JP2012243575A - Manufacturing method of electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To positively remove foreign matters from the inside of an airtight container in the manufacturing method of an electronic apparatus in which an electronic device is enclosed in the airtight container.SOLUTION: A plurality of container members 3, 4 housing an electronic device therein are temporarily aligned with each other with a clearance d interposed to assemble an airtight container 2. With the airtight container erected with a suction hole 7 located at the lower side, a dust-suction process for suctioning the inside from the suction hole by dust-suction means 5 while tapping from both sides of the airtight container to produce vibration is executed. During the process, the electronic device inside is grounded at the same time. Then, a sealing process for sealing the container members to manufacture the airtight container 2 is executed, and air in the container is discharged to seal the container. The volume of foreign matters in the airtight container is decreased, lowering the defective rate.

Description

  The present invention relates to a method of manufacturing an electronic device in which an electronic device is sealed inside an airtight container, and in particular, the airtight container can be manufactured in a state in which the foreign material is more reliably removed from the inside. The present invention relates to a method for manufacturing an electronic device in which various functional failures are less likely to occur.

  Patent Document 1 discloses an invention relating to a method for manufacturing a thin image display device. According to the present invention, in the manufacture of an image forming apparatus that includes an electron source 71 having a large number of surface conduction electron-emitting devices 74 and a fluorescent film 84 that forms an image with an electron beam in an envelope 88, After the electron source 71 and the fluorescent film 84 are disposed in the envelope 88, a cleaning process for removing dust inside the envelope 88 is performed. The cleaning step may be a dust collection step by dust collection means provided at a connection portion between the vacuum exhaust device and the envelope, or may be electric dust collection. Moreover, the washing | cleaning process performed by flowing a liquid in an envelope may be sufficient. According to a thin image display device manufactured by this method, a uniform image can be obtained with few color shifts and missing pixels.

JP 2000-149787 A

  According to the method of manufacturing an image forming apparatus described in Patent Document 1, an envelope provided with an electron source and a fluorescent film is assembled in a sealing process to form an airtight structure, and then communicated with the envelope. In the exhaust / sealing process of sealing the suction pipe after exhausting the inside from the exhaust pipe to a high vacuum state, the dust mixed in the envelope is simultaneously removed by the exhaust process of the same process. . That is, in the present invention, an exhaust process for exhausting the inside of the envelope, which has been completed in an airtight state, to a high vacuum state and a dust suction process for removing foreign matter in the envelope by suction or the like are performed simultaneously.

  As described above, according to the method of manufacturing the image forming apparatus described in Patent Document 1, the exhaust conductance is increased because the inside of the envelope assembled in an airtight state is sucked, and a necessary high vacuum state is obtained. It takes a long time to exhaust the air and it is not effective in terms of dust collection, and only a part of the foreign matter in the area close to the part where the exhaust pipe is connected in the envelope can be sucked out. Many foreign substances that could not be removed remained in the envelope.

  The present invention has been made to solve the above-described problems in the prior art, and in a method for manufacturing an electronic device in which an electronic device is sealed inside an airtight container, foreign matters are more reliably removed from the inside. An object of the present invention is to provide a method for manufacturing an electronic device in which various malfunctions due to the presence of foreign substances are unlikely to occur.

The method for manufacturing an electronic device according to claim 1 is:
In a method for manufacturing an electronic apparatus, comprising: an airtight container in which a plurality of combined container members are sealed; and an electronic device housed in the airtight container.
A plurality of the container members are combined with a gap in a state in which the electronic device is housed therein, and after performing a dust suction step for sucking the inside of the combined plurality of container members, the plurality of container members are sealed. And performing a sealing process for manufacturing the airtight container.

The method for manufacturing an electronic device according to claim 2 is the method for manufacturing an electronic device according to claim 1,
A suction hole is formed in a part of the container member serving as an end of the hermetic container, and a plurality of the combined container members are set in a posture in which the suction hole is positioned below, and vibration is applied to the container member. It is characterized in that the dust-absorbing step is performed while giving.

The method for manufacturing an electronic device according to claim 3 is the method for manufacturing an electronic device according to claim 1 or 2,
The dust absorption step is performed while grounding the electronic device.

  The electronic device manufacturing method according to claim 4 is the electronic device manufacturing method according to any one of claims 1 to 3, wherein the gap of the container member is held by a gap holding member. It is said.

