JP2012229379A - Adhesive composition, adhesive for temporary fixing, and method for manufacturing parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive composition having good coatability, and good detachability when peeled; and to provide an adhesive for temporary fixing and a method for manufacturing parts.SOLUTION: This adhesive composition includes a component (A): an elastomer, a component (B): at least one (meth)acrylic acid-based monomer selected from the group consisting of an alkyl (meth)acrylate, (meth)acrylate having an aromatic ring and (meth)acrylate having a cyclic ether skeleton, a component (C): a (meth)acrylate having an amino group, a component (D): an organic peroxide, and a component (E): a curing accelerator, wherein the content of the component (C) is 7-30 mass% based on 100 mass% total of components (A) to (C), and the viscosity at 23°C is 3,000-200,000 mPa s. The method for manufacturing parts using the composition is also provided.

Description

  The present invention relates to an adhesive composition, an adhesive for temporary fixing, and a method for manufacturing a component that are suitably used, for example, when manufacturing a silicon wafer.

As a method for manufacturing silicon wafers, optical components, semiconductor mounting components, etc., these raw materials (parts to be processed) are temporarily fixed to a fixture with an adhesive, etc., and machined to a predetermined shape or machined A method is used in which the adhesive is removed and peeled from the fixture to obtain a processed part.
For example, in the manufacture of silicon wafers, a silicon ingot, which is a part to be processed, is temporarily fixed to a fixture with an adhesive, cut into a thin film with a cutting machine, and then immersed in a stripping solution such as a weak alkaline aqueous solution or a weak acidic aqueous solution. Then, the silicon wafer is peeled from the fixture to obtain a silicon wafer cut into a thin film.

  As an adhesive used for temporary fixing, for example, Patent Document 1 discloses a curable composition containing a polyfunctional (meth) acrylate, a monofunctional (meth) acrylate, an organic peroxide, and a decomposition promoting complex. Yes.

JP 2007-161871 A

  However, the curable composition described in Patent Document 1 is inferior in coating properties because it drips during coating, and the cured product has poor solubility in the stripping solution and is a temporarily fixed member. It was inferior in the peelability at the time of peeling from a fixture after processing.

  The present invention has been made in view of the above circumstances, and provides an adhesive composition, an adhesive for temporary fixing, and a method for manufacturing a part that have good coatability and good peelability at the time of peeling. The purpose is to do.

  As a result of intensive studies, the present inventors have included an elastomer, a specific (meth) acrylic acid-based monomer, and a specific amount of an amino group-containing (meth) acrylic acid ester, and specified the viscosity of the adhesive composition. As a result, it was found that an adhesive composition having both coating properties and solubility in a peeling solution (particularly weakly acidic aqueous solution) was obtained, and the present invention was completed.

  That is, the adhesive composition of the present invention has (A) component: elastomer, (B) component: (meth) acrylic acid alkyl ester, (meth) acrylic acid ester having an aromatic ring, and a cyclic ether skeleton. At least one (meth) acrylic acid monomer selected from the group consisting of (meth) acrylic acid esters, (C) component: amino group-containing (meth) acrylic acid ester, and (D) component: organic peroxide And (E) component: It is adhesive composition containing a hardening accelerator, Comprising: Containing (C) component in the total of 100 mass% of said (A) component, (B) component, and (C) component The amount is 7 to 30% by mass, and the viscosity at 23 ° C. is 3000 to 200000 mPa · s.

Moreover, the adhesive for temporary fixation of this invention consists of the said adhesive composition, It is characterized by the above-mentioned.
Further, in the method for producing a part of the present invention, the part to be processed is temporarily fixed to a fixture using the adhesive composition, and after the temporarily fixed part to be processed is processed, the part to be processed and the fixture are acidified. It is characterized by immersing in a stripping solution made of an aqueous solution and stripping each other.

  ADVANTAGE OF THE INVENTION According to this invention, it can provide the adhesive composition which has favorable applicability | paintability, and has the favorable peelability at the time of peeling, the adhesive for temporary fixing, and the manufacturing method of components.

