CN106414635A - Adhesive agent composition, and temporary member-fixation method using same - Google Patents

Adhesive agent composition, and temporary member-fixation method using same Download PDF

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Publication number
CN106414635A
CN106414635A CN201580030001.3A CN201580030001A CN106414635A CN 106414635 A CN106414635 A CN 106414635A CN 201580030001 A CN201580030001 A CN 201580030001A CN 106414635 A CN106414635 A CN 106414635A
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CN
China
Prior art keywords
methyl
adhesive composite
component
acrylate
mass parts
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Granted
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CN201580030001.3A
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Chinese (zh)
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CN106414635B (en
Inventor
石田泰则
栗村启之
宇野弘基
关上浩
玉井希
宫崎隼人
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Denka Co Ltd
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Denki Kagaku Kogyo KK
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Abstract

The purpose of the present invention is to provide an adhesive agent composition for temporary fixation such that members fixed thereby do not detach during processing and do not separate during a post-processing cleaning step, specifically an adhesive agent composition comprising (1) a monofunctional (meth)acrylate monomer having a hydroxyl group and an acyclic saturated hydrocarbon linked by an ester bond, (2) a monofunctional (meth)acrylate monomer having cyclic hydrocarbons linked by an ester bond, (3) a polyfunctional (meth)acrylate monomer that does not have an ethylene glycol structure, (4) a thermal radical polymerization initiator, and (5) a reducing agent, wherein, a total of 100 parts by mass of constituents (1), (2) and (3) includes 50-98 parts by mass of constituent (1), 1-40 parts by mass of constituent (2), and 1-30 parts by mass of constituent (3).

Description

Adhesive composite and the method for temporary fixing of the component using adhesive composite
Technical field
The present invention relates to processing the method for temporary fixing of component during various component and being suitable for aforementioned method for temporary fixing Compositionss and bonding agent.The present invention is for example by temporarily solid by this component during silicon ingot casting (silicon ingot) processing Silicon Wafer Fixed method and (methyl) acrylic acid seriess temporarily fixation adhesive composite being suitable for this purposes.
Background technology
As the temporarily fixation bonding agent of the quasiconductor installing component such as Silicon Wafer etc., glued using two-sided tape, hot melt system Connect agent, epoxy bonding agent.The component being engaged using these bonding agents or be laminated is cut into after the shape of regulation, removes Bonding agent, manufacture tooling member.For example, with regard to quasiconductor installing component, these parts are fixed on after base material with two-sided tape, Machining is desired part, and further to two-sided tape irradiation ultraviolet radiation, thus carries out the stripping from part.Hot melt It is the situation of bonding agent, component is connect merga pass heating makes bonding agent be impregnated with to gap, and machining is desired portion Part, and carry out the stripping of bonding agent in organic solvent.The situation of epoxy bonding agent, metering host and firming agent, mixes simultaneously After engaging with component, machining is desired part, and carries out the stripping of bonding agent in organic solvent.
But two-sided tape presence is difficult to reach thickness and precision or adhesive strength weak event stripping etc in component processing Problem.In addition, some two-sided tapes are peeled off by heating, if there is also the heat now not applying more than 100 DEG C, cannot shell From etc problem.In addition, also some double faced adhesive tapes are irradiated by ultraviolet and peel off, pass through if there is also now adherend and lacking Property then cannot peel off such problem.
If hot melt system bonding agent does not apply more than 100 DEG C of heat in bonding, mostly it is difficult to joint applications aforementioned viscous Connect the component of agent, therefore spendable component is restricted.In addition, hot melt system bonding agent need to use organic solvent when peeling off, Matting hence with basic solvent or the organic solvent of halogen system organic solvent is loaded down with trivial details, and can cause on working environment Problem.
Epoxy bonding agent needs suitably to measure host and with firming agent and is sufficiently mixed to use, but this metering with mix not Exist when fully and cause the significantly reduced situation of cementability.In addition, in the same manner as hot melt system bonding agent, epoxy bonding agent is in stripping From when need to use organic solvent, the matting of therefore basic solvent or halogen system organic solvent is loaded down with trivial details, and can cause operation Problem environmentally.In addition, the curing rate of epoxy bonding agent is slow, the period to solidification is necessary to ensure that sufficient solidification Time.The polymercaptan using as the firming agent of epoxy bonding agent or amine can produce stench, therefore have safety and workability Substantially poor problem.The bisphenol A-type diglycidyl ether being usually used as the host of epoxy bonding agent is from safety From the aspect of need cautiously to operate, in workability have problems.
Prior art literature
Patent documentation
Patent documentation 1：Japanese Unexamined Patent Publication 2010-248395 publication
Patent documentation 2：International Publication No. 2013/022096
Patent documentation 3：Japanese Unexamined Patent Publication 2011-089055 publication
Patent documentation 4：Japanese Unexamined Patent Publication 2013-138194 publication
Patent documentation 5：International Publication No. 2011/102341
Patent documentation 6：International Publication No. 2013/021945
Patent documentation 7：International Publication No. 2013/039226
Patent documentation 8：International Publication No. 2013/161221
Patent documentation 9：Japanese Unexamined Patent Publication 7-153724 publication
Patent documentation 10：Japanese Unexamined Patent Publication 11-60400 publication
Content of the invention
Problems to be solved by the invention
In addition, for solving these problems, proposing a kind of (methyl) acrylic acid seriess temporarily fixation bonding in patent documentation 1 Agent.But practicably need in the warm water being immersed in more than 70 DEG C when peeling off, therefore preferably have low temperature from safety The temporarily fixation bonding agent of stripping performance.
In addition, proposing acrylic acid seriess temporarily fixation bonding agent in patent documentation 2～8.But, by selecting this enforcement (methyl) acrylate of mode, such as tensile bond intensity become big, solidfied material glass transition temperature and improve, therefore cutting adds The dimensional accuracy of the component in man-hour become well, be not easy in the matting using water peel off, cleaning excellent, to this Record related content is had no in patent documentation 2～8.
In view of aforementioned present situation, in order to lifted machining rear part dimensional accuracy it is desirable to one kind in processing, component is not Can come off, (methyl) acrylic acid series bonding agent that on the other hand component will not be peeled off in matting after processing.
Present embodiment solves aforementioned problems.
For solution to problem
That is, the present invention is as described below.
1. a kind of adhesive composite, it contains：(1) there is the simple function of hydroxyl and non-ring type saturated hydrocarbons by ester bond (methyl) acrylate monomer, (2) have simple function (methyl) acrylate monomer of ring type hydrocarbon by ester bond, (3) do not have There are multifunctional (methyl) acrylate monomer, (4) hot radical polymerization initiator and (5) reducing agent of ethylene glycol structure, and (1), in total 100 mass parts of (2), (3), the consumption of (1) is 50～98 mass parts, and the consumption of (2) is 1～40 mass parts, (3) consumption is 1～30 mass parts.
2. the adhesive composite according to the 1st, it also contains (6) elastomer components.
3. the adhesive composite according to the 1st or 2, it also contains (7) adaptation and gives composition.
4. the adhesive composite according to any one of the 1st～3, it also contains (8) polymerization inhibitor.
5. the adhesive composite according to any one of the 1st～4, wherein, with respect to (1), (2), (3) total 100 mass parts, the consumption of (4) is 0.5～15 mass parts, with respect to total 100 mass parts of (1), (2), (3), the consumption of (5) For 0.01～5 mass parts.
6. the adhesive composite according to the 2nd, wherein, with respect to total 100 mass parts of (1), (2), (3), (6) consumption is 5～45 mass parts.
7. the adhesive composite according to any one of the 1st～6, wherein, (1) be selected from (methyl) acrylic acid- One or more of 2- hydroxy methacrylate and glycerol list (methyl) acrylate.
8. the adhesive composite according to any one of the 1st～7, wherein, the ring type hydrocarbon of (2) has selected from benzene In ring, bicyclopentyl, dicyclopentenyl more than a kind, and there is no hydroxyl.
9. the adhesive composite according to any one of the 1st～8, wherein, (2) are selected from (methyl) acrylic acid benzene Epoxide ethyl ester, (methyl) benzyl acrylate, (methyl) acrylic acid bicyclo- pentyl ester, (methyl) acrylic acid dicyclopentenyl ester, (methyl) In acrylic acid bicyclopentyl 2-ethoxyethyl acetate, (methyl) acrylic acid dicyclopentenyl 2-ethoxyethyl acetate more than a kind.
10. the adhesive composite according to any one of the 1st～9, wherein, (3) be do not have aromatic ring and Molecular weight is less than 1,000 2 senses (methyl) acrylate monomer.
11. adhesive composites according to any one of the 1st～10, wherein, (3) are selected from 1,6- hexanediol two (methyl) acrylate, 1,9- nonanediol two (methyl) acrylate, 1,10- decanediol two (methyl) acrylate, new penta 2 In alcohol two (methyl) acrylate, dihydroxymethyl-tristane two (methyl) acrylate more than a kind.
A kind of 12. adhesive composites of two component types, it is by the adhesive composite any one of the 1st～11 It is divided into two components, in the first component, at least contains (4) hot radical polymerization initiator, in the second component, at least contain (5) reduction Agent.
13. adhesive composites according to any one of the 1st～12, wherein, the solidfied material of adhesive composite Glass transition temperature be in 90～250 DEG C of scope, and make the solidfied material of adhesive composite impregnated in 23 DEG C pure In water, swelling ratio when 60 minutes is in 0.1～10% scope, and makes the solidfied material of adhesive composite impregnated in 50 DEG C Pure water in 60 minutes when swelling ratio be in 4～20% scope.