  According to the method for manufacturing an electronic device according to claim 1, in the imposition process of assembling the airtight container with the container member, the plurality of container members are set in a predetermined manner so that an airtight container in which the electronic device is housed is configured. Combine with a gap. Next, a dust suction step is performed in which the inside is sucked by suction means from the gap between the imposed container members, and foreign substances that may be present inside are sucked and removed. In this step, the inside of the hermetic container before sealing is communicated to the outside through gaps between a plurality of combined container members. For this reason, when the suction means sucks the inside at a certain position among the gaps of the plurality of container members, the air passes from the outside to the inside of the airtight container through a gap at a different position from the sucked position. Inflow. Therefore, there is little resistance when sucking the inside of the hermetic container, an air flow is generated inside the hermetic container, and the foreign matter is carried along the air flow and can be easily sucked out of the hermetic container by the suction means. . If the container member is sealed after sucking out the foreign matter inside, an airtight container with the foreign matter removed from the inside is manufactured. Thereafter, if necessary, an exhaust process for exhausting from the hole provided in the hermetic container in order to bring the inside of the hermetic container into a high vacuum state, and then a sealing process for sealing the hole is performed. An electronic apparatus in which an electronic device is housed inside the container is completed.

  According to the method for manufacturing an electronic device according to claim 2, a plurality of airtight containers combined so that suction holes provided at the end portions of some container members are positioned relatively downward. The posture of the container member is set, and the dust suction process is performed while applying vibration to the container member. For this reason, even if foreign matter inside the hermetic container before sealing is attached to the inner surface of the container part etc., it is separated from the container part etc. by vibration and falls in the hermetic container and is relatively lower Since it is sucked out from the suction hole, it can be reliably discharged out of the airtight container.

  In the electronic device manufacturing method according to claim 3, in the dust suction process, an air flow is generated in the airtight container, and foreign matters such as dust move on the airflow and the inner surface of the airtight container or electronic It is conceivable that static electricity is generated in the electronic device because it contacts the device. However, in this method, since the dust suction process is performed in a state where the electronic devices in the plurality of container members combined in the shape of an airtight container are grounded, even if static electricity is generated as described above, the static electricity is not grounded. The electronic device is less likely to break down due to static electricity.

  According to the method for manufacturing an electronic device described in claim 4, since the gap of the container member can be held to a predetermined size by the gap holding member, it is possible to reliably suck out dust and the like in the dust suction step. it can.

It is typical sectional drawing explaining the outline | summary of the manufacturing method which concerns on embodiment of this invention. (A) is process drawing of the manufacturing method which concerns on embodiment of this invention, (b) is process drawing of the conventional manufacturing method. In the manufacturing method which concerns on embodiment of this invention, it is a figure which shows the state in the dust absorption process of the electronic device used as manufacture object, Comprising: (a) is a top view, (b) is in the bb cutting line of (a). It is sectional drawing. It is a figure of the dust suction apparatus used by embodiment of this invention, Comprising: (a) is a front view, (b) is a top view, (c) is a left view. It is an enlarged front view which shows the tapping part of the dust suction apparatus used by embodiment of this invention. It is the 1st figure which compares and shows the defective rate of the electronic device manufactured with the manufacturing method concerning the embodiment of the present invention, and the defective rate of the electronic device manufactured with the conventional manufacturing method. It is the 2nd figure which compares and shows the defective rate of the electronic device manufactured with the manufacturing method concerning the embodiment of the present invention, and the defective rate of the electronic device manufactured with the conventional manufacturing method.

Embodiments described herein relate generally to a method for manufacturing a fluorescent light-emitting device that is an example of an electronic device. First, the outline of the present manufacturing method will be described with reference to FIG. 1 showing a process before sealing and FIG. 2 showing a flow of the process.
As shown in FIG. 1, this fluorescent light emitting device 1 includes an electronic device (not shown) including a light emitting element in a box-shaped airtight container 2 in which a plurality of container members, at least a part of which are translucent, are combined. This is an apparatus having a structure in which an electronic element) is housed. In the example shown in FIG. 1, the container members 3 and 4 constituting the hermetic container 2 include a container part 3 as one container member that is a box-shaped lid that is open on one side, and the container part 3 is opened. The other substrate member 4 is imbedded on the other side, and both are sealed (adhered) and fixed via a sealing (adhesive) glass or the like (not shown). An electronic device (not shown) inside the hermetic container 2 is formed on the inner surface side of the substrate 4 or mounted on the substrate 4 and is provided with an external terminal (not shown) connected to the electronic device. The metal terminal) is led out through the sealing portion of the container 3 and the substrate 4 in an airtight manner. Accordingly, the gap d between the combined container members 3 and 4 corresponds to the thickness of the external terminal as a gap holding member penetrating therethrough.

