CN106739245A - Electronic product casing and its manufacture method - Google Patents

Electronic product casing and its manufacture method Download PDF

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Publication number
CN106739245A
CN106739245A CN201710116347.6A CN201710116347A CN106739245A CN 106739245 A CN106739245 A CN 106739245A CN 201710116347 A CN201710116347 A CN 201710116347A CN 106739245 A CN106739245 A CN 106739245A
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CN
China
Prior art keywords
surface covering
laminboard layer
electronic product
product casing
alveolate texture
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Pending
Application number
CN201710116347.6A
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Chinese (zh)
Inventor
孙岷
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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Application filed by Lenovo Beijing Ltd filed Critical Lenovo Beijing Ltd
Priority to CN201710116347.6A priority Critical patent/CN106739245A/en
Publication of CN106739245A publication Critical patent/CN106739245A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/20—All layers being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/10—Properties of the layers or laminate having particular acoustical properties
    • B32B2307/102—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/548—Creep
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/56—Damping, energy absorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/718—Weight, e.g. weight per square meter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Abstract

A kind of electronic product casing, it includes first surface covering, second surface covering and the laminboard layer in alveolate texture being arranged between the first surface covering and the second surface covering.A kind of method for manufacturing the electronic product casing.

Description

Electronic product casing and its manufacture method
Technical field
Present disclosure is related to a kind of electronic product casing and its manufacture method, more particularly to a kind of to include cellular-core The electronic product casing and its manufacture method of layer.
Background technology
Realize that the shell of electronic product was both light and thin using composite characteristics such as carbon fiber, glass fibre, aramid fibers And obtain can the strength and stiffness suitable with metal material be one of new material application strategy of current major brand manufacturers.
Existing solution is：Carbon fiber prepreg paving is used first, then by molding, digital control processing, inside Structural member insertion molding and outer surface spraying, eventually form the shell of electronic product.
The shortcoming of this solution is：
1. weight loss effect is not obvious：Carbon fibre composite density is about 1.8-2.0g/cm3, than being made using aluminium alloy Housing only loss of weight 20-30%, it is suitable with magnesium alloy；
2. relatively costly：The research and development of carbon fiber raw material fail to obtain important breakthrough, carbon fiber needed for industrial volume production all the time Basic dependence on import, price remains high always, and this scheme needs to use a large amount of carbon fibers.
The content of the invention
Regarding to the issue above with the defect of existing solution, the first aspect according to present disclosure proposes a kind of electronics Product casing, it includes first surface covering, second surface covering and is arranged on the first surface covering and second table The laminboard layer in alveolate texture between the covering of face.
Aramid paper is formed in the laminboard layer of alveolate texture using aramid fiber to be made.
It is after forming aramid paper through wet method copy paper technique using aramid fiber, through print in the laminboard layer of alveolate texture Glue, stacking, stretching, resin dipping, cutting action are made.
In the structure that the laminboard layer of alveolate texture is made up of multiple hexagonal cells, the similar beehive of outward appearance Cross section.
The 90-99% of the alveolate texture is empty.
One layer of mat of dipped glue is laid on the first surface covering and the second surface covering, by being hot pressed into Type technique is covered using the mat in the laminboard layer of alveolate texture with the first surface covering and the second surface Leather block is combined, and the adhesive strength between the laminboard layer and the first surface covering, the second surface covering exists More than 3Mpa.
The first surface covering and the second surface covering are made up of carbon fiber prepreg.
Certainly, the first surface covering and the second surface covering can also be made up of glass fibre prepreg.
The first surface covering, the second surface covering and the laminboard layer constitute the two dimension of generally I-beam Network structure.
The first surface covering and the second surface covering are made up of single layer structure or are made up of sandwich construction.
The density of the laminboard layer being made up of the aramid paper is 48kg/m3；The surface density of the carbon fiber prepreg It is 150g/cm2。
Second aspect according to present disclosure proposes a kind of manufacture method of electronic product casing, wherein the electronics is produced Product shell includes first surface covering, second surface covering and is arranged on the first surface covering and the second surface covering Between the laminboard layer in alveolate texture.
The manufacture method includes：The first surface covering is formed using carbon fiber prepreg or glass fibre prepreg With the second surface covering；After forming aramid paper using aramid fiber, formed in the laminboard layer of alveolate texture；By institute Laminboard layer, the first surface covering and the second surface covering is stated to solidify respectively；By mould pressing process so that described first Skin, the second surface covering and the laminboard layer are combined together, and are fixed on so as to form the laminboard layer and combine Sandwich between the first surface covering and the second surface covering；Based on the sandwich for obtaining, formed Electronic product casing.
