JP5806153B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device including a light emitting element.

  In recent years, development of a light emitting device having a light emitting element made of a light emitting diode has been advanced. The light-emitting device has attracted attention with respect to power consumption or product life. Here, as a light-emitting device, a technique is disclosed in which light emitted from a light-emitting element is converted by a phosphor sheet and extracted outside (see Patent Document 1 below). The phosphor sheet is provided so as to be fitted inside the frame.

JP 2007-317815 A

  By the way, in the light-emitting device using the phosphor sheet, the light emitted from the light-emitting element is blocked by a part of the frame body and hardly reaches the end of the phosphor sheet. Therefore, in the edge part of a fluorescent substance sheet, fluorescent substance is hard to be excited and there exists a possibility that the light output of a light-emitting device cannot fully be improved.

  An object of this invention is to provide the light-emitting device which can improve an optical output.

  A light-emitting device according to an embodiment of the present invention includes a substrate, a light-emitting element that emits excitation light provided on the substrate, and surrounds the light-emitting element that is provided on the substrate and has an outer edge on a lower surface. A light-transmitting frame having an inclined surface that decreases from the top to the top, and a light-transmitting frame that is provided on the frame so as to cover the light-emitting element, and covers the frame so that the frame cannot be seen in plan view. And a sheet-like wavelength conversion member containing a phosphor, which is provided at a distance from the inclined surface of the frame.

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which can improve an optical output can be provided.

It is an outline perspective view showing an outline of a light emitting device concerning one embodiment of the present invention. FIG. 2 is an overview perspective view showing the inside of the light emitting device with a wavelength conversion member removed from the light emitting device shown in FIG. 1. It is sectional drawing in alignment with XX of the light-emitting device shown in FIG. It is sectional drawing which shows the manufacturing process of the light-emitting device which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the light-emitting device which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the light-emitting device which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the light-emitting device which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the light-emitting device which concerns on one Embodiment of this invention. It is the general | schematic perspective view which showed the inner surface of the frame of the light-emitting device which concerns on one modification. It is sectional drawing of the light-emitting device which concerns on one modification. It is a general-view perspective view of the light-emitting device which concerns on one modification.

  Hereinafter, an embodiment of a light emitting device according to the present invention will be described with reference to the accompanying drawings. In addition, this invention is not limited to the following embodiment.

<Schematic configuration of light emitting device>
The light emitting device 1 is used for a lighting fixture, a display, a display, a lamp, or the like. The light-emitting device 1 includes a substrate 2, a light-emitting element 3 that emits excitation light provided on the substrate 2, a frame 4 that is provided on the substrate 2 and surrounds the light-emitting element 3, and emits light on the frame 4. A sheet-like wavelength conversion member 5 provided so as to cover the element 3. The light emitting element 3 is, for example, a light emitting diode, and emits light toward the outside by recombination of electrons and holes in a pn junction using a semiconductor. Here, the excitation light refers to light that excites the phosphor.

  The substrate 2 is an insulating substrate and is made of, for example, a ceramic material such as aluminum oxide, titanium oxide, zirconium oxide or yttrium oxide, a glass ceramic material, or a resin material. Or it consists of a composite material which mixed several materials among these materials. The substrate 2 can be made of a polymer resin in which metal oxide fine particles capable of adjusting the thermal expansion of the substrate 2 are dispersed.

  The substrate 2 is formed with a wiring conductor that electrically connects the inside and outside of the substrate 2. The wiring conductor is made of a conductive material such as tungsten, molybdenum, manganese, or copper. The wiring conductor is obtained by, for example, printing a metal paste obtained by adding an organic solvent to a powder of tungsten or the like in a predetermined pattern on a ceramic green sheet to be the substrate 2, laminating a plurality of ceramic green sheets, and firing the laminate. can get. For example, a plating layer such as nickel or gold is formed on the surface of the wiring conductor to prevent oxidation. Further, on the upper surface of the substrate 2, in order to reflect light efficiently above the substrate 2, a metal reflective layer such as aluminum, silver, gold, copper or platinum is formed with a space between the wiring conductor and the plating layer. To do. Furthermore, a translucent glass layer may be formed on the surface of the metal reflection layer, and a decrease in the reflectance of the metal reflection layer due to oxidation is suppressed.

