JP2012527119A - 研磨ヘッドゾーン境界平滑化 - Google Patents

研磨ヘッドゾーン境界平滑化 Download PDF

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Publication number
JP2012527119A
JP2012527119A JP2012510818A JP2012510818A JP2012527119A JP 2012527119 A JP2012527119 A JP 2012527119A JP 2012510818 A JP2012510818 A JP 2012510818A JP 2012510818 A JP2012510818 A JP 2012510818A JP 2012527119 A JP2012527119 A JP 2012527119A
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JP
Japan
Prior art keywords
carrier head
flexible membrane
head assembly
base assembly
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012510818A
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English (en)
Japanese (ja)
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JP2012527119A5 (https=
Inventor
ハン チー チェン，
サミュエル チュ−チャン スウ，
ゴータム ダンダヴェート，
デニス エム． クーソー，
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Applied Materials Inc
Original Assignee
Applied Materials Inc
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Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2012527119A publication Critical patent/JP2012527119A/ja
Publication of JP2012527119A5 publication Critical patent/JP2012527119A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012510818A 2009-05-14 2010-04-20 研磨ヘッドゾーン境界平滑化 Pending JP2012527119A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US17821809P 2009-05-14 2009-05-14
US61/178,218 2009-05-14
US12/720,893 2010-03-10
US12/720,893 US8460067B2 (en) 2009-05-14 2010-03-10 Polishing head zone boundary smoothing
PCT/US2010/031802 WO2010132181A2 (en) 2009-05-14 2010-04-20 Polishing head zone boundary smoothing

Publications (2)

Publication Number Publication Date
JP2012527119A true JP2012527119A (ja) 2012-11-01
JP2012527119A5 JP2012527119A5 (https=) 2013-06-06

Family

ID=43068892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012510818A Pending JP2012527119A (ja) 2009-05-14 2010-04-20 研磨ヘッドゾーン境界平滑化

Country Status (7)

Country Link
US (2) US8460067B2 (https=)
JP (1) JP2012527119A (https=)
KR (1) KR101647962B1 (https=)
CN (1) CN102227803B (https=)
SG (1) SG174850A1 (https=)
TW (1) TWI572442B (https=)
WO (1) WO2010132181A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9287828B2 (en) 2013-03-05 2016-03-15 Panasonic Intellectual Property Management Co., Ltd. Mixing circuit

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8460067B2 (en) * 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
US9418904B2 (en) 2011-11-14 2016-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Localized CMP to improve wafer planarization
US20130210173A1 (en) * 2012-02-14 2013-08-15 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple Zone Temperature Control for CMP
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
KR101223010B1 (ko) 2012-06-29 2013-01-17 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인
US10532441B2 (en) 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
US20140357161A1 (en) * 2013-05-31 2014-12-04 Sunedison Semiconductor Limited Center flex single side polishing head
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
US9610672B2 (en) 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR102160328B1 (ko) * 2017-02-01 2020-09-25 강준모 화학기계적연마장치용 캐리어헤드
JP6431560B2 (ja) * 2017-03-08 2018-11-28 日清工業株式会社 両頭平面研削盤および研削方法
US11945073B2 (en) * 2019-08-22 2024-04-02 Applied Materials, Inc. Dual membrane carrier head for chemical mechanical polishing
US11325223B2 (en) * 2019-08-23 2022-05-10 Applied Materials, Inc. Carrier head with segmented substrate chuck
CN113118969A (zh) * 2019-12-31 2021-07-16 清华大学 一种用于化学机械抛光的承载头

Citations (3)

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JP2000296457A (ja) * 1999-02-25 2000-10-24 Obsidian Inc パッドレス基板キャリヤ
JP2003224095A (ja) * 1994-03-02 2003-08-08 Applied Materials Inc 化学機械研磨装置
JP2004221566A (ja) * 2003-01-14 2004-08-05 Samsung Electronics Co Ltd ポリシングヘッド及び化学機械的研磨装置

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US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6227955B1 (en) * 1999-04-20 2001-05-08 Micron Technology, Inc. Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6855043B1 (en) * 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US6450868B1 (en) * 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US7101273B2 (en) * 2000-07-25 2006-09-05 Applied Materials, Inc. Carrier head with gimbal mechanism
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
EP1177859B1 (en) * 2000-07-31 2009-04-15 Ebara Corporation Substrate holding apparatus and substrate polishing apparatus
TWI246448B (en) * 2000-08-31 2006-01-01 Multi Planar Technologies Inc Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
US6769973B2 (en) * 2001-05-31 2004-08-03 Samsung Electronics Co., Ltd. Polishing head of chemical mechanical polishing apparatus and polishing method using the same
KR100437456B1 (ko) 2001-05-31 2004-06-23 삼성전자주식회사 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법
US20030124963A1 (en) * 2001-12-27 2003-07-03 Applied Materials, Inc. Carrier head with a non-stick membrane
US6890249B1 (en) * 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US6872130B1 (en) * 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
JP2004154874A (ja) * 2002-11-05 2004-06-03 Ebara Corp ポリッシング装置及びポリッシング方法
CN101474771B (zh) * 2003-02-10 2012-07-11 株式会社荏原制作所 用于衬底保持装置中的弹性部件以及衬底抛光装置和方法
TWI393209B (zh) * 2003-02-10 2013-04-11 荏原製作所股份有限公司 研磨基板之方法
US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US7207871B1 (en) * 2005-10-06 2007-04-24 Applied Materials, Inc. Carrier head with multiple chambers
JP2009539626A (ja) * 2006-06-02 2009-11-19 アプライド マテリアルズ インコーポレイテッド メンブレン膨張ステップなしの研磨ヘッドへの高速基板ローディング
JP2009131920A (ja) * 2007-11-29 2009-06-18 Ebara Corp 研磨装置及び方法
US8460067B2 (en) * 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003224095A (ja) * 1994-03-02 2003-08-08 Applied Materials Inc 化学機械研磨装置
JP2000296457A (ja) * 1999-02-25 2000-10-24 Obsidian Inc パッドレス基板キャリヤ
JP2004221566A (ja) * 2003-01-14 2004-08-05 Samsung Electronics Co Ltd ポリシングヘッド及び化学機械的研磨装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9287828B2 (en) 2013-03-05 2016-03-15 Panasonic Intellectual Property Management Co., Ltd. Mixing circuit

Also Published As

Publication number Publication date
WO2010132181A2 (en) 2010-11-18
US9050699B2 (en) 2015-06-09
KR101647962B1 (ko) 2016-08-12
SG174850A1 (en) 2011-11-28
TW201102216A (en) 2011-01-16
US20100291842A1 (en) 2010-11-18
CN102227803A (zh) 2011-10-26
US8460067B2 (en) 2013-06-11
WO2010132181A3 (en) 2011-01-13
TWI572442B (zh) 2017-03-01
US20130252518A1 (en) 2013-09-26
KR20120025446A (ko) 2012-03-15
CN102227803B (zh) 2014-09-17

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