JP2013008985A - Peeling device and peeling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a peeling device and a peeling method for surely peeling a plate like member from a support member in a non-conventional manner.SOLUTION: A peeling device has a rotatable suction roller 2 (holding roller) having an arc-shaped outer peripheral surface, and the suction roller 2 attracts and holds a non adhesive surface of a dicing tape T2 (adhesion sheet) with the outer peripheral surface. Then, the suction roller 2 rotates in a predetermined direction and thereby placing an adhesive surface T2-1 of the dicing tape T2 in contact with a wafer W (plate like member) and peeling the wafer W from a glass plate G (support member) with its adhesive force.

Description

  The present invention relates to a peeling apparatus and a peeling method for peeling a plate-like member attached to a support member.

  Conventionally, as this type of peeling apparatus, for example, a structure of Patent Document 1 is known. The peeling apparatus of the literature 1 peels off a plate-like member attached to a support member, specifically, a polarizing plate (P) attached to a separate film (SF). In the suction stage (21), the separation film (SF) is adhered and peeled off with an adhesive roller (22) (see the description of FIG. 3 and paragraph 0018 of the same document 1). In addition, the code | symbol in the said parenthesis is a code | symbol used by patent document 1. FIG. The same applies to the following.

  However, in the peeling apparatus as described above, when the separate film (SF) is bonded and peeled by the adhesive roller (22) a plurality of times, the adhesive force of the adhesive roller (22) is reduced, and the separate film (SF) is removed. Inconvenience that it becomes impossible to peel off.

Japanese Patent No. 3053244

  The objective of this invention is providing the peeling apparatus and peeling method which can peel a plate-shaped member from a supporting member reliably. Another object of the present invention is to provide a peeling apparatus and a peeling method for peeling a plate-like member from a support member in an unprecedented manner.

In order to achieve the above object, the peeling device of the present invention is a peeling device that peels a plate-like member attached to a support member, and the peeling device has a rotatable holding having an arcuate outer peripheral surface. A holding roller that holds the non-adhesive surface of the adhesive sheet on the outer peripheral surface by suction, and causes the adhesive surface of the adhesive sheet to contact the plate-like member by rotating in a predetermined direction. The plate member is peeled off from the support member by the adhesive force.
Moreover, you may provide the adhesive sheet delivery apparatus which supplies the said adhesive sheet to the said holding roller.
Furthermore, the peeling method of the present invention is a peeling method for peeling a plate-like member affixed to a support member, and the peeling method uses a rotatable holding roller having an arcuate outer peripheral surface and holds the holding member. The non-adhesive surface of the adhesive sheet is sucked and held by the outer peripheral surface of the roller, and the adhesive surface of the adhesive sheet is brought into contact with the plate-like member by the rotation of the holding roller in a predetermined direction. The plate-like member is peeled off from the support member.

  In the peeling apparatus and the peeling method of the present invention, it is possible to provide a hook forming means for forming a hook of peeling before peeling the plate-like member.

  In the peeling apparatus and the peeling method of the present invention, the holding roller sucks the non-adhesive surface of the adhesive sheet at its outer peripheral surface, and the adhesive surface of the adhesive sheet is platen by rotating in a predetermined direction. Since the plate-like member is peeled off from the supporting member by the adhesive force, the adhesive force of the pressure-sensitive adhesive roller is reduced and the adhesive sheet cannot be peeled off. In addition, it is possible to provide a peeling apparatus and a peeling method for peeling a plate-like member from a support member in an unconventional manner.

The top view of the transfer apparatus to which the peeling apparatus and peeling method of this invention are applied. FIG. 2 is a right side view of the vicinity of a suction roller provided in the transfer device of FIG. 1. FIG. 3 is an explanatory diagram of correction of a deviation amount in the X-axis direction in the transfer device of FIG. 1. FIG. 3 is an explanatory diagram of correction of a center deviation angle in the transfer device of FIG. FIG. 2 is an operation explanatory diagram of the transfer device of FIG. 1. FIG. 2 is an operation explanatory diagram of the transfer device of FIG. 1. FIG. 2 is an operation explanatory diagram of the transfer device of FIG. 1. FIG. 2 is an operation explanatory diagram of the transfer device of FIG. 1. FIG. 2 is an explanatory diagram of a suction roller employed in the transfer device of FIG. 1. Explanatory drawing of the other transfer apparatus to which the peeling apparatus and peeling method of this invention are applied. Explanatory drawing of the suction roller employ | adopted with the transfer apparatus of FIG. The block diagram of a control apparatus. Explanatory drawing of the other transfer apparatus to which the peeling apparatus and peeling method of this invention are applied.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a plan view of a transfer apparatus to which the peeling apparatus and the peeling method of the present invention are applied, and FIG. 2 is a right side view of the vicinity of a holding roller provided in the transfer apparatus of FIG.

