JP2012227500A - Packaging structure of light-emitting diode - Google Patents

Packaging structure of light-emitting diode Download PDF

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JP2012227500A
JP2012227500A JP2011114599A JP2011114599A JP2012227500A JP 2012227500 A JP2012227500 A JP 2012227500A JP 2011114599 A JP2011114599 A JP 2011114599A JP 2011114599 A JP2011114599 A JP 2011114599A JP 2012227500 A JP2012227500 A JP 2012227500A
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emitting diode
light emitting
light
packaging structure
substrate
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Wui-Im Chin
威任 陳
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Lingsen Precision Industries Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

PROBLEM TO BE SOLVED: To provide a packaging structure of a light-emitting diode which allows for suppression of halation phenomenon by averaging the distribution of color temperature.SOLUTION: Package colloid 17 in the packaging structure of a white light-emitting diode is composed of an organic resin material and a phosphor powder. The organic resin material has a refraction index of 1.40 or more, and a viscosity coefficient of at least 60 Kgf s/m. When the package colloid 17 is produced, the organic resin material and phosphor powder are mixed by means of a high speed agitation and defoaming mixer, and the phosphor powder is distributed uniformly in the package colloid 17. The package colloid 17 is placed on a substrate 11 to cover a light-emitting diode chip 13 by means of a dispenser. Consequently, the distribution of color temperature is averaged, halation phenomenon is suppressed, and the quality of light can be improved.

Description

本発明は、発光ダイオードのパッケージング構造に関し、詳しくは色温度の分布を平均させ、ハレーション現象を抑制することができる発光ダイオードのパッケージング構造に関するものである。   The present invention relates to a packaging structure for a light emitting diode, and more particularly to a packaging structure for a light emitting diode that can average the distribution of color temperatures and suppress the halation phenomenon.

現在の発光ダイオード（Ｌｉｇｈｔ−ｅｍｉｔｔｉｎｇ ｄｉｏｄｅ）のパッケージング構造は、蛍光体粉末によって白色、温暖色またはピンク系の光を生成することが一般的である。例を挙げて説明してみれば、一般の白色発光ダイオードは黄色の蛍光体粉末が混じったパッケージコロイドが青色光チップに被さることによって青色光チップから放出された青色光により黄色の蛍光体粉末を励起し、黄色光を発生させ、そして黄色光と青色光チップからの青色光とを複合させて白色光を生成する。或いは、緑色および赤色の蛍光体粉末が混じったパッケージコロイドを青色光チップに被せ、青色光チップから放出された青色光により緑色および赤色の蛍光体粉末を励起し、緑色光および赤色光を発生させ、そして緑色光、赤色光および青色光を複合させることによって白色光を生成することができる。特許文献１には、青色発光ダイオード上に赤色蛍光体と緑色発光とを含む発光層が形成されている白色発光ダイオードが掲載されている。   In general, the packaging structure of a current light-emitting diode generally generates white, warm, or pink light using a phosphor powder. For example, in general white light emitting diodes, package phosphors mixed with yellow phosphor powder are covered with blue light chip, and blue phosphor light emitted from blue light chip is used to convert yellow phosphor powder into yellow phosphor powder. Excites, generates yellow light, and combines the yellow light with the blue light from the blue light chip to produce white light. Alternatively, a package colloid mixed with green and red phosphor powder is placed on the blue light chip, and the green and red phosphor powder is excited by the blue light emitted from the blue light chip to generate green light and red light. , And by combining green light, red light and blue light, white light can be generated. Patent Document 1 discloses a white light emitting diode in which a light emitting layer including a red phosphor and green light emission is formed on a blue light emitting diode.

特開２００８−０２１９８８号公報Japanese Patent Laid-Open No. 2008-021988

従来の発光ダイオードのパッケージング構造に使用されるパッケージコロイド内の蛍光体粉末は重力によって沈殿および分布が平均していないため、コロイド内の赤色および緑色の蛍光体粉末の分布が比較的多い部位に色温度の低い赤色光および緑色光を比較的多く発生させ、コロイド内の赤色および緑色の蛍光体粉末の分布が比較的少ない部位に色温度の高い青色光を比較的多く発生させる。青色光、赤色光および緑色光が均一に混じっていないため、色温度を平均させず、鮮明なハレーション現象を発生させてしまう。一方、蛍光体粉末が沈殿し、高効率のチップに接触すれば、蛍光体粉末の放熱不良が原因で発光ダイオードの発光効率を低下させ、蛍光体粉末の損耗率を増加させてしまう。   The phosphor powder in the package colloid used in the conventional light emitting diode packaging structure does not have an average precipitation and distribution due to gravity, so the red and green phosphor powder in the colloid has a relatively large distribution. A relatively large amount of red light and green light having a low color temperature is generated, and a relatively large amount of blue light having a high color temperature is generated at a site where the distribution of the red and green phosphor powders in the colloid is relatively small. Since blue light, red light, and green light are not uniformly mixed, the color temperature is not averaged and a clear halation phenomenon occurs. On the other hand, if the phosphor powder precipitates and comes into contact with a highly efficient chip, the luminous efficiency of the light emitting diode is lowered due to the heat radiation failure of the phosphor powder, and the wear rate of the phosphor powder is increased.

