JP2012227363A - Light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which maintains a color temperature of extracted light in good conditions.SOLUTION: A light emitting device 1 includes: a substrate 2; a light emitting element 3 provided on the substrate 2; a porous frame body 4 provided on the substrate 2 so as to enclose the light emitting element 3; a sealing member 5 provided at a region on the substrate 2, which is enclosed by the porous frame body 4, so as to enclose the light emitting device 3 and partially infiltrating into the porous frame body 4; a wavelength conversion member 6 provided at the porous frame body 4 so as to be spaced away from the light emitting element 3; and an adhesion material 7 provided so as to range from an upper surface of the wavelength conversion member 6 to an upper part of the porous frame body 4 and be spaced away from the sealing member 5 in the porous frame body 4 and partially infiltrating into the porous frame body 4.

Description

  The present invention relates to a light emitting device including a light emitting element.

  In recent years, development of a light emitting device having a light emitting element such as a light emitting diode has been advanced. The light-emitting device has attracted attention with respect to power consumption or product life. As a light emitting device, there is a light emitting device that converts light emitted from a light emitting element into light of a specific wavelength band by a wavelength conversion member and extracts the light outside (see Patent Documents 1 and 2 below).

JP 2009-49172 A JP 2009-70870 A

  In the development of a light emitting device, if the heat generated due to the light emitted from the light emitting element is concentrated at a specific location on the wavelength conversion member, the color temperature of the light extracted outside may change greatly.

  An object of this invention is to provide the light-emitting device which can maintain the color temperature of the taken-out light favorably.

  A light emitting device according to an embodiment of the present invention includes: a substrate; a light emitting element provided on the substrate; a porous frame provided on the substrate so as to surround the light emitting element; A sealing member provided so as to cover the light emitting element in a region surrounded by a porous frame, and a part of which is infiltrated into the porous frame, and the light emitting element supported by the porous frame; A wavelength conversion member provided with a space between the upper surface of the wavelength conversion member and an upper portion of the porous frame, and a part of the wavelength conversion member enters the porous frame; And an adhesive provided at a distance from the sealing member.

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which can maintain favorably the color temperature of the taken-out light can be provided.

It is a cross-sectional perspective view which shows the external appearance of the light-emitting device which concerns on this embodiment. It is sectional drawing of the light-emitting device which concerns on this embodiment. It is sectional drawing to which some light emitting devices concerning this embodiment were expanded. It is a top view of the light-emitting device concerning this embodiment. It is sectional drawing to which a part of porous frame concerning this embodiment was expanded. It is sectional drawing of the light-emitting device which shows the manufacturing process of the light-emitting device which concerns on this embodiment. It is sectional drawing of the light-emitting device which shows the manufacturing process of the light-emitting device which concerns on this embodiment. It is sectional drawing of the light-emitting device which shows the manufacturing process of the light-emitting device which concerns on this embodiment. It is sectional drawing of the light-emitting device which shows the manufacturing process of the light-emitting device which concerns on this embodiment. It is sectional drawing of the light-emitting device which shows the manufacturing process of the light-emitting device which concerns on this embodiment. It is sectional drawing of the light-emitting device which shows the manufacturing process of the light-emitting device which concerns on this embodiment.

  Embodiments of a light emitting device according to the present invention will be described below with reference to the accompanying drawings. In addition, this invention is not limited to the following embodiment.

<Schematic configuration of light emitting device>
FIG. 1 is a cross-sectional perspective view showing an overview of the light emitting device according to the present embodiment, in which a part of the light emitting device is cut out. 2 is a cross-sectional view taken along the line XX ′ of the light emitting device shown in FIG. FIG. 3 is an enlarged cross-sectional view of a part A of the light emitting device shown in FIG. FIG. 4 is a plan view of the light emitting device, showing a state where the wavelength conversion member and the adhesive are removed. In FIGS. 1 to 3, the circles in the porous frame indicate the pores b schematically shown. FIG. 5 is an enlarged cross-sectional view of a part of the porous frame.

  The light emitting device 1 according to this embodiment includes a substrate 2, a light emitting element 3 provided on the substrate 2, a porous frame 4 provided on the substrate 2 so as to surround the light emitting element 3, The region surrounded by the porous frame 4 is provided so as to cover the light emitting element 3, and a part of the sealing member 5 that has entered the porous frame 4 and the porous frame 4 are supported. A wavelength conversion member 6 provided to be spaced apart from the light emitting element 3, a wavelength conversion member 6 provided from the upper surface of the wavelength conversion member 6 to the upper part of the porous frame 4, and a part of the light entering the porous frame 4. The adhesive 7 is provided in the porous frame 4 so as to be spaced from the sealing member 5. The light emitting element 3 is a light emitting diode, and can emit light toward the outside by recombination of electrons and holes in a pn junction using a semiconductor.