14. adhesive composites according to any one of the 1st～13, it is used for temporarily fixing.
A kind of 15. duplexers, it use the adhesive composite any one of the 1st～14 and carry out bonding and glued Thing.
16. duplexers according to the 15th, it is also laminated with priming paint.
17. duplexers according to the 16th, it is sequentially laminated with base material, priming paint, adhesive composite, component.
18. duplexers according to any one of the 15th～17, wherein, component is ingot casting.
19. duplexers according to the 18th, wherein, component is selected from monocrystalline silicon cast ingot, polycrystalline silicon ingot casting, carborundum In ingot casting more than a kind.
A kind of 20. method for temporary fixing of component, it will using the adhesive composite any one of the 1st～14 Component is temporarily fixed to base material, and aforementioned adhesive composite is solidified, after the component temporarily fixed is processed, will be aforementioned viscous The solidfied material connecing agent compositionss impregnated in steeping medium, thus the component after base material takes off processing.
The method for temporary fixing of 21. components according to the 20th, wherein, steeping medium is selected from (a) water, (b) pH4 In following acid, (c) remover containing water, alcohols and surfactant more than a kind.
A kind of 22. method for temporary fixing of component, it will using the adhesive composite any one of the 1st～14 Component is temporarily fixed to base material, and aforementioned adhesive composite is solidified, after the component of aforementioned temporary transient fixation is processed, heating Process the solidfied material of aforementioned adhesive composite, thus the component after base material takes off processing.
The method for temporary fixing of 23. components according to the 22nd, wherein, at heating in the range of 150～300 DEG C Reason solidfied material.
The method for temporary fixing of 24. components according to any one of the 20th～23, wherein, using priming paint.
The method for temporary fixing of 25. components according to the 24th, wherein, primer applications are in base material.
The method for temporary fixing of 26. components according to the 24th, wherein, primer applications are in component.
The method for temporary fixing of 27. components according to any one of the 24th～26, wherein, priming paint contains adaptation Give composition and solvent.
The method for temporary fixing of 28. components according to any one of the 20th～27, wherein, the processing of component is logical Cross and cut to make wafer.
The method for temporary fixing of 29. components according to any one of the 20th～28, wherein, component is ingot casting.
The method for temporary fixing of 30. components according to the 29th, wherein, component is selected from monocrystalline silicon cast ingot, polycrystalline In silicon ingot casting, carborundum ingot casting more than a kind.
The effect of invention
One kind temporarily fixation adhesive composite can be provided according to the present invention, its component in processing will not fall off, In matting after processing, component will not be peeled off.
Specific embodiment
Embodiment of the present invention described further below.
In embodiment of the present invention, contain：(1) there is the simple function (first of hydroxyl and non-ring type saturated hydrocarbons by ester bond Base) acrylate monomer, (2) have simple function (methyl) acrylate monomer of ring type hydrocarbon by ester bond, (3) do not have second Multifunctional (methyl) acrylate monomer of diol structure, (4) hot radical polymerization initiator and (5) reducing agent.
Here, simple function (methyl) acrylate refers to that intramolecular has the compound of 1 (methyl) acryloyl group, many officials Can refer to that intramolecular has the compound of more than 2 (methyl) acryloyl groups by (methyl) acrylate.
(methyl) acrylate monomer that present embodiment is used contains (1) and has hydroxyl and non-ring type by ester bond Simple function (methyl) acrylate monomer of saturated hydrocarbons, (2) have simple function (methyl) acrylic acid of ring type hydrocarbon by ester bond Ester monomer and (3) do not have multifunctional (methyl) acrylate monomer of ethylene glycol structure.
(1) that present embodiment is used has the simple function (methyl) third of hydroxyl and non-ring type saturated hydrocarbons by ester bond Olefin(e) acid ester monomer refers to, for example, have more than one hydroxyl and more than one non-ring type saturation in the molecule by ester bond Simple function (methyl) acrylate monomer of hydrocarbon.The hydrogen being preferably non-ring type saturated hydrocarbons is optionally substituted by a hydroxyl group.As (1), can enumerate (methyl) 2-Hydroxy ethyl acrylate, (methyl) acrylic acid -3- hydroxy propyl ester, (methyl) 2-hydroxypropyl acrylate, (first Base) (methyl) acrylic acid hydroxy alkyl ester such as acrylic acid -4- hydroxybutyl；Polycaprolactone list (methyl) acrylate, poly- four methylenes Ether list (methyl) acrylate, poly- four methylene ether list (methyl) acrylate etc. pass through hydroxyl and (methyl) propylene of polyalcohols The compound of the gained such as the esterification of acid；Trimethylolpropane list (methyl) acrylate, glycerol list (methyl) acrylate, The compounds such as tetramethylolmethane list (methyl) acrylate, i.e. make at least one hydroxyl of the compound containing more than 2 hydroxyls residual Stay and other hydroxyls and (methyl) acrylic acid carry out compound of esterification gained etc..Can using a kind in these materials with On.
From cementability, thermostability, fissility, resistance to cleaning aspect, be wherein preferably selected from (1-1) (methyl) propylene Sour hydroxy alkyl ester, (1-2) make 1 hydroxyl in the compound containing more than 2 hydroxyls carry out esterification instead with (methyl) acrylic acid Answer more than a kind in the compound of gained.(1-1) in (methyl) acrylic acid hydroxy alkyl ester, preferably (methyl) acrylic acid -2- hydroxyl Ethyl ester.(1-2) 1 hydroxyl in the compound containing more than 2 hydroxyls is made to carry out esterification gained with (methyl) acrylic acid Compound in, preferably glycerine list (methyl) acrylate.
In (1), (2), total 100 mass parts of (3), consumption preferably 50～98 mass parts of (1), more preferably 55 ～95 mass parts.(1) consumption only hour, more than for example, 50 mass parts, then is available for improving structure after machining The high-adhesive-strength of the dimensional accuracy of part, the thermostability for processing heat produced during processing also improves, and is easy in water Swelling, the fissility of the component after therefore processing improves.(1) when consumption is excessive, below for example, 98 mass parts, then resistance to clear Washing property is excellent.
There is by ester bond simple function (methyl) the acrylate list of ring type hydrocarbon as (2) that present embodiment is used Body, can illustrate such as following (2-1)～(2-3), can be using more than a kind in these materials.As ring type hydrocarbon, from resistance to cleaning, Set out with the dissolubility of elastomer components, be preferably selected from more than a kind in aliphatic ring and aromatic ring.Also can be used them Mixture.In aliphatic ring, it is preferably selected from more than a kind in dicyclopentenyl and bicyclopentyl, more preferably dicyclopentenyl Base.From the dissolubility of resistance to cleaning and elastomer components, in aromatic ring, it is preferably phenyl ring.
(2-1) there is (methyl) acrylate of dicyclopentenyl
As (methyl) acrylate with dicyclopentenyl, (methyl) acrylic acid dicyclopentenyl ester, (first can be enumerated Base) acrylic acid dicyclopentenyl 2-ethoxyethyl acetate, dicyclopentenyl epoxide diethylene glycol (methyl) acrylate, dicyclopentenyl epoxide Triethylene glycol (methyl) acrylate and dicyclopentenyl epoxide propylene glycol (methyl) acrylate etc., can use these materials In more than a kind.Wherein, it is preferably selected from (methyl) acrylic acid dicyclopentenyl ester and (methyl) acrylic acid dicyclopentenyl oxygen second In ester more than a kind.
(2-2) there is (methyl) acrylate of bicyclopentyl
As (methyl) acrylate with bicyclopentyl, (methyl) acrylic acid bicyclo- pentyl ester, (methyl) third can be enumerated Olefin(e) acid bicyclopentyl 2-ethoxyethyl acetate, bicyclopentyl epoxide diethylene glycol (methyl) acrylate, bicyclopentyl epoxide triethylene glycol (first Base) acrylate and bicyclopentyl epoxide propylene glycol (methyl) acrylate etc., can be using more than a kind in these materials.Its In, it is preferably selected from more than a kind in (methyl) acrylic acid bicyclo- pentyl ester and (methyl) acrylic acid bicyclopentyl 2-ethoxyethyl acetate.
(2-3) there is (methyl) acrylate of phenyl ring
As (methyl) acrylate with phenyl ring, (methyl) the acrylic acid seriess list shown in formula (C) or (D) can be enumerated Body etc..
Formula (C) Z-O- (R5O)q-R6
Formula (D) Z-O- (R5)q-R6
(in formula, Z represents (methyl) acryloyl group, R5Expression-CH2-、-C2H4-、-C3H6-、-CH2CH(CH3)-、-C4H8- Or-C6H12-, R6The phenyl representing phenyl or having the alkyl of carbon number 1～3, q represents 1～10 integer.)
As such (methyl) acrylate, (methyl) acrylate, phenoxy group diethylene glycol can be enumerated (methyl) acrylate, phenoxy group Polyethylene Glycol (methyl) acrylate, (methyl) acrylic acid phenoxy-propyl, phenoxy group dipropyl Glycol (methyl) acrylate and phenoxy group polypropylene glycol (methyl) acrylate, (methyl) benzyl acrylate etc., can use this In a little materials more than a kind.In these materials, it is preferably selected from (methyl) acrylate and (methyl) acrylic acid benzyl In ester more than a kind.