  A first feature of the manufacturing method of the present embodiment is that an imposition process A is performed in which the container members 3 and 4 are combined with a gap in a state where the electronic device is housed therein (see FIGS. 1 and 2A). Next, a dust suction process B (also referred to as “exhaust hole dust suction process B”) in which the inside is sucked by the dust suction means 5 is performed (see FIG. 1 and FIG. 2A), and then each container member 3, 4 is performed. Is a sealing process C for manufacturing the airtight container 2 by sealing (see FIG. 2A). In the dust suction process B, external gas (such as air or inert gas) flows into the airtight container 2 from the gap d between the combined container members 3 and 4. In this case, the exhaust resistance is reduced, a gas flow is generated inside the hermetic container 2, and the foreign matter 6 can be easily sucked out of the hermetic container by the dust suction means 5 on the gas flow.

  The second feature is that suction is performed from the lower side of the combined container members 3 and 4 when the dust suction process B shown in FIGS. 1 and 2A is performed. In order to perform suction from the lower side in this way, the suction hole 7 formed in a part of the container member 3 is located at a position biased to one side of the airtight container 2 in a state where the container members 3 and 4 are combined. Keep it. In the dust suction process B, the postures of the combined container members 3 and 4 are set to be vertically placed so that the suction hole 7 comes downward. If suction is performed from the suction hole 7 positioned below in this way, the foreign matter 6 that may be present inside the combined container members 3 and 4 falls downward due to gravity. It becomes easy to suck out from.

  The third feature is that the dust suction process B shown in FIGS. 1 and 2A is performed while applying vibration to the container members 3 and 4 combined as shown in FIG. Such an operation of hitting in order to apply vibration is referred to herein as tapping. This feature may be based on the second feature, or a certain effect can be obtained even if it is adopted separately from the second feature. Even if the foreign matter adheres to the inner surfaces of the combined container members 3 and 4 before sealing and the foreign matter 6 cannot be easily removed by suction, the container members 3 and 4 vibrate. Therefore, the foreign material 6 can be separated from the container members 3, 4 and the like and easily sucked out of the airtight container 2 by the dust suction means 5. In addition, if the combined container members 3 and 4 are sucked while being set in such a posture that the suction hole 7 is positioned below, the foreign matter 6 separated from the container members 3 and 4 etc. will fall inside. Then, since it gathers around the suction hole 7, it is easy to suck out from the lower suction hole 7, and the discharge to the outside of the airtight container 2 becomes more reliable.

  The fourth feature is that the dust suction process B shown in FIGS. 1 and 2A is performed while grounding the electronic devices in the combined container members 3 and 4. The foreign matter 6 such as dust is moved by the air flow generated in the dust suction process B, and friction between the air flow and the inner surface (including the electronic device) of the hermetic container 2 or the foreign matter and the inner surface of the hermetic container 2 (including the electronic device). ), Even if static electricity is generated due to the friction between the electronic device and the electronic device, the electronic device can be discharged by performing the dust-absorbing process B with the electronic device grounded. There is no problem of being sucked by the container members 3 and 4.

  Among fluorescent light emitting devices, there is a type in which a semiconductor chip for controlling light emission driving and the like is housed in an airtight container as part of an electronic device. In the process, since the static electricity generated by the suction of air is released as in the present embodiment, failure of the semiconductor chip due to static electricity can be prevented, which is advantageous.

  According to the manufacturing method of the present embodiment, as shown in FIG. 1, after the foreign matter 6 is reliably removed from the inside of the combined container members 3 and 4 as described above, as shown in FIG. Then, the sealing step C for manufacturing the airtight container 2 by sealing the container members 3 and 4 is performed. Then, if the exhaust process D which exhausts the inside of the airtight container 2 from an exhaust pipe etc. is performed, and also the sealing process E which closes the exhaust pipe and closes the inside of the airtight container 2 is performed, foreign substances 6 such as dust will be contained inside. The fluorescent light emitting device 1 without contamination is completed. In addition, when performing the exhaust process D, you may exhaust internal gas from the suction hole 7 mentioned above, and in that case, the suction hole 7 will be closed in an airtight state by the sealing process E.

