JP2013016372A - Electric optical device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric optical device achieving high sealing performance.SOLUTION: An electric optical device 1 of this invention includes: a substrate 10; a first electrode 12 formed on the substrate 10; a second electrode 13 formed facing the first electrode 12; a first inorganic sealing layer 14 formed covering the second electrode 13; an organic intermediate layer 15 formed on the first inorganic sealing layer 14; a sealing layer 16 formed contacting with an end part of the organic intermediate layer 15; and a second inorganic sealing layer 17 formed on the organic intermediate layer 15. The sealing layer 16 includes an inorganic material, and the second inorganic sealing layer 17 is in contact with the organic intermediate layer 15. An end part of the second inorganic sealing layer 17 is in contact with the sealing layer 16.

Description

  The present invention relates to an electro-optical device and an electronic apparatus.

  As an electro-optical device provided with a thin-film sealing structure that protects a display unit from moisture and oxygen intrusion, an electro-optical device described in Patent Document 1 is known. In the electro-optical device disclosed in Patent Document 1, a first inorganic sealing layer, an organic intermediate layer, and a second inorganic sealing layer are sequentially stacked on the surface of the display unit to protect the display unit from intrusion of moisture and oxygen. .

  Meanwhile, a driver circuit connected to the second electrode, upper and lower contact wirings, and the like are routed around the outer peripheral portion of the substrate on which the display portion is formed, and there are many irregularities. For this reason, peeling or cracking may occur in the outer peripheral portion of the second inorganic sealing layer (the portion formed on the outer peripheral portion of the substrate of the second inorganic sealing layer). Therefore, in the electro-optical device disclosed in Patent Document 1, an outer shell reinforcing layer made of an epoxy resin is formed on the outer peripheral portion of the second inorganic sealing layer, and peeling or cracking or the like occurs on the outer peripheral portion of the second inorganic sealing layer. Is suppressed.

JP 2006-222071 A

  The outer shell reinforcing layer reinforces the second inorganic sealing layer from the outside when the organic intermediate layer expands and contracts due to thermal deformation. Since the second inorganic sealing layer is formed on the large unevenness formed on the substrate, even if the second inorganic sealing layer is reinforced from the outside by the outer shell reinforcing layer, it is still in a state where peeling or cracking is likely to occur. If peeling or cracking occurs in the second inorganic sealing layer, the outer shell reinforcing layer is made of an organic material, so that moisture or the like may easily enter the display portion from the part where peeling or cracking occurs. There is.

  The present invention has been made in view of such circumstances, and an object thereof is to provide an electro-optical device and an electronic apparatus having high sealing performance.

  In order to solve the above problem, an electro-optical device according to the present invention includes a substrate, a first electrode formed on the substrate, a second electrode formed to face the first electrode, and the second electrode. A first inorganic sealing layer formed over the electrode, an organic intermediate layer formed on the first inorganic sealing layer, a sealing layer formed in contact with an end of the organic intermediate layer, A second inorganic sealing layer formed on the organic intermediate layer, wherein the sealing layer contains an inorganic material, the second inorganic sealing layer is in contact with the organic intermediate layer, and The end of the two inorganic sealing layers is in contact with the sealing layer.

  According to this configuration, the first inorganic sealing layer, the sealing layer, and the second inorganic sealing layer function as a gas barrier layer that seals the second electrode. In this invention, the sealing layer which contact | connects the edge part of an organic intermediate layer is provided. By forming the sealing layer with a sufficient thickness on a portion where the driver circuit or the like is drawn around the substrate and has a lot of unevenness, the unevenness of the substrate can be flattened. Therefore, it can suppress that peeling, a crack, etc. arise in the edge part of the 2nd inorganic sealing layer which contact | connects the said sealing layer. Therefore, an electro-optical device that can improve the coverage of the gas barrier layer can be provided.

  In the electro-optical device according to the aspect of the invention, the sealing layer may be formed outside the organic intermediate layer.

  According to this configuration, the sealing layer can be formed on the outer peripheral portion of the substrate (a region where a driver circuit or the like is drawn around the substrate and a portion having a lot of unevenness is particularly large). Therefore, the coverage of the gas barrier layer can be reliably improved.

  In the electro-optical device according to the aspect of the invention, the sealing layer may be formed so as to surround the organic intermediate layer.

