JP2012240808A - Separation device and separation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a separation device and a separation method that can surely separate an adhesive sheet from a plate-like member, while minimizing an occupying space to a floor surface.SOLUTION: This separation device 1 includes a first sheet support means 2 for supporting a first adhesive sheet S1, a second sheet support means 3 for supporting a second adhesive sheet S2 by a support surface 31 contacting with the other surface side of the second adhesive sheet S2, an abutting means 4 for sandwiching a wafer W with the second sheet support means 3 by contacting an abutting surface 4A with the other surface of the first adhesive sheet S1, a moving means 5 for relatively moving the first sheet support means 2 and the second sheet support means 3 in the orthogonal direction to the support surface 31, and a rotary means 6 for relatively rotating the first sheet support means 2 and the second sheet support means 3 on a plane parallel to the support surface 31.

Description

  The present invention relates to a peeling apparatus and a peeling method.

2. Description of the Related Art Conventionally, there has been used an apparatus for manufacturing chips by dicing a semiconductor wafer (hereinafter referred to as “wafer”) attached to a first tape, and then transferring these chips to a second tape (for example, Patent Documents). 1).
In the apparatus described in Patent Document 1, after manufacturing a chip by dicing a wafer integrated with a first frame via a first UV tape, the chip is attached to a second UV tape to which a second frame is attached. Then, the first UV tape is peeled from the chip by pulling one end side of the first UV tape in the surface direction of the first UV tape.

JP 11-67697 A

However, in the apparatus described in Patent Document 1, since the first UV tape to be peeled is pulled in the surface direction of the first UV tape, the occupied space of the apparatus with respect to the floor surface increases, and the arrangement space of other apparatuses, The inconvenience that the operator's work space becomes narrow occurs.
Therefore, it can be considered that the first UV tape is peeled from the chip by lifting the first frame in a direction perpendicular to the surface of the chip. In this case, since a large peeling force is required, the first UV tape may be torn or the first UV tape may come off from the first frame, so that the peeling cannot be performed and the wafer may be damaged. There is sex.

  The objective of this invention is providing the peeling apparatus and peeling method which can peel an adhesive sheet reliably from a plate-shaped member, suppressing the occupation space with respect to a floor surface to the minimum.

  In order to achieve the above object, the peeling device of the present invention is a plate in which the first surface is attached to one surface of the first adhesive sheet and the second surface is attached to one surface of the second adhesive sheet. A peeling device for peeling the first adhesive sheet from the sheet-like member, wherein the second sheet includes a first sheet support means for supporting the first adhesive sheet and a support surface in contact with the other surface side of the second adhesive sheet. A second sheet support means for supporting the adhesive sheet; a contact means for bringing the contact surface into contact with the other surface of the first adhesive sheet; and sandwiching the plate member with the support surface; and the first sheet support Moving means for relatively moving the means and the second sheet support means in a direction perpendicular to the support surface, the contact means comprising a plurality of contact members capable of forming the contact surface, The contact member is synchronized with the relative movement by the moving means, Serial employs those contact areas of the contact surface from the outer edge of the plate-like member toward the center is provided to be capable of going gradually narrowed, the configuration of.

In this case, it is preferable that each of the plurality of contact members includes an elastic member that can be elastically deformed from an outer edge of the contact surface.
In addition, it is preferable that the first sheet support unit and the second sheet support unit include a rotation unit that relatively rotates the plane with a plane parallel to the support surface.

  On the other hand, in the peeling method of the present invention, the first surface is attached to one surface of the first adhesive sheet and the second surface is attached to one surface of the second adhesive sheet from the plate-like member. A peeling method for peeling one adhesive sheet, the step of supporting the first adhesive sheet, the step of supporting the second adhesive sheet with a support surface in contact with the other surface side of the second adhesive sheet, and a plurality of methods A step of bringing a contact surface formed by the contact member into contact with the other surface of the first adhesive sheet and sandwiching the plate member with the support surface; and the first adhesive sheet and the second adhesive sheet And a step of gradually narrowing the contact area of the contact surface from the outer edge of the plate-like member toward the center in synchronization with the relative movement. The configuration is provided with.

According to the present invention as described above, the first adhesive sheet is peeled from the plate-like member by relatively moving the first sheet supporting means and the second sheet supporting means in the direction orthogonal to the supporting surface. It is not necessary to provide a dedicated space for peeling the sheet from the plate-like member on the side of the support surface, and the occupied space with respect to the floor surface can be minimized.
Further, in synchronization with the relative movement of the first sheet support means and the second sheet support means, the contact area of the contact surface can be gradually narrowed from the outer edge of the plate-like member toward the center. Therefore, the force acting on the first adhesive sheet can be reduced as compared with the case where the entire first adhesive sheet is moved and peeled in a direction perpendicular to the support surface, and the first adhesive sheet is damaged. Of course, even the plate-like member can be prevented from being peeled off and damaged from the second adhesive sheet, and the occurrence of peeling failure due to the damage of the first adhesive sheet.