Hereinafter, the present invention will be described in detail.
In this specification, “(meth) acrylic acid” indicates both acrylic acid and methacrylic acid, and “(meth) acrylate” indicates both acrylate and methacrylate.

[Adhesive composition]
The adhesive composition of the present invention has (A) component: elastomer, (B) component: (meth) acrylic acid alkyl ester, (meth) acrylic acid ester having an aromatic ring, and cyclic ether skeleton (meta ) At least one (meth) acrylic acid monomer selected from the group consisting of acrylic acid esters, (C) component: amino group-containing (meth) acrylic acid ester, (D) component: organic peroxide, (E) component: It contains a curing accelerator.

<(A) component: Elastomer>
The component (A) is an elastomer.
(A) A component is a high molecular compound which has rubber elasticity at normal temperature. (A) A component is a component which provides toughness to the hardened | cured material of an adhesive composition, and improves peeling adhesive strength and impact adhesive strength.
As the component (A), those which are dissolved or dispersed in the component (B) described later are preferable, and specifically, acrylonitrile-butadiene-methacrylic acid copolymer, acrylonitrile-butadiene-methyl methacrylate copolymer, butadiene-styrene. -Methyl methacrylate copolymer, acrylonitrile-styrene-butadiene copolymer, and various synthetic rubbers such as acrylonitrile-butadiene rubber, linear polyurethane, styrene-butadiene rubber, chloroprene rubber, acrylic composite rubber, and butadiene rubber, natural rubber, Styrenic thermoplastic elastomers such as styrene-polybutadiene-styrene synthetic rubber, olefinic thermoplastic elastomers such as polyethylene-EPDM synthetic rubber, urethanes such as caprolactone type, adipate type and PTMG type Thermoplastic elastomers, polyester thermoplastic elastomers such as polybutylene terephthalate-polytetramethylene glycol multiblock polymer, polyamide thermoplastic elastomers such as nylon-polyol block copolymer, nylon-polyester block copolymer, 1, 2 -Polybutadiene-type thermoplastic elastomer, vinyl chloride-type thermoplastic elastomer, etc. are mentioned.

These (A) components may be used individually by 1 type, and if compatibility is good, 2 or more types may be used together.
As the component (A), among those described above, a butadiene-styrene-methyl methacrylate copolymer and an acrylonitrile-styrene-butadiene copolymer are preferable because they are excellent in the effect of improving the peel adhesive strength and the impact adhesive strength.

  The content of the component (A) is preferably 5 to 40% by mass, more preferably 10 to 20% by mass, out of a total of 100% by mass of the component (A), the component (B), and the component (C). If content of (A) component is 5 mass% or more, it can suppress that the viscosity at the time of the uncured adhesive composition falls, sagging arises, or adhesiveness falls. On the other hand, if content of (A) component is 40 mass% or less, it can suppress that the viscosity of adhesive composition rises too much and can maintain coating property favorably.

<(B) component: (meth) acrylic acid monomer>
The component (B) is at least one (meth) acrylic acid ester, (meth) acrylic acid ester having an aromatic ring, and (meth) acrylic acid ester having a cyclic ether skeleton. ) Acrylic acid monomer.

  (Meth) acrylic acid alkyl ester is a linear or branched alkyl group in which the alcohol residue is a linear or branched alkyl group, or a part of hydrogen is replaced by a hydroxyl group or an alkoxy group. Or a monocyclic or polycyclic cycloalkyl group or cycloalkenyl group, or a monocyclic or polycyclic cycloalkyl group in which part of hydrogen is substituted with an alkyl group or a cycloalkyl group Is mentioned. Examples of such (meth) acrylic acid alkyl esters include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, t- Butyl (meth) acrylate, amyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, n-nonyl ( (Meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, stearyl (meth) acrylate, methoxyethyl (meth) acrylate, etoxy Ethyl (meth) acrylate, butoxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2-ethylhexyloxyethylene glycol (meth) acrylate 2-ethylhexyloxydiethylene glycol (meth) acrylate, ethoxyethylene glycol (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, cyclohexyl (meth) acrylate, methylcyclohexyl (meth) acrylate, isobornyl (meth) acrylate, cyclopentenyl (meth) Acrylate, dicyclopentanyl (meth) acrylate, adamantyl (meth) acrylate, dicyclopentenyl Shiechiru (meth) acrylate.