  The transfer apparatus 1 in FIG. 1 peels off a semiconductor wafer (plate member) W (hereinafter simply referred to as “wafer W”) attached to a glass plate G (first support member) as shown in FIG. The transfer device is attached to the ring frame (second support member) F.

  The transfer device 1 includes a suction roller 2 as a holding roller. The suction roller 2 is rotatably supported so that its axis is parallel to the X axis. The suction roller 2 has a structure in which a large number of minute suction ports (not shown) are opened on the outer peripheral surface of the roller, and sucks and holds the dicing tape T2 (adhesive sheet) with the suction force. At this time, the non-adhesive surface of the dicing tape T2 is attached to the outer peripheral surface of the suction roller 2, and the adhesive surface T2-1 of the dicing tape T2 is configured to hold the wafer W while being exposed to the front.

  The suction roller 2 is rotationally driven by a suction roller driving servomotor 7 via a pulley 5 and a belt 6. Such suction roller drive systems 5, 6, 7 and the suction roller 2 are separated from the position where the dicing tape T2 is sucked and held by the lifting means X1 via the frame F1 as shown in FIG. It is configured to be movable up and down in the Z-axis direction depending on the position to be pasted. Specifically, as shown in FIG. 9, the suction roller 2 has a large number of suction ports in an area 2A that is slightly smaller than the outer diameter of the dicing tape T2 in the entire outer peripheral surface of the suction roller 2. The dicing tape T2 is sucked and sucked in the area 2A.

  A conveyance table (conveying means) 8 is provided below the suction roller 2. The transport table 8 has a two-stage stacked structure of a Y-axis table 801 and an X-axis table 802, and moves in the Y-axis direction, that is, the outer peripheral tangential direction of the suction roller 2, and in the X-axis direction, that is, the suction roller 2 It is configured to be movable in a direction orthogonal to the outer circumferential tangent direction. The transfer table 8 can move forward and backward between the standby position S1 in front of the suction roller 2 and the work area S2 behind the suction roller 2 by moving in the Y-axis direction. The movement of the transfer table 8 in the Y-axis direction is performed via a Y-axis rail 803, a Y-axis slider 804, and a Y-axis direction single-axis robot (not shown), and the movement of the transfer table 8 in the X-axis direction is X. This is performed via the axis rail 805, the X axis slider 806, and the X axis direction single axis robot 807.

  An articulated robot 9 is provided in front of the standby position S1 of the transfer table 8. The articulated robot 9 has an arm portion ahead of the most advanced joint, which is composed of a wafer adsorbing arm 901 and a ring frame adsorbing arm 902. The work contents of the articulated robot 9 are as follows. .

(1) A wafer W attached to a glass plate G from a wafer cassette 11 on an elevating table 10 movable in the Z-axis direction by means of a wafer suction arm 901 via a UV curable double-sided adhesive tape (not shown). (Hereinafter referred to as “wafer W with glass plate G”) is taken out and set on the alignment table 120 of the alignment apparatus 12.
(2) The wafer W with the glass plate G after completion of alignment is taken out of the alignment device 12 by the wafer suction arm 901 and set on the transfer table 130 of the ultraviolet irradiation device 13.
(3) The wafer W with the glass plate G after the ultraviolet irradiation is taken out from the ultraviolet irradiation device 13 by the wafer adsorption arm 901 and set on the transfer table 8.
(4) The wafer W mounted on the ring frame F is transferred and loaded into the wafer cassette 15 on the lifting table 14 by the ring frame suction arm 902.

  In the alignment apparatus 12, when the wafer W with the glass plate G is set on the alignment table 120, the orientation flat or V notch of the wafer W is detected by the camera 121, and the wafer W with the glass plate G is brought into an appropriate posture. Correct and detect the center position.

