JP2012226986A - Light source device and lighting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source device capable of sufficiently attaining high luminance in comparison with a conventional light source device.SOLUTION: In the light source device including a solid light source 5 for emitting light of a designated wavelength among a wavelength range from ultraviolet light to visible light, and a phosphor layer 2 containing at least one kind or more of phosphors which is excited with excited light from the solid light source 5 and emits fluorescence of a wavelength longer than the wavelength emitted from the solid light source 5 and not substantially containing a resin component, the solid light source 5 and the phosphor layer 2 are spatially arranged at a separated location, and the fluorescence is extracted from a face among faces of the phosphor layer 2, wherein the excited light from the solid light source 5 is incident, by using a reflection method. A base board 6 having light reflectivity and thermal conductivity is arranged on a face opposite to a side where the excited light is incident, among the faces of the phosphor layer 2, and the phosphor layer 2 is connected to the base board 6 at a connection section 7 made of a material having light reflectivity, thermal conductivity, and fluidity.

Description

  The present invention relates to a light source device and an illumination device.

  A light source device combining an optical semiconductor such as an LED and a phosphor layer has been widely used. However, in recent years, the brightness has been increased, and its application range such as general lighting and automobile headlamps has been expanded. It is considered that such light source devices will continue to be widely used in various applications by increasing the luminance.

  As a means for increasing the brightness of a light source device combining such an optical semiconductor and a phosphor layer, it is conceivable to increase the excitation light intensity from the optical semiconductor by supplying a large current to the optical semiconductor. Heat is generated in the phosphor layer, and in the phosphor layer, the fluorescence intensity decreases due to discoloration of the resin component or temperature quenching of the phosphor. Therefore, as a result, the emission intensity is saturated and decreased, and it is difficult to increase the luminance of the light source device that combines the optical semiconductor and the phosphor layer.

  Here, the discoloration of the resin component in the phosphor layer means that the phosphor layer is usually formed into a fixed shape with good reproducibility. This is a phenomenon in which the resin component is discolored when the resin component is heated to about 200 ° C. or higher. Since the resin component is inherently transparent, if the resin component is discolored by heat, it absorbs a part of the excitation light from the optical semiconductor and the fluorescence from the phosphor layer, which prevents high brightness. It was.

  The temperature quenching of the phosphor is a phenomenon in which the fluorescence intensity decreases when the phosphor is heated. If the fluorescence intensity decreases due to temperature quenching, the energy that has not been converted to fluorescence becomes heat, so the amount of heat generated by the phosphor increases, the temperature of the phosphor rises, temperature quenching proceeds, and the fluorescence intensity further decreases. This happens. For this reason, temperature quenching of the phosphors generated by heat has also been a factor that hinders high brightness.

  In order to solve these problems, Patent Document 1 proposes a light source using a phosphor layer that does not contain a resin in the phosphor layer. In this case, since the phosphor layer does not contain a resin component, discoloration does not occur, and since the phosphor layer is made of a ceramic layer of phosphor with low temperature sensitivity, temperature quenching does not occur, so high brightness can be achieved. is there. Further, as shown in FIG. 1, the phosphor layer 92 is directly bonded to the optical semiconductor (solid light source) 95 to dissipate heat generated in the phosphor layer 92 to the optical semiconductor (solid light source) 95 side. It was.

JP 2006-005367 A

  Incidentally, in the conventional light source device in which the optical semiconductor (solid light source) 95 and the phosphor layer 92 are directly bonded as shown in FIG. 1, the phosphor layer excited by the excitation light from the optical semiconductor (solid light source) 95. The light emitted from the light 92 (fluorescence) is emitted to the side opposite to the optical semiconductor (solid light source) 95 side, and the light semiconductor (solid light source) 95 that is not absorbed by the phosphor layer 92 and passes through the phosphor layer 92. The excitation light from is used. That is, the light source device of FIG. 1 is of a transmissive type that uses light transmitted through the phosphor layer 92.

  Here, when light emitted from the phosphor layer 92 is considered, there is also light reflected from the interface with the phosphor layer 92 together with the transmitted light and returning to the optical semiconductor (solid light source) 95 side, that is, reflected light. This light (reflected light) is re-absorbed by the optical semiconductor (solid light source) 95, so that there is a problem that the light cannot be used as illumination light.