  Examples of the (meth) acrylic acid ester having an aromatic ring include phenyl (meth) acrylate, benzyl (meth) acrylate, phenethyl (meth) acrylate, and naphthyl (meth) acrylate.

  Examples of the (meth) acrylic acid ester having a cyclic ether skeleton include (meth) acrylic acid esters having a cyclic ether skeleton containing a furyl group, a furfuryl group, a pyranyl group, and the like. For example, furyl (meth) acrylate, furfuryl (meth) ) Acrylate, tetrahydrofuryl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, caprolactone-modified tetrahydrofurfuryl (meth) acrylate, pyranyl (meth) acrylate, dihydropyranyl (meth) acrylate, tetrahydropyranyl (meth) acrylate, Examples thereof include dimethyldihydropyranyl (meth) acrylate and dimethyltetrahydropyranyl (meth) acrylate.

These (B) components may be used individually by 1 type, and may use 2 or more types together.
As the component (B), among the above-described components, methyl methacrylate and tetrahydrofurfuryl are easily dissolved and dispersed from the viewpoint of improving the flexibility, adhesiveness, and tensile strength of the cured product of the adhesive composition. Methacrylate, 2-ethylhexyl acrylate, 2-hydroxyethyl methacrylate, 4-hydroxybutyl acrylate, and benzyl methacrylate are preferred.

  The content of the component (B) is preferably 50 to 80% by mass in a total of 100% by mass of the component (A), the component (B), and the component (C). If content of (B) component is 50 mass% or more, the softness | flexibility of the hardened | cured material of adhesive composition will become enough, and adhesiveness will improve. On the other hand, if content of (B) component is 80 mass% or less, it can suppress that the tensile strength of hardened | cured material falls.

<(C) component: amino group-containing (meth) acrylic acid ester>
Component (C) is an amino group-containing (meth) acrylic acid ester.
The component (C) is a component that imparts warm water resistance to the cured product of the adhesive composition and also provides solubility to an acidic aqueous solution, particularly a weakly acidic aqueous solution described later.
Examples of the component (C) include N, N-dimethylaminoethyl (meth) acrylate, N, N-diethylaminoethyl (meth) acrylate, t-butylaminoethyl (meth) acrylate, and the like.

  Content of (C) component is 7-30 mass% in the total 100 mass% of (A) component, (B) component, and (C) component. If content of (C) component is 7 mass% or more, the solubility with respect to the acidic aqueous solution of the hardened | cured material of adhesive composition, especially a weak acidic aqueous solution will improve. On the other hand, if content of (C) component is 30 mass% or less, the warm water resistance of hardened | cured material can be maintained favorable.

<(D) component: organic peroxide>
The component (D) is an organic peroxide.
(D) component is a component which reacts with the (E) component mentioned later and generates a radical.
(D) As a component, a well-known organic peroxide can be used, for example, a diacyl peroxide type | system | group, a peroxy ester type | system | group, a hydroperoxide type | system | group, a dialkyl peroxide type | system | group, a ketone peroxide type | system | group, a peroxy ketal type | system | group, an alkyl peroxide. An ester type, a percarbonate type, etc. are mentioned.
These (D) components may be used individually by 1 type, and may use 2 or more types together.

  The content of the component (D) is preferably 0.05 to 10 parts by mass, and preferably 0.25 to 7.5 parts by mass with respect to 100 parts by mass in total of the components (A), (B), and (C). Part is more preferred. If content of (D) component is 0.05 mass part or more, when an adhesive composition hardens | cures, it can fully harden | cure without generating uncured. On the other hand, if content of (D) component is 10 mass parts or less, it can suppress that the storage stability of an adhesive composition falls.