  In the ultraviolet irradiation device 13, the wafer W with the glass plate G is set on the transfer table 130 in the same device, and passes through the lower part of the ultraviolet lamp 131, so that the glass plate G is transmitted through the glass plate G. Ultraviolet light is irradiated to the double-sided adhesive tape between W and the adhesive strength of the double-sided adhesive tape is reduced.

  The transfer device 1 is provided with a cutter blade 16. The cutter blade 16 is provided as a means for forming a peeling stake when the wafer W is peeled off from the glass plate G, and is moved up and down in a form that is suspended from above so as not to interfere with the moving transfer table 8. It is installed as possible.

  A dicing tape feeding device 17 as an adhesive sheet feeding device is provided on the rear oblique upper part of the suction roller 2. The dicing tape feeding device 17 causes the dicing tape original fabric T, which is wound from the dicing tape original fabric roll R in the direction of the peel plate 171, to run in the peel plate direction by rotating the drive roller 170. The dicing tape T2 is peeled from the release sheet T1 and supplied to the suction roller 2 by acute bending at the plate 171. The release sheet T1 that has been peeled off the dicing tape is wound into a roll and collected. The dicing tape T2 is formed to have a larger diameter than the wafer W, and is temporarily attached to the release sheet T1 via an adhesive layer (not shown).

  In the work area S2 behind the suction roller 2, the setting work of the ring frame F to the transport table 8 and the work of removing the glass plate G from the transport table 8 are performed simultaneously in parallel. As means for performing these operations, a transfer robot 18 having a ring frame suction pad 180 and a glass plate suction pad 181 is provided in the work area S2. The transfer robot 18 is a single-axis robot having an X-axis slider 182 that can move in the X-axis direction. The transfer robot 18 includes upper and lower cylinders 183 and 184 on the left and right sides of the X-axis slider 182. 1 is a means for moving the ring frame suction pad 180 up and down in the Z-axis direction, and the right up-and-down cylinder 184 in FIG. 1 moves the glass plate suction pad 181 up and down in the Z-axis direction. It is a means to move. The work content of the transfer robot 18 having the above structure is as follows.

(1) The ring frame F is taken out from the ring frame stocker 19 by the ring frame suction pad 180 and set on the transport table 8.
(2) The wafer-separated glass plate G on the transfer table 8 is moved to the glass stocker table 20 by the glass plate suction pad 181.

  A pair of ON / OFF sensors 21 and 22 are provided at positions facing the outer peripheral surface of the suction roller 2 with a predetermined interval. As shown in FIG. 3, the pair of ON / OFF sensors 21 and 22 are arranged in parallel at equal intervals on the left and right sides at an arrangement interval D shorter than the diameter of the wafer W with reference to the center line C1 of the wafer W on the transfer table 8. Is arranged. The both ON / OFF sensors 21 and 22 monitor the outer peripheral surface of the suction roller 2 from the work area S2 side (see FIG. 2), and enter and monitor the monitoring point of the wafer W held on the suction roller 2. An ON or OFF signal is output according to the point passing. Specifically, an ON signal is output when the wafer W held by the suction roller 2 enters the monitoring point, and an OFF signal is output when the wafer W passes through the monitoring point. Further, output signals (ON signal, OFF signal) from the ON / OFF sensors 21 and 22 are input to the control device 23 shown in FIG.

  The control device 23 is a device (peeling and sticking control device) for controlling a series of operations from wafer peeling to sticking. The controller 23 outputs a rotation command signal to the suction roller driving servo motor 7 or the transfer table 8. In addition to having a function of outputting a command signal to various components of the transfer apparatus, such as outputting a movement command signal to the transfer device, a pulse count function, a chord length calculation function, a deviation amount calculation function, a correction as shown in FIG. It has a function (correction means).

  The pulse count function of the control device 23 is a function of counting the rotation pulses of the servo motor 7 for driving the suction roller until the output signal of each sensor changes from the ON signal to the OFF signal for each pair of sensors 21 and 22. .

  The chord length calculation function of the control device 23 obtains the rotation angle of the suction roller 2 corresponding to the count value of the rotation pulse, and is held by the suction roller 2 as shown in FIG. 3 based on the rotation angle. This is a function for calculating the chord lengths a and b of the wafer W. 3 is a string length calculated based on the output signal from the sensor 21 on the left side of the figure, and b in FIG. 3 is a string calculated based on the output signal from the sensor 22 on the right side of the figure. Is the length of

  The deviation amount calculation function of the control device 23 calculates the length of A and B in FIG. 3 based on the following formulas (1) and (2), and half of the difference between A and B by the formula (3). Is stored as the amount of deviation C in the X-axis direction of the center line C2 of the wafer W. In the following formulas (1) and (2), r is the radius of the wafer W, and if the radius of the wafer W changes, the value of r in the formula is changed accordingly.