  The substrate 2 is an insulating substrate and is made of a ceramic material such as alumina or mullite, or a glass ceramic material. Alternatively, it is composed of a composite material obtained by mixing a plurality of materials among these materials. Further, as the substrate 2, a polymer resin in which metal oxide fine particles capable of adjusting the thermal expansion of the substrate 2 are dispersed can also be used.

  On the substrate 2, wiring conductors (not shown) that electrically connect the inside and outside of the substrate 2 are formed. The wiring conductor is made of a conductive material such as tungsten, molybdenum, manganese, or copper. The wiring conductor is obtained by printing a metal paste obtained by adding an organic solvent to a powder of tungsten or the like in a predetermined pattern on a ceramic green sheet to be the substrate 2, and laminating and firing the plurality of ceramic green sheets. can get. Note that a plating layer such as nickel or gold is deposited on the surface of the wiring conductor exposed inside and outside the substrate 2 to prevent oxidation.

  Further, a metal made of a metal such as aluminum, silver, gold, copper or platinum is provided on the upper surface of the substrate 2 with a space between the wiring conductor and the plating layer in order to reflect light efficiently above the substrate 2. A reflective layer is formed.

  The light emitting element 3 is mounted on the substrate 2. Specifically, the light emitting element 3 is electrically connected to a plating layer attached to the surface of the wiring conductor formed on the substrate 2 via, for example, a brazing material or solder.

The light emitting element 3 has a translucent base (not shown) and an optical semiconductor layer (not shown) formed on the translucent base. The translucent substrate may be any substrate on which the optical semiconductor layer can be grown using chemical vapor deposition such as metal organic chemical vapor deposition or molecular beam epitaxy. Examples of the material used for the light-transmitting substrate include sapphire, gallium nitride, aluminum nitride, zinc oxide, zinc selenide, silicon carbide, silicon, and zirconium diboride. The thickness of the translucent substrate is, for example, 50
It is not less than μm and not more than 1000 μm.

The optical semiconductor layer includes a first semiconductor layer formed on the translucent substrate, a light emitting layer formed on the first semiconductor layer, and a second semiconductor layer formed on the light emitting layer. ing. The first semiconductor layer, the light emitting layer, and the second semiconductor layer are, for example, a group III nitride semiconductor, a group III-V semiconductor such as gallium phosphide or gallium arsenide, or a group III nitride such as gallium nitride, aluminum nitride, or indium nitride. A semiconductor or the like can be used. The thickness of the first semiconductor layer is, for example, 1 μm to 5 μm, the thickness of the light emitting layer is, for example, 25 nm to 150 nm, and the thickness of the second semiconductor layer is, for example, 50 nm to 600 nm. Further, the light emitting element 3 configured as described above can be used as an element that emits excitation light in a wavelength range of, for example, 370 nm to 420 nm.

  The porous frame 4 is made of a porous ceramic material, and can be disposed on the upper surface of the substrate 2 and, for example, integrally fired to connect the substrate 2 and the porous frame 4. Further, it can be connected to the upper surface of the substrate 2 by bonding via, for example, a brazing material or solder. The porous frame 4 is provided so as to surround the light emitting element 3 on the substrate 2. Note that, when the shape of the inner wall surface of the porous frame 4 is circular in plan view, the light emitted from the light emitting element 3 can be uniformly reflected in all directions and uniformly emitted to the outside.

  The porous frame 4 is made of a porous material formed by sintering a ceramic material such as aluminum oxide, titanium oxide, zirconium oxide or yttrium oxide in a desired shape. The porous frame 4 is provided with a large number of pores b. In addition, the porosity of the porous frame 4 is set to 25% or more and 50% or less, for example. Moreover, the diameter of many pores b provided in the porous frame 4 is set to a size of 0.1 μm or more and 1.5 μm or less, for example. The thermal conductivity of the porous frame 4 is set to, for example, 5 W (m · K) or more and 200 W (m · K) or less.

