JP2012238401A - 欠陥レビュー方法および装置 - Google Patents
欠陥レビュー方法および装置 Download PDFInfo
- Publication number
- JP2012238401A JP2012238401A JP2011104838A JP2011104838A JP2012238401A JP 2012238401 A JP2012238401 A JP 2012238401A JP 2011104838 A JP2011104838 A JP 2011104838A JP 2011104838 A JP2011104838 A JP 2011104838A JP 2012238401 A JP2012238401 A JP 2012238401A
- Authority
- JP
- Japan
- Prior art keywords
- defect
- image
- fine alignment
- file
- information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011104838A JP2012238401A (ja) | 2011-05-10 | 2011-05-10 | 欠陥レビュー方法および装置 |
PCT/JP2012/002419 WO2012153456A1 (fr) | 2011-05-10 | 2012-04-06 | Appareil d'examen des défauts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011104838A JP2012238401A (ja) | 2011-05-10 | 2011-05-10 | 欠陥レビュー方法および装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2012238401A true JP2012238401A (ja) | 2012-12-06 |
Family
ID=47138949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011104838A Pending JP2012238401A (ja) | 2011-05-10 | 2011-05-10 | 欠陥レビュー方法および装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2012238401A (fr) |
WO (1) | WO2012153456A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022058701A (ja) * | 2018-01-31 | 2022-04-12 | コニカミノルタ株式会社 | 画像形成装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7203678B2 (ja) * | 2019-04-19 | 2023-01-13 | 株式会社日立ハイテク | 欠陥観察装置 |
CN117276112B (zh) * | 2023-11-22 | 2024-04-12 | 宁德时代新能源科技股份有限公司 | 缺陷检测方法、装置、设备及计算机可读存储介质 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0643124A (ja) * | 1992-07-22 | 1994-02-18 | Seiko Instr Inc | 異物分析方法 |
JP2002071594A (ja) * | 2000-08-25 | 2002-03-08 | Hitachi Ltd | 電子顕微鏡 |
JP2003227710A (ja) * | 2002-02-01 | 2003-08-15 | Hitachi High-Technologies Corp | 欠陥撮像装置及び撮像方法 |
JP2007101202A (ja) * | 2005-09-30 | 2007-04-19 | Toshiba Corp | パターン観察装置、パターン観察方法およびプログラム |
JP2008135568A (ja) * | 2006-11-28 | 2008-06-12 | Hitachi High-Technologies Corp | 欠陥レビュー方法および装置 |
WO2011030488A1 (fr) * | 2009-09-11 | 2011-03-17 | 株式会社 日立ハイテクノロジーズ | Dispositif de support de revue de défauts, dispositif de revue de défauts et dispositif de support d'inspection |
-
2011
- 2011-05-10 JP JP2011104838A patent/JP2012238401A/ja active Pending
-
2012
- 2012-04-06 WO PCT/JP2012/002419 patent/WO2012153456A1/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0643124A (ja) * | 1992-07-22 | 1994-02-18 | Seiko Instr Inc | 異物分析方法 |
JP2002071594A (ja) * | 2000-08-25 | 2002-03-08 | Hitachi Ltd | 電子顕微鏡 |
JP2003227710A (ja) * | 2002-02-01 | 2003-08-15 | Hitachi High-Technologies Corp | 欠陥撮像装置及び撮像方法 |
JP2007101202A (ja) * | 2005-09-30 | 2007-04-19 | Toshiba Corp | パターン観察装置、パターン観察方法およびプログラム |
JP2008135568A (ja) * | 2006-11-28 | 2008-06-12 | Hitachi High-Technologies Corp | 欠陥レビュー方法および装置 |
WO2011030488A1 (fr) * | 2009-09-11 | 2011-03-17 | 株式会社 日立ハイテクノロジーズ | Dispositif de support de revue de défauts, dispositif de revue de défauts et dispositif de support d'inspection |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022058701A (ja) * | 2018-01-31 | 2022-04-12 | コニカミノルタ株式会社 | 画像形成装置 |
JP2022163104A (ja) * | 2018-01-31 | 2022-10-25 | コニカミノルタ株式会社 | 画像形成装置 |
JP7450650B2 (ja) | 2018-01-31 | 2024-03-15 | コニカミノルタ株式会社 | 画像形成装置 |
JP7468577B2 (ja) | 2018-01-31 | 2024-04-16 | コニカミノルタ株式会社 | 画像検査装置、プログラム、画像検査方法および画像検査システム |
Also Published As
Publication number | Publication date |
---|---|
WO2012153456A1 (fr) | 2012-11-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9040937B2 (en) | Charged particle beam apparatus | |
JP5715873B2 (ja) | 欠陥分類方法及び欠陥分類システム | |
TWI512684B (zh) | Defect observation method and defect observation device | |
JP5412169B2 (ja) | 欠陥観察方法及び欠陥観察装置 | |
JP5948138B2 (ja) | 欠陥解析支援装置、欠陥解析支援装置で実行されるプログラム、および欠陥解析システム | |
US20100246929A1 (en) | Method and system for determining a defect during charged particle beam inspection of a sample | |
JP5103058B2 (ja) | 欠陥観察装置及び欠陥観察方法 | |
JP4616120B2 (ja) | 画像処理装置及び検査装置 | |
JP5937878B2 (ja) | パターンマッチング方法及び装置 | |
JP2009250645A (ja) | 欠陥レビュー方法およびその装置 | |
US20130248709A1 (en) | Defect inspecting apparatus | |
JP2012083147A (ja) | 欠陥分類システム及び欠陥分類装置及び画像撮像装置 | |
US11741683B2 (en) | Apparatus for processing labeled data to be used in learning of discriminator, method of controlling the apparatus, and non-transitory computer-readable recording medium | |
US9972079B2 (en) | Wafer appearance inspection apparatus | |
JP4842782B2 (ja) | 欠陥レビュー方法および装置 | |
WO2012153456A1 (fr) | Appareil d'examen des défauts | |
WO2017203572A1 (fr) | Appareil de classification d'image défectueuse et procédé de classification d'image défectueuse | |
JP5323457B2 (ja) | 観察条件決定支援装置および観察条件決定支援方法 | |
US20150170355A1 (en) | Wafer appearance inspection system and method of sensitivity threshold setting | |
JP4607157B2 (ja) | 観察装置、観察装置のレシピ設定方法 | |
JP5072543B2 (ja) | 半導体装置の不良解析方法および不良解析装置 | |
US20230194253A1 (en) | Pattern Inspection/Measurement Device, and Pattern Inspection/Measurement Program | |
JP2015203628A (ja) | 荷電粒子線装置及び座標補正方法 | |
WO2013008531A1 (fr) | Microscope électronique à balayage, système et dispositif d'inspection des défauts | |
KR20180024913A (ko) | 반도체 패턴 계측을 위한 영상 처리장치 및 방법과, 이를 이용한 계측 시스템 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130821 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130821 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140826 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20141224 |