From temporarily fixing with difficult swelling water, the resistance to cleaning of bonding agent solidfied material excellent, become using aftermentioned (6) elastomer Timesharing should (6) soluble and easily fabricated temporary transient fixation with adhesive composite such from the viewpoint of, in preferred molecule in (2) There is no hydroxyl.
(1), in total 100 mass parts of (2), (3), consumption preferably 1～40 mass parts of (2), more preferably 2～35 Mass parts, most preferably 3～20 mass parts, more preferably 8～16 mass parts.(2) consumption only hour, for example, 1 More than mass parts, then fissility is excellent.In addition, similarly, when the consumption of (2) is excessive, below for example, 40 mass parts, then resistance to Cleaning is excellent.
There is no as (3) that present embodiment is used multifunctional (methyl) acrylate of ethylene glycol structure, can lift Go out intramolecular there is no ethylene glycol structure and there is multifunctional (methyl) acrylate list of more than 2 (methyl) acryloyl groups Body.Can be using more than a kind in these materials.Preferably there is in these materials alkane diol structure (such as-O-R-O- structure.R For alkylidene) but there is no ethylene glycol structure (such as-O-CH2CH2- O- structure) multifunctional (methyl) acrylate monomer.
As 2 senses (methyl) acrylate monomer, 1,3 butylene glycol two (methyl) acrylate, Isosorbide-5-Nitrae-fourth two can be enumerated Alcohol two (methyl) acrylate, 1,6-HD two (methyl) acrylate, 1,9- nonanediol two (methyl) acrylate, new penta Glycol two (methyl) acrylate, 2- ethyl -2- butyl-propylene glycol two (methyl) acrylate, dihydroxymethyl-tristane two (methyl) acrylate, neopentyl glycol modification trimethylolpropane two (methyl) acrylate, stearic acid modified tetramethylolmethane two (methyl) acrylate, polypropylene glycol two (methyl) acrylate, hexanediol two (methyl) acrylate etc..
As 3 senses (methyl) acrylate monomer, trimethylolpropane tris (methyl) acrylate, three [(first can be enumerated Base) acryloyl-oxyethyl] isocyanuric acid ester etc..
As (methyl) acrylate monomers more than 4 senses, can enumerate dihydroxy methylpropane four (methyl) acrylate, Tetramethylolmethane four (methyl) acrylate, tetramethylolmethane ethyoxyl four (methyl) acrylate, dipentaerythritol five (methyl) third Olefin(e) acid ester, dipentaerythritol six (methyl) acrylate etc..
(3), in, preferably intramolecular does not have aromatic ring.(3) molecular weight is preferably less than 1000, more preferably 500 Hereinafter, most preferably less than 400.(3) molecular weight is preferably more than 50, more preferably more than 100, most preferably more than 200. (3), in, preferably intramolecular does not have propylene glycol structure yet.
From high-adhesive-strength, thermostability, resistance to cleaning, workability, fissility, in these materials, preferably 2 senses (methyl) acrylate monomer.In 2 senses (methyl) acrylate monomer, it is preferably selected from 1,6- hexanediol two (methyl) propylene Acid esters, 1,9- nonanediol two (methyl) acrylate, 1,10- decanediol two (methyl) acrylate, neopentyl glycol two (methyl) In acrylate, dihydroxymethyl-tristane two (methyl) acrylate more than a kind, more preferably 1,9- nonanediol two (first Base) acrylate.
From high-adhesive-strength, thermostability, resistance to cleaning, workability, fissility, (1), (2), (3) add up to 100 mass In part, the consumption of (3) is preferably 1～30 mass parts, more preferably 5～15 mass parts.(1) consumption only hour, for example, 1 More than mass parts, then it is available for improving the high-adhesive-strength of the dimensional accuracy of machining rear part, for processing when institute Produce processing heat thermostability improve, not only resistance to cleaning excellent and also peel off after adhesive composite solidfied material formed film Shape, bonding agent solidfied material for component surface will not cull, workability is excellent.In addition, the consumption of (3) only hour, for example, Below 30 mass parts, then the fissility of processing rear part is excellent.
(4) the hot radical polymerization initiator being used for present embodiment, for example, be divided into two groups of timesharing reactivity Aspect more excellent.As hot radical polymerization initiator, preferably isopropyl benzene hydroperoxide, p-menthane hydroperoxide, the tert-butyl group Hydrogen peroxide, diisopropylbenzene (DIPB) diperoxy hydrogen, methyl-ethyl-ketone peroxide, benzoyl peroxide and perbenzoic acid The organic peroxides such as the tert-butyl ester.Can be using more than a kind in these materials.From the reactivity with (1), (2), (3), this In a little materials, preferably isopropyl benzene hydroperoxide.
With respect to total 100 mass parts of (1), (2), (3), the consumption of (4) that present embodiment is used is preferably 0.5 ～15 mass parts, more preferably 1～8 mass parts.(4) consumption only hour, more than for example, 0.5 mass parts, then solidifies speed Degree is fast and workability is excellent, and when in addition excessive, below for example, 15 mass parts, then bin stability is excellent.
(5) reducing agent being used for present embodiment, as long as example reacting and be produced from (4) polymerization initiator Can be used by the known reducing agent of base.From the reactivity with (4), as (5) reducing agent, preferably acetylacetone,2,4-pentanedione oxygen Vanadium (vanadyl acetylacetonate), vanadium acetylacetonate, acetylacetone cobalt, acetylacetone copper, aphthenic acids vanadyl (vanadyl naphthenate), stearic acid vanadyl, copper naphthenate, cobalt octoate etc. have the slaine of reproducibility, more preferably Vanadyl acetylacetonate.Can be using more than a kind in these materials.
Add up to 100 mass parts with respect to (1), (2), (3), the consumption of (5) is preferably 0.01～5 mass parts, more preferably 0.05～2 mass parts.(5) consumption only hour, more than for example, 0.01 mass parts, then curing rate is fast and cementability is big, In addition when excessive, below for example, 5 mass parts, then will not remained unreacted composition and cementability is big.
In present embodiment, in order to improve the dimensional accuracy of machining rear part and obtain high-adhesive-strength, preferably make With (6) elastomer components.
(6) elastomer components being used as present embodiment, can enumerate (methyl) acrylonitrile-butadiene-(methyl) Acrylic copolymer, (methyl) acrylonitrile-butadiene-(methyl) acrylate copolymer, (methyl) acrylic acid methyl ester .-fourth two Alkene-styrol copolymer, (methyl) acrylonitrile-butadiene-styrene copolymer and (methyl) acrylonitrile-butadiene rubber, The various synthetic rubber such as wire polyurethane, SBR styrene butadiene rubberses, chloroprene rubber and butadiene rubber；Natural rubber Glue；The styrene series thermoplastic elastomer of polystyrene-polybutadiene-polystyrene synthetic rubber etc；Polyethylene-EPDM synthesizes The olefin series thermoplastic elastomer of rubber etc；And the carbamate of caprolactone type, adipate types and PTMG type etc Based thermoplastic elastomer；The Polyester thermoplastic of poly- terephthalic acids butanediol ester-polytetramethylene glycol multi-block polymer etc Property elastomer；The Thermoplastic polyamide elastomer of nylon-polyol blocks copolymer etc；1,2- polybutadiene based thermoplastic Elastomer and polyvinyl chloride thermoplastic elastomer (TPE) etc..As long as these elastomer components compatibilitys well then can using a kind with On.
In addition, it is possible to use end (methyl) acrylic acid modified polybutadiene.
From the dissolubility to (methyl) acrylic monomer, cementability, in these materials, preferably (methyl) acrylic acid Methyl ester-BS and/or (methyl) acrylonitrile-butadiene rubber, are more preferably applied in combination these materials. When being applied in combination, its use ratio is for example in (methyl) methylacrylate-butadiene-styrol copolymer and acrylic nitrile-butadiene two In total 100 mass parts of alkene rubber, by quality ratio, preferably (methyl) methylacrylate-butadiene-styrene copolymerized Thing：(methyl) acrylonitrile-butadiene rubber=50～95：5～50, more preferably 60～80：20～40.Use (methyl) propylene During nitrile-butadiene rubber, (methyl) acrylonitrile content (nitrile content) is preferably 36～45 mass %.
With respect to total 100 mass parts of (1), (2), (3), the consumption of (6) is preferably 5～45 mass parts, more preferably 20～35 mass parts.(6) consumption only hour, more than for example, 5 mass parts, then viscosity and cementability improve, in addition, only When big, below for example, 45 mass parts, then viscosity is low and operation on will not produce unfavorable condition.
The adhesive composite of present embodiment, in order that partly solidifying rapidly of ingress of air, can use various paraffin Class.As paraffin class, paraffin, microwax, Brazil wax, Apis cerana Fabriciuss, lanoline, spermaceti, ceresine and candelilla wax can be enumerated (candelilla wax) etc..Can be using more than a kind in these materials.
With respect to total 100 mass parts of (1), (2), (3), the consumption of paraffin class is preferably 0.1～5 mass parts, more excellent Elect 0.3～2.5 mass parts as.If more than 0.1 mass parts, then the solidification of ingress of air part improves, if 5 mass parts with Under, then adhesive strength improves.
To improve the purpose of bin stability, the adhesive composite of present embodiment can use (8) polymerization inhibitor.As (8) polymerization inhibitor, can enumerate hydroquinone, 1,4-benzoquinone, hydroquinone monomethyl ether, 2,6 ditertiary butyl p cresol, 2,2 '-di-2-ethylhexylphosphine oxide (4- first Base -6- tert-butyl phenol), triphenyl phosphate, phenothiazine (phenothiazine) and N- isopropyl-N '-phenyl-pphenylenediamine Deng.Can be using more than a kind in these materials.From bin stability, in these materials, it is preferably selected from 1,4-benzoquinone and hydroquinone In monomethyl ether more than a kind, more preferably 1,4-benzoquinone.
