JP2012227224A - Light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which continues to secure a wavelength conversion member in good conditions.SOLUTION: A light emitting device 1 includes: a substrate 2; a light emitting element 3 provided on the substrate 2; a porous frame body 4 provided on the substrate 2 so as to enclose the light emitting element 3; a ring shaped member 5 provided along an upper part of an inner wall surface of the porous frame body 4 and having a porosity smaller than that of the porous frame body 4; a wavelength conversion member 6 provided on the inner side of the ring shaped member 5 so as to be spaced away from the light emitting element 3; and an adhesion material 7 which is provided so as to range from an upper surface of the wavelength conversion member 6 to an upper surface of the ring shaped member 5.

Description

  The present invention relates to a light emitting device including a light emitting element.

  In recent years, development of a light emitting device having a light emitting element such as a light emitting diode has been advanced. The light-emitting device has attracted attention with respect to power consumption or product life. As a light emitting device, there is a light emitting device that converts light emitted from a light emitting element into light of a specific wavelength band by a wavelength conversion member and extracts the light outside (see Patent Documents 1 and 2 below).

JP 2009-49172 A JP 2009-70870 A

  In the development of a light emitting element, if the heat generated due to the light emitted from the light emitting element is concentrated on a specific portion of the wavelength converting member, the wavelength converting member may be peeled off by the heat.

  An object of this invention is to provide the light-emitting device which can continue adhering a wavelength conversion member favorably.

  A light-emitting device according to an embodiment of the present invention includes a substrate, a light-emitting element provided on the substrate, a porous frame surrounding the light-emitting element provided on the substrate, and the porous frame An annular member provided along the upper portion of the inner wall surface and having a porosity smaller than the porosity of the porous frame, and a wavelength conversion member provided between the light emitting elements inside the annular member, And an adhesive provided from the upper surface of the wavelength conversion member to the upper surface of the ring-shaped member.

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which can suppress the influence by the heat | fever which a light emitting element generate | occur | produces conventionally, and can continue favorably fixing a wavelength conversion member can be provided.

It is a cross-sectional perspective view which shows the external appearance of the light-emitting device which concerns on this embodiment. It is sectional drawing of the light-emitting device which concerns on this embodiment. It is sectional drawing to which some light emitting devices concerning this embodiment were expanded. It is a top view of the light-emitting device concerning this embodiment. It is sectional drawing to which a part of porous frame concerning this embodiment was expanded.

  Embodiments of a light emitting device according to the present invention will be described below with reference to the accompanying drawings. In addition, this invention is not limited to the following embodiment.

<Schematic configuration of light emitting device>
FIG. 1 is a schematic perspective view of a light emitting device according to this embodiment, and a part thereof is cut away. 2 is a cross-sectional view taken along the line XX ′ of the light emitting device shown in FIG. FIG. 3 is an enlarged cross-sectional view of a part A of the light emitting device shown in FIG. FIG. 4 is a plan view of the light emitting device, showing a state in which the wavelength conversion member, the ring-shaped member, and the adhesive are removed. In FIGS. 1 to 3, the circles in the porous frame 4 indicate the pores b schematically shown. FIG. 5 is an enlarged cross-sectional view of a part of the porous frame 4.

  The light emitting device 1 according to the present embodiment includes a substrate 2, a light emitting element 3 provided on the substrate 2, a porous frame 4 surrounding the light emitting element 3 provided on the substrate 2, and a porous frame. An annular member 5 provided along the inner wall surface of the porous member 4 having a porosity smaller than the porosity of the porous frame 4, and a wavelength conversion member provided inside the annular member 5 with a space between the light emitting element 3. 6 and an adhesive 7 that is applied from the upper surface of the wavelength conversion member 6 to the upper surface of the ring-shaped member 5. The light emitting element 3 is, for example, a light emitting diode, and can emit light toward the outside by recombination of electrons and holes in a pn junction using a semiconductor.

