JP2012235112A - チップ型コイル部品 - Google Patents
チップ型コイル部品 Download PDFInfo
- Publication number
- JP2012235112A JP2012235112A JP2012099531A JP2012099531A JP2012235112A JP 2012235112 A JP2012235112 A JP 2012235112A JP 2012099531 A JP2012099531 A JP 2012099531A JP 2012099531 A JP2012099531 A JP 2012099531A JP 2012235112 A JP2012235112 A JP 2012235112A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- external electrode
- coil component
- type coil
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 28
- 238000010030 laminating Methods 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims description 12
- 238000000926 separation method Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
【解決手段】本発明によるチップ型コイル部品は、複数の磁性体層が積層されて形成され、実装面として提供される下面とこれに対応する上面、長さ方向の両側面及び幅方向の両側面を備えた本体と、上記磁性体層上に形成され、コイル構造を有するように接続された導体パターンと、上記本体の外面のうち少なくとも一つに形成され、上記導体パターンと接続された外部電極と、を含み、上記外部電極は、上記下面に形成され、上記下面の端から離隔されて形成されることを特徴とする。本発明によると、チップ型コイル部品の実装及び運用過程で電子部品が接触する場合にもショートが発生せず、チップ型コイル部品と基板との間の固着強度を増加させることができる。
【選択図】図1
Description
20 外部電極
30 導体パターン
31、32 導体パターンリード
40 基板
Claims (5)
- 複数の磁性体層が積層されて形成され、実装面として提供される下面とこれに対応する上面、長さ方向の両側面及び幅方向の両側面を備えた本体と、
前記磁性体層上に形成され、コイル構造を有するように接続された導体パターンと、
前記本体の外面のうち少なくとも一つに形成され、前記導体パターンと接続された外部電極と、を含み、
前記外部電極は、前記下面に形成され、前記下面の端から離隔されて形成されるチップ型コイル部品。 - 前記外部電極にはメッキ層が形成され、前記下面の端と前記外部電極との間の隔離距離は、前記メッキ層の厚さより大きい請求項1に記載のチップ型コイル部品。
- 前記外部電極の個数は二つ以上である請求項1に記載のチップ型コイル部品。
- 前記外部電極は、前記下面において対向する位置に形成された第1及び第2外部電極を含む請求項3に記載のチップ型コイル部品。
- 前記第1及び第2外部電極の間に形成された第3外部電極を含む請求項4に記載のチップ型コイル部品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110040830A KR101219006B1 (ko) | 2011-04-29 | 2011-04-29 | 칩형 코일 부품 |
KR10-2011-0040830 | 2011-04-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2012235112A true JP2012235112A (ja) | 2012-11-29 |
Family
ID=47054973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012099531A Pending JP2012235112A (ja) | 2011-04-29 | 2012-04-25 | チップ型コイル部品 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8593247B2 (ja) |
JP (1) | JP2012235112A (ja) |
KR (1) | KR101219006B1 (ja) |
CN (1) | CN102760551A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018107411A (ja) * | 2016-12-28 | 2018-07-05 | 株式会社村田製作所 | 積層型電子部品の製造方法および積層型電子部品 |
JP2018107412A (ja) * | 2016-12-28 | 2018-07-05 | 株式会社村田製作所 | 積層型電子部品の製造方法および積層型電子部品 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101946493B1 (ko) * | 2013-07-16 | 2019-02-11 | 삼성전기 주식회사 | 칩 전자부품 |
KR20150058869A (ko) * | 2013-11-21 | 2015-05-29 | 삼성전기주식회사 | 적층형 인덕터 |
CN104681267A (zh) * | 2013-11-26 | 2015-06-03 | 昆山玛冀电子有限公司 | 晶片式电感器的制作方法 |
KR20150089279A (ko) * | 2014-01-27 | 2015-08-05 | 삼성전기주식회사 | 칩형 코일 부품 |
KR101548862B1 (ko) * | 2014-03-10 | 2015-08-31 | 삼성전기주식회사 | 칩형 코일 부품 및 그 제조 방법 |
KR101686989B1 (ko) | 2014-08-07 | 2016-12-19 | 주식회사 모다이노칩 | 파워 인덕터 |
KR20160019265A (ko) * | 2014-08-11 | 2016-02-19 | 삼성전기주식회사 | 칩형 코일 부품 및 그 제조방법 |
WO2016039518A1 (ko) * | 2014-09-11 | 2016-03-17 | 주식회사 이노칩테크놀로지 | 파워 인덕터 및 그 제조 방법 |
KR101662208B1 (ko) * | 2014-09-11 | 2016-10-06 | 주식회사 모다이노칩 | 파워 인덕터 및 그 제조 방법 |
CN104347240B (zh) * | 2014-10-09 | 2016-12-07 | 东莞建冠塑胶电子有限公司 | 薄型电感线圈 |
KR102105393B1 (ko) * | 2015-01-27 | 2020-04-28 | 삼성전기주식회사 | 코일 부품 및 그 실장 기판 |
KR102494321B1 (ko) * | 2017-11-22 | 2023-02-01 | 삼성전기주식회사 | 코일 부품 |
US20200303114A1 (en) * | 2019-03-22 | 2020-09-24 | Cyntec Co., Ltd. | Inductor array in a single package |
Citations (9)
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JPH10163004A (ja) * | 1996-12-02 | 1998-06-19 | Sony Corp | 抵抗器、コンデンサ、インダクタ及びコネクタ |
JPH11111556A (ja) * | 1997-10-01 | 1999-04-23 | Tdk Corp | 表面実装用のチップ部品 |