With respect to total 100 mass parts of (1), (2), (3), the consumption of (8) polymerization inhibitor is preferably 0.001～3 mass parts, More preferably 0.01～1 mass parts.More than 0.001 mass parts then effective, below 3 mass parts, then adhesive strength improves.
The adhesive composite of present embodiment can use (7) adaptation to give composition.(7) adaptation gives in composition, It is preferably selected from more than a kind in silane coupler and phosphate.
As silane coupler, γ-r-chloropropyl trimethoxyl silane, vinyltrimethoxy silane, vinyl can be enumerated Trichlorosilane, VTES, vinyl-three ('beta '-methoxy ethyoxyl) silane, γ-(methyl) acryloxy Propyl trimethoxy silicane, β-(3,4- epoxycyclohexyl) ethyl trimethoxy silane, γ-glycidoxypropyl group trimethoxy Silane, γ mercaptopropyitrimethoxy silane, γ aminopropyltriethoxy silane, N- β-(amino-ethyl)-gamma-amino third Base trimethoxy silane, N- β-(amino-ethyl)-gamma-amino hydroxypropyl methyl dimethoxysilane, γ-ureido-propyl triethoxy Silane etc..From cementability, in these materials, preferably γ-glycidoxypropyltrime,hoxysilane and/or γ-(first Base) acryloxypropyl trimethoxy silane, more preferably γ-(methyl) acryloxypropyl trimethoxy silane.
As phosphate, compound shown in formula (A) etc. can be enumerated.
In formula, R8Represent CH2=CR9CO(OR10)u- base (wherein, R9For hydrogen or methyl, R10For-C2H4-、-C3H6-、- CH2CH(CH3)-、-C4H8-、-C6H12- or
U represents 1～10 integer.), t represents 1 or 2 integer.
As phosphate, (methyl) acrylic acid acid phosphonato ethyl ester, (methyl) acrylic acid acid phosphono oxygen can be enumerated Base propyl ester and double (2- (methyl) acryloyl-oxyethyl) ester of phosphoric acid etc..Can be using more than a kind in these materials.From effect Preferably set out, in these materials, be preferably (methyl) acrylic acid acid phosphonato ethyl ester.
With respect to total 100 mass parts of (1), (2), (3), the consumption that (7) adaptation gives composition is preferably 0.1～15 Mass parts, preferably 0.5～10 mass parts, preferably 0.8～7 mass parts, more preferably 1～5 mass parts.If 0.1 mass Dimensional accuracy when then adhesive strength improves and processes more than part is excellent, if then adhesive strength improves below 15 mass parts.
In addition, in addition to these materials, also dependent on needing using plasticizer, filler, coloring agent and preservative etc. Known material.
Additionally, the purpose for adjustment viscosity, mobility, it is possible to use chlorosulfonated polyethylene, polyurethane, styrene/the third The thermal plastic high polymer such as alkene lonitrile copolymer and polymethyl methacrylate and micropowder silicon dioxide etc..
As the embodiment of present embodiment, can enumerate and be used in the form of two component type adhesive composites.With regard to Two component types, do not mix all essential components of the adhesive composite of present embodiment, by adhesive composite in storage It is divided into the first component and the second component, and at least storage (4), at least storage (5) in the second component in the first component respectively. (7) adaptation gives composition and is preferably stored in the second component.Now, two components are coated adherend at the same time or separately and connect Touch, solidify, thus can be used in the form of two component type adhesive composites.
As other embodiment, in any one or both of the first component and the second component, contain (methyl) third in advance Olefin(e) acid ester and other any conditions, and both mixing when using, thus can be in the form of one-pack type adhesive composite Use.
From the aspect that bin stability is excellent, in these embodiments, preferably with two component type adhesive composites Form use.
The adhesive composite of present embodiment does not need correctly to measure two components, even if incomplete metering, mixing, has When only two components contact also can be in normal temperature cure.The solidification of the adhesive composite of present embodiment is not required to ultraviolet.This enforcement The workability of the adhesive composite of mode is excellent.
In present embodiment, the glass transition temperature of the solidfied material being obtained by adhesive composite is preferably 90～250 In the range of DEG C.By making the glass transition temperature of the solidfied material being obtained by this adhesive composite in aforementioned range, that is, Processed component is made to generate heat because of processing heat during processing, the cementability of this component and base material reduces it is also possible to suppression size is smart The deterioration of degree, dimensional accuracy significantly improves.
The mensure side of the glass transition temperature of the solidfied material being obtained by adhesive composition used in present embodiment There is no particular restriction for method, it is possible to use the known method such as DSC, dynamic viscoelastic spectrum is measured, and preferably uses dynamic viscoelastic Spectrum.
Using adhesive composite laminating component (such as silicon) and the substrate (such as clouded glass) of present embodiment, mensure is drawn When stretching adhesive strength, tensile bond intensity is preferably more than 10MPa.If tensile bond intensity is more than 10MPa, processed structure Part becomes abundant with the cementability of base material, and this component of work in-process will not be peeled off, and dimensional accuracy improves, and processing unit (plant) will not produce Fault.From the aspect of dimensional accuracy, tensile bond intensity is more preferably more than 15MPa.
The adhesive composite of present embodiment can use as temporarily fixation adhesive composite.As this embodiment party The using method of the temporarily fixation adhesive composite of formula, can enumerate following method：In a fixing component or substrate The appropriate temporarily fixation adhesive composite of bonding plane coating, the then method of another component overlapping or substrate；Will in advance The component stacking temporarily fixed is multiple, is impregnated into method that gap is coated etc. using making temporarily to fix with adhesive composite Coating temporarily fixation adhesive composite, makes temporarily to fix with adhesive composite solidification, component is temporarily fixed Method etc..
As base material (for example supporting substrate), such as clouded glass can be enumerated.When clouded glass is preferably as processing silicon ingot casting etc. Base material.During using clouded glass, there is advantages below：It is not easy to wear away the line tool being used during processing or cutter etc., easily with low Valency obtains, easily obtains cementability.
The surface roughness of the clouded glass being used as base material, generally uses the clouded glass that Ra is 0.2～10 μm about.
The adhesive composite of present embodiment passes through to control the swelling behavior of solidfied material can have resistance to cleaning and stripping concurrently Property.Specifically, impregnate 60 points of the solidfied material of this temporary transient fixation adhesive composite in cleaning 23 DEG C of used pure water Swelling ratio during clock is preferably 0.1～10% scope, and impregnates the solidfied material of this adhesive composite in 50 DEG C of pure water Swelling ratio when 60 minutes is preferably in 4～20% scope.If the solidfied material of this adhesive composite is contacted with water, only have The part directly contacting with water can be swelling, and the part not contacted with water will not be swelling, therefore can make consolidating of adhesive composite The thickness of compound produces inequality, and produces gap between the solidfied material in adhesive composite and component and/or base material, and water can be invaded Enter this gap and reach stripping.But, if producing by aforementioned swelling caused in 23 DEG C about used of pure water of cleaning Peel off, then make cleaning insufficient sometimes.From the aspect of resistance to cleaning, when impregnating 60 minutes in 23 DEG C of pure water Swelling ratio is more preferably in 0.1～5% scope, and the aspect from fissility, impregnates 60 minutes in 50 DEG C of pure water When swelling ratio be more preferably in 6～20% scope.
Various components are temporarily fixed to base material by the temporarily fixation adhesive composite of present embodiment, and component is implemented After cutting into the processing such as desired shape, grinding, grinding, by impregnating the solidification of this temporary transient fixation adhesive composite Thing, can be from component stripping composition.Steeping medium is preferably selected from (a) water and the acid of (b) below pH4 and (c) contains water, alcohol In the remover of class and surfactant more than a kind.
As method for temporary fixing, following method for temporary fixing etc. can be enumerated：Temporarily fixing using present embodiment is used Component bonding is temporarily fixed by adhesive composite, makes the solidfied material of aforementioned temporary transient fixation adhesive composite, temporary to this When fixing component be processed, impregnate the solidfied material of this temporary transient fixation adhesive composite, peel off this temporary transient fixing use viscous Connect the solidfied material of agent compositionss.
In the method for temporary fixing of present embodiment, when adhesive composite peeled off by component, from can be reached with the short time The fissility of Cheng Shuizhong, put forward large-duty aspect and set out, (a) water preferably use the warm water of appropriate heating, such as 40～99 DEG C Warm water.For the method that temporarily solidfied material of fixation adhesive composite is contacted with water, from easy aspect, preferably The conjugant that component engages will be made to impregnated in the method in water together with the solidfied material of compositionss.The temperature of warm water be preferably 45～ 85 DEG C, more preferably 50～70 DEG C.
The scope that the time in water that impregnated in is preferably 1～60 minute.More than 1 minute then fissility excellent, 60 minutes with Under then productivity ratio excellent.From the viewpoint of the harmony with productivity ratio for the fissility, preferably 5～30 minutes, more preferably 5～ 20 minutes.
In the method for temporary fixing of present embodiment, conjugant during stripping, can be made to impregnated in the acid of (b) below pH4.Logical Crossing the acid that impregnated in below pH4, thus forming uniform oxide-film in component surface, being prevented from because forming irregular oxidation Film and the surface contamination that leads to.From safety, cheap aspect, as the acid of below pH4, it is preferably selected from lactic acid and Fructus Citri Limoniae In acid more than a kind.Acid can also use in the form of with diluent that water dilute.