  The light emitting element 3 is mounted on the substrate 2. The light emitting element 3 has a rectangular shape, and is electrically connected, for example, via a brazing material or solder, onto a plating layer that adheres to the surface of the wiring conductor formed on the substrate 2, or via wire bonding. Connected electrically.

  The light emitting element 3 has a translucent base and an optical semiconductor layer formed on the translucent base. The translucent substrate may be any substrate that can grow an optical semiconductor layer using a chemical vapor deposition method such as a metal organic chemical vapor deposition method or a molecular beam epitaxial growth method. As a material used for the translucent substrate, for example, sapphire, gallium nitride, aluminum nitride, zinc oxide, zinc selenide, silicon carbide, silicon, or zirconium diboride can be used. In addition, the thickness of a translucent base | substrate is 50 micrometers or more and 1000 micrometers or less, for example.

The optical semiconductor layer includes a first semiconductor layer formed on the translucent substrate, a light emitting layer formed on the first semiconductor layer, and a second semiconductor layer formed on the light emitting layer. . The first semiconductor layer, the light emitting layer, and the second semiconductor layer are, for example, a group III nitride semiconductor, a group III-V semiconductor such as gallium phosphide or gallium arsenide, or a group III nitride such as gallium nitride, aluminum nitride, or indium nitride. A semiconductor or the like can be used. The thickness of the first semiconductor layer is
For example, it is 1 μm or more and 5 μm or less, the thickness of the light emitting layer is, for example, 25 nm or more and 150 nm or less, and the thickness of the second semiconductor layer is, for example, 50 nm or more and 600 nm or less. In the light emitting element 3 configured as described above, an element that emits excitation light as near ultraviolet light in a wavelength range of, for example, 370 nm to 420 nm can be used.

  The frame 4 is provided so as to surround the light emitting element 3 on the substrate 2. The frame body 4 protects the light emitting element 3 from the outside, and supports the wavelength conversion member 5. The frame 4 is made of a light transmissive material, for example, a ceramic material such as aluminum oxide, titanium oxide, zirconium oxide or yttrium oxide, a glass ceramic material, or a resin material. Or it consists of a composite material which mixed several materials among these materials. The substrate 2 can be made of a polymer resin in which metal oxide fine particles capable of adjusting the thermal expansion of the substrate 2 are dispersed. In addition, the refractive index of the frame 4 is set to 1.4 or more and 1.8 or less, for example.

  The frame body 4 has a quadrangular shape and has an inclined surface 4 a on each of the outer surfaces of the frame body 4. Moreover, the outer edge of the frame 4 becomes smaller from the lower part toward the upper part. Further, the inclined surface 4 a is formed on the entire circumference of the outer edge of the frame body 4. The outer surface of the frame 4 includes an inclined surface 4 a and a side surface 4 b that is perpendicular to the upper surface of the substrate 2. The inner surface of the frame 4 is formed in a rectangular shape in plan view. The upper surface and the lower surface of the frame body 4 are formed in parallel to the upper surface of the substrate 2.

  The length of one side of the outer edge of the frame 4 is set to, for example, 2 mm or more and 10 mm or less. Moreover, the length of one side of the inner surface of the frame 4 is set to, for example, 1 mm or more and 9 mm or less. The length of the frame 4 from the lower part to the upper part is set to, for example, 0.5 mm to 5 mm, and the length from the lower part to the upper part of the side surface 4b is set to, for example, 0.1 mm to 4 mm. Has been. In addition, the inclination angle of the inclined surface 4 a of the frame body 4 is set to an angle of, for example, 60 degrees or more and 88 degrees or less with respect to the upper surface of the substrate 2.