The manufacture method also includes：One layer of laying is dipped on the first surface covering and the second surface covering The mat of glue；The laminboard layer is laid on the mat to form sandwich.
It is after forming aramid paper through wet method copy paper technique using aramid fiber, through print in the laminboard layer of alveolate texture Glue, stacking, stretching, resin dipping, cutting action are made.
The third aspect according to present disclosure proposes a kind of manufacture method of electronic product casing, wherein the electronics is produced Product shell includes first surface covering, second surface covering and is arranged on the first surface covering and the second surface covering Between the laminboard layer in alveolate texture.
The manufacture method includes：The first surface covering is formed using carbon fiber prepreg or glass fibre prepreg With the second surface covering；After forming aramid paper using aramid fiber, formed in the laminboard layer of alveolate texture；Institute State first surface covering, the second surface covering and the laminboard layer be in its uncured state when, by mould pressing process so that The first surface covering, the second surface covering and the laminboard layer are combined together, so as to form the laminboard layer knot Conjunction is fixed on the sandwich between the first surface covering and the second surface covering；Based on the interlayer knot for obtaining Structure, forms electronic product casing.
The manufacture method also includes：The laminboard layer of dipped glue is placed on the first surface covering and described Between two skins；By mould pressing process so that the first surface covering, the second surface covering and the laminboard layer It is combined together.
It is after forming aramid paper through wet method copy paper technique using aramid fiber, through print in the laminboard layer of alveolate texture Glue, stacking, stretching, resin dipping, cutting action are made.
Advantage in the laminboard layer being made up of aramid paper of alveolate texture is：
1. weight is extremely low；Density range is in 24-160kg/m3, different capacitive structure requirements can be met；
2. there is high shear strength, especially compared with foam core material, be more suitable for being used in light structures；
3. fire-retardant, low cigarette, hypotoxicity；
4. excellent creep resistance and fatigue-resistance characteristics；
5. excellent sound insulation and damping performance；
6. shaping, easy to process is easy to, and compared with metal beehive, aramid fiber paper honeycomb can bend, and processing is more convenient, operation It is more convenient.
According to the cellular above-mentioned advantage of aramid paper, the electricity of the sandwich style sandwich structure that it is made with carbon fibre composite Sub- product casing has the advantage that：
1. containment weight is considerably reduced.Compared to the simple shell being made using carbon fiber prepreg, weight reduction is at least 40%.By taking the panel of 14 ' notebook computers as an example, the raw material of option A are respectively：Density is 48kg/m3Aramid fiber paper honeycomb It is 150g/cm with surface density2Carbon fiber prepreg, the weight of option A is 50.1 grams；The raw material of option b are entirely close face It is 150g/cm to spend2Carbon fiber prepreg, the weight of option b is 91.2 grams.
2. material cost is effectively reduced.In upper example, option A reduces the use of a large amount of carbon fiber prepregs than option b, Material cost can reduce 20-30%.
3. it is the sandwich style sandwich structure of core to make aramid fiber paper honeycomb using mould pressing process, with original autoclave work Skill is compared, and substantially reduces hardening time (molding 0.5 hour, autoclave 3-6 hours), and without using the crowd of autoclave technique (autoclave needs to use the costliness auxiliary material and vacuum tank, vacuum valve etc. such as airfelt, barrier film, putty bar, vacuum bag big to many auxiliary materials Type equipment), greatly save manufacturing cost.
4. aramid fiber paper honeycomb is remarkably improved the bending strength and rigidity of product for the sandwich sandwich structure of core.From knot Seen on structure, " I-beam " shape of the similar bidimensional of honeycomb sandwich board structure.Upper and lower covering can bear the compression and stretching during bending Load.Comb core can bear shear-type load similar to the two-dimensional network structure of " I-beam " so that panel keeps geometric form Shape.This can give panel and continuously reliably support, so as to improve the rigidity of structure.Honeycomb sandwich board can not increase substantially in weight In the case of, increase substantially strength and stiffness.
Brief description of the drawings
Present disclosure will be better understood from by following accompanying drawing those skilled in the art, and more can be clearly Embody the advantage of present disclosure.Accompanying drawing described herein only for selected embodiment illustration purpose, rather than all may be used Can implementation method and being intended to do not limit scope of the present disclosure.
Fig. 1 schematically shows the Lay up design of the shell being made up of carbon fiber prepreg completely of the prior art；
Fig. 2 schematically shows the Lay up design of the shell including cellular-core layer according to present disclosure；
Fig. 3 schematically shows honeycomb sandwich structure, its " I-beam " shape similar to two dimension；
Fig. 4 shows in a tabular form can be in the substantially not increased situation of weight according to the honeycomb sandwich structure of present disclosure Under, increase substantially strength and stiffness；
Fig. 5 shows that honeycomb sandwich structure is contrasted with the mechanical property of other structures in a tabular form；