  The substrate 2 is an insulating substrate and is made of a ceramic material such as alumina or mullite, or a glass ceramic material. Alternatively, it is composed of a composite material obtained by mixing a plurality of materials among these materials. Further, as the substrate 2, a polymer resin in which metal oxide fine particles capable of adjusting the thermal expansion of the substrate 2 are dispersed can also be used.

  On the substrate 2, wiring conductors (not shown) that electrically connect the inside and outside of the substrate 2 are formed. The wiring conductor is made of a conductive material such as tungsten, molybdenum, manganese, or copper. The wiring conductor is obtained, for example, by printing a metal paste obtained by adding an organic solvent to a powder of tungsten or the like in a predetermined pattern on a ceramic green sheet to be the substrate 2 and laminating and firing a plurality of ceramic green sheets. . A plating layer (not shown) such as nickel or gold is deposited on the surface of the wiring conductor exposed inside and outside the substrate 2 to prevent oxidation.

  Further, a metal made of a metal such as aluminum, silver, gold, copper or platinum is provided on the upper surface of the substrate 2 with a space between the wiring conductor and the plating layer in order to reflect light efficiently above the substrate 2. A reflective layer (not shown) is formed.

  The light emitting element 3 is mounted on the substrate 2. Specifically, the light emitting element 3 is electrically connected to a plating layer attached to the surface of the wiring conductor formed on the substrate 2 via, for example, a brazing material or solder.

  The light emitting element 3 has a translucent base (not shown) and an optical semiconductor layer (not shown) formed on the translucent base. The translucent substrate may be any substrate on which the optical semiconductor layer can be grown using chemical vapor deposition such as metal organic chemical vapor deposition or molecular beam epitaxy. As a material used for the translucent substrate, for example, sapphire, gallium nitride, aluminum nitride, zinc oxide, zinc selenide, silicon carbide, silicon, or zirconium diboride can be used. In addition, the thickness of a translucent base | substrate is 50 micrometers or more and 1000 micrometers or less, for example.

The optical semiconductor layer includes a first semiconductor layer formed on the translucent substrate, a light emitting layer formed on the first semiconductor layer, and a second semiconductor layer formed on the light emitting layer. ing. The first semiconductor layer, the light emitting layer, and the second semiconductor layer are, for example, a group III nitride semiconductor, a group III-V semiconductor such as gallium phosphide or gallium arsenide, or a group III nitride such as gallium nitride, aluminum nitride, or indium nitride. A semiconductor or the like can be used. The thickness of the first semiconductor layer is, for example, 1 μm to 5 μm, the thickness of the light emitting layer is, for example, 25 nm to 150 nm, and the thickness of the second semiconductor layer is, for example, 50 nm to 600 nm.
In addition, the light-emitting element 3 configured as described above can be used as an element that emits light in a wavelength range of, for example, 370 nm to 420 nm.

  The porous frame 4 is made of a porous ceramic material, and is disposed on the upper surface of the substrate 2 and is integrally fired, for example. The porous frame 4 is provided so as to surround the light emitting element 3 on the substrate 2. Note that, when the shape of the inner wall surface of the porous frame 4 is circular in plan view, the light emitted from the light emitting element 3 can be uniformly reflected in all directions and uniformly emitted to the outside. The porous frame 4 may be bonded to the upper surface of the substrate 2.

  The porous frame 4 is made of a porous material formed by sintering a ceramic material such as aluminum oxide, titanium oxide, zirconium oxide or yttrium oxide in a desired shape. The porous frame 4 is provided with a large number of pores b. In addition, the porosity of the porous frame 4 is set to 25% or more and 50% or less, for example. Moreover, the diameter of many pores b provided in the porous frame 4 is set to a size of 0.1 μm or more and 1.5 μm or less, for example.

