JP2013016635A5 - - Google Patents

Download PDF

Info

Publication number
JP2013016635A5
JP2013016635A5 JP2011148288A JP2011148288A JP2013016635A5 JP 2013016635 A5 JP2013016635 A5 JP 2013016635A5 JP 2011148288 A JP2011148288 A JP 2011148288A JP 2011148288 A JP2011148288 A JP 2011148288A JP 2013016635 A5 JP2013016635 A5 JP 2013016635A5
Authority
JP
Japan
Prior art keywords
substrate
mounting body
mounting
body support
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011148288A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013016635A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011148288A priority Critical patent/JP2013016635A/ja
Priority claimed from JP2011148288A external-priority patent/JP2013016635A/ja
Publication of JP2013016635A publication Critical patent/JP2013016635A/ja
Publication of JP2013016635A5 publication Critical patent/JP2013016635A5/ja
Pending legal-status Critical Current

Links

JP2011148288A 2011-07-04 2011-07-04 基板処理装置及び半導体装置の製造方法 Pending JP2013016635A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011148288A JP2013016635A (ja) 2011-07-04 2011-07-04 基板処理装置及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011148288A JP2013016635A (ja) 2011-07-04 2011-07-04 基板処理装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2013016635A JP2013016635A (ja) 2013-01-24
JP2013016635A5 true JP2013016635A5 (enrdf_load_stackoverflow) 2014-08-14

Family

ID=47689021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011148288A Pending JP2013016635A (ja) 2011-07-04 2011-07-04 基板処理装置及び半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2013016635A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015223807A1 (de) * 2015-12-01 2017-06-01 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht in einer Abscheidekammer, Vorrichtung zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht und Halbleiterscheibe mit epitaktischer Schicht

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3186750B2 (ja) * 1999-12-09 2001-07-11 イビデン株式会社 半導体製造・検査装置用セラミック板
JP2003197722A (ja) * 2001-12-26 2003-07-11 Toshiba Ceramics Co Ltd 半導体ウェーハ熱処理用治具及びこれを用いた熱処理用装置並びに半導体ウェーハ熱処理用治具の製造方法
KR100492977B1 (ko) * 2002-12-12 2005-06-07 삼성전자주식회사 다공성 실리카 박막의 소결을 위한 웨이퍼 보트
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
JP2006186350A (ja) * 2005-12-02 2006-07-13 Sumitomo Electric Ind Ltd 基板加熱構造体および基板処理装置
JP2008108926A (ja) * 2006-10-26 2008-05-08 Bridgestone Corp ウェハ熱処理用治具
JP2010153467A (ja) * 2008-12-24 2010-07-08 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2009147383A (ja) * 2009-03-26 2009-07-02 Hitachi Kokusai Electric Inc 熱処理方法

Similar Documents

Publication Publication Date Title
JP2010153467A5 (enrdf_load_stackoverflow)
WO2012030751A3 (en) Apparatus and method for shaping a glass substrate
JP2014082318A5 (enrdf_load_stackoverflow)
JP2011222960A5 (enrdf_load_stackoverflow)
JP2011049398A5 (ja) レーザ照射装置
JP2011049566A5 (enrdf_load_stackoverflow)
WO2009099284A3 (en) Substrate supporting unit, substrate processing apparatus, and method of manufacturing substrate supporting unit
JP2011258939A5 (enrdf_load_stackoverflow)
WO2012118606A3 (en) Thin heated substrate support
JP2010153490A5 (enrdf_load_stackoverflow)
EP1944793A3 (en) Temperature measurement and control of wafer support in thermal processing chamber
TW201130073A (en) Coating and developing apparatus and coating and developing method
EP2220675A4 (en) SUBSTRATRATION AND OSCILLATION DEVICE FOR A FAST THERMAL PROCESS
WO2012058005A3 (en) Apparatus having improved substrate temperature uniformity using direct heating methods
WO2013048016A3 (ko) 기판지지유닛 및 기판처리장치, 그리고 기판지지유닛을 제조하는 방법
JP2008042023A5 (enrdf_load_stackoverflow)
WO2010140766A3 (ko) 기판지지유닛 및 이를 포함하는 기판처리장치
JP2013016635A5 (enrdf_load_stackoverflow)
JP2009194374A5 (ja) Ｓｏｉ基板の作製方法
WO2011139640A3 (en) Improved radiation heating efficiency by increasing absorption of a silicon containing material
JP2011091096A5 (enrdf_load_stackoverflow)
WO2008123133A1 (ja) 載置台構造及びこれを用いた処理装置
JP2012231001A5 (enrdf_load_stackoverflow)
SG164332A1 (en) A support assembly for substrate holder, as well as a device provided with such a support assembly for layered deposition of various semiconductor materials on a semiconductor substrate
PL2280834T3 (pl) Personalizowalny nośnik zawierający mechanizm zapobiegający fałszerstwom oraz proces wytwarzania takich nośników