A = (r ² − (a / 2) ² ) ^1/2 (1)
B = (r ² − (b / 2) ² ) ^1/2 (2)
C = (A−B) / 2 (3)
Further, the X-axis direction deviation amount C of the wafer W can also be calculated by the following equation (4) using the arrangement interval D of the ON / OFF sensors 21 and 22.
C = D-A or C = D-B (4)

  Further, as shown in FIG. 4, the deviation amount calculation function of the control device 23 indicates how much the center position of the wafer W is from the sticking center in the arc direction of the suction roller 2 from the calculation formula of a / 2 or b / 2. It also includes a function of specifying and storing whether there is a deviation (hereinafter referred to as “center deviation angle θ”). Here, the sticking center is a reference position when the peeled wafer W is stuck to the ring frame F, and means a predetermined position where the sticking center is attached so as to coincide with the center of the ring frame F. In the present embodiment, since the position parallel to the Y axis passing through the center of the suction roller 2 is set as the pasting center, the center of the wafer W calculated by a / 2 or b / 2 is determined from the Y axis to the suction roller 2. The amount of deviation in the arc direction is the angle θ of the center deviation. It is assumed that the center deviation angle θ is stored after being converted into the number of rotation pulses of the servo motor 7 for driving the suction roller.

  The correction function of the control device 23 is roughly divided into a function for correcting the X-axis direction deviation amount and a function for correcting the center deviation angle. These correction functions are as follows.

  The X-axis direction deviation correction function calculates the X-axis direction deviation amount C because the X-axis direction deviation amount is transferred when the X-axis direction deviation occurs when the wafer W is peeled from the glass plate G. Then, the X-axis direction single-axis robot 807 is instructed to move by that amount, and the transfer table 8 is moved, corrected and pasted. If the wafer W is attached to the ring frame F via the dicing tape T2 with a deviation in the X-axis direction, a dicing operation for the wafer W performed later will be hindered. Such a problem does not occur because the amount of direction deviation is corrected.

  As described above, the center deviation angle correction function is such that when the wafer W is peeled from the glass plate G, the center of the wafer W is displaced from a predetermined position of the suction roller 2 (a position parallel to the Y axis in this embodiment). If it occurs, the center deviation angle θ is calculated and corrected in order to transfer without the deviation. That is, the shift amount of the wafer W in the Y-axis direction after being attached to the ring frame F is corrected. In this correction, the sticking start position on the ring frame F is moved back and forth in consideration of the center deviation angle θ. Further, before the suction roller 2 enters the pasting operation, the center deviation angle θ may be advanced or retracted so that the center of the wafer W is parallel to the Y axis, and then pasted on the ring frame F. . If the wafer W is pasted while ignoring the center deviation angle θ, the center position between the ring frame F and the wafer W will be displaced in the Y-axis direction, which will hinder subsequent wafer W dicing. In this embodiment, since the correction in the Y-axis direction is performed before being attached to the ring frame F, such a problem does not occur.

  Next, the operation of the transfer apparatus of FIG. 1 configured as described above will be described with reference to FIGS.

<Alignment of wafer with glass plate>
In the transfer apparatus 1 of FIG. 1, first, a wafer W with a glass plate G is taken out from the wafer cassette 11 shown in FIG. 1 and transferred into the alignment apparatus 12, and the wafer W is aligned in the apparatus 12.

<UV irradiation>
When the alignment is completed, the wafer W with the glass plate G is transferred into the ultraviolet irradiation device 13, and the ultraviolet curable double-sided adhesive tape between the glass plate G and the wafer W is irradiated with ultraviolet rays in the device 13. . As a result, the adhesive strength of the double-sided adhesive tape is reduced, and the wafer W can be easily peeled off.

<Peel formation for peeling>
In addition, as part of the preparation for peeling off the wafer W, an operation for forming a peeling cut is also performed. That is, when the ultraviolet irradiation is completed, the wafer W with the glass plate G is sucked and set on the transfer table 8 at the standby position S1. In this state, the cutter blade 16 enters the gap between the wafer W and the UV curable double-sided adhesive tape from the outer peripheral surface side of the wafer W with the glass plate G by a moving mechanism (not shown) to form a notch for peeling. (For details, see Japanese Patent Application No. 2004-237332).