  The porous frame 4 has a function of diffusing and reflecting the light from the light emitting element 3 or the light reflected by the wavelength conversion member 6 on the surface of the porous frame 4. Thereby, the light emitted from the light emitting element 3 can be made difficult to concentrate on a part of the wavelength conversion member 6. If light concentrates on a part of the wavelength conversion member 6, the temperature rises at the location where the light of the wavelength conversion member 6 is concentrated, thereby reducing the wavelength conversion efficiency of the wavelength conversion member 6 or wavelength conversion. There is a possibility that the transmittance or mechanical strength of the member 6 may deteriorate. Therefore, by providing the porous frame 4 that can diffusely reflect the light emitted from the light emitting element 3 around the light emitting element 3, it is possible to suppress the light from being concentrated on a specific portion of the wavelength conversion member 6. The wavelength conversion efficiency of the wavelength conversion member 6 can be maintained well over a long period of time. Furthermore, the transmittance or mechanical strength of the wavelength conversion member 6 can be maintained well over a long period of time.

  The region surrounded by the inner wall surface of the porous frame 4 is inclined so that the width between the inner wall surfaces becomes wider from the lower part to the upper part in a cross-sectional view. Further, a step 4 a is provided inside the upper end of the porous frame 4. In addition, on the inclined inner wall surface of the porous frame 4, for example, a metal layer (not shown) made of tungsten, molybdenum, copper, silver or the like, and a plated metal layer made of nickel or gold or the like covering the metal layer ( (Not shown) may be formed. The plated metal layer has a function of reflecting light emitted from the light emitting element 3.

  In addition, the inclination angle of the inner wall surface of the porous frame 4 is set to an angle of, for example, 55 degrees to 70 degrees with respect to the upper surface of the substrate 2. Further, the surface roughness of the porous frame 4 is set such that the arithmetic average height Ra is, for example, 1 μm or more and 3 μm or less.

  The step 4a of the porous frame 4 is for supporting the wavelength conversion member 6 on its lateral surface (usually a horizontal surface). The step 4a is formed by notching a part of the upper part of the porous frame 4 inward, and a ring-shaped member 5 described later is provided along the notched vertical surface (usually a vertical surface). . Note that the above-described plated metal layer may be formed up to the surface of the step 4a.

  A region surrounded by the porous frame 4 is filled with a light-transmitting sealing member 8 so as to seal the light emitting element 3 inside. Since the porous frame 4 is provided with a large number of pores b including the surface of the porous frame 4, a part of the sealing member 8 enters inside from the surface of the porous frame 4 and is fixed. Is done. And since a part of sealing member 8 penetrates into the porous frame 4 and is fixed, the sealing member 8 and the porous frame 4 are firmly joined by the anchor effect.

The sealing member 8 has a function of sealing the light emitting element 3 and transmitting light emitted from the light emitting element 3. The sealing member 8 is a region surrounded by the porous frame 4 in a state in which the light emitting element 3 is accommodated inside the porous frame 4 and is filled to a position lower than the height position of the step 4a. The The sealing member 8 absorbs heat caused by light emitted from the light emitting element 3 and transmits the heat to the entire sealing member 8. If heat concentrates on a specific location in the sealing member 8, partial thermal expansion of the sealing member 8 occurs, and the sealing member 8 is likely to peel from the substrate 2. Further, when heat concentration occurs in the sealing member 8, the light emitting element 3 becomes high temperature, the wavelength of the light emitted from the light emitting element 3 is changed, and the light emission color of the light emitting element 3 may be greatly deviated from the desired light color. It tends to occur. The sealing member 8 is made of a translucent insulating resin such as a silicone resin, an acrylic resin, or an epoxy resin. The thermal conductivity of the sealing member 8 is set to, for example, 0.14 W / (m · K) or more and 0.21 W / (m · K) or less.

  The wavelength conversion member 6 emits light when the light emitted from the light emitting element 3 enters the inside and the phosphor contained therein is excited. Here, the wavelength conversion member 6 is made of a resin material such as a silicone resin, an acrylic resin, or an epoxy resin, and a blue phosphor that emits fluorescence of, for example, 430 nm to 490 nm in the resin material, for example, 500 nm to 560 nm. A green phosphor that emits fluorescence, for example, a yellow phosphor that emits fluorescence of 540 to 600 nm, for example, a red phosphor that emits fluorescence of 590 to 700 nm is contained. The phosphor is contained so as to be uniformly dispersed in the wavelength conversion member 6. The thermal conductivity of the wavelength conversion member 6 is set to, for example, 0.1 W / (m · K) or more and 0.3 W / (m · K) or less.