<(E) component: hardening accelerator>
(E) A component is a hardening accelerator.
(E) As a component, a metal salt and amines are preferable.
Examples of the metal salt include metal soaps such as cobalt naphthenate, cobalt octylate, zinc octylate, vanadium octylate, copper naphthenate and barium naphthenate, and metals such as vanadium acetyl acetate, cobalt acetyl acetate and iron acetylacetonate. Chelates are exemplified.
Examples of amines include aniline, N, N-dimethylaniline, N, N-diethylaniline, p-toluidine, N, N-dimethyl-p-toluidine, N, N-bis (2-hydroxyethyl) -p- Toluidine, 4- (N, N-dimethylamino) benzaldehyde, 4- [N, N-bis (2-hydroxyethyl) amino] benzaldehyde, 4- (N-methyl-N-hydroxyethylamino) benzaldehyde, N, N -Bis (2-hydroxypropyl) -p-toluidine, N-ethyl-m-toluidine, triethanolamine, m-toluidine, diethylenetriamine, pyridine, phenylmorpholine, piperidine, N, N-bis (hydroxyethyl) aniline, diethanol N, N-substituted anilines such as aniline, N, N-substituted-p-toluidine 4- (N, N-substituted amino) benzaldehyde and the like.
These (E) components may be used individually by 1 type, and may use 2 or more types together.

The content of the component (E) is not particularly limited as long as the object of the present invention can be achieved, but a total of 100 masses of the components (A), (B), and (C). 0.1-5 mass parts is preferable with respect to a part.
In addition, (E) component may be previously added to the mixture of (A) component, (B) component, and (C) component, and may be added to a mixture at the time of use of an adhesive composition.

  The combination of the component (D) and the component (E) described above is preferably a hydroperoxide type and a metal salt in terms of reactivity, and particularly a combination of cumene hydroperoxide and cobalt naphthenate.

<Other ingredients>
In addition to the components (A) to (E), the adhesive composition of the present invention may contain a polymerization inhibitor for the purpose of adjusting the curing rate.
Examples of the polymerization inhibitor include trihydrobenzene, methylhydroquinone, 14-naphthoquinone, parabenzoquinone, hydroquinone, benzoquinone, hydroquinone monomethyl ether, p-tert-butylcatechol, 2,6-di-tert-butyl-4-methylphenol. Etc.
The content of the polymerization inhibitor is preferably 0.001 to 0.1 parts by mass, and 0.005 to 0.02 with respect to 100 parts by mass in total of the components (A), (B), and (C). More preferably, it is part by mass. If content of a polymerization inhibitor is in the said range, it will become easy to obtain the resin composition excellent in storage stability, coating property, and strength expression.

Moreover, the adhesive composition may contain other monomers as long as the performance is not impaired.
Examples of other monomers include (meth) acrylic acid, (meth) acryloylmorpholine, glycidyl (meth) acrylate, and the like.
The content of the other monomer is preferably 0.1 to 10 parts by mass, and 0.1 to 5 parts by mass with respect to 100 parts by mass in total of the components (A), (B), and (C). More preferably. When the content of the other monomer is within the above range, a resin composition that does not impair the performance is easily obtained.

Furthermore, the adhesive composition is a (meth) acrylic radical polymerizable monomer having two or more double bonds in one molecule, if necessary, for the purpose of imparting strength or improving elongation. A monomer may be contained.
Examples of such (meth) acrylic radical polymerizable monomers include ethylene glycol di (meth) acrylate, 1,3-propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, diethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, polybutylene glycol di (meth) acrylate, bisphenol A ethylene oxide addition Di (meth) acrylate, bisphenol A propylene oxide adduct di (meth) acrylate, bisphenol A diglycidyl ether (meth) acrylic acid adduct, neopentyl glycol di (meth) acrylic 1,4-cyclohexanedimethanol di (meth) acrylate, tricyclodecane dimethanol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tris (2- (meta ) Acryloyloxyethyl) isocyanurate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate and the like.
These may be used alone or in combination of two or more.
Among these, polyethylene glycol di (meth) acrylate, polybutylene glycol di (meth) acrylate, and dipentaerythritol hexa (meth) acrylate are preferable.

