JP2012232975A - シロキサン化合物およびその硬化物 - Google Patents

シロキサン化合物およびその硬化物 Download PDF

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Publication number
JP2012232975A
JP2012232975A JP2012090666A JP2012090666A JP2012232975A JP 2012232975 A JP2012232975 A JP 2012232975A JP 2012090666 A JP2012090666 A JP 2012090666A JP 2012090666 A JP2012090666 A JP 2012090666A JP 2012232975 A JP2012232975 A JP 2012232975A
Authority
JP
Japan
Prior art keywords
group
siloxane compound
represented
crosslinking
siloxane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012090666A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012232975A5 (enExample
Inventor
Keiji Honjo
啓司 本城
Hiroshi Eguchi
弘 江口
Kazuhiro Yamanaka
一広 山中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central Glass Co Ltd
Original Assignee
Central Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Priority to JP2012090666A priority Critical patent/JP2012232975A/ja
Priority to DE112012001421T priority patent/DE112012001421T5/de
Priority to US14/112,866 priority patent/US20140046014A1/en
Priority to KR1020137030819A priority patent/KR20130140210A/ko
Priority to PCT/JP2012/060314 priority patent/WO2012144481A1/ja
Priority to CN201280018918.8A priority patent/CN103492396A/zh
Publication of JP2012232975A publication Critical patent/JP2012232975A/ja
Publication of JP2012232975A5 publication Critical patent/JP2012232975A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/21—Cyclic compounds having at least one ring containing silicon, but no carbon in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F30/00—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F30/04—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • C08F30/08—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F38/00—Homopolymers and copolymers of compounds having one or more carbon-to-carbon triple bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Polymers (AREA)
  • Sealing Material Composition (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2012090666A 2011-04-20 2012-04-12 シロキサン化合物およびその硬化物 Pending JP2012232975A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012090666A JP2012232975A (ja) 2011-04-20 2012-04-12 シロキサン化合物およびその硬化物
DE112012001421T DE112012001421T5 (de) 2011-04-20 2012-04-17 Siloxanverbindung und ausgehärtetes Produkt derselben
US14/112,866 US20140046014A1 (en) 2011-04-20 2012-04-17 Siloxane compound and cured product thereof
KR1020137030819A KR20130140210A (ko) 2011-04-20 2012-04-17 실록산 화합물 및 그 경화물
PCT/JP2012/060314 WO2012144481A1 (ja) 2011-04-20 2012-04-17 シロキサン化合物およびその硬化物
CN201280018918.8A CN103492396A (zh) 2011-04-20 2012-04-17 硅氧烷化合物及其固化物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011094194 2011-04-20
JP2011094194 2011-04-20
JP2012090666A JP2012232975A (ja) 2011-04-20 2012-04-12 シロキサン化合物およびその硬化物

Publications (2)

Publication Number Publication Date
JP2012232975A true JP2012232975A (ja) 2012-11-29
JP2012232975A5 JP2012232975A5 (enExample) 2013-10-31

Family

ID=47041587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012090666A Pending JP2012232975A (ja) 2011-04-20 2012-04-12 シロキサン化合物およびその硬化物

Country Status (6)

Country Link
US (1) US20140046014A1 (enExample)
JP (1) JP2012232975A (enExample)
KR (1) KR20130140210A (enExample)
CN (1) CN103492396A (enExample)
DE (1) DE112012001421T5 (enExample)
WO (1) WO2012144481A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019104934A (ja) * 2013-09-27 2019-06-27 Rimtec株式会社 ノルボルネン系架橋重合体からなる絶縁材料

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017145229A (ja) * 2016-02-19 2017-08-24 国立大学法人群馬大学 ルイス酸を用いた環状シロキサンの製造方法
CN107987278B (zh) * 2017-11-14 2021-03-30 复旦大学 一种苯并环丁烯官能化有机硅树脂及其制备方法
CN108299645B (zh) * 2018-02-05 2021-12-14 中国科学院上海有机化学研究所 可直接热固化的有机硅氧烷的制备和应用

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4414375A (en) * 1980-09-02 1983-11-08 Neefe Russell A Oxygen permeable contact lens material comprising copolymers of multifunctional siloxanyl alkylesters
JP2937622B2 (ja) * 1992-05-25 1999-08-23 北辰工業株式会社 定着ロール
US5599894A (en) * 1994-06-07 1997-02-04 Shin-Etsu Chemical Co., Ltd. Silicone gel compositions
JPH0853622A (ja) * 1994-06-07 1996-02-27 Shin Etsu Chem Co Ltd シリコーンゲル組成物
JP3427713B2 (ja) 1997-01-22 2003-07-22 株式会社日立製作所 樹脂封止型半導体装置およびその製造方法
US6284906B1 (en) * 1999-10-12 2001-09-04 University Of Southern California Cyclotrisiloxanes, new siloxane polymers and their preparation
JP4256756B2 (ja) 2002-09-30 2009-04-22 新日鐵化学株式会社 官能基を有するかご型シルセスキオキサン樹脂の製造方法
JP4465233B2 (ja) * 2003-06-30 2010-05-19 三星電子株式会社 多官能性環状シロキサン化合物、この化合物から製造されたシロキサン系重合体及びこの重合体を用いた絶縁膜の製造方法
JP2007015991A (ja) 2005-07-08 2007-01-25 Tokyo Univ Of Science かご状シルセスキオキサンの製造方法
JP2007023163A (ja) * 2005-07-15 2007-02-01 Fujifilm Corp 膜形成用組成物、絶縁膜、およびその製造方法
CN101223181A (zh) * 2006-03-02 2008-07-16 设计分子有限公司 含有环硅氧烷的粘合剂组合物
US20090171058A1 (en) * 2007-12-31 2009-07-02 John Kilgour Low temperature platinum-vinylpolysiloxane hydrosilylation catalyst
JP2009191024A (ja) 2008-02-14 2009-08-27 Tatsuya Okubo かご型シロキサン化合物
KR101445878B1 (ko) * 2008-04-04 2014-09-29 삼성전자주식회사 보호 필름 및 이를 포함하는 봉지 재료
JP2009269820A (ja) 2008-04-30 2009-11-19 Showa Denko Kk かご型シロキサン化合物の製造方法
JP5278040B2 (ja) * 2009-02-27 2013-09-04 信越化学工業株式会社 嵩高い置換基を有するシロキシ基含有シリル（メタ）アクリレート化合物及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019104934A (ja) * 2013-09-27 2019-06-27 Rimtec株式会社 ノルボルネン系架橋重合体からなる絶縁材料

Also Published As

Publication number Publication date
KR20130140210A (ko) 2013-12-23
US20140046014A1 (en) 2014-02-13
CN103492396A (zh) 2014-01-01
DE112012001421T5 (de) 2013-12-24
WO2012144481A1 (ja) 2012-10-26

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