  The wavelength conversion member 6 is supported on the porous frame 4 and is provided to be spaced from the light emitting element 3. The end of the wavelength conversion member 6 is located on the step 4 a of the porous frame 4, and the end side of the wavelength conversion member 6 is surrounded by the porous frame 4.

  The wavelength conversion member 6 is circular in plan view, and the diameter of the wavelength conversion member 6 is set to, for example, 2 mm or more and 20 mm or less. Moreover, the thickness of the wavelength conversion member 6 is set to 0.7 mm or more and 3 mm or less, for example, and is set with constant thickness. Here, the constant thickness includes a thickness error of 0.5 μm or less. By making the thickness of the wavelength conversion member 6 constant, the amount of light excited by the wavelength conversion member 6 can be adjusted to be uniform, and uneven brightness in the wavelength conversion member 6 can be suppressed. it can.

  On the step 4 a of the porous frame 4, a ring-shaped member 5 is provided along the upper part of the inner wall surface of the porous frame 4 (vertical surface of the step 4 a). The annular member 5 is made of, for example, a resin material such as silicone resin, acrylic resin, or epoxy resin, or a ceramic material such as aluminum oxide, titanium oxide, zirconium oxide, or yttrium oxide. Further, the porosity of the annular member 5 is set to be 2% or more and 20% or less, for example, and is set smaller than the porosity of the porous frame 4. By making the porosity of the annular member 5 smaller than the porosity of the porous frame 4, the adhesive 7 that connects the wavelength conversion member 6 and the porous frame 4 is changed from the annular member 5 to the porous frame 4. It can be made difficult to flow toward. Thereby, when connecting the porous frame 4 and the wavelength conversion member 6, it can suppress that the adhesive material 7 tries to flow outside, and the wavelength conversion member 6 with respect to the porous frame 4 can be suppressed. Can be firmly bonded. The ring-shaped member 5 may be a dense material in which no pores are formed. In that case, the heat conductivity of the annular member 5 is improved, so that the heat generated in the wavelength conversion member 6 is efficiently diffused into the porous frame 4 through the annular member 5, and the temperature of the wavelength conversion member 6 is increased. The rise is suppressed. Therefore, the wavelength conversion member 6 is less likely to have a reduced wavelength conversion efficiency, or to deteriorate the transmittance or mechanical strength of the wavelength conversion member 6, and maintain the wavelength conversion efficiency of the wavelength conversion member 6 well over a long period of time. In addition, the transmittance or mechanical strength of the wavelength conversion member 6 can be maintained well over a long period of time.

  The ring-shaped member 5 has a function of reflecting light toward the wavelength conversion member 6. The light that has entered the wavelength conversion member 6 from the light emitting element 3 may reach the end within the wavelength conversion member 6. By reflecting the light traveling from the end of the wavelength conversion member 6 toward the porous frame 4 by the ring-shaped member 5, the reflected light can be returned to the wavelength conversion member 6 again. As a result, the light returned to the wavelength conversion member 6 can be excited by the phosphor, and the light output of the light emitting device 1 can be improved.

  The ring-shaped member 5 may have a diffused surface, and in this case, the light emitted from the outer peripheral surface of the wavelength conversion member 6 can be diffusely reflected by the ring-shaped member 5. As a result, the ring-shaped member 5 can suppress temperature rise and mechanical characteristic deterioration caused by absorbing the light in which the wavelength conversion member 6 and the phosphor are locally concentrated.

  The ring-shaped member 5 has an outer diameter of, for example, 3 mm or more and 21 mm or less when viewed in plan, and an inner diameter of 2.5 to 20 mm when viewed in plan. The outer diameter of the annular member 5 is such that the annular member 5 fits inside the step 4 a of the porous frame 4. Further, the inner diameter of the annular member 5 is large enough to fit the wavelength conversion member 6 inside the annular member 5.