  The content of the (meth) acrylic radical polymerizable monomer having two or more double bonds in one molecule is 100 parts by mass in total of the (A) component, the (B) component, and the (C) component. 0.1 to 20 parts by mass is preferable, and 0.5 to 10 parts by mass is more preferable. If the content of the (meth) acrylic radical polymerizable monomer having two or more double bonds in one molecule is within the above range, a resin composition having strength and improved elongation can be obtained. It becomes easy to be done.

In addition, the adhesive composition is made of chlorosulfonated polyethylene, polyurethane, styrene-acrylonitrile copolymer, polymethyl methacrylate, acrylonitrile-butadiene-styrene-methyl methacrylate copolymer for the purpose of adjusting viscosity and fluidity. A thermoplastic polymer such as, fine powder silica and the like may be contained.
Furthermore, the adhesive composition may contain various paraffins in order to quickly cure the part in contact with air, and a commercial inhibitor containing a polymerization inhibitor for the purpose of maintaining storage stability. You may contain antioxidant etc.
In addition, the adhesive composition can be used to improve various properties, if necessary, plasticizer, UV absorber, antistatic agent, lubricant, mold release agent, colorant (dye, pigment, etc.), antifoaming Various additives such as an agent, a polymerization inhibitor, a filler, a wax, and a rust inhibitor may be added.

<Physical properties>
The viscosity at 23 ° C. of the adhesive composition of the present invention is 3000 to 200000 mPa · s, preferably 8000 to 30000 mPa · s. When the viscosity is 3000 mPa · s or more, dripping does not easily occur when the adhesive composition is applied to the fixture. On the other hand, if the viscosity is 200000 mPa · s or less, the adhesive composition can be applied to the fixture.

The viscosity of the adhesive composition is a value measured under the condition of a measurement temperature of 23 ° C. using a single cylindrical rotational viscometer. The rotational speed is set according to the viscosity.
The viscosity of the adhesive composition can be adjusted by adjusting the content and type of each component constituting the adhesive composition. Specifically, when the content of the component (A) is increased, the viscosity value tends to increase.

<Preparation method>
The adhesive composition of the present invention is obtained by mixing the above-described component (A), component (B), component (C), component (D), component (E), and other components as necessary. However, it is preferably prepared as a two-component adhesive composition as follows.
First, the (A) component, the (B) component, and the (C) component are mixed to prepare a mixture.
Subsequently, (D) component is added to the obtained mixture, and it is set as the 1st agent. Separately, (E) component is added to the prepared mixture, and it is set as the 2nd agent. And a 1st agent and a 2nd agent are mixed before use and it uses as an adhesive composition.
In addition, in the two-component adhesive composition, when other components are contained, the other components may be blended in both the first agent and the second agent, or may be blended in either one. .

The adhesive composition of the present invention described above is excellent in coating property and adhesiveness because the viscosity is adjusted by blending the component (A) and the component (B). Moreover, since (C) component is contained, it is excellent in warm water resistance.
Therefore, the adhesive composition of the present invention can firmly and temporarily fix the part to be processed to the fixture.
Further, when machining the workpiece to be temporarily fixed to the fixture, frictional heat is likely to be generated between the cutting jig and the workpiece. Therefore, it is usually processed while being cooled with a large amount of cooling water or the like. However, the adhesive composition of the present invention is excellent in hot water resistance, so that it is difficult to dissolve or swell by water warmed by frictional heat. Therefore, the part to be processed is difficult to peel off from the fixture during processing. In addition, since the part to be processed is difficult to peel off from the fixture during processing, the dimensional stability is also excellent.