  The inclined surface 4a of the frame body 4 has a larger arithmetic average roughness than the side surface 4b. The arithmetic average roughness of the inclined surface 4a is set to, for example, 0.3 μm or more and 3 μm or less. Further, the arithmetic average roughness of the side surface 4b is set to, for example, 0.01 μm or more and 0.1 μm or less. By making the arithmetic mean roughness of the inclined surface 4a of the frame body 4 larger than the surface roughness of the side surface 4b of the frame body 4, the surface area of the inclined surface 4a of the frame body 4 becomes larger than the side surface 4b of the frame body 4, The light incident on the body 4 is more easily emitted from the inclined surface 4a of the frame body 4 than the side surface 4b of the frame body 4, and scatters the light that has reached the inclined surface 4a of the frame body 4 from within the frame body 4. It can be made easy. Further, light reaching the side surface 4b of the frame body 4 from the inside of the frame body 4 is reflected in the inner direction of the frame body 4 due to a difference in refractive index between the frame body 4 and the outside, thereby reducing light emitted to the outside. And the light radiated | emitted from the light-emitting device 1 through the wavelength conversion member 5 increases. The light traveling outward from the inclined surface 4 a of the frame body 4 and the light reflected by the side surface 4 b of the frame body 4 are arranged in the end portion 5 a of the wavelength conversion member 5 or above the light emitting element 3. The wavelength conversion member 5 can be easily reached.

  The inclined surface 4a of the frame 4 may be set to have an arithmetic average roughness smaller than that of the side surface 4b. The arithmetic average roughness of the inclined surface 4a is set to, for example, 0.01 μm or more and 0.1 μm or less. The arithmetic average roughness of the side surface 4b is set to, for example, 0.3 μm or more and 3 μm or less. By making the arithmetic average roughness of the inclined surface 4 a of the frame body 4 smaller than the surface roughness of the side surface 4 b of the frame body 4, the light that has reached the inclined surface 4 a of the frame body 4 from the inside of the frame body 4 The light that is refracted in the direction of the wavelength conversion member 5 due to the difference in refractive index between the light source and the outside is reflected in the direction of the inner side of the frame 4 by the inclined surface 4a and reflected in the direction of the wavelength conversion member 5 by the upper surface of the substrate 2. In addition, it is possible to easily reach the wavelength conversion member 5 through the through hole of the frame body 4 or the inclined surface 4a, and the light whose wavelength is converted by the wavelength conversion member 5 increases. In addition, the light that has reached the side surface 4b of the frame body 4 from the light emitting element 3 is easily scattered and emitted, and the light emitted from the side surface 4b is dispersed around the side surface 4b. Light from the light emitting element 3 that reaches a place away from the light source is reduced, and a change in characteristics of the peripheral members of the light emitting device 1 due to light energy from the light emitting element 3 can be suppressed.

Of the light emitted from the light emitting element 3, the light traveling in the parallel direction along the upper surface of the substrate 2 or the light traveling in the direction of the inclined surface 4 a of the frame body 4 travels into the frame body 4 and goes to the outside. It is taken out. Increasing the surface roughness of the inclined surface 4a increases the surface area of the inclined surface 4a, and of the light traveling into the frame 4 scatters and increases the light extracted from the inclined surface 4a of the frame 4 to the outside. Can be made. As a result, a large amount of light emitted from the light emitting element 3 can enter the wide area at the end of the lower surface of the wavelength conversion member 5 through the inclined surface 4a, and is diffused by the inclined surface 4a to be wavelength converted member 5. It is possible to uniformly enter the end portion of the lower surface. Further, the amount of light that is wavelength-converted at the end 5a of the wavelength conversion member 5 can be increased, and the light from the light-emitting element 3 is uniformly incident on the wavelength conversion member 5 to thereby end the wavelength conversion member 5. The portion 5a can be used efficiently, and the light emission efficiency of the light emitting device 1 can be improved.

  The upper surface of the frame body 4 is flat, and the wavelength conversion member 5 is connected via the adhesive material 6. The adhesive 6 is for fixing the wavelength conversion member 5 to the frame body 4. The adhesive 6 is made of a translucent insulating resin such as a fluororesin, a silicone resin, an acrylic resin, or an epoxy resin.

  The adhesive 6 is preferably provided so as not to adhere to the inclined surface 4a. By enlarging the exposed area of the inclined surface 4a, the area where the adhesive 6 is provided can be reduced, and the light transmitted through the inclined surface 4a and incident on the wavelength conversion member 5 increases. . And the light absorbed by the adhesive material 6 is suppressed, and the light emitted from the wavelength conversion member 5 increases, whereby the light output of the light emitting device 1 is improved. The light emitting element 4 generates heat during light emission, but the heat is transmitted to the frame body 4 through the substrate 2 and is radiated from the inclined surface 4a of the frame body 4 to the atmosphere. If the adhesion area of the adhesive 6 is large, heat is easily transferred from the adhesive 6 to the wavelength conversion member 5, and the temperature of the wavelength conversion member 5 rises more than necessary and is excited by the phosphor 7. The light output is likely to change, or the light output of the light-emitting device 1 is reduced due to a decrease in the transmittance of the wavelength conversion member 5 due to heat. Therefore, by reducing the adhesion area of the adhesive material 6, it is possible to easily maintain the light emission color extracted outside via the wavelength conversion member 5 to a desired color, and to maintain the light output of the light emitting device 1. Can be easier.