JPH11288839A (ja) * | 1998-03-31 | 1999-10-19 | Tdk Corp | 積層チップ型電子部品及びその製造方法 |
JP2000196393A (ja) * | 1998-12-28 | 2000-07-14 | Tdk Corp | 分布定数型ノイズフィルタとその製造方法 |
JP2003272923A (ja) * | 2002-03-15 | 2003-09-26 | Matsushita Electric Ind Co Ltd | 電子部品 |
JP2004031934A (ja) * | 2003-05-15 | 2004-01-29 | Ngk Spark Plug Co Ltd | 実装型電子回路部品 |
JP2006332121A (ja) * | 2005-05-23 | 2006-12-07 | Tdk Corp | バリスタ |
JP2007088173A (ja) * | 2005-09-21 | 2007-04-05 | Tdk Corp | 積層型チップバリスタ及び電子機器の製造方法 |
JP2008198923A (ja) * | 2007-02-15 | 2008-08-28 | Matsushita Electric Ind Co Ltd | コイル部品 |
Family Cites Families (10)
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JP3351738B2 (ja) * | 1998-05-01 | 2002-12-03 | 太陽誘電株式会社 | 積層インダクタ及びその製造方法 |
JP2002217037A (ja) | 2001-01-15 | 2002-08-02 | Matsushita Electric Ind Co Ltd | Lc複合部品およびその製造方法 |
US6680664B2 (en) * | 2002-05-21 | 2004-01-20 | Yun-Kuang Fan | Ferrite core structure for SMD and manufacturing method therefor |
JP4421436B2 (ja) * | 2004-09-30 | 2010-02-24 | 太陽誘電株式会社 | 面実装コイル部品 |
KR100953276B1 (ko) * | 2006-02-27 | 2010-04-16 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층형 전자부품 및 그 제조방법 |
TWI405225B (zh) * | 2008-02-22 | 2013-08-11 | Cyntec Co Ltd | 扼流線圈 |
JP4708469B2 (ja) * | 2008-02-29 | 2011-06-22 | Tdk株式会社 | バルントランス |
JP5310238B2 (ja) * | 2008-07-10 | 2013-10-09 | 株式会社村田製作所 | 積層セラミック電子部品 |
KR101282025B1 (ko) * | 2008-07-30 | 2013-07-04 | 다이요 유덴 가부시키가이샤 | 적층 인덕터, 그 제조 방법 및 적층 초크 코일 |
JP4737268B2 (ja) * | 2008-10-31 | 2011-07-27 | Tdk株式会社 | 表面実装型パルストランス並びにその製造方法及び製造装置 |
-
2011
- 2011-04-29 KR KR1020110040830A patent/KR101219006B1/ko active IP Right Grant
-
2012
- 2012-04-25 JP JP2012099531A patent/JP2012235112A/ja active Pending
- 2012-04-27 US US13/458,842 patent/US8593247B2/en active Active
- 2012-04-28 CN CN2012101351665A patent/CN102760551A/zh active Pending
Patent Citations (9)
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JPH10163004A (ja) * | 1996-12-02 | 1998-06-19 | Sony Corp | 抵抗器、コンデンサ、インダクタ及びコネクタ |
JPH11111556A (ja) * | 1997-10-01 | 1999-04-23 | Tdk Corp | 表面実装用のチップ部品 |
JPH11288839A (ja) * | 1998-03-31 | 1999-10-19 | Tdk Corp | 積層チップ型電子部品及びその製造方法 |
JP2000196393A (ja) * | 1998-12-28 | 2000-07-14 | Tdk Corp | 分布定数型ノイズフィルタとその製造方法 |
JP2003272923A (ja) * | 2002-03-15 | 2003-09-26 | Matsushita Electric Ind Co Ltd | 電子部品 |
JP2004031934A (ja) * | 2003-05-15 | 2004-01-29 | Ngk Spark Plug Co Ltd | 実装型電子回路部品 |
JP2006332121A (ja) * | 2005-05-23 | 2006-12-07 | Tdk Corp | バリスタ |
JP2007088173A (ja) * | 2005-09-21 | 2007-04-05 | Tdk Corp | 積層型チップバリスタ及び電子機器の製造方法 |
JP2008198923A (ja) * | 2007-02-15 | 2008-08-28 | Matsushita Electric Ind Co Ltd | コイル部品 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018107411A (ja) * | 2016-12-28 | 2018-07-05 | 株式会社村田製作所 | 積層型電子部品の製造方法および積層型電子部品 |
JP2018107412A (ja) * | 2016-12-28 | 2018-07-05 | 株式会社村田製作所 | 積層型電子部品の製造方法および積層型電子部品 |
US10886061B2 (en) | 2016-12-28 | 2021-01-05 | Murata Manufacturing Co., Ltd. | Multilayer electronic component manufacturing method and multilayer electronic component |
US10886060B2 (en) | 2016-12-28 | 2021-01-05 | Murata Manufacturing Co., Ltd. | Multilayer electronic component manufacturing method and multilayer electronic component |
Also Published As
Publication number | Publication date |
---|---|
US8593247B2 (en) | 2013-11-26 |
CN102760551A (zh) | 2012-10-31 |
KR20120122590A (ko) | 2012-11-07 |
US20120274435A1 (en) | 2012-11-01 |
KR101219006B1 (ko) | 2013-01-09 |
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