JP2012530838A5

JP2012530838A5 -

Info

Publication number: JP2012530838A5
Application number: JP2012516864A
Authority: JP
Filing date: 2010-06-25
Publication date: 2015-02-26
Anticipated expiration: 2030-06-25

Description

したがって、好ましくは、プリプレグは、第１の外層と第１の外層に隣接する構造層の領域内とにある粒子材料を含む。一般的に、２〜７０重量％、好ましくは５〜４０重量％が構造層にあり、残りが第１の外層にある。 Thus, preferably, the prepreg comprises particulate material in the first outer layer and in the region of the structural layer adjacent to the first outer layer. Generally, 2 to 70 wt%, preferably in the structural layer is 5 to 40 wt%, in the remaining Riga first outer layer.

図６に、本発明による例１による他の硬化積層物のインターリーフ層の拡大画像を示す。図５の場合と同様に、直線の上のＹ方向の繊維層と直線の下のＸ方向のインターリーフ層との区別は、対応する未硬化プリプレグに存在する境界が明瞭な接触面の位置を参照することによって行われる。この場合、強化粒子２６は、一方向繊維２０の直径と同じ粒径を有することを確認することができる。インターリーフ層は、強化粒子２６と一方向繊維２０の両方の分散体を含んでいる。
本発明の諸態様は、以下のとおり要約される。
［１］．
隙間に熱硬化性樹脂を含む充填一方向導電性繊維の構造層と、熱硬化性樹脂を含み、一方向導電性繊維を本質的に含まない樹脂の第１の外層とを含むプリプレグであって、高温下で硬化させるとき、充填一方向導電性繊維の硬化構造層及び内部に分散した一方向導電性繊維を含む硬化樹脂の第１の外層を含む硬化複合材料を生ずる、上記プリプレグ。
［２］．
第１の外層中の導電性一方向繊維が、プリプレグにおける充填一方向導電性繊維の構造層の集団からのものである、上記１項に記載のプリプレグ。
［３］．
第１の外層内、及び第１の外層に隣接する構造層の領域内に位置する粒子材料を含む、上記１項又は２項に記載のプリプレグ。
［４］．
プリプレグにおける粒子材料の平均粒径と充填一方向繊維の平均直径との比が４：１〜１：４、好ましくは３：１〜１：３、より好ましくは２：１〜１：２、最も好ましくは１．５：１〜１：１．５である、上記３項に記載のプリプレグ。
［５］．
粒子材料が０．６を超える球形度を有する、上記３項又は４項に記載のプリプレグ。
［６］．
粒子材料が総樹脂含量に対して３〜４０重量％のレベルで一般的に存在する、上記３から５項までのいずれか一項に記載のプリプレグ。
［７］．
第１の外層により形成されないプリプレグの面を形成している、一方向導電性繊維を本質的に含まない樹脂の第２の外層を含む、上記１から６項までのいずれか一項に記載のプリプレグ。
［８］．
プリプレグにおける充填繊維の厚さと、第１の外層及び存在する場合第２の外層の厚さとの比が１０：１〜３：１である、上記１から７項までのいずれか一項に記載のプリプレグ。
［９］．
構造層における樹脂が第１の外層における樹脂と同じ組成である、上記１から８項までのいずれか一項に記載のプリプレグ。
［１０］．
内部に分散した一方向導電性繊維を含む硬化樹脂のインターリーフ層によって分離されている一方向導電性繊維の複数の層を含む、上記１から９項までのいずれか一項に記載の複数のプリプレグを含む積層物を高温下で硬化させることにより得られる、硬化複合積層物。
［１１］．
少なくとも７０重量％がインターリーフ層に存在する粒子材料を含む、上記１０項に記載の硬化複合物。
［１２］．
インターリーフ層が、１〜５０容積％の導電性一方向繊維、好ましくは１〜４０容積％、より好ましくは５〜３０％、最も好ましくは１０〜２０％を含む、上記１０項又は１１項に記載の硬化複合物。
［１３］．
一方向導電性繊維の層を連続的に供給すること、繊維の第１の面と熱硬化性樹脂を含む樹脂の第１の層とを接触させること、及び樹脂と繊維を一緒に圧縮することを含み、且つ、樹脂が繊維の隙間に入り、一方向導電性繊維を本質的に含まない樹脂の第１の外層から出るように、樹脂が十分な量で存在する、上記１から９項までのいずれか一項に記載のプリプレグの製造の方法。
［１４］．
熱硬化性樹脂を含む樹脂の第２の層を、一般的に第１の層と同時に、繊維の第２の面と接触させ、樹脂が繊維の隙間に入るように樹脂の第１及び第２の層を繊維と一緒に圧縮する、上記１３項に記載の方法。
［１５］．
粒子材料を第１の樹脂層及び存在する場合第２の樹脂層内に分散させ、圧縮により、樹脂が隙間に強制的に入り、そして、粒子材料が繊維の構造に押し込まれて、繊維の外側部分にそれら自体を埋め込んでいるいくつかの粒子によりその構造を崩壊させるような粒子材料の部分的なろ過が起こる、上記１３項又は１４項に記載の方法。
［１６］．
導電性繊維の層が所定の幅を有し、１つ又は複数の含浸ロール上に通すことにより樹脂及び繊維を圧縮し、導電性繊維及び樹脂にかける圧力が導電性繊維の幅１センチメートル当たり４０ｋｇを超えない、上記１３から１５項までのいずれか一項に記載の方法。 FIG. 6 shows an enlarged image of the interleaf layer of another cured laminate according to Example 1 according to the invention. As in the case of FIG. 5, the distinction between the Y-direction fiber layer above the straight line and the X-direction interleaf layer below the straight line is based on the position of the contact surface having a clear boundary existing in the corresponding uncured prepreg. This is done by reference. In this case, it can be confirmed that the reinforcing particles 26 have the same particle size as the diameter of the unidirectional fiber 20. The interleaf layer includes a dispersion of both reinforcing particles 26 and unidirectional fibers 20.
Aspects of the invention are summarized as follows.
[1].
A prepreg comprising a structure layer of filled unidirectional conductive fibers containing a thermosetting resin in a gap and a first outer layer of resin containing a thermosetting resin and essentially free of unidirectional conductive fibers, The prepreg, when cured at high temperature, produces a cured composite material comprising a cured structural layer of filled unidirectional conductive fibers and a first outer layer of cured resin comprising unidirectional conductive fibers dispersed therein.
[2].