Fig. 6 shows that as a example by manufacturing 14 ' notebook computer shells aramid fiber honeycomb sandwich board material is several with other in a tabular form The contrast of common used material；
Fig. 7 shows the step according to included by the manufacture method of the electronic product casing of present disclosure.
Specific embodiment
Fig. 2 schematically shows a kind of electronics including cellular-core layer of the first embodiment according to present disclosure The Lay up design of product casing, it includes first surface covering 1, second surface covering 2 and is arranged on the first surface covering 1 The laminboard layer 3 in alveolate texture and the second surface covering 2 between.
Aramid paper is formed in the laminboard layer 3 of alveolate texture using aramid fiber to be made.
The laminboard layer 3 be using aramid fiber through wet method copy paper technique formed aramid paper after, through print glue, stacking, stretching, Resin dipping, cutting action are made.
The structure that the laminboard layer 3 is made up of multiple hexagonal cells, the cross section of the similar beehive of outward appearance.The honeybee The 90-99% of nest shape structure is empty.
The advantage of the above-mentioned laminboard layer being made up of aramid paper in alveolate texture is：
1. weight is extremely low；Density range is in 24-160kg/m3, different capacitive structure requirements can be met；
2. there is high shear strength, especially compared with foam core material, be more suitable for being used in light structures；
3. fire-retardant, low cigarette, hypotoxicity；
4. excellent creep resistance and fatigue-resistance characteristics；
5. excellent sound insulation and damping performance；
6. it is easy to that shaping is easy to process, compared with metal beehive, aramid fiber paper honeycomb can bend, and processing is more convenient, operation It is more convenient.
In order to strengthen bond strength, can also respectively be spread on the first surface covering 1 and the second surface covering 2 If one layer of mat of dipped glue, the mat and institute are utilized in the laminboard layer 3 of alveolate texture by hot press forming technology State first surface covering and the second surface covering is combined together, the laminboard layer 3 and the first surface covering 1, institute The adhesive strength between second surface covering 2 is stated in more than 3Mpa.
The first surface covering 1 and the second surface covering 2 are made up of carbon fiber prepreg.Certainly, described first Skin 1 and the second surface covering 2 can also be made up of glass fibre prepreg.
The first surface covering 1 and the second surface covering 2 can be made up of single layer structure or can be by multilayer Structure (as shown in Figure 2) is made.
The density of the laminboard layer being made up of the aramid paper is 48kg/m3；The surface density of the carbon fiber prepreg It is 150g/cm2。
Fig. 3 schematically shows honeycomb sandwich structure, wherein the first surface covering 1, the second surface covering 2 with And the laminboard layer 3 constitutes the two-dimensional network structure of generally I-beam.
Two-dimensional network structure based on this I-beam, Fig. 4 shows to be pressed from both sides according to the honeycomb of present disclosure in a tabular form Cored structure can increase substantially strength and stiffness in the case of weight is not substantially increased, wherein increasing by 3% He in relative weight Relative intensity increases by 250% and 825% respectively in the case of 6%；Relative rigidity increases by 600% and 3600% respectively.
Fig. 5 shows that honeycomb sandwich structure is contrasted with the mechanical property of other structures in a tabular form.From fig. 5, it can be seen that Honeycomb sandwich structure according to the present embodiment is superior to foam sandwich construction, extrusion at two aspects of relative rigidity and relative intensity Profile structure, sheet-beam structure and laminated structure.
Fig. 6 shows that as a example by manufacturing 14 ' notebook computer shells aramid fiber honeycomb sandwich board material is several with other in a tabular form The contrast of thickness and weight several aspects of the common used material under bending modulus, density, identical rigidity.As can be seen that basis The aramid fiber honeycomb sandwich board material of the present embodiment has more comprehensively overall characteristic compared to other different materials in thickness, special It is not that weight is most light.
According to the cellular above-mentioned advantage of aramid paper, the electricity of the sandwich style sandwich structure that it is made with carbon fibre composite Sub- product casing, has the advantage that：
● containment weight is considerably reduced, compared to the simple shell (as shown in Figure 1) being made using carbon fiber prepreg, weight Amount reduces at least 40%.By taking the housing face-plate of 14 ' notebook computers as an example, the raw material of option A are respectively：Density is 48kg/ m3Aramid fiber paper honeycomb and surface density be 150g/cm2Carbon fiber prepreg, the weight of option A is 50.1 grams；The former material of option b Material is entirely that surface density is 150g/cm2Carbon fiber prepreg, the weight of option b is 91.2 grams.
● effectively reduce material cost.In upper example, option A reduces the use of a large amount of carbon fiber prepregs than option b, Material cost can reduce 20-30%.
● aramid fiber paper honeycomb is remarkably improved the bending strength and rigidity of product for the sandwich sandwich structure of core.From knot Seen on structure, honeycomb sandwich board structure is similar to " I-beam " shape of two dimension.Upper and lower covering can bear the compression and stretching during bending Load.Comb core can bear shear-type load similar to the two-dimensional network structure of " I-beam " so that panel keeps geometric form Shape.This can give panel and continuously reliably support, so as to improve the rigidity of structure.Honeycomb sandwich board can not increase substantially in weight In the case of, increase substantially strength and stiffness.
