the joining of the lid by a reliable method that is unlikely to cause a leak portion or the like. .
In addition, by using the regions P1, P2, and P3 of the peripheral edge left unwelded in the welding process (ST13) of the lid body 40, heating in a vacuum atmosphere allows removal from the package. Gas is performed. As a result, the degree of vacuum in the package can be increased, and an optimum package environment is formed for components operating in the vacuum.
Furthermore, a slight gap left between the lid 40 and the package 57 can be completely closed by applying a heating beam to the peripheral regions P1, P2, and P3 left without welding.
Thus, compared to the case where welding is performed by irradiating laser light along the entire circumference of the lid body 40, most of the entire circumference is welded by seam welding with higher stability. Since there is no hole sealing process, the manufacturing process and the sealing process of the package are simplified, and the manufacturing cost is reduced.

As described above, compared with the conventional process, the package structure is simple, and the metal ball is not used, so that this embodiment can reduce the manufacturing cost by about 10%, for the following reason. The time required for carrying out the manufacturing process can be greatly reduced.
That is, FIG. 8 is a flowchart showing steps in the conventional manufacturing method in comparison with FIG.
In the present embodiment, the appearance inspection is performed three times in ST4, ST6, and ST9 in the conventional process as compared with the appearance inspection twice in ST14 and ST18. In addition, the “ball setting” of ST5, that is, the appearance inspection after setting the metal ball to the through hole for hole sealing requires confirmation of a certain set of balls prior to the hole sealing, and therefore it takes a relatively long time. It takes. Further, in the final appearance inspection in ST9, it is checked whether or not the molten metal is surely filled in the through-holes, and it takes much longer time than the appearance inspection in ST18 of this embodiment. .
For this reason, in this embodiment, the time required for the processes after ST3, which was conventionally required, took an average of 179, 2 seconds in units of lots, but the process time after ST13 in FIG. The average unit can be 144 seconds, which is about 20% reduction.

The present invention is not limited to the above-described embodiment. Each configuration of each embodiment can be appropriately combined or omitted, and can be combined with other configurations not shown.
In addition, the present invention can be applied to semiconductor devices, crystal resonators, crystal oscillators, crystal filters, SAW devices, gyros, as long as various electrical and electronic components such as IC elements and piezoelectric vibrating pieces are accommodated in the package. It can be applied to all electronic components regardless of the name of the angle sensor or the like.

1 is a schematic plan view of a piezoelectric device according to an embodiment of the present invention. FIG. 3 is a schematic cut end view taken along line AA of the piezoelectric device of FIG. 1. The flowchart which shows embodiment of the manufacturing method of the piezoelectric device of FIG. Explanatory drawing of the welding process of the cover body of the piezoelectric device of FIG. Explanatory drawing which shows one method in the welding method of the cover body in embodiment of the manufacturing method of the piezoelectric device of FIG. Explanatory drawing which shows one method in the welding method of the cover body in embodiment of the manufacturing method of the piezoelectric device of FIG. Explanatory drawing which shows one method in the welding method of the cover body in embodiment of the manufacturing method of the piezoelectric device of FIG. The flowchart which shows embodiment of the conventional manufacturing method of a piezoelectric device.

Explanation of symbols

  22 ... Electrode roller, 30 ... Piezoelectric device, 32 ... Piezoelectric vibrating piece, 35, 36 ... Vibrating arm, 40 ... Lid, 51 ... Base, 57 ... Package, 58 ... Seam ring (sealing material), 61,62 ... Supporting arm, P1, P2, P3 ... Unwelded location

Claims (5)

A method of manufacturing an electronic component configured to house a component in a package and hermetically seal with a lid,
At least a pre-process for forming the package;
A mounting step of bonding the component inside the package;
A lid welding process for welding the lid to the package,
In the lid welding process, leaving a part of the periphery of the lid, seam welding the remaining area to the package,
Then, degas by heating in a vacuum atmosphere,
A method of manufacturing an electronic component comprising: a sealing step of irradiating a heating beam to the partial region left unwelded in the lid welding step to hermetically seal.   The method of manufacturing an electronic component according to claim 1, wherein a piezoelectric device is manufactured by using a piezoelectric vibrating piece as the component.   3. The method of manufacturing an electronic component according to claim 1, wherein a laser beam is used as the heating beam.   The welding process is seam welding using an electrode roller that rolls in contact with the lid, and at least a pair of the electrode rollers used in the seam welding are shifted back and forth along the direction of travel. 4. The method of manufacturing an electronic component according to claim 1, wherein the non-welded partial region is formed by arranging the first and second regions.   The welding process is seam welding using an electrode roller that rolls in contact with the lid body, and a part of the outer periphery of the roller is removed as the electrode roller used in the seam welding. The method of manufacturing an electronic component according to claim 1, wherein the non-welded partial region is formed by using a material.

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