Further, if the plurality of contact members are each provided with an elastic member that can be elastically deformed from the outer edge of the contact surface, the first adhesive sheet is more easily peeled from the outer edge of the plate-like member toward the center. .
Furthermore, if the first sheet support means and the second sheet support means are rotated relative to each other, it becomes easy to form a peeling stake on the outer edge side in the contact area between the plate-like member and the first adhesive sheet. The peeling of the first adhesive sheet can be promoted from the cut.

Schematic of the peeling apparatus concerning embodiment of this invention. The partial top view of FIG. (A), (B) Operation | movement explanatory drawing of FIG. (C), (D) Operation | movement explanatory drawing of FIG. (E), (F) Operation | movement explanatory drawing of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
Further, in the present embodiment, unless otherwise specified, terms indicating directions such as “up”, “down”, “left”, and “right” are used with reference to FIG.
In FIG. 1, the peeling device 1 has a first surface W1 attached to one surface (upper surface) of the first adhesive sheet S1, and a second surface W2 attached to one surface (lower surface) of the second adhesive sheet S2. The first adhesive sheet S1 is peeled off from the wafer W as the affixed plate-shaped member, and the first sheet support means 2 that supports the first adhesive sheet S1 and the other surface (upper surface) of the second adhesive sheet S2. The second sheet support means 3 that supports the second adhesive sheet S2 with the support surface 31 in contact with the side), and the contact surface 4A is brought into contact with the other surface (lower surface) of the first adhesive sheet S1, thereby providing the second sheet support means. 3, the contact means 4 that sandwiches the wafer W, the moving means 5 that relatively moves the first sheet support means 2 and the second sheet support means 3 in the direction orthogonal to the support surface 31, and the first sheet support means 2. And the second sheet support means 3 parallel to the support surface 31 And rotating means (6) for relative rotation plane, and a.

  An adhesive layer AD1 is provided on one surface of the first adhesive sheet S1, and the wafer W and the first ring frame RL1 as a frame member are attached to the adhesive layer AD1, and the second An adhesive layer AD2 is provided on one surface of the adhesive sheet S2, and the wafer W and the second ring frame RL2 are attached to the adhesive layer AD2. The wafer W is in a state of being divided into a plurality of chips WA by dicing.

  The first sheet support means 2 includes a support plate 21 that supports the first adhesive sheet S1 and the first ring frame RL1 from the lower left and right sides, a linear motor 22 that is a driving device provided on the lower surface of the support plate 21, and a linear And a pressing member 24 fixed to the output shaft 23 of the motor 22.

  The second sheet support means 3 is configured to be capable of sucking and supporting the second adhesive sheet S2 through a suction hole (not shown) provided in the planar support surface 31 by a pressure reduction means such as a pressure reduction pump or a vacuum ejector (not shown). ing.

The contact means 4 includes a base 41 having a recess 411 in the center, first, second, and third linear motors 42, 43, and 44 that are driving devices fixed in the recess 411, and the first linear motor 42. A cylindrical first contact member 45 fixed to the output shaft 421, a cylindrical second contact member 46 fixed to the output shaft 431 of the second linear motor 43, and an output shaft of the third linear motor 44 A cylindrical third abutting member 47 fixed to 441 and a ring-shaped support plate 48 placed on the base 41 are provided.
Further, the outer edge side of the contact area (contact area) with the wafer W in the upper part of the first, second, and third contact members 45, 46, and 47 is notched, and the inner upper end side of the notch is The width is narrowed. Ring-shaped elastic members 451, 461, and 471 formed so that the width of the lower surface is smaller than the width of the upper surface are attached to these notches. And the contact surface 4A is comprised by the upper surface of these elastic members 451,461,471. The contact area is a circle centered on the upper surface of the first contact member 45 and is formed slightly larger than the outer shape of the wafer W. Further, a flange 481 protruding outward is provided on the outer periphery of the support plate 48.

  The moving means 5 includes two linear motors 51 that are two drive devices provided on the left and right sides of the base 41. The linear motor 51 is supported by the rotating means 6, and the support plate 21 is supported at the tip of the output shaft 52.

As shown in FIG. 2, the rotating means 6 includes a shaft 61 provided on the support plate 48, a linear motor 62 that is a drive device rotatably attached to the shaft 61, and an output shaft of the linear motor 62. A holding member 64 having a distal end of 63 rotatably connected thereto, and a ring-shaped rotating plate 65 rotatably held by the holding member 64 with respect to the support plate 48 are provided. The rotating plate 65 includes a protruding portion 651 formed to face the flange 481 of the support plate 48, and a bearing 652 is disposed between the flange 481 and the protruding portion 651.