  According to this configuration, since the second electrode is completely sealed by the sealing layer, it is possible to prevent moisture and the like from entering the second electrode and the first electrode from the sealing layer. Therefore, the sealing property of the gas barrier layer can be improved.

  In the electro-optical device according to the aspect of the invention, a region where the sealing layer and an end of the second inorganic sealing layer are in contact may surround the organic intermediate layer.

  According to this configuration, since the second electrode is completely sealed by the sealing layer and the second inorganic sealing layer, moisture or the like is transferred from the interface between the sealing layer and the second inorganic sealing layer. Intrusion into the first electrode can be suppressed. Therefore, the sealing property of the gas barrier layer can be improved.

  In the electro-optical device according to the aspect of the invention, the sealing layer may be formed on the first inorganic sealing layer in contact with the first inorganic sealing layer.

  According to this configuration, since both the sealing layer and the first inorganic sealing layer contain an inorganic material, the sealing layer and the first inorganic sealing layer are firmly adhered. For this reason, it can suppress that a water | moisture content etc. permeate into a 2nd electrode and a 1st electrode from the interface of a sealing layer and a 1st inorganic sealing layer. Therefore, the sealing property of the gas barrier layer can be improved.

  In the electro-optical device according to the aspect of the invention, it is preferable that the sealing layer is located between an end portion of the first inorganic sealing layer and an end portion of the second inorganic sealing layer.

  According to this configuration, unlike the configuration in which the sealing layer is formed on the outer peripheral portion of the second inorganic sealing layer, the sealing layer is composed of the first inorganic sealing layer and the second inorganic sealing layer 17. It becomes the structure inserted | pinched. Therefore, the panel frame can be reduced.

  In the electro-optical device according to the aspect of the invention, the sealing layer may be in contact with the substrate.

  According to this structure, when a board | substrate (surface part of a board | substrate) contains an inorganic material, a sealing layer and a board | substrate adhere firmly. For this reason, it can suppress that a water | moisture content etc. permeate into a 2nd electrode and a 1st electrode from the interface of a sealing layer and a board | substrate. Therefore, the sealing property of the gas barrier layer can be improved.

  In the electro-optical device according to the aspect of the invention, a color filter layer may be formed on the second inorganic sealing layer.

  As a method for reducing the size of the electro-optical device, there is a method in which a color filter layer is directly formed on a gas barrier layer. In Patent Document 1, since the outer shell reinforcing layer formed on the outer peripheral portion of the gas barrier layer is made of resin, abnormalities such as moisture absorption, swelling, and dissolution occur in the outer shell reinforcing layer in the photolithography process when forming the color filter layer. There was a fear. In contrast, in the present invention, the sealing layer includes an inorganic material, and the second inorganic sealing layer is in contact with the sealing layer. Moreover, the outer shell reinforcing layer made of resin is not formed on the second inorganic sealing layer. For this reason, even if the color filter layer is directly formed on the second inorganic sealing layer, the above-described abnormality does not occur. Therefore, it is easy to reduce the size of the electro-optical device.

  In the electro-optical device according to the aspect of the invention, it is preferable that the sealing layer is made of a material containing at least one of polysilazane and polysiloxane.

  According to this structure, it can suppress that a water | moisture content etc. permeate into a 2nd electrode and a 1st electrode from a sealing layer. Therefore, the sealing property of the gas barrier layer can be improved.

  In the electro-optical device according to the aspect of the invention, the first inorganic sealing layer and the second inorganic sealing layer are made of a material containing at least one of silicon oxide, silicon nitride, silicon oxynitride, and alumina. It is desirable.

  According to this configuration, it is possible to improve the sealing performance of the gas barrier layer.

  In the electro-optical device according to the aspect of the invention, it is preferable that the sealing layer is formed by coating.

  According to this configuration, the thickness of the sealing layer formed is larger than the sealing layer formed by sputtering, CVD, or the like. Therefore, the sealing layer can be formed with a sufficient thickness on a portion where the driver circuit or the like is routed around the outer peripheral portion of the substrate and has many irregularities. Thereby, the unevenness | corrugation of a board | substrate can be planarized with a sealing layer. Therefore, the coverage of the gas barrier layer can be improved.