  The wavelength conversion member 5 has a function of converting the wavelength of light emitted from the light emitting element 3. The wavelength conversion member 5 emits light when the light emitted from the light emitting element 3 enters the inside and the phosphor 7 contained therein is excited. The wavelength conversion member 5 is provided on the frame body 4 so as to cover the light emitting element 3, and the end portion 5 a corresponds to the largest portion of the outer edge of the frame body 4 in plan view, and the inclined surface 4 a of the frame body 4. It is provided with a gap.

  The wavelength conversion member 5 is made of a translucent insulating resin such as a fluororesin, a silicone resin, an acrylic resin, or an epoxy resin. Further, in the insulating resin, for example, a blue phosphor emitting fluorescence of 430 nm to 490 nm, for example, a green phosphor emitting fluorescence of 500 nm to 560 nm, for example, a yellow phosphor emitting fluorescence of 540 nm to 600 nm, for example, 590 nm or more A phosphor 7 such as a red phosphor emitting fluorescence of 700 nm or less is contained.

Moreover, the thermal conductivity of the wavelength conversion member 5 is set to 0.1 W / (m · K) or more and 0.8 W / (m · K) or less, for example. The coefficient of thermal expansion of the wavelength conversion member 5 is set to, for example, 0.8 × 10 ⁻⁵ / K or more and 8 × 10 ⁻⁵ / K or less. The refractive index of the wavelength conversion member 5 is set to, for example, 1.3 or more and 1.6 or less. For example, the refractive index of the wavelength conversion member 5 can be adjusted by adjusting the composition ratio of the material of the wavelength conversion member 5. Here, the refractive index of the wavelength conversion member 5 refers to the refractive index of the insulating resin material excluding the phosphor 7.

  The wavelength conversion member 5 is a sheet-like member, and is supported on the frame 4 via an adhesive 6 and is provided with a space from the light emitting element 3. The wavelength conversion member 5 has a rectangular shape, and the length of one side is set to, for example, 2 mm or more and 10 mm or less. The end 5a of the wavelength conversion member 5 is formed so as to overlap with the largest portion of the outer edge of the frame 4 in plan view. The thickness of the wavelength conversion member 5 is set to, for example, 0.3 mm or more and 3 mm or less, and the thickness is set to be constant. Here, the constant thickness includes a thickness error of 0.5 μm or less. By making the thickness of the wavelength conversion member 5 constant, the amount of light excited in the wavelength conversion member 5 can be adjusted to be uniform. Unevenness can be suppressed.

  The wavelength conversion member 5 is formed so that the end portion 5a coincides with the side surface 4b of the frame body 4 in plan view and covers the inclined surface 4a of the frame body 4. And the inclined surface 4a of the frame 4 and the lower surface of the wavelength conversion member 5 are arrange | positioned at intervals. Light traveling outward from the inclined surface 4 a of the frame body 4 enters the end portion 5 a of the wavelength conversion member 5, and the phosphor 7 is excited at the end portion 5 a of the wavelength conversion member 5. When the end 5a of the wavelength conversion member 5 is formed so as to coincide with the side surface 4b of the frame 4 in plan view, the light emitting device 1 is mounted on the substrate 2 regardless of the size of the wavelength conversion member 5. Depending on the size, they can be arranged on an external circuit board. In addition, the light emitting device 1 can be mounted on the external circuit board with high density, and the lighting device using the light emitting device 1 as a light source can be miniaturized and incident on the end 5a from the inclined surface 4a. Light from the light emitting element 3 can be improved.