  1 is intended to dissipate the heat of the phosphor layer 92 to the optical semiconductor (solid light source) 95 side, but the excitation light intensity of the optical semiconductor (solid light source) 95 is increased. Since heat is generated not only in the phosphor layer 92 but also in the optical semiconductor (solid light source) 95, the heat generated in the phosphor layer 92 is dissipated from the side of the optical semiconductor (solid light source) 95 that is also generating heat. There was a problem that the efficiency of was not good.

  As described above, the light source device shown in FIG. 1 has a limitation on high luminance because it is of a transmissive type and the efficiency of heat dissipation with respect to the heat generation of the phosphor layer 92 is not good.

  An object of the present invention is to provide a light source device and an illuminating device capable of achieving a sufficiently high luminance as compared with the conventional art.

  In order to achieve the above object, the invention described in claim 1 is excited by a solid light source that emits light of a predetermined wavelength in a wavelength region from ultraviolet light to visible light, and excitation light from the solid light source. A phosphor layer that contains at least one type of phosphor that emits fluorescence having a wavelength longer than the emission wavelength of the solid light source and substantially does not contain a resin component, and the solid light source and the phosphor layer are in a space. Is a light source device that takes out at least fluorescence in a reflective manner from the surface of the phosphor layer on the side on which excitation light from the solid light source is incident, the surface of the phosphor layer, Among them, a substrate having light reflectivity and heat conductivity is provided on a surface opposite to the side on which excitation light is incident, and the phosphor layer is made of a material having light reflectivity, heat conductivity, and fluidity on the substrate. It is characterized by being joined.

  According to a second aspect of the present invention, in the light source device according to the first aspect, the phosphor layer is phosphor ceramic.

  According to a third aspect of the present invention, there is provided a solid light source that emits light having a predetermined wavelength in a wavelength region from ultraviolet light to visible light, and an emission wavelength of the solid light source that is excited by excitation light from the solid light source. A phosphor layer containing at least one kind of phosphor that emits fluorescence having a longer wavelength than the solid-state light source and the phosphor layer are spatially separated from each other, and the surface of the phosphor layer A light source device that takes out at least fluorescence by a reflection method from a surface on which excitation light from the solid light source is incident, on a surface of the phosphor layer opposite to the side on which excitation light is incident. A light reflection film is formed, and the phosphor layer and the light reflection film are bonded to the substrate by a bonding portion.

  According to a fourth aspect of the present invention, in the light source device according to the third aspect, the joint is formed of a material having thermal conductivity and fluidity, and the substrate is made of a material having thermal conductivity. It is characterized by being formed.

  In addition, the invention according to claim 5 is the light source device according to any one of claims 1 to 4, further comprising a fixing means for fixing the phosphor layer to the substrate. It is characterized by.

  The invention according to claim 6 is the light source device according to any one of claims 1 to 5, wherein the light source device includes a fluorescent rotating body having the phosphor layer and the substrate. It is characterized by being.

  The invention according to claim 7 is an illumination device characterized by using the light source device according to any one of claims 1 to 6.

  According to the first to seventh aspects of the invention, the solid light source that emits light having a predetermined wavelength in the wavelength region from ultraviolet light to visible light, and the solid that is excited by the excitation light from the solid light source. A phosphor layer containing at least one phosphor that emits fluorescence having a wavelength longer than the emission wavelength of the light source, wherein the solid-state light source and the phosphor layer are spatially separated from each other, and the fluorescence Since at least fluorescence is extracted from the surface of the body layer on the side where the excitation light from the solid-state light source is incident, the brightness can be sufficiently increased as compared with the conventional case.

  In particular, according to the first and second aspects of the present invention, the phosphor layer is a phosphor layer that does not substantially contain a resin component, and the side on which excitation light is incident on the surface of the phosphor layer. Since the opposite surface is provided with a substrate having light reflectivity and heat conductivity, and the phosphor layer is bonded to the substrate with a material having light reflectivity, heat conductivity and fluidity, The efficiency of heat dissipation (heat dissipation) can be further increased, and higher brightness can be achieved. In addition, a phosphor layer that does not substantially contain a resin component (for example, phosphor ceramics) is bonded to the substrate with a fluid material, so that a phosphor layer that substantially does not contain a resin component (for example, The phosphor ceramic) can be effectively prevented from cracking due to the difference in the thermal expansion coefficient between the substrate and the bonded portion with the substrate.

  Further, according to the third and fourth aspects of the present invention, the light reflecting layer is formed on the surface of the phosphor layer opposite to the side on which the excitation light is incident. High brightness can be achieved.