From the aspect of cost and the formation effect of oxide-film, as the dilution rate of lactic acid, with the quality of lactic acid and water Ratio meter, preferably 100：0～1：99 scope, more preferably 40：60～10：90 scope, most preferably 25：75～15：85 Scope.
Form the aspect of effect from cost with oxide-film, as the dilution rate of citric acid, with the matter of citric acid and water Amount ratio meter, preferably 99：1～1：99 scope, more preferably 60：40～10：90 scope, most preferably 55：45～15：85 Scope.
The time being immersed in the acid of below pH4 is preferably the scope of 1～60 minute.More than 1 minute then fissility excellent, Less than 60 minutes then productivity ratio excellent.From the viewpoint of the harmony with productivity ratio for the fissility, preferably 5～30 minutes, more It is preferably 5～20 minutes.
In the method for temporary fixing of present embodiment, conjugant can be made during stripping to impregnated in (c) and to contain water, alcohols and table In the remover of face activating agent.
As surfactant, anionic surfactant, cationic surfactant, amphoteric surface's work can be enumerated Property agent, nonionic surfactant etc..In these materials, preferred anionic surfactant.
As anionic surfactant, carboxylic acid type (such as soap, polyoxyethylene alkyl ether carboxylic acid can be enumerated Salt, N- alkyl sarcosine salt, N- acyl glutamate), sulfuric acid ester type (such as alkyl sodium sulfate ester salt, polyoxyethylene alkyl ether sulfur Hydrochlorate, alcohol ethoxysulfate, oils and fatss sulfuric acid), sulfonic acid type (for example：Alkylbenzenesulfonate, alkane sulfonate, α- Alkene sulfonate, dialkyl sulfosuccinic acids, xylenesulfonate, naphthalene sulfonate-formaldehyde condensation substance, alkylnaphthalene sulfonate, N- Methyl-N- acyl taurine salt), phosphate type (such as alkylphosphonic, ether phosphates, polyoxyethylene alkane Base phenyl ether phosphate) etc..In these materials, preferably sulfonic acid type.In sulfonic acid type, preferably xylenesulfonate.Dimethylbenzene In sulfonate, preferably sodium xylene sulfonate.
Alcohols can enumerate methanol, ethanol, normal propyl alcohol, isopropanol, butanol, benzylalcohol etc..In these materials, from fissility and peace From the viewpoint of harmony in all directions, preferably benzylalcohol.
From secure context, environment aspect, for the use ratio of water and alcohols and surfactant, in water and alcohols In total 100 mass parts of surfactant, water and alcohols and surfactant are preferably with 20～60：20～60：1～40 Mass ratio contains, more preferably with 30～50：30～50：5～30 mass ratio contains, most preferably with 30～40：40～50：10～ 25 mass ratio contains.Remover can also be only made up of these three.
With regard to the method that temporarily solidfied material of fixation adhesive composite is contacted with remover, go out in terms of easy Send out, preferably conjugant be impregnated in together the method in remover.From fissility can be reached in the short time and improve productivity ratio Aspect set out, the temperature of remover is preferably 15～50 DEG C, more preferably 20～40 DEG C.The temperature of this remover 15 DEG C with On then fissility excellent, below 50 DEG C, then water, alcohols will not volatilize, and secure context, fissility are excellent.
The time that impregnated in remover is preferably the scope of 1～60 minute.More than 1 minute then fissility excellent, 60 minutes Hereinafter then productivity ratio is excellent.From the viewpoint of the harmony with productivity ratio for the fissility, preferably 5～30 minutes.
After preceding method fixing component, in present embodiment, the component enforcement temporarily fixed is cut into desired After the processing such as shape, grinding, grinding, perforate, by impregnating the solidfied material of this temporary transient fixation adhesive composite, can be from structure Part peels off the solidfied material of temporarily fixation adhesive composite.
In present embodiment, the component temporarily fixed is implemented to cut into desired shape, grinding, grinding, perforate etc. After processing, temporarily fixed it is also possible to peel off from component by heat treated is carried out with the solidfied material of bonding agent to this temporary transient fixation Solidfied material with adhesive composite.The temperature of heat treated is preferably 150～300 DEG C, more preferably 150～250 DEG C.
The temporarily fixation adhesive composite of present embodiment can be used for selected from silicon, resin, carbon, metal, crystal, Lan Bao 1 kind of bonding with upper member in stone, carborundum and glass.By selected from more than a kind in silicon, crystal, sapphire, carborundum Ingot casting is processed into the bonding during wafer of 80～1000 μm of thickness, using the temporarily fixation adhesive composite of present embodiment When, there is bigger effect.The thickness of wafer be more than 80 μm then process after dimensional accuracy excellent, then peel off for less than 1000 μm Property is excellent.The thickness of wafer is preferably 100～800 μm, more preferably 120～400 μm, most preferably 150～250 μm.
When particularly cutting silicon ingot casting to manufacture Silicon Wafer, the temporarily fixation adhesive composite of present embodiment has Bigger effect.
From the point of view of this viewpoint, the present invention provides a kind of duplexer obtaining as follows：In tooling member, using such viscous Connecing agent compositionss, this component being adhered to the support base material of the processing of aforementioned components as adherend, thus obtaining.In addition, This duplexer can be suitable for the processing of this component, such as ingot casting.
Method as the manufacture Silicon Wafer of one of its purposes for example can enumerate following methods：Temporary using present embodiment When fixation adhesive composite, silicon ingot casting bonding is temporarily fixed to after base material, cuts silicon ingot casting and make Silicon Wafer, will temporarily When fixation adhesive composite solidfied material impregnated in water, then take off the method for Silicon Wafer from base material etc..
Can by making solid silicon melt in heating furnace, the method that solidifies etc. obtain silicon ingot casting.Silicon ingot casting passes through scroll saw etc. Cut.Scroll saw can be enumerated and refer to as in Japanese Unexamined Patent Publication 7-153724 publication, Japanese Unexamined Patent Publication 11-60400 publication etc. Piano wire etc..Silicon Wafer can be used in solaode, quasiconductor etc..
From the aspect improving workability, present embodiment preferably uses priming paint.Priming paint can be applied and for example be coated with or spray Mist is in the surface of component, base material.Can be in the coating of the surface of priming paint or spraying temporarily fixation adhesive composite.Table in base material Face coating or spraying priming paint, and in the coating of the surface of priming paint or spraying temporarily fixation adhesive composite, use temporarily fixing During the surface adhesive member of adhesive composite, when peeling off the temporarily solidfied material of fixation adhesive composite, temporarily fix It is only attached to base material with the solidfied material of adhesive composite, peel off from component.Therefore, can omit and remove temporarily fixing using from component The operation of adhesive composite, workability improves.
Priming paint preferably comprises solvent and (7) adaptation gives composition.
(7) are preferably made to be dissolved or dispersed in solvent and form priming paint.For example not on component primer coating and only in base material Upper primer coating, thus when the solidfied material peeling member of temporarily fixation adhesive composite, bonding agent group is used in temporarily fixation The solidfied material of compound is selectively attached to base material, and workability is especially excellent.
When (7) are used as priming paint, be easily soluble in calmly solvent and temporarily fixation adhesive composite solidfied material hold The aspect being easily selectively attached to base material is set out, and (7) are preferably selected from a kind in aforementioned silane coupling agent and aforementioned phosphate salt More than.
As long as the solvent that priming paint is used can dissolve (7) adaptation and gives composition.Never affect temporarily to fix with gluing The aspect connecing the performance of agent compositionss is set out, and is preferably (methyl) acrylate monomer in solvent.(methyl) acrylate monomer In, it is preferably selected from more than a kind in aforementioned (1) and aforementioned (2).In aforementioned (1) and aforementioned (2), it is preferably selected from (methyl) 2-Hydroxy ethyl acrylate, glycerol list (methyl) acrylate, (methyl) acrylate, (methyl) acrylic acid benzyl Ester, (methyl) acrylic acid bicyclo- pentyl ester, (methyl) acrylic acid dicyclopentenyl ester, (methyl) acrylic acid bicyclopentyl 2-ethoxyethyl acetate, (first Base) in acrylic acid dicyclopentenyl 2-ethoxyethyl acetate more than a kind.Solvent beyond (methyl) acrylate can enumerate hexane and hexamethylene The fatty family solvent such as alkane；The alkylbenzene series solvent such as toluene and dimethylbenzene；The alcohols such as methanol, ethanol and isopropanol；Acetone and first The organic solvents such as the ketones such as base isobutyl ketone.
Give composition and solvent for the adaptation in aforementioned priming paint, give total the 100 of composition and solvent in adaptation In mass parts, adaptation is given composition and is preferably with 0.5～10 with solvent：99.5～90 mass ratio contains, more preferably with 1～ 5：99～95 mass ratio contains.If the ratio that adaptation gives composition is more than 0.5, temporarily fixation adhesive composite Solidfied material be selectively attached to base material.If the ratio that adaptation gives composition is less than 10, adaptation gives composition not Can be impregnated with to component side by temporarily fixation adhesive composite, therefore temporarily the consolidating of fixation adhesive composite after stripping Compound will not cull in component.
If use priming paint on the surface of base material, on the surface of priming paint using temporary transient fixing adhesive composite, temporary transient The surface adhesive member of fixation adhesive composite, then can lift the resistance to cleaning of component in matting.Herein, using being Refer to coating, spraying etc..In present embodiment, by not using priming paint and only in base material primer coating such that it is able to make in component The solidfied material of the temporarily fixation adhesive composite after stripping is attached to base material.