  The light emitting device 1 according to the present embodiment can allow the light emitted from the light emitting element 3 to pass outside by configuring the frame 4 from a light transmissive material. If the frame 4 is made of a light-absorbing and light-reflecting material, the light emitted from the light-emitting element 3 enters the central portion of the wavelength conversion member 5 on the region surrounded by the inner surface of the frame 4. On the other hand, it is difficult to reach the end 5 a of the wavelength conversion member 5. As a result, the phosphor 7 is difficult to be excited at the end 5a of the wavelength conversion member 5, and the phosphor 7 in the end 5a of the wavelength conversion member 5 cannot be fully utilized. Therefore, by using the frame body 4 as a light-transmitting material, the light emitted from the light emitting element 3 can be used for the frame body in addition to the central portion of the wavelength conversion member 5 positioned on the region surrounded by the inner surface of the frame body 4. 4 can easily reach the end 5a of the wavelength conversion member 5 located on the top.

  Moreover, the light-emitting device 1 which concerns on this embodiment forms the inclined surface 4a in the outer surface of the frame 4, The light which reached | attained the inclined surface 4a among the lights which progress to an outer surface from the inner surface of the frame 4 is as follows. It is possible to make the traveling direction by light refraction easier to travel toward the lower surface of the wavelength conversion member 5. And the fluorescent substance 7 in the edge part 5a of the wavelength conversion member 5 can be excited efficiently, and it suppresses that a brightness nonuniformity generate | occur | produces between the center part and the edge part 5a of the wavelength conversion member 5. it can.

  Further, in the light emitting device 1 according to the present embodiment, the inclined surface 4 a is formed on the entire circumference of the outer edge of the frame body 4, so that the light emitted from the light emitting element 3 strikes anywhere on the entire inner surface of the frame body 4. In addition, the direction of light can be adjusted so as to reach the end 5a of the wavelength conversion member 5 at the inclined surface 4a formed on the outer edge of the frame body 4.

<Method for manufacturing light emitting device>
Here, a method of manufacturing the light emitting device 1 shown in FIG. 1 will be described. First, the substrate 2 is prepared. If the substrate 2 is made of, for example, an aluminum oxide sintered body, an organic binder, a plasticizer, a solvent, or the like is added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to obtain a mixture. obtain. And a some green sheet is produced from a mixture.

Moreover, a high melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste. Then, by printing a metallized pattern to be a wiring conductor on the ceramic green sheet to be the substrate 2 and a metallized pattern for joining the frame body 4 as needed, respectively, by laminating a plurality of ceramic green sheets, A plurality of substrates 2 for taking a large number can be prepared.

  Similarly to the substrate 2, the frame body 4 is formed with a plurality of ceramic green sheets and a through hole is previously formed by punching or the like in order to mount the light emitting element 3. Furthermore, in order to take a large number, a cut is made at a place where a plurality of frame bodies 4 are continuous. At this time, after firing, the surface is roughened by blasting or the like so as to increase the arithmetic average roughness. Then, as shown in FIG. 4, a plurality of frames 4 for multi-pieces are provided on a plurality of substrates 2 for multi-pieces. Furthermore, the plurality of substrates 2 and the plurality of frames 4 can be prepared at a time by simultaneously firing the plurality of substrates 2 for multi-cavity and the plurality of frames 4 for multi-acquisition. In addition, the cut | interruption formed in the location where several frame bodies 4 continue is equivalent to the inclined surface 4a of the frame body 4. FIG.

  As shown in FIG. 5, the light emitting element 3 is mounted, for example, via a brazing material at a position where the through hole of the frame body 4 is formed. Alternatively, the multi-piece substrate 2 and the multi-piece frame 4 may be fired separately, and both may be bonded via a bonding member such as a silicone resin.

  Next, the wavelength conversion member 5 is prepared. The wavelength conversion member 5 is a sheet in which a plurality of wavelength conversion members 5 are continuously formed by mixing the phosphor 7 with an uncured resin and forming the mixture using a sheet forming technique such as a spin coating method or a dip method. Can be prepared. And as shown in FIG. 6, the prepared wavelength conversion member 5 is adhere | attached on the frame 4 through the silicone resin as the adhesive material 6, for example.

  Next, a resin blade B1 capable of cutting the wavelength conversion member 5 is prepared. Then, as shown in FIG. 7, a plurality of continuous wavelength conversion members 5 are cut using a resin blade B1. At this time, the resin blade B <b> 1 moves along the cut line of the frame body 4 so as not to contact the frame body 4 and separates the wavelength conversion member 5 into pieces. The resin blade B1 is a blade specialized for cutting resin, and the blade of the blade is damaged when it comes into contact with the frame 4 made of ceramics.