  By fitting the ring-shaped member 5 inside the porous frame 4, the inner wall surface of the porous frame 4 abuts the outer wall surface of the ring-shaped member 5 when the porous frame 4 contracts due to heat. It is possible to suppress the porous frame 4 from being contracted and deformed more than necessary and to generate cracks in the porous frame 4, and when the porous frame 4 is contracted by heat, the porous frame 4 It is possible to prevent the wavelength conversion member 6 from being bent, deformed, or cracked or cracked by the inner wall surface of the contact with the wavelength conversion member 6.

  On the step 4 a of the porous frame 4, the end of the wavelength conversion member 6 is fixed to the ring-shaped member 5 via the adhesive 7. The adhesive material 7 is provided from the upper surface of the wavelength conversion member 6 to the upper surface of the ring-shaped member 5. By attaching the adhesive material 7 from the wavelength conversion member 6 to the ring-shaped member 5, the wavelength conversion member 6 can be fixed to the ring-shaped member 5 with the adhesive material 7. The adhesive 7 is provided from the upper surface of the wavelength conversion member 6 to the upper surface of the ring-shaped member 5, and the inner peripheral surface of the step 4a of the porous frame 4 and the outer peripheral surface of the wavelength conversion member 6 are arranged with a gap. May be. As a result, the expansion caused by the heat of the porous frame 4 and the wavelength conversion member 6 is alleviated by the gap. Accordingly, in the porous frame 4 and the wavelength conversion member 6, the stress acting on each other is relieved in the gap, and the wavelength conversion member 6 is prevented from being bent or deformed, and cracks or cracks are generated. Can be operated well over a wide range.

  For the adhesive 7, for example, a translucent insulating resin such as a silicone resin, an acrylic resin, or an epoxy resin is used. The thermal conductivity of the adhesive 7 is set to, for example, 0.14 W / (m · K) or more and 4 W / (m · K) or less.

  The ring-shaped member 5 has a circular outer edge. If the shape of the outer edge is rectangular, the thermal stress is transmitted by the heat generated by the light emitting element 3, but there is a possibility that the stress concentrates on the corners of the rectangular shape and is destroyed. And if it replaces with the annular member 5 and a rectangular member is destroyed, the wavelength conversion member 6 will peel from a rectangular member, and a product defect will generate | occur | produce. Therefore, by using the annular member 5 having a circular outer edge, the thermal stress applied to the annular member 5 can be dispersed, and the production yield is improved by suppressing the annular member 5 from being broken. be able to.

  A gap SP is provided between the wavelength conversion member 6 and the annular member 5, and a part of the adhesive 7 enters the gap SP. The adhesive 7 that has entered the gap SP is interposed between the side surface of the wavelength conversion member 6 and the inner wall surface of the ring-shaped member 5 to bond them together.

  The adhesive material 7 is continuously formed along the outer periphery of the wavelength conversion member 6 in plan view. Further, the gap SP between the wavelength conversion member 6 and the annular member 5 is provided along the outer periphery of the wavelength conversion member 6. The adhesive 7 is filled in a gap SP provided along the outer periphery of the wavelength conversion member 6 and firmly connects the wavelength conversion member 6 and the ring-shaped member 5. In a cross-sectional view, the area on which the adhesive 7 is attached is increased by attaching from the side surface of the wavelength converting member 6 to the inner wall surface of the annular member 5, and the wavelength converting member 6 and the annular shape are attached via the adhesive 7. The member 5 can be firmly connected. As a result, the connection strength between the wavelength conversion member 6 and the ring-shaped member 5 can be improved, and bending of the wavelength conversion member 6 is suppressed. And it can suppress effectively that the optical distance between the light emitting element 3 and the wavelength conversion member 6 fluctuates.

