JP2012516559A - フォトダイオードを作製するための方法、ならびに対応するフォトダイオードおよび電磁放射検出器 - Google Patents
フォトダイオードを作製するための方法、ならびに対応するフォトダイオードおよび電磁放射検出器 Download PDFInfo
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- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
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Abstract
Description
- 良好な信号雑音比を確実にするための、弱い電流の増幅および低い電子的な雑音指数(noise factor)
- アバランシェフォトダイオードを通って流れ、信号雑音比の低下の一因となる、暗電流の最小化
- アバランシェ利得の増大、および、
- バイアス電圧の低減
- 第1の下部層と第2の上部層との間に配置される中間層を備える3つの半導体層のスタックを生成するステップであって、3つの層は第1の導電型を有するステップと、
- 少なくとも中間層および第2の上部層と接触し、3つの層の平面に対して横断方向に延在する半導体領域を生成するステップであって、前記領域は、中間層とP-N接合を形成するために、第1の導電型と反対の第2の導電型を有するステップと
からなる方法に関する。
- 中間層は、第2の導電型を有する半導体材料で作製され、
- 中間層の厚さ、ならびに、第1および第2の層のドーパント濃度と、中間層のドーパント濃度とが、第1および第2の層に存在する第1の導電型のドーパントにより引き起こされる、第2の導電型から第1の導電型への、中間層の導電型の反転を得るように選択される。
- 1015cm-3から1017cm-3までの第1の導電型のドーパントの濃度、
- 0.5から2マイクロメートルまでの厚さ、および、
- 0.3から0.8までのモル比率x
を有する場合がある。
- 1014cm-3から1015cm-3までの第2の導電型のドーパントの濃度、
- 0.1から1マイクロメートルまでの厚さ、および、
- 0.1から0.5までのモル比率x、好ましくは0.2から0.3までのモル比率
を有する場合がある。
- 第1の層は、フォトキャリアを生成するために、入射光子と相互作用するように設計される相互作用層であってよく、
- 中間層は、フォトキャリア捕集層であってよく、第1および第2の層のそれぞれのバンドギャップの2倍より少ない幅であるバンドギャップを有する場合があり、
- かつ、第2の層は、捕集層にフォトキャリアを閉じ込めるように設計される閉じ込め層であってよい。
- 中間層は、フォトキャリアを生成するために、入射光子と相互作用するように設計される相互作用層、およびフォトキャリア捕集層の両方であってよく、中間層は、第1および第2の層のそれぞれのバンドギャップの幅より小さいバンドギャップを有し、かつ、
- 第1および第2の層は、捕集層にフォトキャリアを閉じ込めるように設計される閉じ込め層であってよい。
- 3つの層のスタックであって、第1の導電型を有する第1の半導体層1と第2の半導体層3との間に配置される中間層2を備えるスタックと、
- 3つの層1、2、3の平面に対して横断方向に延在し、少なくとも中間層2および第2の層3と接触し、第1の導電型と反対である導電型を有する領域4と
を備える。
- 1015cm-3から1017cm-3までの第1の導電型のドーパントの濃度、
- 0.5から2マイクロメートルまでの厚さ、および、
- 0.3から0.8までのモル比率x
を有する外因性半導体材料で作製される。
- 1014cm-3から1015cm-3までの第2の導電型のドーパントの濃度、
- 0.1から1マイクロメートルまでの厚さ、および、
- 0.1から0.5までのモル比率x、好ましくは0.2から0.3までのモル比率
を有する半導体材料で作製される。
- 中間層は、フォトキャリアを生成するために、入射光子と相互作用するように設計される相互作用層、およびフォトキャリア捕集層の両方であってよく、中間層は、第1および第2の層のそれぞれのバンドギャップの幅より小さいバンドギャップを有し、かつ、
- 第1および第2の層は、捕集層にフォトキャリアを閉じ込めるように設計される閉じ込め層であってよい。
2 中間層、層
3 第2の半導体層、第2の層、閉じ込め層、層
4 領域
5 パッシベーション層
6 接点、読み出しプロット
7 第1の反射面
8 第2の反射面
Claims (13)
- 少なくとも、
− 第1の下部層(1)と第2の上部層(3)との間に配置される中間層(2)を備える3つの半導体層のスタックを生成するステップであって、前記3つの層(1、2、3)は第1の導電型を有するステップと、
− 少なくとも前記中間層(2)および前記第2の上部層(3)と接触し、前記3つの層(1、2、3)の平面に対して横断方向に延在する半導体領域(4)を生成するステップであって、前記領域(4)は、中間層(2)とP−N接合を形成するために、前記第1の導電型と反対の第2の導電型を有するステップと
からなる、入射光子と相互作用することが可能なフォトダイオードを製造するための方法において、
− 前記中間層(2)は、前記第2の導電型を有する半導体材料で作製され、
− かつ、前記中間層(2)の厚さ、ならびに、前記第1および第2の層(1、2、3)のドーパント濃度と、前記中間層(2)のドーパント濃度とが、前記第1および第2の層(1、3)に存在する前記第1の導電型の前記ドーパントにより引き起こされる、前記第2の導電型から前記第1の導電型への、中間層(2)の導電型の反転を得るように選択される