  On the other hand, as shown in FIG. 2 (b), in the manufacturing process of the conventional fluorescent light emitting device, after combining a plurality of container members in the form of an airtight container in the imposition process A, the combination in the sealing process C The sealing glass provided between the container members is heated and melted to bond the container members together to complete an airtight container with airtightness. Thereafter, an exhaust process D for exhausting the inside through an exhaust pipe or the like communicating with the hermetic container is performed, and a sealing process E for closing the exhaust pipe or the like is performed when a necessary degree of vacuum is obtained. Thus, in the exhaust process D, since the inside of the completed airtight container is sucked, external air does not flow into the inside through the gap between the container members, so that sufficient air flow does not occur inside the airtight container. , Foreign matter is not sucked out sufficiently.

Next, a specific example of a method for manufacturing a fluorescent light emitting device that is a vacuum electronic device according to an embodiment of the present invention will be described with reference to FIGS.
FIG. 3 is a view showing the fluorescent light emitting device 11 or the airtight container 12 in the course of assembly, which is an object of the manufacturing method of the present embodiment. In addition, about the whole fluorescence light-emitting device 11 or the airtight container 12, and its component parts, it shall refer with the same code | symbol during assembly and after completion for convenience of explanation. The fluorescent light emitting device 11 has a box-shaped panel-like airtight container 12. The airtight container 12 is a combination of two rectangular substrates 13 and 14 as container members facing each other so as to be parallel to each other at a predetermined interval. A suction hole 15 used for exhausting the inside in the exhaust process is formed through substantially the center of one end of the exhaust.

  An electronic device 16 including a light emitting element and an electron source is accommodated in the hermetic container 12. The light emitting element (display element) includes, for example, an anode provided with a phosphor, and the electron source includes a planar cathode such as a filament cathode coated with an electron emitting material, or an FEC (field emission cathode). There are electron sources. In addition, a control electrode that controls the movement of electrons emitted from the electron source may be provided between the electron source and the anode. Since at least some of the substrates 13 and 14 constituting the hermetic container 12 are translucent, the light emitted from the electronic device 16 can be visually recognized through the substrates 13 and 14 from the outside. The external terminal 17 connected to the electronic device 16 is led out to the outside through a gap on the long side of the combined substrates 13 and 14. The external terminals 17 include energization leads such as an anode lead connected to the anode, a grid lead connected to the control electrode, a filament lead connected to the cathode, and a driver chip lead connected to the semiconductor chip. . Therefore, the distance between the two substrates 13 and 14 corresponds to the thickness of the external terminal 17 and is, for example, about 0.2 mm. When these two substrates 13 and 14 are completed, the periphery of the substrates 13 and 14 is sealed and fixed with sealing glass or the like to constitute the hermetic container 12, but in the state shown in FIG. Are only combined facing each other at a predetermined interval and have not been sealed yet. This is because when the inside of the hermetic container 12 is sucked in the subsequent dust sucking step, the foreign matter is sucked out efficiently with a small suction resistance.

  As shown in FIG. 3, the two combined substrates 13 and 14 are placed on a dish-like back plate 18 having a rectangular shape in plan view. An open hole 19 is formed in the center of the back plate 18 so that the central portion of one substrate 14 is exposed. Further, the pair of long sides of the back plate 18 constitutes a flange 20 projecting outward in parallel with the substrates 13 and 14, and an external portion derived from the long sides of the two combined substrates 13 and 14. The terminal 17 comes into contact with the flange 20 and is supported without being deformed. Then, the two combined substrates 13 and 14 and the back plate 18 are sandwiched in the thickness direction at four locations by clips 21 as holding means and are held together as a whole. The back plate 18 including the flange 20 is conductive, and the external terminal 17 connected to the electronic device 16 in the fluorescent light emitting device 11 is electrically connected to the flange 20 of the back plate 18. Can be discharged from the electronic device 16 of the fluorescent light emitting device 11 by connecting (grounding) to the ground.