  According to another aspect of the invention, an electronic apparatus includes the electro-optical device.

  According to this electronic apparatus, since the above-described electro-optical device is provided, it is possible to provide a highly reliable electronic apparatus capable of displaying a high-quality image.

1 is a schematic diagram of an organic EL device according to a first embodiment of the present invention. It is principal part sectional drawing of the organic electroluminescent apparatus of 2nd Embodiment of this invention. It is a schematic diagram of the organic electroluminescent apparatus of 3rd Embodiment of this invention. It is a figure which shows an example of an electronic device. It is a schematic diagram which shows the organic EL apparatus of a prior art example.

  Embodiments of the present invention will be described below with reference to the drawings. This embodiment shows one aspect of the present invention, and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each structure easy to understand, an actual structure and a scale, a number, and the like in each structure are different.

(First embodiment)
FIG. 1 is a schematic diagram of an organic EL device according to the first embodiment of the present invention. FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view of the main part.

  In the following embodiments, the electro-optical device will be described using an organic EL device using an organic electroluminescence (EL) material which is an example of an organic functional material.

  As shown in FIG. 1, the organic EL device 1 includes a substrate 10 on which various wirings such as TFTs 19 are formed, an insulating film 7 formed on the substrate 10, a planarization layer 8, and a planarization layer 8. A light-emitting element having the light-emitting layer 11 sandwiched between the pixel electrode (first electrode) 12 and the counter electrode (second electrode) 13 formed; a pixel partition wall 9 that separates the light-emitting element; and a first inorganic sealing layer 14 The organic intermediate layer 15, the sealing layer 16, and the second inorganic sealing layer 17 are included. In the present embodiment, the first inorganic sealing layer 14, the sealing layer 16, and the second inorganic sealing layer 17 function as a gas barrier layer.

  The organic EL device 1 of the present embodiment is an active matrix type using thin film transistors (hereinafter referred to as TFTs) as switching elements, and intersects a plurality of scanning lines substantially at right angles to each scanning line. The wiring structure includes a plurality of signal lines extending in the direction and a plurality of power supply lines extending in parallel with each signal line. In the present invention, an active matrix using a TFT or the like is not essential, and simple matrix driving may be performed using an element substrate for a simple matrix.

  When the so-called top emission method is adopted as the substrate 10, since the emitted light is extracted from the gas barrier layer side that is the opposite side of the substrate, either a transparent substrate or an opaque substrate can be used. Examples of opaque substrates include ceramics such as alumina, metal sheets such as stainless steel that have been subjected to insulation treatment such as surface oxidation, thermosetting resins and thermoplastic resins, and films thereof (plastic films). It is done.

  In addition, when the so-called bottom emission method is adopted, since the emitted light is extracted from the substrate side, a transparent or translucent substrate is used as the substrate. As the transparent substrate, for example, an inorganic substance such as glass, quartz glass, or silicon nitride, or an organic polymer (resin) such as an acrylic resin or a polycarbonate resin can be used. A composite material formed by laminating or mixing the materials can also be used. In this embodiment, the top emission method is adopted, and the above-described opaque plastic film is used as the material of the substrate 10.

  On the substrate 10, various wirings for driving the organic EL device 1, driving elements 19 such as switching TFTs and driving TFTs, an insulating film 7 made of an inorganic material or an organic material, and the like are formed. Various wirings and drive elements 19 are formed by patterning using a photolithography technique, an etching technique, or the like. The insulating film 7 is formed by a known film forming method such as a vapor deposition method, a CVD method, or a sputtering method.

Insulating film 7, a silicon oxide _(SiO 2), silicon nitride (SiN), it is formed of an inorganic insulating material such as silicon oxynitride (SiON).

  The pixel electrode 12 is formed of a material having a high hole injection effect having a work function of 5 eV or more. As such a material, for example, a metal oxide such as ITO (Indium Tin Oxide) is used. In this embodiment, since the top emission method is adopted, the pixel electrode 12 does not need to have translucency. Therefore, in this embodiment, a light reflective metal layer such as Al is formed under the transparent conductive layer made of ITO to form a laminated structure, and the pixel electrode 12 is formed by this laminated structure.