Fig. 7 shows the step according to included by the manufacture method of the electronic product casing of present disclosure.Present disclosure Using mould pressing process, due to introducing aramid fiber paper honeycomb as core, so in " paving " and " compression molding " operation with biography That unites is completely different using carbon fiber prepreg manufacturing process.
The forming method of the electronic product casing of the sandwich style sandwich structure of present disclosure has two kinds of dry and wet.
1st kind is dry-press process：The method is first to solidify aramid fiber paper honeycomb core material and carbon fiber prepreg covering respectively Afterwards, they are then bonded into sandwich again.In order to ensure core and covering strong bond, can be in one layer of covering upper berth mat (dipped glue), spreads honeycomb, and heating pressurization is allowed to solidification integral.The sandwich of this method manufacture, honeybee core and covering Adhesive strength can bring up to more than 3MPa.It is smooth that the advantage of dry-press process is mainly product surface, smooth, per pass in production process Operation can in time check that product quality is easily guaranteed that.
Specifically, the second embodiment according to present disclosure proposes a kind of manufacture method of electronic product casing, its Described in electronic product casing include first surface covering 1, second surface covering 2 and being arranged on the and of first surface covering 1 The laminboard layer 3 in alveolate texture between the second surface covering 2.
The manufacture method includes：
The first surface covering 1 is formed using carbon fiber prepreg or glass fibre prepreg and the second surface is covered Skin 2；
After forming aramid paper using aramid fiber, formed in the laminboard layer 3 of alveolate texture；
It is in paving technique, the laminboard layer 3, the first surface covering 1 and the second surface covering 2 is solid respectively Change, and the laminboard layer 3 is arranged between the first surface covering 1 and the second surface covering 2；
By mould pressing process so that the first surface covering 1, the second surface covering 2 and the laminboard layer 3 are combined Together, it is fixed between the first surface covering 1 and the second surface covering 2 so as to form the laminboard layer 3 and combine Sandwich；
Based on the sandwich for obtaining, final electronics is formed by CNC deburrings, plastic frame injection moulding and spraying Product casing.
The manufacture method also includes：
One layer of mat of dipped glue is laid respectively on the first surface covering 1 and the second surface covering 2；Institute State and laid on mat the laminboard layer to form sandwich.
It is warp after forming aramid paper through wet method copy paper technique using aramid fiber in the laminboard layer 3 of alveolate texture Print glue, stacking, stretching, resin dipping, cutting action are made.
2nd kind is wet moulding：The method is that covering and cellular sandwich are in its uncured state, the once glue on mould It is connected into type.During production, upper and lower panel is first made on mould, then pulls open honeycomb bar impregnation, be put between upper and lower covering, Pressurization (0.01~0.08MPa), solidification, are trimmed to product after the demoulding.The advantage of wet moulding is bonded by force between honeycomb and covering Degree is high, with short production cycle, is best suited for the production of the three-dimensional structure product such as sphere, housing.
Specifically, the 3rd embodiment according to present disclosure proposes a kind of manufacture method of electronic product casing, its Described in electronic product casing include first surface covering 1, second surface covering 2 and being arranged on the and of first surface covering 1 The laminboard layer 3 in alveolate texture between the second surface covering 2.
The manufacture method includes：
The first surface covering 1 is formed using carbon fiber prepreg or glass fibre prepreg and the second surface is covered Skin 2；
After forming aramid paper using aramid fiber, formed in the laminboard layer 3 of alveolate texture；
In paving technique, it is in not in the first surface covering 1, the second surface covering 2 and the laminboard layer 3 During solid state, the laminboard layer 3 is arranged between the first surface covering 1 and the second surface covering 2；
By mould pressing process so that the first surface covering 1, the second surface covering 2 and the laminboard layer 3 are combined Together, it is fixed between the first surface covering 1 and the second surface covering 2 so as to form the laminboard layer 3 and combine Sandwich；
Based on the sandwich for obtaining, final electronics is formed by CNC deburrings, plastic frame injection moulding and spraying Product casing.
The manufacture method also includes：
The laminboard layer 3 of dipped glue is placed between the first surface covering 1 and the second surface covering 2； By mould pressing process so that the first surface covering 1, the second surface covering 2 and the laminboard layer 3 are combined together.
It is warp after forming aramid paper through wet method copy paper technique using aramid fiber in the laminboard layer 3 of alveolate texture Print glue, stacking, stretching, resin dipping, cutting action are made.
The use of aramid fiber paper honeycomb is made according to the mould pressing process of present disclosure is the sandwich style sandwich structure of core, with Original autoclave technique is compared, and substantially reduces hardening time (molding 0.5 hour, autoclave 3-6 hours), and without using (autoclave need to use the expensive auxiliary material such as airfelt, barrier film, putty bar, vacuum bag and vacuum to numerous auxiliary materials of autoclave technique The large scale equipments such as tank, vacuum valve), greatly save manufacturing cost.