ことを特徴とする、フォトダイオードを製造するための方法。 - 中間層(2)は、前記第1および第2の層(1、3)のそれぞれの厚さより小さい厚さを有することを特徴とする、請求項1に記載のフォトダイオードを製造するための方法。
- 中間層(2)は、意図的にはドープされておらず、前記第2の導電型の残留ドーパントを含む半導体材料で作製され、中間層(2)内の前記第2の導電型の残留ドーパントの濃度は、前記第1および第2の層(1、3)内それぞれの前記第1の導電型のドーパントの濃度より低いことを特徴とする、請求項1または2に記載のフォトダイオードを製造するための方法。
- 前記スタックの前記3つの層(1、2、3)を形成するために使用される前記半導体材料は、一般式がCdxHg1−xTeである、カドミウム、水銀およびテルルの合金であり、ただし、xは、0から1までの値であり、前記合金の組成でのカドミウムのモル比率を表すことを特徴とする、請求項1から3のいずれかに記載のフォトダイオードを製造するための方法。
- 前記第1および第2の層(1、3)は、それぞれ、
− 1015cm−3から1017cm−3までの前記第1の導電型のドーパントの濃度、
− 0.5μmから2μmまでの厚さ、および、
− 0.3から0.8までのモル比率x
を有し、前記中間層(2)は、
− 1014cm−3から1015cm−3までの前記第2の導電型のドーパントの濃度、
− 0.1μmから1μmまでの厚さ、および、
− 0.1から0.5までのモル比率x、好ましくは0.2から0.3までのモル比率
を有することを特徴とする、請求項4に記載のフォトダイオードを製造するための方法。 - 入射光子と相互作用することが可能であり、請求項1から5のいずれかに記載の方法により製造されるフォトダイオード。
- − 前記第1の層(1)は、フォトキャリアを生成するために、入射光子と相互作用するように設計される相互作用層であり、
− 前記中間層(2)は、フォトキャリア捕集層であり、前記第1および第2の層(1、3)のそれぞれのバンドギャップの2倍より少ない幅であるバンドギャップを有し、
− かつ、前記第2の層(3)は、前記捕集層にフォトキャリアを閉じ込めるように設計される閉じ込め層である
ことを特徴とする、請求項6に記載のフォトダイオード。 - − 中間層(2)は、フォトキャリアを生成するために、入射光子と相互作用するように設計される相互作用層、およびフォトキャリア捕集層の両方であり、前記中間層(2)は、前記第1および第2の層(1、3)のそれぞれのバンドギャップの幅より小さいバンドギャップを有し、
− かつ、前記第1および第2の層(1、3)は、前記捕集層にフォトキャリアを閉じ込めるように設計される閉じ込め層である
ことを特徴とする、請求項6または7に記載のフォトダイオード。 - 前記スタックの両側にそれぞれ配置される第1の反射面(7)および第2の反射面(8)により形成される光キャビティをさらに備えることを特徴とする、請求項6から8のいずれかに記載のフォトダイオード。
- 前記第1の反射面(7)は、金属ミラーであり、前記第2の反射面(8)は、分布ブラッグ反射鏡であることを特徴とする、請求項9に記載のフォトダイオード。
- 前記領域(4)は、第1の相互作用層(1)中に部分的に延在することを特徴とする、請求項6から9のいずれかに記載のフォトダイオード。
- 前記第2の層(3)は、パッシベーション層(5)により被覆されることを特徴とする、請求項6から10のいずれかに記載のフォトダイオード。
- 請求項6から12のいずれかに記載の、少なくとも1つのフォトダイオードを備える、電磁放射検出器。
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PCT/FR2010/050112 WO2010086543A1 (fr) | 2009-01-29 | 2010-01-26 | Procede de fabrication d ' une photodiode et photodiode et detecteur de rayonnement electromagnetique correspondants |
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JPH05175532A (ja) * | 1991-12-26 | 1993-07-13 | Nec Kansai Ltd | 光検出器及びその製造方法 |
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GB9322246D0 (en) * | 1993-10-28 | 1993-12-15 | Hitachi Europ Ltd | Improved metal-semiconductor-metal photodetector |
FR2879818B1 (fr) * | 2004-12-17 | 2007-04-20 | Commissariat Energie Atomique | Photodetecteur a semi-conducteur, dispositif de detection multi-spectrale d'un rayonnement electromagnetique mettant en oeuvre un tel photodetecteur, et procede de mise en oeuvre d'un tel dispositif |
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