  The adhesive 7 is provided from the upper surface of the ring-shaped member 5 to the upper part of the porous frame 4. By providing the adhesive 7 from the upper part of the ring-shaped member 5 to the upper part of the porous frame body 4, the contact area between the ring-shaped member 5 and the porous frame body 4 can be increased, and the ring-shaped member 5 and the porous frame body can be increased. The connection strength with 4 can be improved.

  In addition, a part of the adhesive 7 enters the inside from the top of the porous frame 4. That is, since the porous frame 4 is provided with a large number of pores b including the surface of the porous frame 4, a part of the adhesive 7 enters and is fixed in the porous frame 4. . The adhesive 7 and the porous frame 4 are firmly joined to each other by the anchor effect because a part of the adhesive 7 enters and is fixed in the porous frame 4.

  The thermal conductivity of the adhesive 7 may be set larger than the thermal conductivity of the wavelength conversion member 6. By making the thermal conductivity of the adhesive 7 greater than the thermal conductivity of the wavelength conversion member 6, the heat transmitted from the light emitting element 3 to the wavelength conversion member 6 can be easily transmitted to the adhesive 7. The wavelength conversion member 6 generates heat due to conversion loss when the light emitted from the light emitting element 3 is wavelength-converted by the phosphor, and the temperature of the wavelength conversion member 6 is increased by this heat. By making the heat easy to be absorbed by the adhesive 7 from the wavelength conversion member 6, it is possible to suppress the wavelength conversion member 6 from becoming high temperature. Therefore, when the wavelength conversion member 6 becomes high temperature, the color temperature of the light excited by the excitation light emitted from the light emitting element 3 changes, and it becomes difficult to obtain a light color of a desired color temperature. By suppressing the high temperature, the desired light color can be stably extracted.

  Further, the permeation region S of the adhesive 7 is provided apart from the sealing member 8. The light emitting element 3 generates heat during light emission and is transmitted to the sealing member 8. Furthermore, although the heat transmitted to the sealing member 8 is transmitted to the porous frame 4, the heat transmitted to the porous frame 4 is separated from the adhesive 7 and the sealing member 8. The amount of heat transferred from the adhesive 7 to the wavelength conversion member 6 can be reduced. By reducing the amount of heat transmitted to the wavelength conversion member 6, it is possible to suppress the wavelength conversion efficiency of the wavelength conversion member 6 from decreasing or the transmittance or mechanical strength of the wavelength conversion member 6 from being deteriorated. The wavelength conversion efficiency of the wavelength conversion member 6 can be favorably maintained over a long period. Furthermore, the transmittance or mechanical strength of the wavelength conversion member 6 can be maintained well over a long period of time.

  The adhesive 7 and the ring-shaped member 5 may have transparency to the light emitted from the wavelength conversion member 6. As a result, since the radiation area of the light emitting device 1 is increased by the surface of the adhesive 7 and the ring-shaped member 5, the light emitted from the inside of the wavelength conversion member 6 is emitted through the adhesive 7 and the ring-shaped member 5. The light output from the light emitting device 1 is improved.

Further, the light emitted from the light emitting element 3 can reach the wavelength converting member 6 uniformly, and the heat generated in the wavelength converting member 6 due to the light from the light emitting element 3 is dispersed throughout the wavelength converting member 6. It is possible to suppress the specific portion of the wavelength conversion member 6 from becoming high temperature, and to suppress variations in the color temperature of the light extracted to the outside. In particular, the color temperature of the light extracted from the wavelength conversion member 6 to the outside may change due to the temperature of a specific portion of the wavelength conversion member 6 continuing to rise for a long time. On the other hand, according to this embodiment, the color temperature of the light extracted outside can be favorably maintained by suppressing the specific portion of the wavelength conversion member 6 from becoming high temperature.