  Assembling the airtight container 12 in this way is referred to as “imposition”, and in this embodiment, the airtight container 12 or the fluorescent light emitting device 11 in the imposition state is temporarily fixed by the back plate 18 and the clip 21, and the substrate 13, 14 can be handled with a gap between them.

  As will be described later, the back plate 18 that temporarily fixes the airtight container 12 in the imposition state is sent to the sealing process as it is after the dust suction process and heated together with the airtight container 12. The function as a soaking plate for uniformly heating the airtight container 12 is also exhibited.

FIG. 4 is a diagram of the dust suction device 25 used in the manufacturing method of the present embodiment.
An operation table 27 of the hermetic container 12 is installed on a substrate 26 installed on a base (not shown). The operating table 27 is provided with a suction holding unit 28 so that the fluorescent light emitting device 11 placed on the operating table 27 can be held by air suction. The fluorescent light-emitting device 11 placed on the operation table 27 is illustrated in a simplified manner in FIG. 4, but is actually temporarily fixed with a back plate 18 and a clip 21 as shown in FIG. The back plate 18 is placed on the operation table 27 so that the back plate 18 contacts the operation table 27 on the lower side.

  As shown in FIG. 4, the operation console 27 is attached to a shaft of a rotation cylinder 29 installed on the substrate 26. The rotating cylinder 29 is a rotary actuator that operates by air pressure. The operation table 27 can be arbitrarily moved between a horizontal receiving position and a vertical dust suction position by driving the rotation cylinder 29. The receiving position is a position at which the operation table 27 is supported by the support rod 30 in a horizontal state with respect to the base 26. The airtight container 12 is supplied and placed in a horizontal state on the operation table 27 in the receiving position, and is held by the suction holding unit 28. The dust absorption position is a position where the operation table 27 rotates upward from the horizontal position and becomes perpendicular to the base 26. Since the airtight container 12 held on the operation console 27 at the dust absorption position receives internal suction in the dust suction process, the suction hole 15 (not shown) is placed vertically.

  As shown in FIG. 4, the operating table 27 includes a first tapping device 31 as a vibrating means for applying vibration by hitting the airtight container 12 held by the operating table 27 by the suction holding unit 28. A tapping unit 32 is provided. The tapping device 31 has a configuration in which a tapping head 35 made of an elastic material is attached to the tip of the air cylinder 34, similarly to the tapping device 31 of the second tapping portion 33 described later shown in FIG. The three tapping devices 31 are arranged at positions corresponding to the opening holes 19 of the back plate 18 of the fluorescent light emitting device 11 held on the operation table 27, and the fluorescent light emitting device 11 is connected through the opening holes 19. One substrate 14 can be contacted. Accordingly, by supplying air pressure of an appropriate cycle to the first tapping unit 32, the drive unit of each air cylinder 34 is reciprocated back and forth at an appropriate repetition cycle, and the tapping head 35 is moved back and forth (in the left-right direction in FIG. 5). Can be reciprocated to strike and vibrate one substrate 14 (substrate on the lower surface side) of the hermetic container 12.

  The operation console 27 is made of a conductive resin and is grounded. Accordingly, when the fluorescent light emitting device 11 temporarily fixed by the back plate 18 and the clip 21 is placed on the operation table 27 and held by the suction holding unit 28, the fluorescent light is emitted via the conductive back plate 18 and the external terminal 17. The electronic device 16 inside the light emitting device 11 is grounded, and static electricity can be released. For this reason, the electronic device 16 can be protected from static electricity that may be generated by friction between air and foreign matter and the airtight container 12 in the dust suction process.

  As shown in FIG. 4, a second tapping portion 33 that vibrates the vertically installed hermetic container 12 held on the operation table 27 at the dust absorption position is provided adjacent to the operation table 27. As described above with reference to FIG. 4, the basic configuration of the second tapping unit 33 is substantially the same as that of the first tapping unit 32. However, the three tapping devices 31 included in the second tapping unit 33 are arranged in the vertical direction so that they can come into contact with the other substrate 13 of the airtight container 12 placed vertically by the operation table 27 set at the dust absorption position. Are arranged at appropriate intervals. Therefore, by supplying air pressure of an appropriate cycle to the second tapping unit 33, the drive unit of each air cylinder 34 is moved back and forth at an appropriate repetition cycle, and the other substrate 13 of the airtight container 12 is moved by the tapping head 35. It can be vibrated by tapping (the substrate on the upper surface side).

