JP2012506128A5 - - Google Patents

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Publication number
JP2012506128A5
JP2012506128A5 JP2011532277A JP2011532277A JP2012506128A5 JP 2012506128 A5 JP2012506128 A5 JP 2012506128A5 JP 2011532277 A JP2011532277 A JP 2011532277A JP 2011532277 A JP2011532277 A JP 2011532277A JP 2012506128 A5 JP2012506128 A5 JP 2012506128A5
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JP
Japan
Prior art keywords
control valve
temperature
flow control
process chamber
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011532277A
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English (en)
Japanese (ja)
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JP2012506128A (ja
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Publication date
Priority claimed from US12/253,657 external-priority patent/US9155134B2/en
Application filed filed Critical
Publication of JP2012506128A publication Critical patent/JP2012506128A/ja
Publication of JP2012506128A5 publication Critical patent/JP2012506128A5/ja
Pending legal-status Critical Current

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JP2011532277A 2008-10-17 2009-10-16 プラズマ処理装置内における高速応答熱制御のための方法及び装置 Pending JP2012506128A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/253,657 2008-10-17
US12/253,657 US9155134B2 (en) 2008-10-17 2008-10-17 Methods and apparatus for rapidly responsive heat control in plasma processing devices
PCT/US2009/060979 WO2010045538A2 (en) 2008-10-17 2009-10-16 Methods and apparatus for rapidly responsive heat control in plasma processing devices

Publications (2)

Publication Number Publication Date
JP2012506128A JP2012506128A (ja) 2012-03-08
JP2012506128A5 true JP2012506128A5 (OSRAM) 2014-10-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011532277A Pending JP2012506128A (ja) 2008-10-17 2009-10-16 プラズマ処理装置内における高速応答熱制御のための方法及び装置

Country Status (7)

Country Link
US (2) US9155134B2 (OSRAM)
JP (1) JP2012506128A (OSRAM)
KR (1) KR101455249B1 (OSRAM)
CN (1) CN102187742B (OSRAM)
SG (1) SG195553A1 (OSRAM)
TW (1) TWI533764B (OSRAM)
WO (1) WO2010045538A2 (OSRAM)

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CN111383881B (zh) * 2018-12-27 2023-03-07 中微半导体设备(上海)股份有限公司 一种电容耦合等离子体处理器及其温度调节方法
KR20220065843A (ko) * 2019-09-23 2022-05-20 램 리써치 코포레이션 예열된 샤워헤드를 포함하는 저온 플라즈마 강화된 화학적 기상 증착 (pecvd) 프로세스
CN113097097A (zh) * 2019-12-23 2021-07-09 中微半导体设备(上海)股份有限公司 等离子体刻蚀装置及其工作方法
EP3843501B1 (en) * 2019-12-23 2022-10-19 Kanthal GmbH Methods and systems for cooling a heating element
US12278094B2 (en) * 2020-05-08 2025-04-15 Applied Materials, Inc. Methods and apparatus for processing a substrate
WO2023043526A1 (en) * 2021-09-17 2023-03-23 Applied Materials, Inc. Energy efficiency improvement with continuous flow modulation in cluster tool
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