<Dicing tape set>
Further, as part of the preparation for removing the wafer W, an operation of setting the dicing tape T2 on the suction roller 2 is also performed. That is, as shown in FIG. 2, the suction roller 2 rotates at a predetermined rotation angle in the direction of the arrow a in the position where the dicing tape T2 is sucked and held, and the suction roller 2 is fed from the dicing tape feeding device 17 in synchronism with this rotation. One dicing tape T2 is fed out to the outer peripheral surface of the sheet. At this time, the dicing tape T2 is sucked and held on the outer peripheral surface by the suction force of the suction roller. Note that the non-adhesive surface of the dicing tape T2 contacts the outer peripheral surface of the suction roller 2, and the adhesive surface T2-1 of the dicing tape T2 is exposed to the front.

<Wafer peeling>
When the above preparation for peeling is completed, an operation of peeling the wafer W from the wafer W with the glass plate G is performed. That is, as shown in FIG. 5, the transfer table 8 at the standby position S <b> 1 transfers the wafer W with the glass plate G in the direction of the suction roller 2. A sensor (not shown) detects that the transport table 8 has reached a predetermined position, and the suction roller 2 is lowered by the lifting means X1, and the suction roller 2 is indicated by an arrow a in FIG. The wafer W is gradually peeled and held by the adhesive surface T2-1 of the dicing tape T2. That is, here, when the adhesive surface T2-1 of the dicing tape T2 contacts the wafer W, the wafer W is held by the adhesive force. When the peeling is completed, the rotation of the suction roller 2 stops at a position rotated by a predetermined angle, and the suction roller 2 is raised by the lifting means X1 and stands by. FIG. 6 shows the state at this time.

<Ring frame set>
When the separation of the wafer W is completed as described above, preparations for attaching the wafer W to the ring frame F are started. That is, as shown in FIG. 7, the transfer table 8 further advances to the work area S <b> 2, and the transfer robot 18 simultaneously removes the glass plate G from the transfer table 8 and sets the ring frame F.

<Wafer alignment>
Further, as part of preparation for attaching the wafer W, alignment is performed on the wafer W held on the suction roller 2. As described above, this alignment specifies the amount of deviation of the wafer W in the X-axis direction and the center deviation angle θ of the wafer W.

<Attaching a wafer>
When the above alignment is completed, thereafter, an operation of attaching the wafer W to the ring frame F through the dicing tape T2 is performed. That is, as shown in FIG. 8, the transport table 8 in the work area S2 transports the ring frame F in the direction opposite to that at the time of peeling. In synchronization with this transport operation, the suction roller 2 rotates in the direction opposite to that during the peeling (the direction indicated by arrow C in the figure). By these operations, the wafer W held on the suction roller 2 is attached to the ring frame F via the dicing tape T2. At the time of this bonding, the amount of deviation of the wafer W in the X-axis direction specified by the wafer alignment and the center deviation angle θ of the wafer W are corrected. That is, the amount of deviation in the X-axis direction is corrected by the X-axis direction single-axis robot 807, and the amount of deviation in the Y-axis direction is corrected by moving the sticking start position due to the lowering of the elevating means X1 back and forth. As a result, the wafer W is accurately attached in the ring frame F. This sticking operation proceeds according to the rotation angle of the suction roller 2, the wafer W is attached to the ring frame F and mounted, and at a position advanced by a predetermined angle, the rotation of the suction roller 2 is stopped and the lifting means X1 is raised. And return to the initial position. Thereafter, the above-described dicing tape setting operation is performed for the next transfer.

  The wafer W mounted on the ring frame F is accommodated in the wafer cassette 15 together with the ring frame F. Thus, a series of transfer operations from peeling to sticking for one wafer W is completed.

  FIG. 10 is an explanatory diagram of another transfer apparatus to which the peeling apparatus and the peeling method of the present invention are applied. The transfer device 1 shown in the figure peels off an adhesive label (plate-like member) L attached to a release sheet (first support member) K and attaches it to a label application object (second support member) M. Device. Since the basic configuration of this apparatus is the same as that of the transfer apparatus of FIG. 1, the same members are denoted by the same reference numerals, and detailed description thereof is omitted. The transfer device of FIG. 10 differs from the transfer device of FIG. 1 in the following points.