Claims (17)

1. a kind of electronic product casing, it includes first surface covering, second surface covering and is arranged on the first surface covering The laminboard layer in alveolate texture between skin and the second surface covering.
2. electronic product casing according to claim 1, wherein being to utilize aramid fiber in the laminboard layer of alveolate texture Fiber forms what aramid paper was made.
3. electronic product casing according to claim 2, wherein being to utilize aramid fiber in the laminboard layer of alveolate texture After fiber forms aramid paper through wet method copy paper technique, it is made through print glue, stacking, stretching, resin dipping, cutting action.
4. electronic product casing according to claim 1, wherein being by multiple six in the laminboard layer of alveolate texture The structure of corner shaped elements composition.
5. electronic product casing according to claim 1, wherein the 90-99% of the alveolate texture is empty.
6. electronic product casing according to claim 2, wherein being covered in the first surface covering and the second surface One layer of mat of dipped glue is laid on skin, the mat is utilized in the laminboard layer of alveolate texture by hot press forming technology It is combined together with the first surface covering and the second surface covering, the laminboard layer and the first surface covering, Adhesive strength between the second surface covering is in more than 3Mpa.
7. electronic product casing according to claim 6, wherein the first surface covering and the second surface covering It is made up of carbon fiber prepreg.
8. electronic product casing according to claim 7, wherein the first surface covering, the second surface covering with And the laminboard layer constitutes the two-dimensional network structure of generally I-beam.
9. electronic product casing according to claim 7, wherein the first surface covering and the second surface covering It is made up of single layer structure or is made up of sandwich construction.
10. electronic product casing according to claim 7, wherein the density of the laminboard layer being made up of the aramid paper It is 48kg/m3；The surface density of the carbon fiber prepreg is 150g/cm2。
11. electronic product casings according to claim 6, wherein the first surface covering and the second surface covering It is made up of glass fibre prepreg.
12. a kind of manufacture methods of electronic product casing, wherein the electronic product casing includes first surface covering, the second table Face covering and the laminboard layer in alveolate texture being arranged between the first surface covering and the second surface covering；
The manufacture method includes：
The first surface covering and the second surface covering are formed using carbon fiber prepreg or glass fibre prepreg；
After forming aramid paper using aramid fiber, formed in the laminboard layer of alveolate texture；
The laminboard layer, the first surface covering and the second surface covering are solidified respectively；
By mould pressing process so that the first surface covering, the second surface covering and the laminboard layer are combined together, The sandwich being fixed between the first surface covering and the second surface covering is combined so as to form the laminboard layer；
Based on the sandwich for obtaining, electronic product casing is formed.
13. manufacture methods according to claim 12, wherein the manufacture method also includes：
One layer of mat of dipped glue is laid on the first surface covering and the second surface covering；
The laminboard layer is laid on the mat to form sandwich.
14. manufacture method according to claim 12 or 13, wherein being using virtue in the laminboard layer of alveolate texture After synthetic fibre fiber forms aramid paper through wet method copy paper technique, it is made through print glue, stacking, stretching, resin dipping, cutting action.
A kind of 15. manufacture methods of electronic product casing, wherein
The electronic product casing includes first surface covering, second surface covering and is arranged on the first surface covering and institute State the laminboard layer in alveolate texture between second surface covering；
The manufacture method includes：
The first surface covering and the second surface covering are formed using carbon fiber prepreg or glass fibre prepreg；
After forming aramid paper using aramid fiber, formed in the laminboard layer of alveolate texture；
When the first surface covering, the second surface covering and the laminboard layer are in its uncured state, by molding Technique causes that the first surface covering, the second surface covering and the laminboard layer are combined together, so as to form described Laminboard layer combines the sandwich being fixed between the first surface covering and the second surface covering；
Based on the sandwich for obtaining, electronic product casing is formed.
16. manufacture methods according to claim 15, wherein the manufacture method also includes：
The laminboard layer of dipped glue is placed between the first surface covering and the second surface covering；
By mould pressing process so that the first surface covering, the second surface covering and the laminboard layer are combined together.
17. manufacture method according to claim 15 or 16, wherein being using virtue in the laminboard layer of alveolate texture After synthetic fibre fiber forms aramid paper through wet method copy paper technique, it is made through print glue, stacking, stretching, resin dipping, cutting action.
CN201710116347.6A 2017-03-01 2017-03-01 Electronic product casing and its manufacture method Pending CN106739245A (en)