  The porous frame 4 has a function of diffusing and reflecting the light from the light emitting element 3 or the light reflected by the wavelength conversion member 6 on the surface of the porous frame 4. Thereby, the light emitted from the light emitting element 3 can be made difficult to concentrate on a part of the wavelength conversion member 6. If light concentrates on a part of the wavelength conversion member 6, the temperature rises at the location where the light of the wavelength conversion member 6 is concentrated, thereby reducing the wavelength conversion efficiency of the wavelength conversion member 6 or wavelength conversion. There is a possibility that the transmittance or mechanical strength of the member 6 may deteriorate. Therefore, by providing the porous frame 4 that can diffusely reflect the light emitted from the light emitting element 3 around the light emitting element 3, it is possible to suppress the light from being concentrated on a specific portion of the wavelength conversion member 6. The wavelength conversion efficiency of the wavelength conversion member 6 can be maintained well over a long period of time. Furthermore, the transmittance or mechanical strength of the wavelength conversion member 6 can be maintained well over a long period of time.

  Further, the inner wall surface is inclined with respect to the region surrounded by the inner wall surface of the porous frame 4 so that the width between the inner wall surfaces becomes wider from the lower part to the upper part in a sectional view. Further, a step 4 a is provided inside the upper end of the porous frame 4. The step 4a of the porous frame 4 is for supporting the wavelength conversion member 6 on its lateral surface (usually corresponding to a horizontal plane). Here, the step 4a is formed by cutting out a part of the upper portion of the porous frame 4 inward.

  In addition, the inclination angle of the inner wall surface of the porous frame 4 is set to an angle of, for example, 55 degrees to 70 degrees with respect to the upper surface of the substrate 2. Moreover, the surface roughness of the inner wall surface of the porous frame 4 is set to, for example, 1 μm or more and 3 μm or less in terms of arithmetic average roughness Ra.

A region surrounded by the porous frame 4 is filled with a light-transmitting sealing member 5 so as to seal the light emitting element 3 inside. Since the porous frame 4 is provided with a large number of pores b including the surface of the porous frame 4, a part of the sealing member 5 enters inside from the surface of the porous frame 4 and is fixed. Is done. The sealing member 5 and the porous frame 4 are firmly bonded to each other by the anchor effect because a part of the sealing member 5 enters and adheres to the porous frame 4.

  The sealing member 5 has a function of sealing the light emitting element 3 and transmitting light emitted from the light emitting element 3. The sealing member 5 is filled up to a position lower than the height position of the step 4 a in the region surrounded by the porous frame 4 in a state where the light emitting element 3 is accommodated inside the porous frame 4. . The sealing member 5 absorbs heat caused by light emitted from the light emitting element 3 and transmits the heat to the entire sealing member 5. If heat concentrates on a specific location in the sealing member 5, partial thermal expansion of the sealing member 5 occurs and the sealing member 5 may be peeled off from the substrate 2 and the porous frame 4. It becomes easy. Further, when heat concentration occurs in the sealing member 5, the light emitting element 3 becomes high temperature, the wavelength of light emitted from the light emitting element 3 changes, and the emission color of the light emitting element 3 may greatly deviate from the desired light color. It tends to occur. The sealing member 5 is made of a translucent insulating resin such as a silicone resin, an acrylic resin, or an epoxy resin. The thermal conductivity of the sealing member 5 is set to, for example, 0.14 W / (m · K) or more and 0.21 W / (m · K) or less.

The intrusion region S1 in which a part of the sealing member 5 enters the inside of the porous frame 4 from the inner wall surface of the porous frame 4 is continuously provided over the entire circumference of the inner wall surface of the porous frame 4. It has been. The intrusion region S1 is set to, for example, 0.5 mm or more and 2 mm or less in a cross-sectional view from the inner wall surface of the porous frame 4 toward the inside of the porous frame 4. The impregnation amount of the sealing member 5 that has entered the intrusion region S1 is set to ³ mm ³ or more and 180 mm ³ or less, for example.

  The heat generated by the light emitting element 3 is transmitted to the intrusion region S <b> 1 through the sealing member 5. Then, the heat is transmitted from the intrusion region S1 into the porous frame 4 and can be radiated from the side surface of the porous frame 4 to the outside through the porous frame 4 in which many pores b exist. As a result, it is possible to suppress heat from being accumulated in the sealing member 5 and to change the electrical characteristics of the light emitting element 3, and to emit a desired amount of light from the light emitting element 3 toward the wavelength conversion member 6. be able to.