  In this embodiment, the organic functional layer 11 is formed including an organic light emitting layer made of a low molecular organic EL material. As such an organic functional layer 11, for example, a structure in which a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer are sequentially stacked from the pixel electrode side is known. A structure in which the hole transport layer and the electron transport layer are omitted, a hole injection / transport layer having both functions of the hole injection layer and the hole transport layer, or both the electron injection layer and the electron transport layer are used. A structure using an electron injecting / transporting layer having the above functions is known. In the present invention, an appropriate structure is selected and formed from such structures.

Moreover, as a material of the organic functional layer 11, a well-known thing can be used, respectively.
For example, as the material for the organic light emitting layer, a styrylamine light emitting material or the like is used as the organic light emitting material that emits white light in the present embodiment.
Furthermore, as the material for the hole injection layer, triarylamine (ATP) multimers are used, and as the material for the hole transport layer, TDP (triphenyldiamine) -based materials are used. Aluminum quinolinol (Alq3) or the like is used as the material for the transport layer.

  A counter electrode 13 is formed on the organic functional layer 11 so as to cover the organic functional layer 11. In the present embodiment, the counter electrode 13 is a top emission method and is formed of a transparent conductive material because it is on the light extraction side. As the transparent conductive material, for example, ITO (Indium Tin Oxide: Indium Tin Oxide) is suitable, but other than this, for example, indium oxide / zinc oxide based amorphous transparent conductive film (Indium Zinc Oxide: IZO / I Zet O (registered trademark)) or the like can be used. In this embodiment, ITO is used.

  The counter electrode 13 is preferably made of a material having a large electron injection effect. For example, calcium, magnesium, sodium, lithium metal, or a metal compound thereof. Examples of the metal compound include metal fluorides such as calcium fluoride, metal oxides such as lithium oxide, and organometallic complexes such as acetylacetonato calcium. Moreover, it is preferable to reduce electrical resistance by laminating transparent metal oxide conductive layers such as ITO and tin oxide. In the present embodiment, a laminate of lithium fluoride, magnesium-silver alloy, and ITO is used by adjusting the film thickness to obtain transparency.

  The counter electrode 13 is connected to a contact portion (not shown) formed on the substrate 10. The contact portion is connected to a terminal portion 18 shown in FIG. 1A provided along one side of the substrate 10.

  In the organic EL device 1 of the present embodiment, an organic EL element is formed by the pixel electrode 12, the functional layer 11, and the counter electrode 13. That is, when a voltage is applied between the pixel electrode 12 and the counter electrode 13, holes are injected from the pixel electrode 12 into the hole injection layer and transported to the organic light emitting layer through the hole transport layer. Further, electrons are injected from the counter electrode 13 into the electron injection layer and transported to the organic light emitting layer through the electron transport layer. Then, the holes and electrons transported to the organic light emitting layer are recombined, so that the organic light emitting layer emits light.

  The light emitted from the organic light emitting layer to the pixel electrode side passes through the transparent conductive layer, is reflected by the light reflective metal layer, and enters the organic light emitting layer side again. Since the counter electrode 13 functions as a transflective film, light other than a wavelength in a predetermined range is reflected to the light reflective metal layer side and reciprocates between the counter electrode 13 and the light reflective metal layer. In this way, only light having a resonance wavelength corresponding to the optical distance between the counter electrode 13 and the light reflective metal layer is amplified and extracted. That is, the space between the counter electrode 13 and the light-reflective metal layer that functions as a resonator can emit light having a high emission luminance and a sharp spectrum. . Here, the optical distance is obtained by the sum of the optical distances of the layers included between the counter electrode 13 and the light-reflecting metal layer, and the optical distance of each layer is determined by the film thickness and the refractive index. Calculated by product.

  The first inorganic sealing layer 14 is formed so as to cover the entire portion of the counter electrode 13 exposed on the substrate 10. The first inorganic sealing layer 14 is for blocking oxygen and moisture from entering. In the present embodiment, the first inorganic sealing layer 14 is formed of a material containing at least one of silicon oxide, silicon nitride, silicon oxynitride, and alumina. The first inorganic sealing layer 14 needs to be a dense and defect-free film to block gas such as water vapor, and can be formed using a high-density plasma film forming method that can form a dense film at a low temperature. preferable.