本発明は、色温度の分布を平均させ、ハレーション現象を抑制することが可能な発光ダイオードのパッケージング構造を提供することを主な目的とする。   The main object of the present invention is to provide a packaging structure of a light emitting diode capable of averaging the distribution of color temperatures and suppressing the halation phenomenon.

本発明は、耐久性を向上させることが可能な発光ダイオードのパッケージング構造を提供することをもう一つの目的とする。   Another object of the present invention is to provide a light emitting diode packaging structure capable of improving durability.

上述の目的を達成するために、本発明による発光ダイオードのパッケージング構造は、基板、発光ダイオードチップおよびパッケージコロイドを備える。発光ダイオードチップは、基板に配置され、かつ基板に電気的に接続される。パッケージコロイドは発光ダイオードチップに被さるように基板に配置され、かつ分布が平均した蛍光体粉末を含有する。上述により、本発明による発光ダイオードのパッケージング構造は、色温度の分布を平均させ、ハレーション現象を抑制することができる。   To achieve the above object, a light emitting diode packaging structure according to the present invention includes a substrate, a light emitting diode chip, and a package colloid. The light emitting diode chip is disposed on the substrate and electrically connected to the substrate. The package colloid is disposed on the substrate so as to cover the light emitting diode chip, and contains phosphor powder with an average distribution. As described above, the packaging structure of the light emitting diode according to the present invention can average the color temperature distribution and suppress the halation phenomenon.

本発明による発光ダイオードのパッケージング構造は、さらに導線を備える。導線は発光ダイオードチップと基板との接続に用いられ、発光ダイオードチップと基板とを電気的に接続させる。パッケージコロイドは導線に被さるため、外部の空気と導線との接触を遮断し、導線の酸化現象を減少させ、本発明による発光ダイオードのパッケージング構造の耐久性を向上させることができる。   The packaging structure of the light emitting diode according to the present invention further comprises a conducting wire. The conducting wire is used to connect the light emitting diode chip and the substrate, and electrically connects the light emitting diode chip and the substrate. Since the package colloid covers the conductive wire, the contact between the external air and the conductive wire is blocked, the oxidation phenomenon of the conductive wire is reduced, and the durability of the light emitting diode packaging structure according to the present invention can be improved.

本発明による発光ダイオードのパッケージング構造において、パッケージコロイド内に蛍光体粉末を均一に分布させるには、パッケージコロイドは粘性係数が少なくとも６０Ｋｇｆ・ｓ／ｍ2以上の有機樹脂材料を含有することが最も好ましい。 In the packaging structure of the light emitting diode according to the present invention, in order to uniformly distribute the phosphor powder in the package colloid, the package colloid most preferably contains an organic resin material having a viscosity coefficient of at least 60 kgf · s / m 2 or more. preferable.

本発明による発光ダイオードのパッケージング構造についての詳細な特徴を説明するため、以下の実施形態および図面を提示し、本発明領域において常識がある人ならば本発明の実施形態を簡単に実施できる範囲内に説明を進める。   In order to explain the detailed characteristics of the packaging structure of a light emitting diode according to the present invention, the following embodiments and drawings are presented, and those who have common sense in the field of the present invention can easily implement the embodiments of the present invention. Proceed with the explanation.

本発明の一実施形態による発光ダイオードのパッケージング構造を示す模式図である。1 is a schematic diagram illustrating a packaging structure of a light emitting diode according to an embodiment of the present invention. 本発明の一実施形態による発光ダイオードのパッケージング構造を示す別の模式図である。FIG. 5 is another schematic diagram illustrating a packaging structure of a light emitting diode according to an embodiment of the present invention.

以下、本発明による発光ダイオードのパッケージング構造を図面に基づいて説明する。
（一実施形態）
図１に示すように、本発明の一実施形態による発光ダイオードのパッケージング構造１０は、基板１１、発光ダイオードチップ１３、導線１５およびパッケージコロイド１７を備える。 Hereinafter, a packaging structure of a light emitting diode according to the present invention will be described with reference to the drawings.
(One embodiment)
As shown in FIG. 1, a light emitting diode packaging structure 10 according to an embodiment of the present invention includes a substrate 11, a light emitting diode chip 13, a conductive wire 15, and a package colloid 17.