  The wavelength conversion member 6 emits light when the light emitted from the light emitting element 3 enters the inside and the phosphor contained therein is excited. Here, the wavelength conversion member 6 is made of a resin material such as a silicone resin, an acrylic resin, or an epoxy resin, and a blue phosphor that emits fluorescence of, for example, 430 nm to 490 nm in the resin material, for example, 500 nm to 560 nm. A green phosphor that emits fluorescence, for example, a yellow phosphor that emits fluorescence of 540 to 600 nm, for example, a red phosphor that emits fluorescence of 590 to 700 nm is contained. The phosphor is contained so as to be uniformly dispersed in the wavelength conversion member 6. The thermal conductivity of the wavelength conversion member 6 is set to, for example, 0.1 W / (m · K) or more and 0.3 W / (m · K) or less.

  The wavelength conversion member 6 is supported on the porous frame 4 and is provided to be spaced from the light emitting element 3. The end of the wavelength conversion member 6 is positioned on the step 4 a of the porous frame 4, and the end surface of the wavelength conversion member 6 is surrounded by the porous frame 4.

  The wavelength conversion member 6 is circular in plan view, and the diameter of the wavelength conversion member 6 is set to, for example, 2 mm or more and 20 mm or less. Moreover, the thickness of the wavelength conversion member 6 is set to 0.7 mm or more and 3 mm or less, for example, and is set with constant thickness. Here, the constant thickness includes a thickness error of 0.5 μm or less. By making the thickness of the wavelength conversion member 6 constant, the amount of light excited by the wavelength conversion member 6 can be adjusted to be uniform, and uneven brightness in the wavelength conversion member 6 can be suppressed. it can.

On the step 4 a of the porous frame 4, the end of the wavelength conversion member 6 is interposed between the porous frame 4 and the adhesive 7.
Fixed to the top of the. The adhesive 7 is provided from the upper surface of the wavelength conversion member 6 to the upper part of the porous frame 4. For the adhesive 7, for example, a translucent insulating resin such as a silicone resin, an acrylic resin, or an epoxy resin is used. The thermal conductivity of the adhesive 7 is set to, for example, 0.14 W / (m · K) or more and 4 W / (m · K) or less.

  A gap SP is provided between the wavelength converting member 6 and the inner wall surface of the step 4 a of the porous frame 4, and a part of the adhesive 7 enters the gap SP. Then, the adhesive 7 that has entered the gap SP is interposed between the side surface of the wavelength conversion member 6 and the inner wall surface of the porous frame 4 to bond them together.

  The adhesive material 7 is continuously formed along the outer periphery of the wavelength conversion member 6 in plan view. Further, the gap SP between the wavelength conversion member 6 and the porous frame 4 is provided along the outer periphery of the wavelength conversion member 6. The adhesive 7 is filled in a gap SP provided along the outer periphery of the wavelength conversion member 6 and firmly connects the wavelength conversion member 6 and the porous frame 4. In a cross-sectional view, by attaching from the side surface of the wavelength conversion member 6 to the inner wall surface of the porous frame 4, the area to which the adhesive 7 is attached is increased, and the wavelength conversion member 6 is interposed via the adhesive 7. And the porous frame 4 can be firmly connected. As a result, the connection strength between the wavelength conversion member 6 and the porous frame 4 can be improved, and bending of the wavelength conversion member 6 is suppressed. And it can suppress effectively that the optical distance between the light emitting element 3 and the wavelength conversion member 6 fluctuates.

  In addition, a part of the adhesive 7 enters the inside from the top of the porous frame 4. That is, since the porous frame 4 is provided with a large number of pores b including the surface of the porous frame 4, a part of the adhesive 7 enters and is fixed in the porous frame 4. . The adhesive 7 and the porous frame 4 are firmly bonded to each other by the anchor effect because a part of the adhesive 7 enters and adheres to the porous frame 4.

The intrusion region S2 in which a part of the adhesive material 7 infiltrates from the upper part of the porous frame 4 toward the inside of the porous frame 4 is the lower surface of the porous frame 4 from the lateral surface of the inner surface of the step 4a. Toward the outer surface of the porous frame 4 from the vertical surface (usually a vertical surface) of the inner surface of the step 4a, preferably on both of them, the step 4a of the porous frame 4 It is provided continuously over the entire circumference of the inner surface. The intrusion region S2 is set to, for example, 0.5 mm or more and 2 mm or less in a cross-sectional view from the surface of the porous frame 4 toward the inside of the porous frame 4. The impregnation amount of the adhesive 7 that has entered the intrusion region S2 is set to, for example, 3 mm ³ or more and 120 mm ³ or less.