  The organic intermediate layer 15 is formed on the first inorganic sealing layer 14 so as to cover at least a region facing the counter electrode 13. The organic intermediate layer 15 is disposed so as to fill the uneven portion of the counter electrode 13 formed in an uneven shape due to the influence of the shape of the pixel portion 11 (organic functional layer). The organic intermediate layer 15 has a function of relieving stress generated by warping or volume expansion of the substrate 10. Further, the upper surface of the organic intermediate layer 15 is substantially flattened. The organic intermediate layer 15 can be formed using, for example, a screen printing method or a dispensing method.

  As a forming material of the organic intermediate layer 15, a polymer material having lipophilicity and low water absorption, for example, polyolefin or polyether is preferable. Alternatively, an organosilicon polymer obtained by hydrolyzing and condensing alkoxysilane such as methyltrimethoxysilane or tetraethoxysilane may be used. In addition, dicarboxylic acid anhydrides can be used for polymer derivatives and acrylic polymers such as tolylene diisocyanate and xylylene diisocyanate, which are mainly composed of acrylic polyol, methacryl polyol, polyester polyol, polyether polyol and polyurethane polyol. A polymer derivative obtained by polymerizing a physical compound or an amine compound may be employed. Furthermore, by using a polymer containing a silicon compound such as a silane coupling agent such as 3-aminopropyltrimethoxysilane and 3-glycidoxypropyltrimethoxysilane, the first inorganic sealing layer 14 and the second inorganic sealing layer 14 The adhesiveness of the interface with the inorganic material such as the sealing layer 17 can be improved.

  Further, as the material for forming the organic intermediate layer 15, a material that cures at a low temperature is preferable, and an ultraviolet curable resin mainly composed of a methacrylate resin, an epoxy resin, or the like can also be used. By using the ultraviolet curable resin, the organic intermediate layer 15 is formed without performing heat treatment, so that the adverse effect on the light emitting layer due to heating can be suppressed.

  FIG. 5 is a schematic diagram of a conventional organic EL device 100. FIG. 5A is a plan view, and FIG. 5B is a cross-sectional view of the main part.

  A driver circuit connected to the counter electrode, upper and lower contact wirings and the like are routed around the outer periphery of the substrate on which the display portion is formed, and there are many irregularities. For this reason, peeling or cracking may occur in the outer peripheral portion of the second inorganic sealing layer 117 (the portion formed on the outer peripheral portion of the substrate of the second inorganic sealing layer).

  As shown in FIG. 5, in the organic EL device 100 of the conventional example, an outer shell reinforcing layer 116 made of an epoxy resin is formed on the outer peripheral portion of the second inorganic sealing layer 117. Thereby, it is suppressed that peeling, a crack, etc. arise in the outer peripheral part of the 2nd inorganic sealing layer 117. FIG.

  However, the outer shell reinforcing layer 116 reinforces the second inorganic sealing layer 117 from the outside when the organic intermediate layer 115 expands and contracts due to thermal deformation. Since the second inorganic sealing layer 117 is formed on the large irregularities formed on the substrate 110, even if it is reinforced from the outside by the outer shell reinforcing layer 116, it still remains prone to peeling or cracking. It is in. When peeling or cracking occurs in the second inorganic sealing layer 117, the outer shell reinforcing layer 116 is made of an organic material, so that moisture or the like is transferred from the portion where peeling or cracking occurs to the counter electrode 113 and the pixel electrode 112. There is a risk of intrusion.

  Further, in the organic EL device 100 of the conventional example, since the outer shell reinforcing layer 116 is formed on the outer peripheral portion of the second inorganic sealing layer 117, the panel frame becomes large.

  Therefore, in the organic EL device 1 of the present embodiment, the sealing layer 16 formed by applying a sealing material containing at least an inorganic material is formed so as to cover the outer periphery of the organic intermediate layer 15. The sealing layer 16 suppresses destruction (generation of cracks) of the gas barrier layer (second inorganic sealing layer 17) in the outer peripheral portion of the substrate 10.

  In the present embodiment, the sealing layer 16 is in contact with the first inorganic sealing layer 14. The sealing layer 16 of the present embodiment is disposed so as to fill in uneven portions such as a driver circuit and upper and lower contact wirings formed on the substrate 10. That is, the sealing layer 16 is formed on the first inorganic sealing layer 14 with a sufficient thickness. For this reason, the upper surface of the sealing layer 16 is planarized.