  In the above peeling apparatus 1, as a procedure for peeling the first adhesive sheet S1 from the wafer W, first, as shown in FIG. 1, the second adhesive sheet S2 attached to the second ring frame RL2 is supported on the second sheet. The first ring frame RL1 is sandwiched between the support plate 21 and the pressing member 24 by driving the linear motor 22 and supported by the support surface 31 by the means 3. When the first, second, and third contact members 45, 46, and 47 are moved upward by driving the linear motors 42, 43, and 44, and reach a preset position, they are detected by a sensor (not shown), The wafer W is sandwiched between the contact surface 4A and the second sheet support means 3, and the driving of the linear motors 42, 43, 44 is completed.

  Next, when the linear motor 51 is driven and the first sheet support means 2 moves downward as shown in FIG. 3A, the elastic member 471 of the third contact member 47 can be deformed. The outer edge side of the contact region of the member 471 with the wafer W is deformed so as to be separated from the wafer W, and the first adhesive sheet S1 is gradually peeled from the outer edge side of the wafer W, and the first adhesive sheet S1 and the wafer W At the outer edge of the abutting area, a peeling stake T is formed. The first sheet support means 2 may be controlled to reciprocate by a predetermined angle by driving the linear motor 62 in synchronization with the driving of the linear motor 51. Thereby, peeling of 1st adhesive sheet S1 is accelerated | stimulated.

  Next, as shown in FIG. 3 (B), the first adhesive sheet S1 is gradually peeled with the further downward movement of the first sheet support means 2, and the peeling tip position P is set to the third contact member 47. Reaches the inner edge of the contact area with the wafer W. At this time, the elastic member 471 constituting the contact surface 4A is deformed so as to be separated from the wafer W from the inner edge side to the outer edge side of the contact area with the wafer W. This deformation can prevent the first adhesive sheet S1 from receiving a large force from the third contact member 47 and being damaged. Further, since the width of the upper end side of the first, second, and third contact members 45, 46, and 47 is narrow, the inner contact member is deformed until the outer contact member is lowered. Therefore, the effect of gradually peeling the first adhesive sheet S1 can be promoted.

Then, as shown in FIG. 4C, when the first sheet support means 2 moves further downward, the linear motor 44 is driven, and the third contact member 47 is in contact with the first adhesive sheet S1 while moving downward. Move to. As a result, the first adhesive sheet S1 is supported between the first sheet support means 2 and the peeling tip position P, and no large force is suddenly applied to the peeling tip position P of the first adhesive sheet S1. 1 adhesive sheet S1 can be peeled gradually.
Further, when the first sheet supporting means 2 moves downward, as shown in FIG. 4D, the linear motor 43 is driven, and the second contact member 46 moves downward while contacting the first adhesive sheet S1. To do. Then, the downward movement of the first sheet support means 2 is continued, and the separation tip position P is the contact region of the elastic member 451 of the first contact member 45 with the wafer W, as shown in FIG. When the center is reached, the driving of the linear motor 51 is stopped by the detection of a sensor (not shown), and the movement of the first sheet support means 2 is completed. And the linear motor 42 drives and the 1st contact member 45 moves below. Then, as shown in FIG. 5 (F), the separation of the first adhesive sheet S1 from the wafer W is completed by separating the first contact member 45 from the first adhesive sheet S1.

  That is, in the peeling apparatus 1, the entire first adhesive sheet S <b> 1 moves away from the second adhesive sheet S <b> 2 along the direction orthogonal to the support surface 31, and the contact area of the contact surface 4 </ b> A is the wafer W Therefore, the first adhesive sheet S1 can be gradually peeled off from the outer edge of the wafer W.

According to the embodiment as described above, it is not necessary to provide a dedicated space for peeling the first adhesive sheet S1 from the wafer W on the side of the support surface 31, and the space occupied by the peeling device 1 with respect to the floor surface is minimized. To the limit.
Further, in synchronization with the relative movement between the first adhesive sheet S1 and the second adhesive sheet S2, the contact area of the contact surface 4A is gradually narrowed from the outer edge of the wafer W toward the center. The force acting on the first adhesive sheet S1 can be reduced as compared with the case where the entire first adhesive sheet S1 is moved and peeled at once in a direction orthogonal to the support surface 31. Therefore, the first adhesive sheet S1 and the wafer W can be damaged, and the peeling failure of the first adhesive sheet S1 can be suppressed.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, the first adhesive sheet S1 may be supported by the first sheet support means 2 without the first ring frame RL1, or the second adhesive sheet S2 may be supported by the second sheet support means 3 without the second ring frame RL2. May be.
Further, when the first adhesive sheet S1 is peeled from the wafer W, the first sheet support means 2 does not have to be reciprocally rotated.