  In addition, since the adhesive composition of the present invention contains the component (C), it has excellent solubility in acidic aqueous solutions, particularly weakly acidic aqueous solutions. Therefore, when an acidic aqueous solution is used as a stripping solution used when stripping the workpiece to be processed from the fixture, the adhesive composition is sufficiently dissolved, so that the workpiece to be processed can be easily stripped from the fixture.

  Furthermore, since the adhesive composition of the present invention contains an organic peroxide as component (D) and a curing accelerator as component (E), it can be cured at room temperature in a short time and has excellent curability. . Further, since it is different from an adhesive that is cured by ultraviolet rays, it is also suitable for parts to be processed that are difficult to transmit ultraviolet rays, such as silicon ingots.

[Fixing adhesive]
The adhesive composition of the present invention is suitable as a temporary fixing adhesive used when a raw material (part to be processed) such as a silicon wafer, an optical component, or a semiconductor mounting component is temporarily fixed to a fixture.
Since the adhesive for temporary fixing of the present invention is composed of the adhesive composition of the present invention, it can be cured at room temperature in a short time, and has adhesiveness during processing of a part to be processed and releasability during peeling. In addition, it is also suitable for parts that are difficult to transmit ultraviolet rays.

[Parts manufacturing method]
In the method for producing a part of the present invention, the part to be processed is temporarily fixed to a fixture using the above-described adhesive composition, and after the temporarily fixed part to be processed is processed, the part to be processed and the fixture are acid aqueous solution. It is characterized by detaching each other by immersing in a stripping solution comprising
Specifically, first, the adhesive composition is applied to the fixture, and the part to be processed is bonded to the fixture via the adhesive composition. Next, the adhesive composition is cured, and the part to be processed is temporarily fixed (adhered) to the fixture. Then, machining such as cutting, cutting, and polishing is performed so that the temporarily fixed processing target part has a predetermined shape. Thereafter, the part to be processed and the fixture are immersed in a stripping solution made of an acidic aqueous solution, the cured product of the adhesive composition is dissolved, and the part to be processed is peeled from the fixture to obtain a processed part.

The parts to be processed are not particularly limited, and examples thereof include raw materials such as silicon wafers, optical parts, and semiconductor mounting parts. For example, when manufacturing a silicon wafer, a silicon ingot is used as a part to be processed.
The fixing tool is not particularly limited as long as the part to be processed can be temporarily fixed, and examples thereof include a pedestal.

As a method of applying the adhesive composition to the fixture, for example, various coating methods such as a brush coating method, a spray coating method, a roller coating method, a bar coating method, an air knife coating method, a dipping method, and the like can be appropriately selected. .
As for the film thickness of the adhesive composition to apply, 50-500 micrometers is preferable from a viewpoint of sclerosis | hardenability or adhesive force.
In addition, after bonding the workpiece to be fixed to the fixture, the adhesive composition may be cured by heating. However, the adhesive composition of the present invention can be cured at room temperature in a short time.
In the present invention, “normal temperature” means 23 ° C.

Acidic aqueous solutions used as stripping solutions include hydroiodic acid, perchloric acid, hydrobromic acid, hydrochloric acid, sulfuric acid, oxalic acid, sulfurous acid, phosphoric acid, hydrofluoric acid, formic acid, lactic acid, acetic acid, butyric acid, propionic acid, etc. An aqueous solution of
Among these, aqueous solutions of organic acids such as oxalic acid, formic acid, lactic acid, acetic acid, butyric acid, and propionic acid are preferable. These aqueous solutions of organic acids are weakly acidic aqueous solutions, and can suppress corrosion and deterioration of fixtures, parts to be processed, devices, and the like. In particular, lactic acid is preferable in terms of coatability, handleability, and availability.
In the present invention, “acidic” means that the pH is less than 7, and “weakly acidic” means that the pH is 3 or more and less than 7.