  The sealing layer 16 can be formed using, for example, a screen printing method or a dispensing method. In the present embodiment, the sealing layer 16 is formed so as to cover the outer periphery of the organic intermediate layer 15 with a frame shape closed in a plan view.

  In the present embodiment, the sealing layer 16 is formed of a material containing at least one of polysilazane and polysiloxane.

  The second inorganic sealing layer 17 is formed in contact with the sealing layer 16 while covering the entire portion of the organic intermediate layer 15 exposed on the substrate. Thereby, the organic intermediate layer 15 is configured to be sandwiched between the first inorganic sealing layer 14, the sealing layer 16, and the second inorganic sealing layer 17. The second inorganic sealing layer 17 is formed following the shape of the organic intermediate layer 15. Since the upper surface of the organic intermediate layer 15 is flattened, the second inorganic sealing layer 17 formed on the upper surface of the organic intermediate layer 15 is also flattened.

  In the present embodiment, the second inorganic sealing layer 17 is formed of a material containing at least one of silicon oxide, silicon nitride, silicon oxynitride, and alumina. The second inorganic sealing layer 17 needs to be a dense and defect-free film to block gas such as water vapor, and can be formed using a high-density plasma film forming method that can form a dense film at low temperatures. preferable. In the present embodiment, the portion where the second inorganic sealing layer 17 is in contact with the sealing layer 16 has a frame shape closed in plan view.

  According to the organic EL device 1 of the present embodiment, the first inorganic sealing layer 14, the sealing layer 16, and the second inorganic sealing layer 17 function as a gas barrier layer that seals the counter electrode 13. In the present invention, the sealing layer 16 in contact with the end of the organic intermediate layer 15 is provided. By forming the sealing layer 16 with a sufficient thickness on a portion where the driver circuit or the like is drawn around the substrate 10 and has many irregularities, the irregularities of the substrate 10 can be flattened. Therefore, it is possible to suppress the occurrence of peeling or cracking at the end of the second inorganic sealing layer 17 in contact with the sealing layer 16. Therefore, the organic EL device 1 capable of improving the coverage of the gas barrier layer can be provided.

  In addition, according to this configuration, since the sealing layer 16 is formed outside the organic intermediate layer 15, the outer peripheral part of the substrate 10 (particularly, the driver circuit or the like is drawn around the substrate 10 and there are many irregularities). The sealing layer 16 can be formed on the region. Therefore, the coverage of the gas barrier layer can be reliably improved.

  Further, according to this configuration, since the counter electrode 13 is completely sealed by the sealing layer 16, it is possible to suppress moisture and the like from entering the counter electrode 13 from the sealing layer 16. Therefore, the sealing property of the gas barrier layer can be improved.

  In addition, according to this configuration, the counter electrode 13 is completely sealed by the sealing layer 16 and the second inorganic sealing layer 17, so that moisture is introduced from the interface between the sealing layer 16 and the second inorganic sealing layer 17. Or the like can be prevented from entering the counter electrode 13. Therefore, the sealing property of the gas barrier layer can be improved.

  Moreover, according to this structure, since both the sealing layer 16 and the 1st inorganic sealing layer 14 contain an inorganic material, the sealing layer 16 and the 1st inorganic sealing layer 14 adhere firmly. For this reason, it is possible to prevent moisture and the like from entering the counter electrode 13 and the pixel electrode 11 from the interface between the sealing layer 16 and the first inorganic sealing layer 14. Therefore, the sealing property of the gas barrier layer can be improved.

  Further, according to this configuration, unlike the configuration in which the sealing layer is formed on the outer peripheral portion of the second inorganic sealing layer, the sealing layer 16 includes the first inorganic sealing layer 14 and the second inorganic sealing layer. The structure is sandwiched between the layers 17. Therefore, the panel frame can be reduced.

  Further, according to this configuration, since the sealing layer 16 is made of a material containing at least one of polysilazane and polysiloxane, it is possible to prevent moisture and the like from entering the counter electrode 13 and the pixel electrode 11 from the sealing layer 16. can do. Therefore, the sealing property of the gas barrier layer can be improved.