  The intrusion area S2 is located away from the intrusion area S1, and the sealing member 5 and the adhesive material 7 are not connected in the porous frame 4 and are arranged apart from each other. In addition, since the porous frame 4 has a large number of pores b therein, the heat transmitted from the light emitting element 3 to the sealing member 5 located in the intrusion region S1 in the porous frame 4 is in the intrusion region S1. Since the heat insulation from the intrusion area S1 to the intrusion area S2 is maintained by the pore b containing the air in the porous frame 4 located between the intrusion area S2 and the intrusion area S2, the intrusion area S1 is changed to the intrusion area S2. Difficult to communicate. As a result, the heat transmitted to the sealing member 5 in the porous frame 4 is not easily transferred to the adhesive 7 in the porous frame 4 and is radiated from the side surface of the porous frame 4 to the outside to be bonded. It can suppress that the temperature of the material 7 becomes high temperature. And by suppressing that the temperature of the adhesive material 7 becomes high, the heat transmitted from the adhesive material 7 to the wavelength conversion member 6 can be reduced, and therefore, the wavelength conversion member 6 is prevented from becoming high temperature. Can do. When the wavelength conversion member 6 becomes high temperature, the color temperature of the light excited by the excitation light emitted from the light emitting element 3 changes and it becomes difficult to obtain a light color having a desired color temperature. However, the temperature of the wavelength conversion member 6 is high. By suppressing this, light of a desired light color can be stably extracted.

Moreover, the wavelength conversion member 6 can be reduced by reducing the amount of heat transferred from the adhesive 7 to the wavelength conversion member 6.
The wavelength conversion efficiency of the wavelength conversion member 6 can be suppressed from decreasing, or the transmittance or mechanical strength of the wavelength conversion member 6 can be prevented from deteriorating, and the wavelength conversion efficiency of the wavelength conversion member 6 can be maintained well over a long period. it can. Furthermore, the transmittance or mechanical strength of the wavelength conversion member 6 can be maintained well over a long period of time.

  The thermal conductivity of the adhesive 7 may be set larger than the thermal conductivity of the wavelength conversion member 6. Heat transmitted from the light emitting element 3 through the sealing member 5 to the wavelength converting member 6 from above the sealing member 5 by making the thermal conductivity of the adhesive 7 larger than the thermal conductivity of the wavelength converting member 6. Can be easily transmitted to the adhesive 7. The heat transferred from the wavelength conversion member 6 to the adhesive 7 is difficult to be transferred from the adhesive 7 to the sealing member 5 because the penetration region S2 and the penetration region S1 are separated from each other, and from the side surface of the porous frame 4 to the outside. It is possible to suppress the heat dissipation toward the wavelength conversion member 6 from rising. The wavelength conversion member 6 generates heat due to conversion loss when the light emitted from the light emitting element 3 is wavelength-converted by the phosphor, and the temperature of the wavelength conversion member 6 is increased by this heat. By making the heat easy to be absorbed by the adhesive 7 from the wavelength conversion member 6, it is possible to suppress the wavelength conversion member 6 from becoming high temperature.

  According to the present embodiment, the light emitted from the light-emitting element 3 is diffused by the inner wall surface of the porous frame body 4 having irregularities due to the pores b, and the dispersed light reaches the lower surface of the wavelength conversion member 6. It is possible to suppress the specific portion of the wavelength conversion member 6 from becoming high temperature, and to suppress variations in the color temperature of the light extracted to the outside. In particular, if the temperature at a specific portion of the wavelength conversion member 6 may continue to rise for a long time, the color temperature of the light extracted from the wavelength conversion member 6 may change. On the other hand, according to this embodiment, the color temperature of the light extracted outside can be favorably maintained by suppressing the specific portion of the wavelength conversion member 6 from becoming high temperature.

  Further, according to the present embodiment, the heat generated by the light emitting element 3 is formed by separating the intrusion region S1 of the sealing member 5 that has entered the porous frame 4 and the intrusion region S2 of the adhesive 7. The temperature transmitted to the wavelength conversion member 6 can be suppressed by dissipating heat to the outside of the porous frame 4 through the pores b in the porous frame 4, resulting in light emitted from the light emitting element 3. It is possible to make it difficult to concentrate the heat generated in a specific place of the wavelength conversion member 6. As a result, it is possible to provide the light-emitting device 1 that can effectively suppress a large change in the color temperature of the light extracted to the outside and can maintain a good color temperature of the extracted light.