When manufacturing wafer by present embodiment, component is preferably ingot casting.Ingot casting is preferably selected from by monocrystalline silicon cast ingot, many In crystal silicon ingot casting, carborundum ingot casting more than a kind.
By using more than a kind in monocrystalline silicon cast ingot, polycrystalline silicon ingot casting, carborundum ingot casting as component, this reality The temporarily fixation adhesive composite applying mode has bigger effect.If using present embodiment, can implement to be difficult in the past The processing of the carborundum of processing.
Embodiment
Embodiments of the present invention are described in detail by following experimental example, but the present invention is not limited to these experimental examples. Respectively represented with mass parts using the consumption unit of material.As long as not specified, then temperature be 23 DEG C, the ring of humidity 50%RH Carry out under border.
(modulation example 1)
[modulated media]
Medium shown in modulation table 1 is as the medium impregnating the temporarily solidfied material of fixation adhesive composite.By acid with Water modulated media 1～4 so that the mass ratio shown in table 1 mixes.Medium 5 is with water：Benzylalcohol：Sulfonic acid type Anionic surfactants Agent=35：45：The remover of 20 mass ratio mixing gained.It is used sodium xylene sulfonate system surfactant cloudy as sulfonic acid type Ionic surfactant.
[table 1]
Table 1
(modulation example 2)
[modulation of priming paint]
Priming paint shown in modulation table 2 is as priming paint.(7) adaptation is given composition with solvent with the mass ratio shown in table 2 Mix and modulate priming paint.
[table 2]
Table 2
Priming paint 1 (7) adaptation gives composition Solvent
Composition Methacrylic acid acid phosphonato ethyl ester Phenoxyethyl methacrylate
Mass ratio 3 97
Priming paint 2 (7) adaptation gives composition Solvent
Composition Methacrylic acid acid phosphonato ethyl ester Methacrylic acid -2- hydroxy methacrylate
Mass ratio 3 97
Priming paint 3 (7) adaptation gives composition Solvent
Composition Methacrylic acid acid phosphonato ethyl ester Acetone
Mass ratio 5 95
Priming paint 4 (7) adaptation gives composition Solvent
Composition Methacrylic acid acid phosphonato ethyl ester Benzyl methacrylate
Mass ratio 1 99
Priming paint 5 (7) adaptation gives composition Solvent
Composition γ-methacryloxypropyl trimethoxy silane Methacrylic acid dicyclopentenyl 2-ethoxyethyl acetate
Mass ratio 3 97
(experimental example 1)
Each use material is mixed with the composition of table 3, modulation comprises the temporarily fixation bonding of the first component and the second component Agent compositionss, and evaluate physical property.Show the result in table 3.
(using material)
Methacrylic acid -2- hydroxy methacrylate：Commercially available product
Phenoxyethyl methacrylate：Commercially available product
Glycerin monomethyl acrylic ester：Commercially available product
Benzyl methacrylate：Commercially available product
Methacrylic acid -2- hydroxy propyl ester：Commercially available product
2-Ethylhexyl Methacrylate：Commercially available product
Lauryl methacrylate：Commercially available product
Double [4- (methacryloxy polyethoxy) phenyl] propane of 2,2-：Commercially available product, has the many of ethylene glycol structure Sense (methyl) acrylate
1,9- nonanediol dimethylacrylate：Commercially available product
Methacrylic acid dicyclopentenyl 2-ethoxyethyl acetate：Commercially available product
Dihydroxymethyl tristane dimethylacrylate：Commercially available product
γ-methacryloxypropyl trimethoxy silane：Commercially available product
Isopropyl benzene hydroperoxide：Commercially available product
Methyl methacrylate/butadiene/styrene copolymers (MMA-BD-ST copolymer)：Commercially available product
Acrylonitrile/butadiene rubber (AN-BD rubber)：High nitrile NBR, nitrile content 41 mass %, commercially available product
Paraffin class：Paraffin, commercially available product
Hydroquinone monomethyl ether：Commercially available product
1,4-benzoquinone：Commercially available product
Citric acid：Commercially available product
Lactic acid：Commercially available product
Vanadyl acetylacetonate：Commercially available product
Methacrylic acid acid phosphonato ethyl ester salt：Commercially available product
Acetone：Commercially available product
SPCC：SPCC-D blasting treatment steel plate, commercially available product
Silicon Wafer (Si wafer)：Commercially available product
Silicon ingot casting (Si ingot casting)：Commercially available product
Polycrystalline silicon ingot casting：Commercially available product, 125mm × 125mm × 400mm
Monocrystalline silicon cast ingot：Commercially available product, 125mm × 125mm × 400mm
Carborundum ingot casting：Commercially available product, 100mm × 100mm × 400mm
Clouded glass：Commercially available product, blue or green glass sheet, 125mm × 400mm × 20mmt, Ra are 5 μm
U-bond：Commercially available product, epoxy temporary transient fixed bonding agent (daily use chemicals Seiko company system)
Physical property measures as follows.
[set time]
According to JIS K-6856, by the first component and the second component mixed in equal amounts and coat test film (100mm × 25mm × 1.6mmt, SPCC-D blasting treatment) side, the test film of overlapping at once afterwards and opposite side of fitting is as sample.For Set time (the unit of sample：Minute), in the environment of 23 DEG C of temperature, humidity 50%RH, measure from being stretched with pull and push dynamometer To the time being measured to more than 0.4MPa intensity.
[tensile bond intensity]
According to JIS K6849 (1994), by the first component and the second component mixed in equal amounts and coat test film (15mm × 15mm × 0.725mmt, Si wafer) side, test film (clouded glass (the blue or green plate glass of overlapping at once afterwards and opposite side of fitting Glass, 15mm × 15mm × 0.7mmt, Ra：5 μm)) after, make the circle that bonding site is diameter 8mm, after 23 DEG C of solidifications 24 hours As sample.The tensile bond of sample in the environment of 23 DEG C of temperature, humidity 50%RH, is measured with draw speed 10mm/ minute Intensity (unit：MPa).
[23 DEG C of water-swellable rates (%)]
The template being formed by the silicon chip of 1mm thickness is configured on PET film.Flow into temporarily fixation bonding agent in a template Compositionss.Flowing into the PET film of the surface configuration 1mm thickness having the temporarily template of fixation adhesive composite.That is, make Clip between 2 PET film and flow into the structure having the temporarily template of fixation adhesive composite.Afterwards, will be temporarily Fixation adhesive composite solidifies 24 hours at 23 DEG C, makes the solidification of the temporarily fixation adhesive composite of thickness 1mm Thing.Made solidfied material is cut into after 25mm × 25mm square, the water absorption rate algoscopy according to ASTMD570 measures institute The solidfied material obtaining.Water-swellable rate (%) is tried to achieve by following formula.Water uses 23 DEG C of pure water.Solidfied material be impregnated in after 60 minutes in water It is measured.
Water-swellable rate (%)=100 × (impregnated in the solidfied material quality after water-impregnated in the solidfied material quality before water)/ (impregnated in the solidfied material quality before water)
[50 DEG C of water-swellable rates (%)]
The template being formed by the silicon chip of 1mm thickness is configured on PET film.Flow into temporarily fixation bonding agent in a template Compositionss.Flowing into the PET film of the surface configuration 1mm thickness having the temporarily template of fixation adhesive composite.That is, make Clip between 2 PET film and flow into the structure having the temporarily template of fixation adhesive composite.Afterwards, will be temporarily Fixation adhesive composite solidifies 24 hours at 23 DEG C, makes the solidification of the temporarily fixation adhesive composite of thickness 1mm Thing.Made solidfied material is cut into after 25mm × 25mm square, the water absorption rate algoscopy according to ASTMD570 measures institute The solidfied material obtaining.Water-swellable rate (%) is tried to achieve by following formula.Wherein, water uses 50 DEG C of pure water.Solidfied material be impregnated in 60 in water It is measured after minute.
Water-swellable rate (%)=100 × (impregnated in the solidfied material quality after water-impregnated in the solidfied material quality before water)/ (impregnated in the solidfied material quality before water)
[glass transition temperature (DEG C)]
The template being formed by the silicon chip of 1mm thickness is configured on PET film.Flow into temporarily fixation bonding agent in a template Compositionss.Flowing into the PET film of the surface configuration 1mm thickness having the temporarily template of fixation adhesive composite.That is, make Clip between 2 PET film and flow into the structure having the temporarily template of fixation adhesive composite.Afterwards, will be temporarily Fixation adhesive composite solidifies 24 hours at 23 DEG C, makes the solidification of the temporarily fixation adhesive composite of thickness 1mm Thing.With cutter, solidfied material is cut into long 50mm × wide 5mm, as glass transition temperature mensure solidfied material.Using SEIKO The Measurement of Dynamic Viscoelasticity device " DMS210 " of electronic industry company system measures glass transition temperature.Under nitrogen environment, to front State the stress of draw direction and the strain that solidfied material applies 1Hz, heated up with 2 DEG C per minute of programming rate and measure Tan δ, using the temperature of the summit of this tan δ as glass transition temperature.
[table 3]
Table 3
[table 4]
Table 3 (Continued)
(experimental example 2)
Carried out with the priming paint shown in adhesive composite, table 4 and the medium shown in table 4 using the temporarily fixation shown in table 4 Si ingot casting processing experiment, and evaluate physical property.Show the result in table 4.