  Further, an inorganic material blade B2 capable of cutting the substrate 2 and the frame body 4 is prepared. Then, as shown in FIG. 8, a plurality of continuous substrates 2 and a plurality of continuous frames 4 are cut using an inorganic material blade B2. At this time, the frame 4 is cut so that the thickness of the frame 4 cut by the inorganic material blade B2 is reduced, so that the substrate 2 and the frame 4 are cut more smoothly and efficiently. can do. In this way, a large number of the plurality of light emitting devices 1 can be obtained. Alternatively, the substrate 2 is formed with a cut at the lower surface along the cut line of the frame body 4 by the inorganic material blade B2, and an external force is applied so as to be divided along the cut line of the substrate 2 and the frame body 4, A large number of light emitting devices 1 divided into a plurality of parts can be obtained.

  In addition, this invention is not limited to the above-mentioned form, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. Here, the modified example which concerns on embodiment mentioned above is demonstrated. Note that, in the light emitting device according to the modification of the present embodiment, the same parts as those of the light emitting device according to the present embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  FIG. 9 is a schematic perspective view showing the inside of a light emitting device according to a modification, and shows the inner surface of the frame body 4. In the embodiment described above, the inner surface of the frame body 4 is formed in a rectangular shape in plan view, but the inner surface of the frame body 4 may be formed in a circular shape in plan view. By making the inner surface of the frame body 4 circular, when the optical design is performed with the light emitting element 3 as the center, the distance from the light emitting element 3 to the inner surface of the frame body 4 can be adjusted to be constant. As a result, the light from the light emitting element 3 can be reduced from being repeatedly reflected at the corners of the inner surface of the frame 4, and the amount of light extracted from the light emitting element 3 to the outside can be increased. Since the light from the light emitting element 3 can be incident on the wavelength conversion member 5 from the inner surface of the frame body 4 without unevenness, the light emission efficiency of the wavelength conversion member 5 can be effectively utilized without lowering.

  Further, as shown in FIG. 10, the substrate 2 and the frame body 4 may be provided separately, and both may be connected via the joining member 8. In such a case, compared to using the uncured substrate 2 and the frame body 4, the cured substrate 2 and the frame body 4 can be used together, and it is easy to handle and can reduce manufacturing restrictions during production. Manufacturing technology suitable for mass production can be provided.

  In addition, as shown in FIG. 11, the substrate 2, the frame body 4, and the wavelength conversion member 5 may have a circular outer shape. By making the outer shape of each member circular, the optical path length from the light emitting element 3 to the wavelength conversion member 5 is axially symmetric with respect to the optical axis of the light emitting element 3, so that the light emitted from the light emitting device 1 is Thus, it is possible to form a light distribution that is symmetrical about the rotational axis about the optical axis of the light emitting element 3. That is, it is possible to suppress unevenness in light intensity caused by the formation of a portion having a high light intensity and a weak portion in the rotation direction of the optical axis.

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Board | substrate 3 Light-emitting element 4 Frame 4a Inclined surface 5 Wavelength conversion member 6 Adhesive material 7 Phosphor

Claims (4)

A substrate,
A light-emitting element that emits excitation light provided on the substrate;
A light-transmitting frame provided on the substrate, surrounding the light-emitting element, and having an inclined surface whose outer edge decreases from the lower part toward the upper part on the outer surface;
A phosphor provided on the frame so as to cover the light emitting element, and covering the frame so that the frame cannot be seen in a plan view, and being provided with a gap from the inclined surface of the frame; And a sheet-like wavelength conversion member. The light-emitting device according to claim 1,
The frame body has a quadrangular shape, and the inclined surface is provided on each of the outer surfaces of the frame body. The light-emitting device according to claim 1 or 2,
The outer surface of the frame body includes a side surface perpendicular to the upper surface of the substrate and the inclined surface,
The inclined surface has a surface roughness larger than that of the side surface. The light-emitting device according to any one of claims 1 to 3,
The light emitting device according to claim 1, wherein an inner surface of the frame is circular in plan view.

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