  Further, according to this configuration, the first inorganic sealing layer 14 and the second inorganic sealing layer 17 are made of a material containing at least one of silicon oxide, silicon nitride, silicon oxynitride, and alumina. Therefore, it is possible to improve the sealing performance of the gas barrier layer.

  Further, according to this configuration, since the sealing layer 16 is formed by coating, the formed sealing layer 16 is thicker than a sealing layer formed by sputtering, CVD, or the like. Therefore, the sealing layer 16 can be formed with a sufficient thickness on a portion where the driver circuit or the like is drawn around the outer peripheral portion of the substrate 10 and has many irregularities. Thereby, the unevenness of the substrate 10 can be flattened by the sealing layer 16. Therefore, the coverage of the gas barrier layer can be improved.

  In the present embodiment, an organic EL device has been described as an example of an electro-optical device, but the present invention is not limited to this. For example, the present invention can be applied even when an inorganic electroluminescence device is used as the electro-optical device.

(Second Embodiment)
FIG. 2 is a cross-sectional view of a main part of the organic EL device 2 according to the second embodiment of the present invention.
As shown in FIG. 2, the organic EL device 2 of the present embodiment is different from the organic EL device 1 according to the first embodiment described above in that the sealing layer 26 is in contact with the substrate 10. Since the other points are the same as the above-described configuration, the same elements as those in FIG.

  In the organic EL device 1 of the first embodiment, the sealing layer 16 is in contact with the first inorganic sealing layer 14. On the other hand, in the organic EL device 2 of the present embodiment, the sealing layer 26 does not contact the first inorganic sealing layer 24 but directly contacts the substrate 10.

  In the organic EL device 2 of the present embodiment, the intermediate sealing layer 25 is formed so as to cover the entire portion of the first inorganic sealing layer 24 exposed on the substrate 10.

  According to the organic EL device 2 of the present embodiment, when the substrate 10 (surface portion of the substrate) contains an inorganic material, the sealing layer 26 and the substrate 10 are firmly adhered. For this reason, it is possible to prevent moisture and the like from entering the counter electrode 13 and the pixel electrode 11 from the interface between the sealing layer 26 and the substrate 10. In addition, since the sealing layer 16 is formed with a sufficient thickness on a portion where the driver circuit or the like is routed around the outer peripheral portion of the substrate 10 and has a lot of unevenness, the sealing layer 16 has unevenness on the substrate. Can be flattened, and the second inorganic sealing layer 17 in contact with the sealing layer 16 can be prevented from peeling or cracking. Therefore, the sealing property of the gas barrier layer can be improved.

(Third embodiment)
FIG. 3 is a schematic diagram of an organic EL device 3 according to the third embodiment of the present invention. 3A is a plan view, and FIG. 3B is a cross-sectional view of the main part.
As shown in FIG. 3, the organic EL device 3 of the present embodiment is different from the organic EL device 1 according to the first embodiment described above in that the color filter layer 30 is formed on the second inorganic sealing layer 17. Is different. Since the other points are the same as the above-described configuration, the same elements as those in FIG.

  In the organic EL device 3 of the present embodiment, the pixel unit 11 has sub-pixels arranged in a matrix. The organic functional layer provided in each subpixel is configured to emit white light. Each sub-pixel has red (R), green (G), and red (R), green (G), and color filters corresponding to R, G, and B (red color filter layer 30R, green color filter layer 30G, and blue color filter layer 30B). The light of each color of blue (B) is emitted.

  In the display area, sub-pixels of the same color are arranged in one direction, forming a so-called stripe arrangement. In the display area, full-color display is enabled by mixing the light emitted from the sub-pixels arranged in a matrix and converted into RGB colors by the color filter layer 30.

  Thus, in this embodiment, the organic EL device 3 can be reduced in size by forming the color filter layer 30 directly on the second inorganic sealing layer 17.

  Incidentally, in Patent Document 1, as shown in FIG. 5, the outer shell reinforcing layer 116 formed on the outer peripheral portion of the second inorganic sealing layer 117 is made of a resin, and therefore, in the photolithography process when forming the color filter layer. There was a possibility that abnormalities such as moisture absorption, swelling, and dissolution occurred in the outer shell reinforcing layer 116.

