JP2012238401A - 欠陥レビュー方法および装置 - Google Patents

欠陥レビュー方法および装置 Download PDF

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Publication number
JP2012238401A
JP2012238401A JP2011104838A JP2011104838A JP2012238401A JP 2012238401 A JP2012238401 A JP 2012238401A JP 2011104838 A JP2011104838 A JP 2011104838A JP 2011104838 A JP2011104838 A JP 2011104838A JP 2012238401 A JP2012238401 A JP 2012238401A
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JP
Japan
Prior art keywords
defect
image
fine alignment
file
information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011104838A
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English (en)
Japanese (ja)
Inventor
Hisami Kaneko
久美 兼子
Katsuaki Abe
勝明 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hitachi High Technologies Corp, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2011104838A priority Critical patent/JP2012238401A/ja
Priority to PCT/JP2012/002419 priority patent/WO2012153456A1/fr
Publication of JP2012238401A publication Critical patent/JP2012238401A/ja
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26Electron or ion microscopes
    • H01J2237/28Scanning microscopes
    • H01J2237/2813Scanning microscopes characterised by the application
    • H01J2237/2817Pattern inspection

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2011104838A 2011-05-10 2011-05-10 欠陥レビュー方法および装置 Pending JP2012238401A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011104838A JP2012238401A (ja) 2011-05-10 2011-05-10 欠陥レビュー方法および装置
PCT/JP2012/002419 WO2012153456A1 (fr) 2011-05-10 2012-04-06 Appareil d'examen des défauts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011104838A JP2012238401A (ja) 2011-05-10 2011-05-10 欠陥レビュー方法および装置

Publications (1)

Publication Number Publication Date
JP2012238401A true JP2012238401A (ja) 2012-12-06

Family

ID=47138949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011104838A Pending JP2012238401A (ja) 2011-05-10 2011-05-10 欠陥レビュー方法および装置

Country Status (2)

Country Link
JP (1) JP2012238401A (fr)
WO (1) WO2012153456A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022058701A (ja) * 2018-01-31 2022-04-12 コニカミノルタ株式会社 画像形成装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7203678B2 (ja) * 2019-04-19 2023-01-13 株式会社日立ハイテク 欠陥観察装置
CN117276112B (zh) * 2023-11-22 2024-04-12 宁德时代新能源科技股份有限公司 缺陷检测方法、装置、设备及计算机可读存储介质

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0643124A (ja) * 1992-07-22 1994-02-18 Seiko Instr Inc 異物分析方法
JP2002071594A (ja) * 2000-08-25 2002-03-08 Hitachi Ltd 電子顕微鏡
JP2003227710A (ja) * 2002-02-01 2003-08-15 Hitachi High-Technologies Corp 欠陥撮像装置及び撮像方法
JP2007101202A (ja) * 2005-09-30 2007-04-19 Toshiba Corp パターン観察装置、パターン観察方法およびプログラム
JP2008135568A (ja) * 2006-11-28 2008-06-12 Hitachi High-Technologies Corp 欠陥レビュー方法および装置
WO2011030488A1 (fr) * 2009-09-11 2011-03-17 株式会社 日立ハイテクノロジーズ Dispositif de support de revue de défauts, dispositif de revue de défauts et dispositif de support d'inspection

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0643124A (ja) * 1992-07-22 1994-02-18 Seiko Instr Inc 異物分析方法
JP2002071594A (ja) * 2000-08-25 2002-03-08 Hitachi Ltd 電子顕微鏡
JP2003227710A (ja) * 2002-02-01 2003-08-15 Hitachi High-Technologies Corp 欠陥撮像装置及び撮像方法
JP2007101202A (ja) * 2005-09-30 2007-04-19 Toshiba Corp パターン観察装置、パターン観察方法およびプログラム
JP2008135568A (ja) * 2006-11-28 2008-06-12 Hitachi High-Technologies Corp 欠陥レビュー方法および装置
WO2011030488A1 (fr) * 2009-09-11 2011-03-17 株式会社 日立ハイテクノロジーズ Dispositif de support de revue de défauts, dispositif de revue de défauts et dispositif de support d'inspection

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022058701A (ja) * 2018-01-31 2022-04-12 コニカミノルタ株式会社 画像形成装置
JP2022163104A (ja) * 2018-01-31 2022-10-25 コニカミノルタ株式会社 画像形成装置
JP7450650B2 (ja) 2018-01-31 2024-03-15 コニカミノルタ株式会社 画像形成装置
JP7468577B2 (ja) 2018-01-31 2024-04-16 コニカミノルタ株式会社 画像検査装置、プログラム、画像検査方法および画像検査システム

Also Published As

Publication number Publication date
WO2012153456A1 (fr) 2012-11-15

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