The prepreg of claim 1 wherein the conductive unidirectional fibers in the first outer layer are from a group of structural layers of filled unidirectional conductive fibers in the prepreg.
[3].
3. A prepreg according to claim 1 or 2 comprising particulate material located in the first outer layer and in the region of the structural layer adjacent to the first outer layer.
[4].
The ratio of the average particle diameter of the particulate material in the prepreg to the average diameter of the filled unidirectional fibers is 4: 1 to 1: 4, preferably 3: 1 to 1: 3, more preferably 2: 1 to 1: 2. The prepreg according to the above item 3, which is preferably 1.5: 1 to 1: 1.5.
[5].
5. The prepreg as described in 3 or 4 above, wherein the particulate material has a sphericity exceeding 0.6.
[6].
6. A prepreg according to any one of claims 3 to 5 wherein the particulate material is generally present at a level of 3 to 40% by weight relative to the total resin content.
[7].
7. The method according to any one of the above items 1 to 6, comprising a second outer layer of resin essentially free of unidirectional conductive fibers, forming a prepreg surface not formed by the first outer layer. Prepreg.
[8].
The ratio of the thickness of the filling fiber in the prepreg and the thickness of the first outer layer and, if present, the second outer layer is 10: 1 to 3: 1, according to any one of 1 to 7 above. Prepreg.
[9].
The prepreg according to any one of 1 to 8 above, wherein the resin in the structural layer has the same composition as the resin in the first outer layer.
[10].
10. The plurality of any one of 1 to 9 above, comprising a plurality of layers of unidirectional conductive fibers separated by an interleaf layer of cured resin comprising unidirectional conductive fibers dispersed therein. A cured composite laminate obtained by curing a laminate containing a prepreg at a high temperature.
[11].
11. A cured composite according to claim 10 comprising at least 70% by weight of particulate material present in the interleaf layer.
[12].
In paragraph 10 or 11, wherein the interleaf layer comprises 1 to 50 volume% conductive unidirectional fibers, preferably 1 to 40 volume%, more preferably 5 to 30%, most preferably 10 to 20%. The cured composite as described.
[13].
Continuously supplying a layer of unidirectional conductive fiber, contacting the first side of the fiber with a first layer of resin comprising a thermosetting resin, and compressing the resin and fiber together 1 to 9, wherein the resin is present in a sufficient amount such that the resin enters the fiber gap and exits from the first outer layer of resin essentially free of unidirectional conductive fibers. The method for producing a prepreg according to any one of the above.
[14].
A second layer of resin comprising a thermosetting resin is generally brought into contact with the second surface of the fiber simultaneously with the first layer so that the resin enters the gap between the fibers. 14. The method of claim 13, wherein the layer is compressed together with the fibers.
[15].
The particulate material is dispersed within the first resin layer and the second resin layer, if present, and the compression forces the resin into the gaps, and the particulate material is pushed into the fiber structure, causing the outside of the fiber 15. A method according to paragraph 13 or 14, wherein partial filtration of the particulate material occurs such that some particles embedded in the portion cause their structure to collapse.
[16].
The conductive fiber layer has a predetermined width, compresses the resin and fiber by passing over one or more impregnating rolls, and the pressure applied to the conductive fiber and resin per centimeter of conductive fiber width 16. The method according to any one of items 13 to 15, which does not exceed 40 kg.

