JP2012528472A - オプトエレクトロニクス半導体チップおよびオプトエレクトロニクス半導体チップの製造方法 - Google Patents
オプトエレクトロニクス半導体チップおよびオプトエレクトロニクス半導体チップの製造方法 Download PDFInfo
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Abstract
【選択図】図1
Description
成長基板を形成するステップと、
成長基板の上に半導体積層体をエピタキシャル成長させるステップであって、半導体積層体が、一次放射を発生させる少なくとも1層の活性層と、一次放射を少なくとも一時的に吸収し、それを一次放射よりも長い波長の二次放射に変換する1層または好ましくは複数の変換層と、を備えている、ステップと、
特に、変換層に面している半導体積層体の面に、粗面化領域を形成するステップであって、粗面化領域が少なくとも何箇所かにおいて変換層の中まで、または変換層のうちの1層の中まで延びており、したがって、少なくとも1層の変換層の材料が部分的に粗面化領域によって除去される、ステップと、
半導体チップを完成させるステップと、
を含んでおり、
半導体チップによって放出される放射の色位置を粗面化領域によって変化させる。
Claims (14)
- 半導体積層体(2)を有するオプトエレクトロニクス半導体チップ(1)であって、
前記半導体積層体(2)が、
一次放射(P)を発生させる少なくとも1層の活性層(3)と、
1層または複数の変換層(4)であって、前記一次放射(P)の少なくとも一部分を吸収し、それを、前記一次放射(P)よりも長い波長を有する二次放射(S)に変換する、前記変換層(4)と、
少なくとも何箇所かにおいて前記変換層(4)の中まで、または前記変換層(4)のうちの1層の中まで延びている粗面化領域(5)と、
を備えている、
オプトエレクトロニクス半導体チップ(1)。 - 前記粗面化領域(5)が、何箇所かにおいて前記少なくとも1層の活性層(3)の方向に前記変換層(4)を完全に貫通している、
請求項1に記載のオプトエレクトロニクス半導体チップ(1)。 - 互いに異なって形成されている変換層(4)の少なくとも2つのグループ(41,42)であって、少なくとも2つの相互に異なるスペクトル範囲の前記二次放射(S)を発生させるのに適している、前記少なくとも2つのグループ(41,42)、
を備えている、請求項1または2に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記半導体チップ(1)によって放出される混合放射(R)が、前記一次放射(P)および前記二次放射(S)から形成されている、
請求項1〜3のいずれか1項に記載のオプトエレクトロニクス半導体チップ(1)。 - 白色光を放出するように設計されている、
請求項1〜4のいずれか1項に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記半導体積層体(2)が、10〜50層の範囲内(両端値を含む)の変換層(4)を備えている、
請求項1〜5のいずれか1項に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記粗面化領域(5)の全体または一部分が、六角錐もしくは六角錐台またはその両方によって形成されている、
請求項1〜6のいずれか1項に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記少なくとも1層の活性層(3)とは反対側の、前記粗面化領域の頂上領域(6)において、活性層に面している前記粗面化領域(5)の谷領域において放出される放射とは異なる色位置を有する放射(P,S)が放出される、
請求項1〜7のいずれか1項に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記粗面化領域(5)の平均深さ(T)が、0.2μm〜3.5μmの範囲内(両端値を含む)である、
請求項1〜8のいずれか1項に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記少なくとも1層の活性層(3)および前記変換層(4)がモノリシックに集積化されている、
請求項1〜9のいずれか1項に記載のオプトエレクトロニクス半導体チップ(1)。 - オプトエレクトロニクス半導体チップ(1)を製造する方法であって、
成長基板(25)を形成するステップと、
前記成長基板(25)の上に半導体積層体(2)をエピタキシャル成長させるステップであって、前記半導体積層体(2)が、一次放射(P)を発生させる少なくとも1層の活性層(3)と、前記一次放射(P)の少なくとも一部分を吸収し、それを、前記一次放射(P)よりも長い波長の二次放射(S)に変換する1層の変換層(4)または複数の変換層(4)と、を備えているステップと、
粗面化領域(5)を形成するステップであって、前記粗面化領域が、少なくとも何箇所かにおいて前記変換層(4)のうちの1層の中に延びており、少なくとも1層の変換層(4)の材料が何箇所かにおいて前記粗面化領域(5)によって除去されるステップと、
前記半導体チップ(1)を完成させるステップと、
を有し、
前記半導体チップ(1)によって放出される放射(P,R,S)の色位置を前記粗面化領域(5)によって変化させる、
方法。 - 前記粗面化領域(5)を形成している間、前記半導体チップ(1)に、少なくとも随時、放射(R,S)を放出させ、前記半導体チップ(1)によって放出される前記放射(R,S)の色位置を、少なくとも随時、測定する、
請求項11に記載の方法。 - 前記粗面化領域(5)を形成している間、前記半導体チップ(1)によって放出される前記放射(R)の前記色位置のcx値およびcy値の合計を、CIE標準色度図において、少なくとも0.05単位で減少させる、
請求項11または12に記載の方法。 - 前記粗面化領域(5)を形成する前に、前記半導体積層体(2)から前記成長基板(25)を除去し、前記粗面化領域(5)を形成する前に、前記半導体チップ(1)を電気的に接続し、前記粗面化領域(5)を形成している間、随時、前記半導体チップ(1)を電気的に動作させる、
請求項11〜13のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102009023351A DE102009023351A1 (de) | 2009-05-29 | 2009-05-29 | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
DE102009023351.2 | 2009-05-29 | ||
PCT/EP2010/054662 WO2010136251A1 (de) | 2009-05-29 | 2010-04-08 | Optoelektronischer halbleiterchip und verfahren zur herstellung eines optoelektronischen halbleiterchips |
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JP2012528472A5 JP2012528472A5 (ja) | 2013-02-28 |
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US (2) | US8900888B2 (ja) |
EP (1) | EP2436045B1 (ja) |
JP (1) | JP2012528472A (ja) |
KR (1) | KR20120027035A (ja) |
CN (1) | CN102428579B (ja) |
DE (1) | DE102009023351A1 (ja) |
WO (1) | WO2010136251A1 (ja) |
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2009
- 2009-05-29 DE DE102009023351A patent/DE102009023351A1/de not_active Withdrawn
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2010
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- 2010-04-08 KR KR1020117031462A patent/KR20120027035A/ko not_active Application Discontinuation
- 2010-04-08 WO PCT/EP2010/054662 patent/WO2010136251A1/de active Application Filing
- 2010-04-08 JP JP2012512270A patent/JP2012528472A/ja active Pending
- 2010-04-08 US US13/318,818 patent/US8900888B2/en not_active Expired - Fee Related
- 2010-04-08 CN CN201080021820.9A patent/CN102428579B/zh not_active Expired - Fee Related
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2014
- 2014-10-29 US US14/526,713 patent/US9306131B2/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
KR20120027035A (ko) | 2012-03-20 |
EP2436045A1 (de) | 2012-04-04 |
US20150053919A1 (en) | 2015-02-26 |
CN102428579A (zh) | 2012-04-25 |
US8900888B2 (en) | 2014-12-02 |
DE102009023351A1 (de) | 2010-12-02 |
CN102428579B (zh) | 2015-02-25 |
EP2436045B1 (de) | 2017-01-25 |
US20120132945A1 (en) | 2012-05-31 |
US9306131B2 (en) | 2016-04-05 |
WO2010136251A1 (de) | 2010-12-02 |
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