基板１１は、導電性または非導電性の熱伝導材料から構成されてもよい。熱伝導材料は、金属材料、セラミックス材料、複合材料、カーボンナノチューブまたはプリント回路板から選ぶことが好ましい。金属材料は、銅、銀、アルミニウムまたはその合金である。セラミックス材料は酸化アルミニウム（Ａｌ2Ｏ3）、炭化ケイ素（ＳｉＣ）または窒化アルミニウム（ＡｌＮ）である。 The substrate 11 may be made of a conductive or non-conductive heat conductive material. The heat conducting material is preferably selected from metal materials, ceramic materials, composite materials, carbon nanotubes or printed circuit boards. The metal material is copper, silver, aluminum, or an alloy thereof. The ceramic material is aluminum oxide (Al 2 O 3 ), silicon carbide (SiC), or aluminum nitride (AlN).

発光ダイオードチップ１３は、炭化ケイ素（ＳｉＣ）またはＩＩＩ−Ｖ族化合物半導体材料から構成されてもよい。ＩＩＩ−Ｖ族化合物半導体材料は窒化ガリウム（ＧａＮ）、ガリウムリン（ＧａＰ）またはガリウムヒ素リン（ＧａＡｓＰ）である。製作の際、発光ダイオードチップ１３を基板１１に配置し、発光ダイオードチップ１３の頂面または頂面および底面に図示しない正電極および負電極を配置する。本実施形態において、正電極および負電極は発光ダイオードチップ１３の頂面に配置され、かつ導線１５を介して基板１１に接続することで発光ダイオードチップ１３と基板１１とを電気的に接続させる。   The light emitting diode chip 13 may be made of silicon carbide (SiC) or a III-V compound semiconductor material. The III-V compound semiconductor material is gallium nitride (GaN), gallium phosphide (GaP), or gallium arsenide phosphorus (GaAsP). At the time of manufacture, the light emitting diode chip 13 is arranged on the substrate 11, and a positive electrode and a negative electrode (not shown) are arranged on the top surface or top surface and bottom surface of the light emitting diode chip 13. In the present embodiment, the positive electrode and the negative electrode are disposed on the top surface of the light emitting diode chip 13 and are connected to the substrate 11 via the conductive wire 15 to electrically connect the light emitting diode chip 13 and the substrate 11.

パッケージコロイド１７は、本実施形態において有機樹脂材料および蛍光体粉末から構成される。有機樹脂材料は屈折率が１．４０以上であり、粘性係数が少なくとも６０Ｋｇｆ・ｓ／ｍ2以上である。有機樹脂材料はシリコーンを採用することが最も好ましい。蛍光体粉末は特に制限されず、発光ダイオードのパッケージングに使用される市販の蛍光体粉末を使用し、実際の需要に応じて色を適切に選択してもよい。パッケージコロイド１７を製作する際、高速撹拌脱泡ミキサーによって有機樹脂材料および蛍光体粉末を混合させ、パッケージコロイド１７内に蛍光体粉末を均一に分布させる。パッケージコロイド１７はディスペンサーによって発光ダイオードチップ１３に被さるように基板１１に配置される。 The package colloid 17 is composed of an organic resin material and a phosphor powder in the present embodiment. The organic resin material has a refractive index of 1.40 or more and a viscosity coefficient of at least 60 kgf · s / m 2 or more. The organic resin material is most preferably silicone. The phosphor powder is not particularly limited, and a commercially available phosphor powder used for packaging of a light emitting diode may be used, and a color may be appropriately selected according to actual demand. When the package colloid 17 is manufactured, the organic resin material and the phosphor powder are mixed by a high-speed stirring and defoaming mixer, and the phosphor powder is uniformly distributed in the package colloid 17. The package colloid 17 is disposed on the substrate 11 so as to cover the light emitting diode chip 13 by a dispenser.

実際に製作する際、図２に示すように発光ダイオードチップ１３および導線１５にパッケージコロイド１７を被せると同時にパッケージコロイド１７を基板１１に配置すれば、導線１５と外部の空気との接触を遮断し、導線１５の酸化現象を抑制し、本発明による発光ダイオードのパッケージング構造１０の耐久性を向上させることができる。   In actual production, as shown in FIG. 2, if the package colloid 17 is placed on the substrate 11 at the same time as the light emitting diode chip 13 and the conductor 15 are covered, the contact between the conductor 15 and the outside air is blocked. The oxidation phenomenon of the conductive wire 15 can be suppressed, and the durability of the light emitting diode packaging structure 10 according to the present invention can be improved.