  According to a fifth aspect of the present invention, in the light source device according to any one of the first to fourth aspects, a fixing means for fixing the phosphor layer to the substrate is further provided. Therefore, even if the bonding portion between the phosphor layer and the substrate is formed of a material having fluidity, the phosphor layer can be fixed to the substrate.

  According to a sixth aspect of the present invention, in the light source device according to any one of the first to fifth aspects, the light source device includes a fluorescent rotator including the phosphor layer and the substrate. Since it is provided, by rotating the phosphor layer with respect to the solid light source, it is possible to disperse the place where the excitation light from the solid light source hits, and to suppress the heat generation in the light irradiating part, and thereby High brightness can be achieved.

It is a figure which shows the conventional light source device. It is a figure which shows the 1st structural example of the light source device of this invention. FIG. 3 is a diagram illustrating an example of a fixing unit that fixes a phosphor layer to a substrate in the light source device of FIG. 2. FIG. 6 is a diagram illustrating another example of a fixing unit that fixes a phosphor layer to a substrate in the light source device of FIG. 2. FIG. 6 is a diagram illustrating another example of a fixing unit that fixes a phosphor layer to a substrate in the light source device of FIG. 2. It is a figure which shows the structural example about the fluorescent substance layer of a reflection type fluorescent rotating body. It is a figure which shows the 2nd structural example of the light source device of this invention. FIG. 8 is a diagram illustrating an example of a fixing unit that fixes a phosphor layer to a substrate in the light source device of FIG. 7. FIG. 8 is a diagram illustrating another example of a fixing unit that fixes a phosphor layer to a substrate in the light source device of FIG. 7. FIG. 8 is a diagram illustrating another example of a fixing unit that fixes a phosphor layer to a substrate in the light source device of FIG. 7. It is a figure which shows the structural example about the fluorescent substance layer of a reflection type fluorescent rotating body. It is a figure which shows the protective film with respect to a light reflection film. It is a figure which shows the buffer material of the thermal stress provided between a fluorescent substance layer and a light reflection film.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  2A and 2B are diagrams showing a first configuration example of the light source device of the present invention. 2A is a front view of the whole, and FIG. 2B is a plan view of a portion where a phosphor layer is provided. Referring to FIGS. 2A and 2B, the light source device 10 includes a solid-state light source 5 that emits light having a predetermined wavelength in a wavelength region from ultraviolet light to visible light, A phosphor layer 2 including at least one kind of phosphor that is excited by excitation light and emits fluorescence having a wavelength longer than that of the solid light source 5, and the solid light source 5 and the phosphor layer 2 are spatially separated. Are located apart.

  Here, the phosphor layer 2 is substantially free of a resin component.

  Further, a substrate (heat radiating substrate) 6 having light reflectivity and thermal conductivity is provided on the surface of the phosphor layer 2 opposite to the surface on which the excitation light is incident. The heat radiating substrate 6 is joined by the joint 7. Here, as described later, a material having light reflectivity, heat conductivity, and fluidity (for example, heat conductive grease) may be used for the joint portion 7.

  Further, in the light source device 10, light such as fluorescent light (excitation is used using reflection by a reflection surface provided on the opposite side of the surface of the phosphor layer 2 from the surface on which excitation light from the solid light source 5 is incident. A method of taking out light (fluorescence) (hereinafter referred to as a reflection method) is employed.

  As described above, the light source device 10 is basically characterized in that the solid light source 5 and the phosphor layer 2 are spatially separated and light emission is used in a reflective manner.

  That is, as in the conventional light source device shown in FIG. 1, when the phosphor layer 92 is in contact with the solid light source 95, both the phosphor layer 92 and the solid light source 95 are used even if the luminance is increased. However, in the light source device 10 shown in FIGS. 2A and 2B, the phosphor layer 2 is arranged away from the solid light source 5 because the heat dissipation efficiency from the phosphor layer 92 is poor. As a result, even when the luminance is increased, the heat from the phosphor layer 2 can be dissipated to the low-temperature heat dissipation substrate 6 via the joint portion 7, and the efficiency of heat dissipation from the phosphor layer 2 can be reduced. Compared to the conventional light source device shown in FIG.