  It should be noted that the strength of tapping by the first tapping unit 32 and the second tapping unit 33 can most effectively remove foreign substances from the inner surface as long as the hermetic container 12 and the internal electronic device 16 are not damaged. Set to degree. The timing of tapping by the first tapping unit 32 and the second tapping unit 33 is arbitrary, and the timing of hitting may be shifted or simultaneous. Further, since tapping is an example of a vibration method and a tapping device is an example of a vibration unit, a vibration method other than tapping and a vibration unit other than a tapping device may be used.

  As shown in FIG. 4, dust suction means 36 is provided adjacent to the operation console 27. The dust suction means 36 is a means for sucking the inside of the airtight container 12 held by the operation console 27 at the dust suction position and sucking out foreign matter. The dust suction means 36 of the present embodiment is a tube in which an open-ended dust suction port is provided with an O-ring for preventing air leakage, and a suction pump (not shown) is connected to the other end. When the operating table 27 holding the airtight container 12 is rotated upward from the horizontal receiving position and set to the dust suction position, the suction hole 15 of the airtight container 12 placed in the vertical position is in an airtight state in the dust suction port of the dust suction means 36. Connected.

  As shown in FIG. 4C, the dust suction device 25 of this embodiment is housed in a clean box 37. The airtight container 12 temporarily fixed in the imposition process is transported by a transport means (not shown), brought into the clean box 37, and placed and held on the operation table 27 of the dust suction device 25 set at the receiving position. The The airtight container 12 that has undergone the dust suction process is carried out of the clean box 37 by a conveying means (not shown), and is carried to the next sealing process.

  The clean box 37 is not a completely sealed structure, but has a structure in which dust is difficult to enter from the outside. Further, on the upper part of the clean box 37 is a static eliminator that removes static electricity from the airtight container 12 brought into the clean box 37. 38 is provided. The static eliminator 38 includes a blower unit that alternately generates + and − air ions, and a detection unit that detects an ionic current generated by a potential difference between the airtight container 12 and the blower part to detect a charging state of the airtight container 12. I have. And the static elimination apparatus 38 can perform the optimal static elimination according to the charge condition of the airtight container 12 by supplying required ion from a blower part according to the charge amount and polarity of the airtight container 12 which the detection part detected. it can. According to the static eliminator 38, by removing static electricity from the hermetic container 12, dust or the like adhering to the hermetic container 12 due to static electricity can be removed and dropped. It should be noted that the static elimination principle of the static elimination device 38 is not limited to the above-described principle, and static electricity may be removed from the airtight container 12 by other principles.

A method for manufacturing the fluorescent light-emitting device 11 using the dust suction device 25 described above will be described with reference to FIGS.
The hermetic container 12 of the fluorescent light emitting device 11 shown in FIG. 3 temporarily fixed in the imposition process is carried into the clean box 37 shown in FIG. 4C by a conveying means (not shown), and shown in FIG. Is placed on the operation table 27 of the dust suction device 25 in the horizontal receiving position. After the suction holding unit 28 sucks the airtight container 12 and holds it on the operation table 27, as shown in the arrow in FIG. 4A and FIG. The dust-absorbing position is set, and the airtight container 12 is placed in a vertical position. Thereby, the dust suction port of the dust suction means 36 is connected to the suction hole 15 of the airtight container 12 in an airtight state. Here, the suction pump (not shown) is operated, and the first tapping unit 32 and the second tapping unit 33 are operated. The first tapping portion 32 and the second tapping portion 33 strike the airtight container 12 from the upper surface and the lower surface to give vibration, and the dust suction means 36 sucks the inside of the airtight container 12 from the lower suction hole 15.

  In this dust suction process, the inside of the hermetic container 12 before sealing is communicated to the outside through a gap between the two substrates 13 and 14 combined. For this reason, when the dust suction means 36 sucks the inside from the suction hole 15, air flows from the outside to the inside of the airtight container 12 through the gap between the substrate 13 and the substrate 14. Therefore, the resistance when sucking the inside of the hermetic container 12 is small, and an air flow from the upper side to the lower side is generated inside the hermetic container 12, and the foreign matter is carried downward along the air flow, and gathered and sucked downward. It is sucked out from the hole 15 by the dust suction means 36.