上述した通り、本発明による発光ダイオードのパッケージング構造１０は、パッケージコロイド１７内に蛍光体粉末が均一に分布するため、色温度の分布を平均させ、ハレーション現象を抑制し、光の品質をより良好にすることができる。均一に分布した蛍光体粉末が発光ダイオードチップ１３に接触しにくいため、放熱不良が原因で発光効率を低下させ、蛍光体粉末の損耗率を増加させてしまうという問題を改善することができる。一方、パッケージコロイド１７は導線１５に被さるため、導線１５の酸化現象を抑制し、本発明による発光ダイオードのパッケージング構造１０の寿命を延ばすことができる。   As described above, in the light emitting diode packaging structure 10 according to the present invention, since the phosphor powder is uniformly distributed in the package colloid 17, the color temperature distribution is averaged, the halation phenomenon is suppressed, and the light quality is further improved. Can be good. Since the uniformly distributed phosphor powder is difficult to contact the light emitting diode chip 13, it is possible to improve the problem that the luminous efficiency is lowered due to heat radiation failure and the wear rate of the phosphor powder is increased. On the other hand, since the package colloid 17 covers the conductor 15, the oxidation phenomenon of the conductor 15 can be suppressed and the life of the light emitting diode packaging structure 10 according to the present invention can be extended.

以上、本発明は、上記実施形態になんら限定されるものではなく、発明の趣旨を逸脱しない範囲において種々の形態で実施可能である。   As mentioned above, this invention is not limited to the said embodiment at all, In the range which does not deviate from the meaning of invention, it can implement with a various form.

１０：発光ダイオードのパッケージング構造、
１１：基板、
１３：発光ダイオードチップ、
１５：導線、
１７：パッケージコロイド。 10: Light emitting diode packaging structure,
11: substrate
13: Light emitting diode chip,
15: Conductor,
17: Package colloid.

Claims (4)

基板と、
前記基板に配置され、かつ前記基板に電気的に接続される発光ダイオードチップと、
前記発光ダイオードチップに被さるように前記基板に配置され、かつ分布が平均している蛍光体粉末を含有するパッケージコロイドと、
を備えることを特徴とする発光ダイオードのパッケージング構造。 A substrate,
A light emitting diode chip disposed on the substrate and electrically connected to the substrate;
A package colloid containing phosphor powder disposed on the substrate so as to cover the light emitting diode chip and having an average distribution;
A light-emitting diode packaging structure comprising: さらに導線を備え、前記導線は前記発光ダイオードチップと前記基板との接続に用いられ、前記発光ダイオードチップと前記基板とを電気的に接続させ、前記パッケージコロイドは前記導線に被さることを特徴とする請求項１に記載の発光ダイオードのパッケージング構造。   Further, a conductive wire is provided, the conductive wire is used to connect the light emitting diode chip and the substrate, the light emitting diode chip and the substrate are electrically connected, and the package colloid covers the conductive wire. The light emitting diode packaging structure according to claim 1. 前記パッケージコロイドは、粘性係数が少なくとも６０Ｋｇｆ・ｓ／ｍ2以上の有機樹脂材料を含有することを特徴とする請求項１に記載の発光ダイオードのパッケージング構造。 2. The light emitting diode packaging structure according to claim 1, wherein the package colloid contains an organic resin material having a viscosity coefficient of at least 60 kgf · s / m 2 or more. 前記パッケージコロイドは、高速撹拌脱泡ミキサーによって前記有機樹脂材料および蛍光体粉末を混合させることによって製作されることを特徴とする請求項３に記載の発光ダイオードのパッケージング構造。   4. The light emitting diode packaging structure according to claim 3, wherein the package colloid is manufactured by mixing the organic resin material and the phosphor powder with a high-speed stirring and defoaming mixer.
JP2011114599A 2011-04-19 2011-05-23 Packaging structure of light-emitting diode Pending JP2012227500A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
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CN105235476A (en) * 2015-08-28 2016-01-13 哈尔滨固泰电子有限责任公司 Rear windshield glass carrying with brake lamp and mounting method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008082A (en) * 2002-05-13 2003-01-10 Nichia Chem Ind Ltd Light emitting diode and method for forming the same
JP2010114217A (en) * 2008-11-05 2010-05-20 Toshiba Corp Fluorescer solution, light-emitting device, and method for manufacturing it

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008082A (en) * 2002-05-13 2003-01-10 Nichia Chem Ind Ltd Light emitting diode and method for forming the same
JP2010114217A (en) * 2008-11-05 2010-05-20 Toshiba Corp Fluorescer solution, light-emitting device, and method for manufacturing it

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105235476A (en) * 2015-08-28 2016-01-13 哈尔滨固泰电子有限责任公司 Rear windshield glass carrying with brake lamp and mounting method
CN105235476B (en) * 2015-08-28 2019-07-05 成都固泰电子有限责任公司 The wind shield glass wind shield and installation method of included brake lamp

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