[Si ingot casting processing experiment]
Will be (many for Si (silicon) ingot casting of 125mm × 125mm × 400mm with the temporarily fixation adhesive composite shown in table 4 Crystal silicon ingot casting) and clouded glass (blue or green glass sheet, 125mm × 400mm × 20mmt, Ra：5 μm) bonding solidification.Ingot casting is used as structure Part, is used clouded glass as base material.Now, in experimental example 2-1～2-8 and experimental example 2-10～2-13, table is coated with to clouded glass Priming paint (with reference to table 2) shown in 4.Specifically proceed as described below.In clouded glass surface primer coating.Apply on the surface of priming paint Cloth temporarily fixation adhesive composite.When being not coated with priming paint, in clouded glass surface coating temporarily fixation adhesive composite. Surface configuration Si ingot casting bonding in temporarily fixation adhesive composite.And then, in order to Si casting is installed on wire sawing apparatus Ingot and the adhesive test body of clouded glass, and be coated with temporarily fixing the using shown in table 4 in clouded glass (face of Si ingot casting of not fitting) and glue Connect agent compositionss, in the surface of temporarily fixation adhesive composite laminating aluminum fixture.Afterwards, by adhesive test body at 23 DEG C Solidification 24 hours.Only the Si ingot casting part of cured adhesive test body is cut into 180 μ m-thick using wire sawing apparatus.Observe and cut out The Si ingot casting that hits has or not come off (Si ingot casting processing experiment (come off state)).The adhesive test body only being cut Si ingot casting impregnated in 23 DEG C of pure water 60 minutes, observe the Si wafer cutting and have or not come off (Si ingot casting processing experiment (washing test)).Then, this is glued Connect test body and impregnated in the medium shown in table 4, measure from impregnated in medium is completely exfoliated with blue or green glass sheet to Si wafer Time (Si ingot casting processing experiment (splitting time)).Now, also observe exfoliated state (the Si ingot casting processing examination of bonding agent solidfied material Test (exfoliated state)).Finally with heating plate, aluminum fixture is heated 1 hour with 200 DEG C, confirm that can aluminum fixture and clouded glass Separate ((fixture stripping)).In exfoliated state, will not on the surface of base material or component with temporary transient fixation adhesive composite The aspect of cull is set out, preferably in interface peel.
[table 5]
[table 6]
Table 4 (Continued)
Si wafer interface peel refers to the interface peel of Si wafer and bonding agent.
Clouded glass interface peel refers to the interface peel of clouded glass and bonding agent.
Priming paint (base material) is the priming paint coating substrate surface.
Priming paint (component) is the priming paint coating component surface.
(experimental example 3)
Using the priming paint shown in the temporarily fixing adhesive composite shown in the component shown in table 5, table 5, table 5, table 5 institute The medium showing carries out ingot casting processing experiment, and evaluates physical property.Show the result in table 5.
[ingot casting processing experiment]
With the temporarily fixation adhesive composite shown in table 5 make the ingot casting shown in table 5 and clouded glass (blue or green glass sheet, 125mm×400mm×20mmt、Ra：5 μm) bonding solidification.Ingot casting is used as component, clouded glass is used as base material.Now, In experimental example 2-1, experimental example 3-1, experimental example 3-3, experimental example 3-5, the priming paint shown in table 5 is coated with to clouded glass (base material), In experimental example 3-1～3-3 and experimental example 3-5, ingot casting (component) is coated with the priming paint (with reference to table 2) shown in table 5.Specifically, such as Carry out described in lower.Surface primer coating in clouded glass or ingot casting.In the coating of the surface of the priming paint coating substrate surface temporarily Fixation adhesive composite.When being not coated with priming paint, in the surface of clouded glass coating temporarily fixation adhesive composite.Temporary When the surface configuration ingot casting of fixation adhesive composite bonding.In ingot casting surface primer coating, temporarily fixing with gluing Connect the primed surface on surface configuration ingot casting surface the bonding of agent compositionss.And then, in order on wire sawing apparatus install ingot casting with The adhesive test body of clouded glass, and it is coated with the temporarily fixation bonding agent group shown in table 5 in clouded glass (face of ingot casting of not fitting) Compound, and the fixture of aluminum of fitting on the surface of temporarily fixation adhesive composite.Afterwards, adhesive test body is solid at 23 DEG C Change 24 hours.Ingot casting part only to cured adhesive test body, using wire sawing apparatus by polycrystalline silicon ingot casting, monocrystalline silicon cast ingot It is cut into 180 μ m thick, carborundum ingot casting is cut into 400 μ m thick.Observe the ingot casting in cutting and have or not (the ingot casting processing that comes off Test (come off state)).The adhesive test body only being cut ingot casting impregnated in 60 minutes in 30 DEG C of pure water, observes the wafer cutting Have or not come off (ingot casting processing experiment (washing test)).Then, this adhesive test body be impregnated in the medium shown in table 5, measure From the time (ingot casting processing experiment (splitting time)) that impregnated in medium is completely exfoliated to wafer with blue or green glass sheet.Now Observe the exfoliated state (ingot casting processing experiment (exfoliated state)) of bonding agent solidfied material.Finally with heating plate by aluminum fixture with 200 DEG C are heated 1 hour, confirm that can aluminum fixture separate ((fixture stripping)) with clouded glass.In exfoliated state, temporarily to fix Will not the aspect of cull be set out on base material, the surface of component with adhesive composite, preferably in interface peel.
[table 7]
Table 5
Si wafer interface peel refers to the interface peel of Si wafer and bonding agent.
Clouded glass interface peel refers to the interface peel of clouded glass and bonding agent.
Sic wafer interface peel refers to the interface peel of sic wafer and bonding agent.
Priming paint (base material) is the priming paint coating substrate surface.
Priming paint (component) is the priming paint coating component surface.
Following item is confirmed by experimental example.The scheme being equivalent to embodiment of the present invention has excellent effect.Using tool There is multifunctional (methyl) acrylate (double [4- (methacryloxy polyethoxy) phenyl] third of 2,2- of ethylene glycol structure Alkane) replace (3) do not have ethylene glycol structure multifunctional (methyl) acrylate monomer when, after process finishing, after washing test Wafer can come off (experimental example 2-14, experimental example 2-15, experimental example 2-18, experimental example 3-5, experimental example 3-6).(1), the use of (2) If amount is outside the scope of present embodiment, after process finishing, after washing test, wafer can come off (experimental example 2-16, experimental example 2-17).Using during epoxy temporary transient fixed bonding agent, after process finishing, after washing test, wafer can come off (experimental example 3-7).
By using the temporarily fixation adhesive composite of present embodiment, can solidify in the short time and show high bonding Intensity.By contact water, adhesive strength reduces said curing thing, and the bonding force of the bonding force between component or component and fixture Can reduce, therefore, it is possible to easily reclaim component.For the temporarily fixation adhesive composite of present embodiment, by the bottom of by Paint only coats substrate surface, thus temporarily fixation adhesive composite can be selectively attached to base when reclaiming component Material, therefore temporarily fixation adhesive composite will not be remained on component surface, workability is excellent.By priming paint is coated base material Surface, thus the resistance to cleaning raising of component, productivity ratio are excellent in matting.Temporarily fixing using using present embodiment is glued Connect agent compositionss, silicon ingot casting will not fall off when cutting silicon ingot casting, show good processability and be easily peeled off after processing.
Present embodiment for example has following characteristics.By present embodiment, safe two component types (methyl) can be obtained Acrylic acid series bonding agent compositionss, the dimensional accuracy of its machining rear part improves, there is high-adhesive-strength, have for plus Fissility in the thermostability of man-hour produced processing heat, water is excellent, will not peel off in matting after processing, will not Cull is in component, Environmental or workability is excellent and curing rate is fast.
Present embodiment is solidified in the short time by mixing (methyl) acrylic acid series bonding agent compositionss of two components.Cause This, compared to epoxy adhesive composite, in workability and the aspect that shortens the activity duration is significantly excellent, and do not use amine, The odorant of polymercaptan etc is as firming agent, therefore safety, workability are excellent.Present embodiment does not use bisphenol A-type two Glycidyl ether, therefore excellent in safety.The solidfied material of present embodiment will not be affected by the institute such as cutting water being used when processing, There are high-adhesive-strength and high elastic modulus, therefore do not allow during tooling member to be also easy to produce deviation, be readily available dimensional accuracy aspect excellent Different component.The glass transition temperature of the solidfied material of present embodiment is high, therefore has and processed heat for generating during processing Thermostability, and the aspect of dimensional accuracy is excellent.In present embodiment, solidfied material is contacted with warm water understands swelling, stripping, but because controlling Its swelling ratio, therefore for using the matting of water, there is resistance to cleaning.In present embodiment, by being only coated with bottom in base material Paint, can make the solidfied material of the temporarily fixation adhesive composite after stripping be attached to base material.Thus, can save after processing Component removes the operation of the temporarily solidfied material of fixation adhesive composite, and workability, productivity ratio are excellent.In present embodiment, By in base material primer coating, thus the resistance to cleaning of component improves in matting.Excellent by this productivity ratio.

Claims (30)

1. a kind of adhesive composite, it contains：(1) there is the simple function (first of hydroxyl and non-ring type saturated hydrocarbons by ester bond Base) acrylate monomer, (2) have simple function (methyl) acrylate monomer of ring type hydrocarbon by ester bond, (3) do not have second Multifunctional (methyl) acrylate monomer of diol structure, (4) hot radical polymerization initiator and (5) reducing agent,
(1), in total 100 mass parts of (2), (3), the consumption of (1) is 50～98 mass parts, and the consumption of (2) is 1～40 mass Part, the consumption of (3) is 1～30 mass parts.