  Further, in the dust suction process, the airtight container 12 is vertically placed so that the suction hole 15 is positioned below, and the first and second tapping parts 32 and 33 further vibrate the airtight container 12 from both sides. It is done while giving. For this reason, even if the foreign matter inside the hermetic container 12 before sealing is attached to the inner surface of the hermetic container 12 or the like, the foreign matter is separated from the hermetic container 12 by vibrations and falls inside, so that the lower suction hole 15 is sucked out of the airtight container 12 and can be reliably discharged out of the hermetic container 12.

  Further, in the dust suction process, a flow of air is generated in the hermetic container 12 to cause friction with the inner surface of the hermetic container 12 and the electronic device 16, and foreign substances such as dust moving on the air flow are retained in the hermetic container 12. Since friction occurs due to contact with the inner surface or the electronic device 16, static electricity may be generated in the hermetic container 12 or the electronic device 16. However, in the dust suction process of this method, the external terminal 17 connected to the electronic device 16 inside the hermetic container 12 is grounded via the back plate 18 and the operation table 27. Even if static electricity is generated as described above, the static electricity escapes to the ground, so that the electronic device 16 is less likely to fail due to the static electricity.

  When the dust suction step is completed, the suction pump is stopped and the first tapping unit 32 and the second tapping unit 33 are stopped. The rotating cylinder 29 sets the operation table 27 from the vertical dust suction position to the horizontal receiving position, and puts the airtight container 12 in a horizontal state. The suction holding unit 28 stops the suction and releases the holding of the airtight container 12 with respect to the operation table 27. Thereafter, a conveying means (not shown) takes out the airtight container 12 from the operation table 27 and carries it out of the clean box 37. It should be noted that the static eliminator 38 of the clean box 37 is always in operation and exhibits a function of constantly removing static electricity from the hermetic container 12.

  Thereafter, the temporarily fixed airtight container 12 is subjected to a baking process in the sealing process, whereby the sealing glass is melted and solidified, the gap between the substrates 13 and 14 is sealed, and foreign matters are removed from the inside. The airtight container 12 is fixed. Thereafter, in the exhaust process, if the suction hole 15 of the hermetic container 12 is used as an exhaust hole, the interior is evacuated and the inside is brought into a high vacuum state, and the suction hole 15 is sealed in the sealing process, The fluorescent light emitting device 11 in which the electronic device 16 is housed is completed.

Next, specific numerical examples in the manufacturing method of the embodiment described above will be described based on actual experimental data.
The internal volume of the hermetic container 12 of the fluorescent light emitting device 11 in this embodiment is 26280 mm ² in one experimental example, the inner diameter of the suction hole 15 is 4 mm, the inner diameter of the O-ring of the dust suction means 36 is 10 mm, and the outer diameter is 13 mm. Met. When dust suction was repeatedly carried out at a suction speed of 30 m / sec with a suction pump in the dust suction process, it was confirmed that the glass foreign matter could be removed without problems in a dust suction time of 7 seconds or longer. Increasing the suction speed may increase the amount of charge of the electronic device 16 due to friction with air and cause a failure, but no problem occurred at least up to 45 m / sec. When the suction speed is lowered, it has been found that a speed exceeding at least 15 m / sec is necessary to effectively remove foreign matter with a dust suction time of 7 sec.

  It is preferable that the tapping for applying vibration to the hermetic container 12 is performed from both surfaces of the hermetic container 12 as described in the embodiment as a result of the experiment. As for the strength of tapping, the movement of the foreign matter is promoted as the tapping force increases. However, since there is a concern that the electronic device 16 breaks down or the substrates 13 and 14 are damaged, an experiment is performed under various conditions. When the range of tapping strength was confirmed, no problem occurred in the range of 300 to 1000 G.

  Regarding the failure of the electronic device 16 due to static electricity during dust absorption, it was confirmed that the problem does not occur if the charge amount on the surface of the electronic device 16 is 20 V or less due to the effect of the static eliminating device 38 in the clean box 37. Moreover, about the cleanliness in the clean box 37, it confirmed that a problem would not arise if it was 0.5 or less and 1000 or less.