When the workpiece and the fixture to be processed after being processed are immersed in the stripping solution, the stripping solution is accelerated as the temperature of the stripping solution increases. Therefore, heating to 23 ° C. or higher is preferable. Although it depends on the tolerance of the parts to be processed, the fixture, the apparatus, and the life of the stripping solution, it can be heated to 50 ° C. or higher.
Although it does not restrict | limit especially as a heating method, Oven, a dryer, heating steam, an oil bath, a water bath, an infrared heating furnace, a high frequency heating furnace etc. can be used.
Further, the time for immersing in the stripping solution is preferably 1 minute to 24 hours, and may be appropriately determined from the material, shape, coating property, etc. of the part to be processed and the fixture.

  According to the method for manufacturing a component of the present invention described above, the portion to be processed is firmly bonded to the fixture when the component to be processed is processed, and the component to be processed can be easily peeled from the fixture at the time of peeling after processing.

Hereinafter, the present invention will be described with reference to examples and comparative examples. In the following examples, “part” means “part by mass”.
The measurement / evaluation methods in the following examples are as follows.

<Measurement and evaluation method>
(Measurement of viscosity)
The viscosity of the adhesive composition is measured using a single cylinder rotational viscometer (manufactured by Tokyo Keiki Co., Ltd., BM type, BH type) as a mixture comprising the components (A), (B), and (C). The measurement was performed at 23 ° C.
The single cylinder rotational viscometer used BM type when the viscosity was 50000 mPa · s or less, and used BH type when the viscosity was 50000 mPa · s or more.
The number of revolutions is 60 rpm when the viscosity is 20 to 5000 mPa · s, 30 rpm when the viscosity is 5000 to 10000 mPa · s, 12 rpm when the viscosity is 10,000 to 25000 mPa · s, 6 rpm when the viscosity is 25000 to 50000 mPa · s, and 50000 to 100000 mPa · s. In the case of s, it was set to 4 rpm, and in the case of 100,000 to 2000000 mPa · s, it was set to 2 rpm.

(Evaluation of coatability)
The coatability was evaluated according to the following evaluation criteria.
○: An adhesive composition having a predetermined thickness can be applied to the fixture.
(Triangle | delta): The adhesive composition of predetermined thickness cannot be applied to a fixing tool.
X: The adhesive composition cannot be applied to the fixture.

(Evaluation of peelability)
The adhesive composition was applied to heat resistant glass, and a polyethylene terephthalate (PET) film (10 mm × 20 mm × thickness 0.02 mm) was bonded as a support. Then, the adhesive composition was cured by leaving it for 1 day under the condition of a temperature of 23 ° C. After curing, the PET film was peeled off to prepare a peel test specimen.
The obtained peel test specimen was immersed in a 5% by mass lactic acid aqueous solution or 5% by mass acetic acid aqueous solution at 60 ° C., and the time until the cured product of the adhesive composition peeled from the heat-resistant glass was measured. Further, the peeled state was visually observed and evaluated according to the following evaluation criteria.
A: The peeled shape is a film.
X: The peeled shape is a jelly shape.

[Example 1]
(A) component butadiene-styrene-methyl methacrylate copolymer 15 parts, (B) component tetrahydrofurfuryl methacrylate 57 parts, 2-ethylhexyl acrylate 5 parts, and 2-hydroxyethyl methacrylate 15 parts, (C) 8 parts of N, N-dimethylaminoethyl methacrylate as a component and 0.05 part of 2,6-di-tert-butyl-4-methylphenol as a polymerization inhibitor were mixed to prepare a mixture.
To the obtained mixture, 2 parts of cumene hydroperoxide was added as a component (D) to prepare a first agent.
Separately, a mixture was prepared, and 1 part of cobalt naphthenate (metal content: 6%) was added as the component (E) to prepare a second agent.
Subsequently, the first agent and the second agent were mixed to prepare an adhesive composition.
Various measurements and evaluations were performed on the obtained adhesive composition. The results are shown in Table 1.