The number of the first sheet support means 2 and the linear motor 51 is not limited to two but may be three or more, or may be one. The number of the first sheet support means 2 and the number of linear motors 51 may be different. For example, two first sheet support means 2 connected by a connecting member are moved up and down by one linear motor 51. You may let them.
Furthermore, although the planar surface was illustrated as the support surface 31, it is good also as a curved surface shape which the center part protruded below to such an extent that a wrinkle does not enter into 2nd adhesive sheet S2. With such a configuration, the peeling t is easily formed.
The plate-like member may be a wafer W that has not been diced.
Further, the contact member of the contact means is composed of columnar or cylindrical first, second and third contact members 45, 46 and 47, and the contact surface 4A is circular, but the outer edge of the wafer W As long as the contact area can be gradually narrowed from the center toward the center, the contact surface 4A may be divided into a lattice shape or a strip shape.

Alternatively, the first sheet support means 2 may be stopped and the second sheet support means 3 and the contact means 4 may be moved upward, or the first sheet support means 2 may be moved downward to The sheet support means 3 and the contact means 4 may be moved upward. Even in these cases, the operations of the linear motors 42, 43, and 44 may be appropriately controlled so that the contact area of the contact surface 4A gradually narrows from the outer edge of the wafer W toward the center.
Further, the first sheet support means 2 may be stopped and the second sheet support means 3, the contact means 4, etc. may be rotated, or the first sheet support means 2 may be rotated and the second sheet support means 3 The contact means 4 and the like may be rotated in the direction opposite to the first sheet support means 2.

In addition, the types and materials of the first and second adhesive sheets S1, S2 in the present invention are not particularly limited, for example, those having an intermediate layer between the base sheet and the adhesive layers AD1, AD2, Three or more layers, such as having other layers, may be used. Further, the first and second adhesive sheets S1 and S2 may be protective sheets, dicing tapes, die attach films, other arbitrary sheets, films, tapes, and the like, adhesive sheets having arbitrary uses and shapes. Examples of semiconductor wafers include silicon semiconductor wafers and compound semiconductor wafers, and the plate-like members include not only optical disks, glass plates, steel plates, resin plates, and other members, but also members and articles of any form. Can be targeted.
As the elastic members 451, 461, and 471, rubber, resin, sponge, or the like can be used.
Further, the elastic members 451, 461, 471 may be configured by other than those shown in the above embodiment, as long as the elastic members 451, 461, 471 can be deformed by the contact of the first adhesive sheet S1. It is not limited at all.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 ... Peeling device 2 ... 1st sheet support means 3 ... 2nd sheet support means 4 ... Contact means 5 ... Moving means 6 ... Rotating means 31 ... Support surface 45,46,47 ... 1st, 2nd, 3rd contact Contact member (contact member)
451, 461, 471 ... elastic member 4A ... contact surface RL1 ... first ring frame (frame member)
S1 ... first adhesive sheet S2 ... second adhesive sheet W ... wafer (plate-like member)

Claims (4)

A peeling device that peels the first adhesive sheet from a plate-like member having a first surface attached to one surface of the first adhesive sheet and a second surface attached to one surface of the second adhesive sheet. And
First sheet support means for supporting the first adhesive sheet;
Second sheet support means for supporting the second adhesive sheet with a support surface in contact with the other surface side of the second adhesive sheet;
A contact means for bringing a contact surface into contact with the other surface of the first adhesive sheet and sandwiching the plate member with the support surface;
A moving means for relatively moving the first sheet supporting means and the second sheet supporting means in a direction perpendicular to the supporting surface;
The contact means includes a plurality of contact members capable of forming the contact surface,
The abutting member is provided so that the abutting area of the abutting surface can be gradually narrowed from the outer edge of the plate-shaped member toward the center in synchronization with the relative movement by the moving means. The peeling apparatus characterized by the above-mentioned.   The peeling device according to claim 1, wherein each of the plurality of contact members includes an elastic member that is elastically deformable from an outer edge of the contact surface.   The peeling apparatus according to claim 1, further comprising a rotation unit that relatively rotates the first sheet support unit and the second sheet support unit in a plane parallel to the support surface. A peeling method in which the first surface is attached to one surface of the first adhesive sheet and the second surface is peeled off from the plate-like member attached to one surface of the second adhesive sheet. There,
Supporting the first adhesive sheet;
Supporting the second adhesive sheet with a support surface in contact with the other surface side of the second adhesive sheet;
Contacting a contact surface formed by a plurality of contact members with the other surface of the first adhesive sheet, and sandwiching the plate-like member with the support surface;
Relatively moving the first adhesive sheet and the second adhesive sheet in a direction perpendicular to the support surface;
And a step of gradually narrowing the contact area of the contact surface from the outer edge of the plate-shaped member toward the center in synchronization with the relative movement.

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