2. adhesive composite according to claim 1, it also contains (6) elastomer components.
3. adhesive composite according to claim 1 and 2, it also contains (7) adaptation and gives composition.
4. the adhesive composite according to any one of claims 1 to 3, it also contains (8) polymerization inhibitor.
5. the adhesive composite according to any one of Claims 1 to 4, wherein, with respect to (1), (2), (3) total 100 mass parts, the consumption of (4) is 0.5～15 mass parts, with respect to total 100 mass parts of (1), (2), (3), the consumption of (5) For 0.01～5 mass parts.
6. adhesive composite according to claim 2, wherein, with respect to total 100 mass parts of (1), (2), (3), (6) consumption is 5～45 mass parts.
7. the adhesive composite according to any one of claim 1～6, wherein, (1) be selected from (methyl) acrylic acid- One or more of 2- hydroxy methacrylate and glycerol list (methyl) acrylate.
8. the adhesive composite according to any one of claim 1～7, wherein, the ring type hydrocarbon of (2) has selected from benzene In ring, bicyclopentyl, dicyclopentenyl more than a kind, and there is no hydroxyl.
9. the adhesive composite according to any one of claim 1～8, wherein, (2) are selected from (methyl) acrylic acid benzene Epoxide ethyl ester, (methyl) benzyl acrylate, (methyl) acrylic acid bicyclo- pentyl ester, (methyl) acrylic acid dicyclopentenyl ester, (methyl) In acrylic acid bicyclopentyl 2-ethoxyethyl acetate, (methyl) acrylic acid dicyclopentenyl 2-ethoxyethyl acetate more than a kind.
10. the adhesive composite according to any one of claim 1～9, wherein, (3) be do not have aromatic ring and Molecular weight is less than 1,000 2 senses (methyl) acrylate monomer.
11. adhesive composites according to any one of claim 1～10, wherein, (3) are selected from 1,6- hexanediol two (methyl) acrylate, 1,9- nonanediol two (methyl) acrylate, 1,10- decanediol two (methyl) acrylate, new penta 2 In alcohol two (methyl) acrylate, dihydroxymethyl-tristane two (methyl) acrylate more than a kind.
A kind of 12. adhesive composites of two component types, it is by the adhesive composite any one of claim 1～11 It is divided into two components, in the first component, at least contains (4) hot radical polymerization initiator, in the second component, at least contain (5) reduction Agent.
13. adhesive composites according to any one of claim 1～12, wherein, the solidfied material of adhesive composite Glass transition temperature be in 90～250 DEG C of scope, and make the solidfied material of adhesive composite impregnated in 23 DEG C pure In water, swelling ratio when 60 minutes is in 0.1～10% scope, and makes the solidfied material of adhesive composite impregnated in 50 DEG C Pure water in 60 minutes when swelling ratio be in 4～20% scope.
14. adhesive composites according to any one of claim 1～13, it is used for temporarily fixing.
A kind of 15. duplexers, it use the adhesive composite any one of claim 1～14 and carry out bonding and glued Thing.
16. duplexers according to claim 15, it is also laminated with priming paint.
17. duplexers according to claim 16, it is sequentially laminated with base material, priming paint, adhesive composite, component.
18. duplexers according to any one of claim 15～17, wherein, component is ingot casting.
19. duplexers according to claim 18, wherein, component is selected from monocrystalline silicon cast ingot, polycrystalline silicon ingot casting, carborundum In ingot casting more than a kind.
A kind of 20. method for temporary fixing of component, the adhesive composite any one of its usage right requirement 1～14 will Component is temporarily fixed to base material, and described adhesive composite is solidified, after the component temporarily fixed is processed, will be described viscous The solidfied material connecing agent compositionss impregnated in steeping medium, thus the component after base material takes off processing.
The method for temporary fixing of 21. components according to claim 20, wherein, steeping medium is selected from (a) water, (b) pH4 In following acid, (c) remover containing water, alcohols and surfactant more than a kind.
A kind of 22. method for temporary fixing of component, the adhesive composite any one of its usage right requirement 1～14 will Component is temporarily fixed to base material, and described adhesive composite is solidified, after the component of described temporary transient fixation is processed, heating Process the solidfied material of described adhesive composite, thus the component after base material takes off processing.
The method for temporary fixing of 23. components according to claim 22, wherein, at heating in the range of 150～300 DEG C Reason solidfied material.
The method for temporary fixing of 24. components according to any one of claim 20～23, wherein, using priming paint.
The method for temporary fixing of 25. components according to claim 24, wherein, primer applications are in base material.
The method for temporary fixing of 26. components according to claim 24, wherein, primer applications are in component.
The method for temporary fixing of 27. components according to any one of claim 24～26, wherein, priming paint contains adaptation Give composition and solvent.
The method for temporary fixing of 28. components according to any one of claim 20～27, wherein, the processing of component is logical Cross and cut to make wafer.
The method for temporary fixing of 29. components according to any one of claim 20～28, wherein, component is ingot casting.
The method for temporary fixing of 30. components according to claim 29, wherein, component is selected from monocrystalline silicon cast ingot, polycrystalline In silicon ingot casting, carborundum ingot casting more than a kind.
CN201580030001.3A 2014-06-05 2015-06-04 The method for temporary fixing of adhesive composite and the component using adhesive composite Active CN106414635B (en)

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108884180B (en) * 2016-03-31 2021-06-29 电化株式会社 Composition comprising a metal oxide and a metal oxide
JP6739238B2 (en) * 2016-05-31 2020-08-12 デンカ株式会社 Composition
KR102399784B1 (en) * 2016-07-19 2022-05-19 덴카 주식회사 adhesive composition
JP6742256B2 (en) * 2017-02-16 2020-08-19 株式会社菱晃 Curable resin composition and cured product thereof, and coating material, sheet and film
JP6955412B2 (en) * 2017-09-28 2021-10-27 デンカ株式会社 Composition
JP6955411B2 (en) * 2017-09-28 2021-10-27 デンカ株式会社 Composition
WO2021060707A1 (en) * 2019-09-26 2021-04-01 주식회사 엘지화학 Adhesive composition for dicing tape and dicing tape comprising same
EP4247909A1 (en) * 2020-11-23 2023-09-27 Zephyros Inc. Acrylate structural adhesive free of mma
CN115260919A (en) * 2022-09-27 2022-11-01 怡通科技有限公司 Microphone diaphragm mass block bonding process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012229379A (en) * 2011-04-27 2012-11-22 Mitsubishi Rayon Co Ltd Adhesive composition, adhesive for temporary fixing, and method for manufacturing parts
CN103080258A (en) * 2010-09-01 2013-05-01 电气化学工业株式会社 Method for disassembling bonded body, and adhesive
CN103797082A (en) * 2011-09-14 2014-05-14 电气化学工业株式会社 Composition and method for temporarily fixing member using same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3325676B2 (en) 1993-11-29 2002-09-17 シャープ株式会社 Slicing method of silicon ingot
JPH1160400A (en) 1997-08-20 1999-03-02 Olympus Optical Co Ltd Peeling of flat planar blank and peeling device
JP4767007B2 (en) 2005-12-14 2011-09-07 電気化学工業株式会社 Curable composition and method for temporarily fixing member using the same
EP2050799B1 (en) * 2006-08-10 2014-06-18 Denki Kagaku Kogyo Kabushiki Kaisha Adhesive composition and method for temporarily fixing member by using the same
US8067500B2 (en) * 2007-03-02 2011-11-29 Denki Kagaku Kogyo Kabushiki Kaisha Curable composition, bonding method and assembly
JP5599575B2 (en) 2009-04-16 2014-10-01 電気化学工業株式会社 Adhesive composition for temporary fixing
JP5466477B2 (en) 2009-10-23 2014-04-09 電気化学工業株式会社 Adhesive composition for temporary fixing
JP2011102341A (en) 2009-11-10 2011-05-26 Sekisui Chem Co Ltd Method for producing polyvinyl acetal
JP5617438B2 (en) * 2010-08-30 2014-11-05 パナソニック株式会社 Cooker
JP5941043B2 (en) 2011-05-24 2016-06-29 デンカ株式会社 Adhesive composition for temporary fixing
JP5938765B2 (en) 2011-07-17 2016-06-22 株式会社オリンピア Game machine
JP2013021945A (en) 2011-07-19 2013-02-04 Chuo Green System:Kk Spraying system
JP5706269B2 (en) 2011-08-16 2015-04-22 富士フイルム株式会社 Apparatus and method for sharing dose information of radiation imaging system
JP6052869B2 (en) 2011-12-01 2016-12-27 デンカ株式会社 Temporary fixing method of workpiece
JP5950597B2 (en) 2012-02-03 2016-07-13 キヤノン株式会社 Information processing apparatus and control method thereof
JP6081094B2 (en) * 2012-07-13 2017-02-15 リンテック株式会社 Dicing sheet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103080258A (en) * 2010-09-01 2013-05-01 电气化学工业株式会社 Method for disassembling bonded body, and adhesive
JP2012229379A (en) * 2011-04-27 2012-11-22 Mitsubishi Rayon Co Ltd Adhesive composition, adhesive for temporary fixing, and method for manufacturing parts
CN103797082A (en) * 2011-09-14 2014-05-14 电气化学工业株式会社 Composition and method for temporarily fixing member using same

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