  In contrast, in the present embodiment, the sealing layer 16 includes at least an inorganic material, and the second inorganic sealing layer 17 is in contact with the sealing layer 16. Moreover, it is not the structure by which the outer shell reinforcement layer which consists of resin was formed in the 2nd inorganic sealing layer 17. FIG. For this reason, even if the color filter layer 30 is directly formed on the second inorganic sealing layer 17, the above-described abnormality does not occur. Therefore, it becomes easy to reduce the size of the organic EL device 3.

(Electronics)
Next, the electronic apparatus of the present invention will be described.
The electronic device has the above-described organic EL device as a display unit, and specifically, the one shown in FIG.
FIG. 4A is a perspective view showing an example of a mobile phone. 4A, the mobile phone 1000 includes a display unit 1001 using the organic EL device 3 described above.
FIG. 4B is a perspective view showing an example of a wristwatch type electronic device. In FIG. 4B, the timepiece 1100 includes a display unit 1101 using the organic EL device 3 described above.
FIG. 4C is a perspective view showing an example of a portable information processing apparatus such as a word processor or a personal computer. 4C, the information processing apparatus 1200 includes an input unit 1202 such as a keyboard, a display unit 1206 using the organic EL device 3 described above, and an information processing apparatus body (housing) 1204.

  As described above, each of the electronic devices shown in FIGS. 4A to 4C includes the display units 1001, 1101, and 1206 having the organic EL device 3 described above, so that high-quality image display is possible. Excellent reliability.

  In addition to the above, the electronic equipment includes an engineering workstation (EWS), a pager, a television, a viewfinder type or a monitor direct-view type video tape recorder, an electronic notebook, an electronic desk calculator, a car navigation device, a POS terminal, A touch panel, a head mounted display (HMD), etc. can be mentioned.

1, 2, 3 ... Organic EL device (electro-optical device), 10 ... substrate, 12 ... pixel electrode (first electrode), 13 ... counter electrode (second electrode), 14, 24 ... first inorganic sealing layer, DESCRIPTION OF SYMBOLS 15, 25 ... Organic intermediate layer, 16, 26 ... Sealing layer, 17 ... 2nd inorganic sealing layer, 30 ... Color filter layer, 1000 ... Cell-phone (electronic device), 1100 ... Clock (electronic device), 1200 ... Information processing equipment (electronic equipment)

Claims (12)

A substrate,
A first electrode formed on the substrate;
A second electrode formed to face the first electrode;
A first inorganic sealing layer formed to cover the second electrode;
An organic intermediate layer formed on the first inorganic sealing layer;
A sealing layer formed in contact with an end of the organic intermediate layer;
A second inorganic sealing layer formed on the organic intermediate layer,
The sealing layer contains an inorganic material, the second inorganic sealing layer is in contact with the organic intermediate layer, and an end of the second inorganic sealing layer is in contact with the sealing layer, An electro-optical device.   The electro-optical device according to claim 1, wherein the sealing layer is formed outside the organic intermediate layer.   The electro-optical device according to claim 1, wherein the sealing layer is formed so as to surround the organic intermediate layer.   The electric field according to any one of claims 1 to 3, wherein a region where the sealing layer and an end of the second inorganic sealing layer are in contact surrounds the organic intermediate layer. Optical device.   5. The electricity according to claim 1, wherein the sealing layer is formed on the first inorganic sealing layer in contact with the first inorganic sealing layer. 6. Optical device.   The said sealing layer is located between the edge part of the said 1st inorganic sealing layer, and the edge part of the said 2nd inorganic sealing layer, It is any one of Claims 1-5 characterized by the above-mentioned. Electro-optic device.   The electro-optical device according to claim 1, wherein the sealing layer is in contact with the substrate.   The electro-optical device according to claim 1, wherein a color filter layer is formed on the second inorganic sealing layer.   The electro-optical device according to claim 1, wherein the sealing layer is made of a material containing at least one of polysilazane and polysiloxane.   2. The first inorganic sealing layer and the second inorganic sealing layer are made of a material containing at least one of silicon oxide, silicon nitride, silicon oxynitride, and alumina. The electro-optical device according to any one of?   The electro-optical device according to claim 1, wherein the sealing layer is formed by coating.   An electronic apparatus comprising the electro-optical device according to claim 1.

Images