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Cited By (5)

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Publication number Priority date Publication date Assignee Title
CN108112202A (en) * 2017-12-15 2018-06-01 中国电子科技集团公司第十八研究所 Power supply controller structure
CN112140691A (en) * 2020-11-24 2020-12-29 苏州鸿赞蜂窝材料有限公司 Novel composite forming method for television backboard
CN112743879A (en) * 2020-12-22 2021-05-04 江苏鸿赞蜂窝科技有限公司 Manufacturing process method of sounding back plate of laser television
CN112848370A (en) * 2020-12-31 2021-05-28 江苏鸿赞蜂窝科技有限公司 Laser television sounding back plate and manufacturing process thereof
US11608174B2 (en) 2020-08-17 2023-03-21 Ge Aviation Systems Limited Power distribution panel

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CN103042734A (en) * 2013-01-22 2013-04-17 益阳卡斯达尔复合材料有限公司 High-strength fiber composite material, preparation method thereof and application thereof in sanitation compartment
CN103240834A (en) * 2012-02-03 2013-08-14 南京润泰科技有限公司 Preparation method of carbon fiber resin matrix composite material

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CN103240834A (en) * 2012-02-03 2013-08-14 南京润泰科技有限公司 Preparation method of carbon fiber resin matrix composite material
CN103042734A (en) * 2013-01-22 2013-04-17 益阳卡斯达尔复合材料有限公司 High-strength fiber composite material, preparation method thereof and application thereof in sanitation compartment

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108112202A (en) * 2017-12-15 2018-06-01 中国电子科技集团公司第十八研究所 Power supply controller structure
US11608174B2 (en) 2020-08-17 2023-03-21 Ge Aviation Systems Limited Power distribution panel
CN112140691A (en) * 2020-11-24 2020-12-29 苏州鸿赞蜂窝材料有限公司 Novel composite forming method for television backboard
CN112743879A (en) * 2020-12-22 2021-05-04 江苏鸿赞蜂窝科技有限公司 Manufacturing process method of sounding back plate of laser television
CN112848370A (en) * 2020-12-31 2021-05-28 江苏鸿赞蜂窝科技有限公司 Laser television sounding back plate and manufacturing process thereof

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Application publication date: 20170531