Next, the effect of the product manufactured by the manufacturing method of the embodiment described above will be described with reference to FIGS.
In these drawings, a predetermined number of fluorescent light emitting devices 11 having the same structure are manufactured by the manufacturing method of the present embodiment and the conventional manufacturing method, respectively, and the defect of the fluorescent light emitting device 11 manufactured by the manufacturing method of the present embodiment is not shown. The rate is compared with the defect rate of the fluorescent light-emitting device 11 manufactured by the conventional manufacturing method. In each item in each figure, the left bar graph shown in gray indicates the defect rate of the product (suction hole dust collection) according to the present embodiment, and the right bar graph indicated in white indicates the defect rate of a general product (conventional product). Indicates. The fluorescent light emitting device 11 of the present embodiment and the fluorescent light emitting device 11 according to the conventional manufacturing method have the same conditions such as the shape, structure, dimensions, material, etc. of the device itself, and only the manufacturing method is different. Therefore, it is considered that the difference in the defective rate observed in these drawings is caused by the difference in the manufacturing method.

  In FIG. 6, the defective rate of insulation failure is 0.011 or more for the conventional product (right side), whereas it is about 0.009 for the product (left side) according to this embodiment. The defect rate of disconnection failure was smaller for the product according to the present embodiment (left side) than for the conventional product. The defect rate of IC-related defects was about 0.0005 for the conventional product (right side), whereas it was 0 for the product according to the present embodiment (left side). Since the fluorescent light emitting device of the type in which the IC is housed in the hermetic container 12 is more expensive than the type that does not include the IC, a high yield is required, but this embodiment satisfies the requirement.

  In FIG. 7, the defect rate of the foreign matter in the pipe is about 0.002 for the conventional product (right side), whereas it is 0 for the product (left side) according to this embodiment. The defect rate of glass inner surface contamination was about 0.007 for the conventional product (right side), whereas it was about 0.002 for the product according to this embodiment (left side). The defect rate of luminance unevenness is as high as about 0.0225 for the conventional product (right side), but as low as about 0.008 for the product according to the present embodiment (left side).

  Further, although not shown, substrate glass chipping, glass scratches, and leakage light emission defects were found in the conventional product, but were not recognized at all in the product according to the present embodiment. Moreover, when the inside of the airtight container 12 is sucked and sucked, it is expected that a defect that the coating of the filament is peeled off due to the movement of the foreign matter and colliding with the filament. As a result, the above-mentioned peeling failure occurred at a constant failure rate in the conventional product, but was not recognized at all in the product according to this embodiment.

  In the manufacturing method of the embodiment described above, the fluorescent light emitting device is exemplified as an example of the electronic device to be manufactured. However, the electronic device targeted by the manufacturing method of the present invention is not limited to this, and a plurality of container members It is sufficient that an electronic device having some function is housed in an airtight container, particularly a vacuum airtight container. For example, a display device capable of displaying various information as well as a light emitting function, and a display having an electrostatic switch function It may be a device or various sensors using FEC.

DESCRIPTION OF SYMBOLS 1 ... Fluorescence light-emitting device 2 ... Airtight container 3 ... Container part as container member 4 ... Substrate as container member 5 ... Dust-absorbing means 7 ... Suction hole 8 ... Excitation means 11 ... Fluorescent light-emitting device 12 ... Air-tight container 13, 14 ... Substrate 15 as a container member 15 suction hole 16 electronic device 17 external terminal 18 back plate 25 dust suction device 31 tapping device as vibration means 36 dust suction means 38 static elimination means

Claims (4)

In a method for manufacturing an electronic apparatus, comprising: an airtight container in which a plurality of combined container members are sealed; and an electronic device housed in the airtight container.
A plurality of the container members are combined with a gap in a state in which the electronic device is housed therein, and after performing a dust suction step for sucking the inside of the combined plurality of container members, the plurality of container members are sealed. And a sealing process for manufacturing the airtight container. A suction hole is formed in a part of the container member serving as an end of the hermetic container, and a plurality of the combined container members are set in a posture in which the suction hole is positioned below, and vibration is applied to the container member. The method of manufacturing an electronic device according to claim 1, wherein the dust suction step is performed while applying the dust. The method of manufacturing an electronic device according to claim 1, wherein the dust suction step is performed while grounding the electronic device. The method for manufacturing an electronic device according to claim 1, wherein the gap of the container member is held by a gap holding member.

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