Claims

A prepreg comprising a structural layer comprising filled unidirectional conductive fibers and a thermosetting resin,
The prepreg further includes a first outer layer of a resin including a thermosetting resin,
A first outer layer of this resin is located adjacent to the first surface of the structural layer and is essentially free of unidirectional conductive fibers;
The structural layer includes a first outer region located adjacent to the first outer layer of resin, the first outer region including a first portion of filled unidirectional conductive fibers;
The unidirectional conductive fibers in the first portion have collapsed to form gaps located between the fibers,
The prepreg includes a first particulate material, and the first particulate material is located in the gap in the first portion of the filling unidirectional conductive fiber of the structural layer and the first outer layer of the resin, and in the gap The amount of the first particulate material is 5-40% by weight of the total amount of the first particulate material;
When the prepreg is cured, a cured composite material is produced, wherein the first portion of the collapsed unidirectional conductive fibers moves to the first outer layer of resin,
Prepreg .

The ratio of the average particle size of the particulate material in the prepreg to the average diameter of the filled unidirectional fibers is 1 . The prepreg according to claim 1 , which is 5: 1 to 1: 1.5.

The prepreg according to claim 1 or claim 2 , wherein the particulate material has a sphericity of greater than 0.6.

The prepreg according to any one of claims 1 to 3 , wherein the particulate material is generally present at a level of 3 to 40% by weight relative to the total resin content.

The prepreg includes a second outer layer of resin located adjacent to the second surface of the structural layer opposite the first outer layer of resin, the second outer layer of resin being also unidirectionally conductive Essentially free of fiber,
The structural layer further includes a second outer region located adjacent to the second outer layer of resin, the second outer region including a second portion of filled unidirectional conductive fibers;
The unidirectional conductive fibers in the second part have collapsed to form gaps located between the fibers,
The prepreg includes a second particulate material, the second particulate material is located in the gap in the second portion of the filled unidirectional conductive fibers of the structural layer and the second outer layer of the resin, in the gap The amount of the second particulate material is 5-40% by weight of the total amount of the second particulate material;
When the prepreg is cured, a cured composite material is produced, in which case the second portion of the collapsed unidirectional conductive fiber moves to the second outer layer of resin,
Prepreg .

6. The ratio according to claim 1, wherein the ratio of the thickness of the filling fibers in the prepreg to the thickness of the first outer layer and the second outer layer, if present, is 10: 1 to 3: 1. Prepreg.

The prepreg according to any one of claims 1 to 4 , wherein the resin in the structural layer has the same composition as the resin in the first outer layer.

5. A plurality of layers according to claim 1 , comprising a plurality of layers of unidirectional conductive fibers separated by an interleaf layer of curable resin comprising unidirectional conductive fibers dispersed therein. A cured composite laminate obtained by curing a laminate containing a prepreg at a high temperature, and transferring at least a part of filled unidirectional conductive fibers to a first outer layer of resin .

The cured composite laminate of claim 8 comprising at least 70% by weight of particulate material present in the interleaf layer.

Interleaf layer comprises 10 to 20 volume% of the conductive unidirectional textiles, cured composite laminate according to claim 8 or claim 9.

Continuously supplying a layer of unidirectional conductive fiber, contacting the first side of the fiber with a first layer of resin comprising a thermosetting resin, and compressing the resin and fiber together includes, and the resin enters the interstices of the fibers, to exit the unidirectional conductive fibers from a first outer layer of resin essentially free, resin is present in an amount sufficient, the claims 1 to 7 The method for producing a prepreg according to any one of the above.

A second layer of resin comprising a thermosetting resin is generally brought into contact with the second surface of the fiber simultaneously with the first layer so that the resin enters the gap between the fibers. The method of claim 11 , wherein the layer of is compressed together with the fibers.

The particulate material is dispersed within the first resin layer and the second resin layer, if present, and the compression forces the resin into the gaps, and the particulate material is pushed into the fiber structure, causing the outside of the fiber 13. A method according to claim 11 or claim 12 , wherein partial filtration of the particulate material occurs such that some of the particles embedded in the portion cause the structure to collapse.

The conductive fiber layer has a predetermined width, compresses the resin and fiber by passing over one or more impregnating rolls, and the pressure applied to the conductive fiber and resin per centimeter of conductive fiber width 14. A method according to any one of claims 11 to 13 which does not exceed 40 kg.