[Examples 2 to 17, Comparative Examples 1 to 4]
Except having prepared the mixture according to the compounding composition shown to Table 1, 2, the 1st agent and the 2nd agent were produced like Example 1, and the adhesive composition was prepared.
Various measurements and evaluations were performed on the obtained adhesive composition. The results are shown in Tables 1 and 2.
In addition, the compounding quantity of (D) component shown in Table 1, 2 and (E) component is (A) component, (B) component, and (C) component when 1st agent and 2nd agent are mixed. It is the amount for a total of 100 parts.

The symbols in Tables 1 and 2 are as follows.
C-201: butadiene-styrene-methyl methacrylate copolymer (manufactured by Mitsubishi Rayon Co., Ltd.)
MUX-IR: acrylonitrile-styrene-butadiene copolymer (manufactured by UMG ABS)
・ MMA: Methyl methacrylate (Mitsubishi Rayon Co., Ltd.)
THFMA: Tetrahydrofurfuryl methacrylate (Mitsubishi Rayon Co., Ltd.)
2-EHA: 2-ethylhexyl acrylate (Mitsubishi Chemical Corporation)
・ 2-HEMA: 2-hydroxyethyl methacrylate (Mitsubishi Rayon Co., Ltd.)
・ 4-HBA: 4-hydroxybutyl acrylate (Mitsubishi Rayon Co., Ltd.)
・ BzMA: benzyl methacrylate (Mitsubishi Rayon Co., Ltd.)
DMAEMA: N, N-dimethylaminoethyl methacrylate (Mitsubishi Rayon Co., Ltd.)
DEAEMA: N, N-diethylaminoethyl methacrylate (Mitsubishi Rayon Co., Ltd.)
-TBAEM: t-butylaminoethyl methacrylate (manufactured by Sigma Aldrich Japan Co., Ltd.)
-CHP: Cumene hydroperoxide (manufactured by Kayaku Akzo Corporation)
・ Naphtex Co6% T: Cobalt naphthenate (metal content: 6%) (manufactured by Nippon Chemical Industry Co., Ltd.)
-BHT: 2,6-di-t-butyl-4-methylphenol (manufactured by Sumitomo Chemical Co., Ltd.)

As is clear from Tables 1 and 2, the adhesive compositions obtained in each Example were excellent in coating properties and solubility in weakly acidic aqueous solutions.
On the other hand, the adhesive composition obtained in Comparative Example 1 was inferior in coatability. Since this adhesive composition was too high in viscosity and could not be applied to the fixture, the peelability could not be evaluated.
The adhesive composition obtained in Comparative Example 2 having a low content of component (C) of 5% by mass was inferior in solubility in a weakly acidic aqueous solution, and the cured product could not be peeled from the heat-resistant glass.
(C) Although the adhesive composition obtained by the comparative example 3 with much content of a component is 33 mass%, although hardened | cured material was able to peel from heat resistant glass, the peeling state is inferior compared with the case of each Example. It was.
The adhesive composition obtained in Comparative Example 4 was inferior in coatability. Since this adhesive composition was too low in viscosity, it could not be applied to the fixture due to liquid dripping, so the peelability could not be evaluated.

Claims (3)

(A) Component: selected from the group consisting of an elastomer and (B) component: (meth) acrylic acid alkyl ester, (meth) acrylic acid ester having an aromatic ring, and (meth) acrylic acid ester having a cyclic ether skeleton At least one (meth) acrylic acid monomer, (C) component: amino group-containing (meth) acrylic acid ester, (D) component: organic peroxide, (E) component: curing accelerator, An adhesive composition comprising:
The content of the component (C) in the total 100% by mass of the component (A), the component (B) and the component (C) is 7 to 30% by mass, and the viscosity at 23 ° C. is 3000 to 200000 mPa · s. An adhesive composition.   A temporary fixing adhesive comprising the adhesive composition according to claim 1.   A workpiece to be processed is temporarily fixed to a fixture using the adhesive composition according to claim 1, and after the temporarily fixed workpiece to be processed is processed, the workpiece to be processed and the fixture are immersed in a stripping solution made of an acidic aqueous solution. Part manufacturing method which peels each other.