  In addition, this invention is not limited to the above-mentioned form, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

<Method for manufacturing light emitting device>
Here, a method of manufacturing the light emitting device 1 shown in FIG. 1 will be described. 6 to 11 are cross-sectional views of the light-emitting device showing the manufacturing steps of the light-emitting device, and correspond to the cross-section shown in FIG.

  First, the substrate 2 is prepared. If the substrate 2 is made of, for example, an aluminum oxide sintered body, an organic binder, a plasticizer, a solvent, or the like is added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to obtain a mixture. obtain. And a some green sheet is produced from a mixture.

Moreover, a high melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste. And the metallized pattern used as a wiring conductor and the metallized pattern for joining the porous frame 4 as needed are each printed with the predetermined pattern to the ceramic green sheet used as the board | substrate 2, and the state which laminated | stacked the several ceramic green sheet The board | substrate 2 can be prepared by baking by.

  On the other hand, the porous frame 4 is prepared. For the porous frame 4, a ceramic material such as aluminum oxide, titanium oxide, zirconium oxide or yttrium oxide is prepared. The porous frame 4 can be prepared by filling the mold of the porous frame 4 with a ceramic material and drying it, followed by firing. Also on the porous frame 4, a metallized pattern is formed on the surface to which the substrate 2 is bonded as required.

  Next, as shown in FIG. 6, the porous frame 4 is provided on the substrate 2 by joining both metallized patterns to each other through, for example, solder. Then, as shown in FIG. 7, the light emitting element 3 is mounted in a region surrounded by the porous frame 4 on the upper surface of the substrate 2.

  And as shown in FIG. 8, the area | region enclosed by the porous frame 4 on the board | substrate 2 is filled with the silicone resin as the sealing member 5, for example. At this time, the sealing member 5 does not enter the porous frame 4. Furthermore, a region surrounded by the porous frame 4 is filled with a silicone resin, and a part of uncured silicone resin is made porous from the inner wall surface of the porous frame 4 by, for example, passing a time of 1 minute or longer. It penetrates toward the inside of the frame 4. Thereafter, for example, the silicone resin is heated to a temperature of 150 ° C. or higher to cure the silicone resin, thereby forming the sealing member 5 and sealing the light emitting element 3. In this manner, as shown in FIG. 9, the porous frame 4 in which the intrusion region S1 is formed can be provided.

  Next, the wavelength conversion member 6 is prepared. The wavelength conversion member 6 can be produced by mixing a phosphor with an uncured resin and using a sheet forming technique such as a doctor blade method, a die coater method, an extrusion method, a spin coating method, or a dip method. The wavelength conversion member 6 can also be obtained by filling the mold with the uncured wavelength conversion member 6 and curing it.

  Then, as shown in FIG. 10, the prepared wavelength conversion member 6 is bonded onto the step 4 a of the porous frame 4 via a silicone resin as the adhesive 7. At this time, the adhesive 7 does not enter the porous frame 4. Further, in a state where the wavelength conversion member 6 is bonded to the porous frame 4 via the adhesive 7, for example, an uncured silicone resin is infiltrated into the porous frame 4 by elapse of one minute or more. Let Thereafter, the silicone resin is heated to a temperature of, for example, 150 ° C. or higher and 360 ° C. or lower at which the sealing member 5 is not broken to cure the silicone resin. Thus, as shown in FIG. 11, the porous frame 4 in which the intrusion region S2 is formed can be provided, and the light emitting device 1 can be manufactured.

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Board | substrate 3 Light-emitting element 4 Porous frame 4a Level | step difference 5 Sealing member 6 Wavelength conversion member 7 Adhesive material SP Clearance S1 Infiltration area S2 Infiltration area

Claims (3)

A substrate,
A light emitting device provided on the substrate;
A porous frame provided on the substrate so as to surround the light emitting element;
A sealing member provided so as to cover the light emitting element in a region surrounded by the porous frame on the substrate, and a part of which is infiltrated into the porous frame;
A wavelength conversion member provided in the porous frame with a space between the light emitting element, and
Provided from the upper surface of the wavelength conversion member to the upper part of the porous frame, and a part of the wavelength conversion member penetrates into the porous frame, and is provided with a gap from the sealing member in the porous frame. A light-emitting device comprising: an adhesive material. The light-emitting device according to claim 1,
The light emitting device, wherein the porous frame has pores between the sealing member and the adhesive. The light-emitting device according to claim 1 or 2,
A light emitting device, wherein a gap is provided between the wavelength conversion member and the porous frame, and a part of the adhesive material enters the gap.

Images