  That is, in the transfer apparatus of FIG. 10, the adhesive label L is peeled from the adhesive label L with the release sheet K and held by the suction roller 2 outer peripheral surface itself. The pressure-sensitive adhesive label L with the release sheet K is temporarily attached to the release sheet K via its pressure-sensitive adhesive layer (not shown).

  In the transfer apparatus of FIG. 10, the operation of peeling the adhesive label L from the adhesive label L with the release sheet K as described above and the operation of attaching the peeled adhesive label L to the label sticking object M are shown in FIG. Although it is basically the same as that of the transfer device, these operations will be briefly described below.

  In the peeling operation, the transport table 8 transports the adhesive label L with the release sheet K, the suction roller descends at a predetermined position, and the suction roller 2 rotates around its axis in synchronization with the transport of the transport table 8. The label L is peeled and held by stopping at a position rotated by a predetermined angle.

  In the pasting operation, the transport table 8 transports the label sticking object M in the direction opposite to that at the time of peeling, the suction roller descends at a predetermined position, and the suction roller 2 is synchronized with the transport of the transport table 8. The adhesive label L held by the suction roller 2 is attached to the label application object M by rotating in the direction opposite to that at the time of peeling around the axis.

  FIG. 11 is an explanatory view of the suction roller employed in the transfer device of FIG. 10, and this suction roller 2 has a large number of suction openings in an area 2A that is slightly smaller than the outer shape of the adhesive label L in the entire outer peripheral surface of the suction roller 2. Is opened, and the adhesive label L is sucked and adsorbed by the area 2A. Further, in the suction roller 2 of FIG. 11, the suction area L2A-1 in the area area 2A is made a suction system independent of other parts, so that a sufficient suction force can be obtained at the start of peeling of the adhesive label L. Adopts a configuration capable of acting on the adhesive label L.

  1 employs a configuration in which the ring frame F to which the dicing tape T2 is not attached is conveyed by the conveyance table 8, instead of this, the dicing tape T2 is adhered in advance as shown in FIG. A configuration in which the transport table 8 transports the ring frame F that is present can also be employed. In this case, before the transfer robot 18 sets the ring frame F on the transfer table 8, the dicing tape T2 is applied to the ring frame F by the dicing tape applying device, and the adhesive surface T2-1 is the upper surface. The ring frame F is set on the transfer table 8, and the wafer W is held by the suction roller 2 on the outer peripheral surface itself of the suction roller 2 as shown in FIG. 13, like the adhesive label L shown in FIG. What is necessary is just to comprise so that the wafer W may be hold | maintained directly. The wafer W held in this manner is operated in a manner similar to that of the transfer apparatus of FIG. 1, that is, the suction roller 2 rotates around its axis in synchronization with the operation of the transfer table 8 transferring the ring frame F with the dicing tape T2. The wafer W being held is attached to the ring frame F via the dicing tape T2.

1 Transfer device 2 Suction roller (holding roller)
8 Transport table (transport means)
16 Cutter blade F Ring frame (second support member)
G Glass plate (first support member)
K release sheet (first support member)
L Adhesive label (plate member)
M Label application target (second support member)
T2 dicing tape (adhesive sheet)
T2-1 Adhesive surface W of dicing tape Wafer (plate member)

Claims (3)

A peeling device for peeling a plate-like member attached to a support member,
The peeling device is
A rotatable holding roller having an arcuate outer peripheral surface;
The holding roller sucks and holds the non-adhesive surface of the adhesive sheet on the outer peripheral surface, and abuts the adhesive surface of the adhesive sheet on the plate-like member by rotating in a predetermined direction. The peeling apparatus characterized by peeling the said plate-shaped member from the said supporting member.   The peeling apparatus according to claim 1, further comprising an adhesive sheet feeding device that supplies the adhesive sheet to the holding roller. A peeling method for peeling a plate-like member affixed to a support member,
The peeling method includes:
Using a rotatable holding roller having an arcuate outer peripheral surface,
Adsorb and hold the non-adhesive surface of the adhesive sheet on the outer peripheral surface of the holding roller;
Peeling, wherein the holding roller rotates in a predetermined direction to bring the adhesive surface of the adhesive sheet into contact with the plate-like member, and the plate-like member is peeled off from the support member by the adhesive force. Method.

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