TWI572442B - 研磨頭區域邊界平滑化 - Google Patents

研磨頭區域邊界平滑化 Download PDF

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Publication number
TWI572442B
TWI572442B TW099114991A TW99114991A TWI572442B TW I572442 B TWI572442 B TW I572442B TW 099114991 A TW099114991 A TW 099114991A TW 99114991 A TW99114991 A TW 99114991A TW I572442 B TWI572442 B TW I572442B
Authority
TW
Taiwan
Prior art keywords
base assembly
carrier head
flexible film
assembly
annular
Prior art date
Application number
TW099114991A
Other languages
English (en)
Chinese (zh)
Other versions
TW201102216A (en
Inventor
陳志宏
徐主強
丹達維特果譚沙杉克
庫薩丹尼斯
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201102216A publication Critical patent/TW201102216A/zh
Application granted granted Critical
Publication of TWI572442B publication Critical patent/TWI572442B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW099114991A 2009-05-14 2010-05-11 研磨頭區域邊界平滑化 TWI572442B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17821809P 2009-05-14 2009-05-14
US12/720,893 US8460067B2 (en) 2009-05-14 2010-03-10 Polishing head zone boundary smoothing

Publications (2)

Publication Number Publication Date
TW201102216A TW201102216A (en) 2011-01-16
TWI572442B true TWI572442B (zh) 2017-03-01

Family

ID=43068892

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099114991A TWI572442B (zh) 2009-05-14 2010-05-11 研磨頭區域邊界平滑化

Country Status (7)

Country Link
US (2) US8460067B2 (https=)
JP (1) JP2012527119A (https=)
KR (1) KR101647962B1 (https=)
CN (1) CN102227803B (https=)
SG (1) SG174850A1 (https=)
TW (1) TWI572442B (https=)
WO (1) WO2010132181A2 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8460067B2 (en) * 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
US9418904B2 (en) 2011-11-14 2016-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Localized CMP to improve wafer planarization
US20130210173A1 (en) * 2012-02-14 2013-08-15 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple Zone Temperature Control for CMP
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
KR101223010B1 (ko) 2012-06-29 2013-01-17 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인
US10532441B2 (en) 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
WO2014136402A1 (ja) 2013-03-05 2014-09-12 パナソニック株式会社 ミキサ回路
US20140357161A1 (en) * 2013-05-31 2014-12-04 Sunedison Semiconductor Limited Center flex single side polishing head
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
US9610672B2 (en) 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR102160328B1 (ko) * 2017-02-01 2020-09-25 강준모 화학기계적연마장치용 캐리어헤드
JP6431560B2 (ja) * 2017-03-08 2018-11-28 日清工業株式会社 両頭平面研削盤および研削方法
US11945073B2 (en) * 2019-08-22 2024-04-02 Applied Materials, Inc. Dual membrane carrier head for chemical mechanical polishing
US11325223B2 (en) * 2019-08-23 2022-05-10 Applied Materials, Inc. Carrier head with segmented substrate chuck
CN113118969A (zh) * 2019-12-31 2021-07-16 清华大学 一种用于化学机械抛光的承载头

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040137832A1 (en) * 2003-01-14 2004-07-15 Moon Jin-Ok Polishing head and chemical mechanical polishing apparatus
TWI246448B (en) * 2000-08-31 2006-01-01 Multi Planar Technologies Inc Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
TWI301089B (en) * 2005-10-06 2008-09-21 Applied Materials Inc Carrier head with multiple chambers

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3595011B2 (ja) * 1994-03-02 2004-12-02 アプライド マテリアルズ インコーポレイテッド 研磨制御を改善した化学的機械的研磨装置
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6276998B1 (en) * 1999-02-25 2001-08-21 Applied Materials, Inc. Padless substrate carrier
US6227955B1 (en) * 1999-04-20 2001-05-08 Micron Technology, Inc. Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6855043B1 (en) * 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US6450868B1 (en) * 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US7101273B2 (en) * 2000-07-25 2006-09-05 Applied Materials, Inc. Carrier head with gimbal mechanism
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
EP1177859B1 (en) * 2000-07-31 2009-04-15 Ebara Corporation Substrate holding apparatus and substrate polishing apparatus
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
US6769973B2 (en) * 2001-05-31 2004-08-03 Samsung Electronics Co., Ltd. Polishing head of chemical mechanical polishing apparatus and polishing method using the same
KR100437456B1 (ko) 2001-05-31 2004-06-23 삼성전자주식회사 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법
US20030124963A1 (en) * 2001-12-27 2003-07-03 Applied Materials, Inc. Carrier head with a non-stick membrane
US6890249B1 (en) * 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US6872130B1 (en) * 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
JP2004154874A (ja) * 2002-11-05 2004-06-03 Ebara Corp ポリッシング装置及びポリッシング方法
CN101474771B (zh) * 2003-02-10 2012-07-11 株式会社荏原制作所 用于衬底保持装置中的弹性部件以及衬底抛光装置和方法
TWI393209B (zh) * 2003-02-10 2013-04-11 荏原製作所股份有限公司 研磨基板之方法
US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
JP2009539626A (ja) * 2006-06-02 2009-11-19 アプライド マテリアルズ インコーポレイテッド メンブレン膨張ステップなしの研磨ヘッドへの高速基板ローディング
JP2009131920A (ja) * 2007-11-29 2009-06-18 Ebara Corp 研磨装置及び方法
US8460067B2 (en) * 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI246448B (en) * 2000-08-31 2006-01-01 Multi Planar Technologies Inc Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
US20040137832A1 (en) * 2003-01-14 2004-07-15 Moon Jin-Ok Polishing head and chemical mechanical polishing apparatus
TWI301089B (en) * 2005-10-06 2008-09-21 Applied Materials Inc Carrier head with multiple chambers

Also Published As

Publication number Publication date
WO2010132181A2 (en) 2010-11-18
US9050699B2 (en) 2015-06-09
KR101647962B1 (ko) 2016-08-12
SG174850A1 (en) 2011-11-28
TW201102216A (en) 2011-01-16
US20100291842A1 (en) 2010-11-18
CN102227803A (zh) 2011-10-26
JP2012527119A (ja) 2012-11-01
US8460067B2 (en) 2013-06-11
WO2010132181A3 (en) 2011-01-13
US20130252518A1 (en) 2013-09-26
KR20120025446A (ko) 2012-03-15
CN102227803B (zh) 2014-09-17

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