  According to the present embodiment, the annular member 5 having a porosity smaller than the porosity of the porous frame 4 is provided between the porous frame 4 and the wavelength conversion member 6, and the wavelength conversion member is interposed via the adhesive 7. By connecting 6 and the ring-shaped member 5, the amount of the adhesive 7 that enters the porous frame 4 can be suppressed, and the wavelength conversion member 6 can be firmly bonded to the ring-shaped member 5. As a result, even if the heat generated by the light emitting element 3 is concentrated on the end of the wavelength conversion member 6, the wavelength conversion member 6 is peeled off by firmly joining the wavelength conversion member 6 and the ring-shaped member 5. It is possible to provide the light-emitting device 1 that can be suppressed and can keep the wavelength conversion member 6 firmly fixed.

  In addition, this invention is not limited to the above-mentioned form, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

<Method for manufacturing light emitting device>
Here, a method of manufacturing the light emitting device 1 shown in FIG. 1 will be described. First, the substrate 2 is prepared. If the substrate 2 is made of, for example, an aluminum oxide sintered body, an organic binder, a plasticizer, a solvent, or the like is added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. Get. And a some green sheet is produced from a mixture.

  Moreover, a high melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste. Then, a metallized pattern as a wiring conductor and a metallized pattern for joining the porous frame 4 are printed in a predetermined pattern on the ceramic green sheet as the substrate 2 and fired in a state where a plurality of ceramic green sheets are laminated. Thus, the substrate 2 can be prepared.

  On the other hand, the porous frame 4 is prepared. For the porous frame 4, a ceramic material such as aluminum oxide, titanium oxide, zirconium oxide or yttrium oxide is prepared. The porous frame 4 can be prepared by firing after filling the mold of the porous frame 4 with a ceramic material and drying it. A metallized pattern is also formed on the porous frame 4 on the surface to be bonded to the substrate 2.

  Next, the porous frame 4 is provided on the substrate 2 by bonding both metallized patterns to each other through, for example, solder. Then, the light emitting element 3 is mounted on a region surrounded by the porous frame 4 on the upper surface of the substrate 2.

  And the area | region enclosed with the porous frame 4 on the board | substrate 2 is filled with a silicone resin, for example, and the silicone resin is hardened, the sealing member 8 is formed and the light emitting element 3 is sealed. .

  Next, the wavelength conversion member 6 is prepared. The wavelength conversion member 6 can be produced by mixing a phosphor with an uncured resin and using a sheet forming technique such as a doctor blade method, a die coater method, an extrusion method, a spin coating method, or a dip method. The wavelength conversion member 6 can also be obtained by filling the mold with the uncured wavelength conversion member 6 and curing it.

Moreover, the ring-shaped member 5 is prepared. The ring-shaped member 5 can be produced, for example, by forming an uncured transparent acrylic resin containing bubbles into a desired shape by a conventional molding method.

  And the light-emitting device 1 is producible by adhere | attaching the prepared wavelength conversion member 6 on the level | step difference 4a of the porous frame 4 via the adhesive materials 7, such as a silicone resin.

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Board | substrate 3 Light-emitting element 4 Porous frame 4a Level | step difference 5 Ring-shaped member 6 Wavelength conversion member 7 Adhesive material 8 Sealing member SP Clearance S Penetration area | region b Pore

Claims (4)

A substrate,
A light emitting device provided on the substrate;
A porous frame provided on the substrate and surrounding the light emitting element;
A ring-shaped member provided along the upper portion of the inner wall surface of the porous frame, the porosity of which is smaller than the porosity of the porous frame;
A wavelength conversion member provided inside the ring-shaped member and spaced apart from the light emitting element;
And an adhesive provided from the upper surface of the wavelength conversion member to the upper surface of the ring-shaped member. The light-emitting device according to claim 1,
A gap is provided between the wavelength conversion member and the ring-shaped member, and a part of the adhesive material enters the gap. The light-emitting device according to claim 1 or 2,
The light emitting device according to claim 1, wherein the adhesive material is also provided from an upper surface of the ring-shaped member to an upper portion of the porous frame. The light-emitting device according to claim 3,
The light-emitting device, wherein the adhesive material penetrates into the inside from the upper part of the porous frame.

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