  Further, in the conventional light source device shown in FIG. 1, among the excitation light from the solid light source 95 and the fluorescence from the phosphor layer 92, the fluorescence emitted to the side opposite to the solid light source 95 and the phosphor layer 92 Excitation light from a solid light source 95 that is transmitted without being absorbed is used. In other words, the transmission method is used. Here, in the transmission method, when the emitted light from the phosphor layer 92 is considered, the excitation light is reflected at the interface with the phosphor layer 92 together with the transmitted light and returns to the solid light source 95 side, that is, reflected. There is also light, and this reflected light is reabsorbed by the solid light source 95 and becomes light that cannot be used as illumination light. Further, since the fluorescence from the phosphor layer 92 is emitted from both sides of the phosphor layer 92, the light emitted to the solid light source 95 side cannot be used. Thus, in the transmission method, the light use efficiency is reduced. In addition, in the transmission method, in order to obtain illumination light with a desired chromaticity, it is necessary to increase the thickness of the phosphor layer 92, and the distance from the phosphor layer 92 to the solid light source 95 becomes long. It was disadvantageous in dissipating the heat from 92 to the solid light source 95.

  On the other hand, in the light source device 10 shown in FIGS. 2A and 2B, light (excitation light, fluorescence) emitted to the side opposite to the solid light source 5 is solid on the reflection surface (for example, the reflection surface of the substrate 6). Since the reflection method that reflects to the light source 5 side is adopted, all of the light emission (fluorescence) from the phosphor layer 2 excited by the excitation light from the solid light source 5 (that is, fluorescence emitted to the solid light source 5 side). And all of the excitation light from the solid light source 5 that is not absorbed by the phosphor layer 2 (that is, the reflected light of the light from the solid light source 5 that is not absorbed by the phosphor layer 2) can be used as illumination light. (That is, since both excitation light and fluorescence can be efficiently used as illumination light), the light use efficiency can be remarkably increased, and high brightness can be achieved. In contrast to the transmission type, in the reflection type, even if the thickness of the phosphor layer 2 is less than half, the optical path lengths in the phosphor layer 2 are equal, and light of the same chromaticity can be obtained. In addition, the distance from the phosphor layer 2 to the substrate 6 is shortened, which is advantageous in terms of heat dissipation.

  As described above, in the light source device 10 of FIGS. 2A and 2B, the solid light source 5 and the phosphor layer 2 are basically spatially separated and light emission is used in a reflective manner. Therefore, it is possible to achieve a sufficiently high brightness as compared with the conventional case.

  Further, in the light source device 10 shown in FIGS. 2A and 2B, since the phosphor layer 2 that does not substantially contain a resin component is used, there is no discoloration due to heat and light absorption is small. For this reason, it is possible to further increase the luminance.

  Here, the phosphor layer 2 substantially not containing a resin component means that the resin component normally used for forming the phosphor layer is 5 wt% or less of the phosphor layer. As a material for realizing such a phosphor layer, a phosphor powder dispersed in glass, a glass phosphor in which a luminescent center ion is added to a glass matrix, a phosphor single crystal, or a phosphor polycrystal (hereinafter referred to as a phosphor) And phosphor ceramics). The phosphor ceramic is a lump of phosphor that is formed by firing a material into an arbitrary shape before firing in the phosphor manufacturing process. Phosphor ceramics may use an organic substance as a binder in the molding process during the manufacturing process. However, an organic resin component is included in the fired phosphor ceramic because a degreasing process is provided after molding to burn off the organic components. Remains only 5 wt% or less. Therefore, since the phosphor layer mentioned here does not substantially contain a resin component and is composed only of an inorganic substance, discoloration due to heat does not occur. In addition, glass or ceramics made of only an inorganic substance generally has a higher thermal conductivity than a resin, and is therefore advantageous in heat dissipation from the phosphor layer 2 to the substrate 6. In particular, phosphor ceramics generally have higher thermal conductivity than glass and are less expensive to manufacture than single crystals. Therefore, it is preferable to use them for the phosphor layer 2.

  The phosphor layer 2 includes at least one kind of phosphor that is excited by excitation light from the solid light source 5 and emits fluorescence having a longer wavelength than the emission wavelength of the solid light source 5. Specifically, when the solid-state light source 5 emits ultraviolet light, the phosphor layer 2 includes at least one kind of phosphor among phosphors such as blue, green, and red. When the solid light source 5 emits ultraviolet light, the phosphor layer 2 contains, for example, blue, green, and red phosphors (the blue, green, and red phosphors are, for example, uniformly When the phosphor layer 2 is irradiated with ultraviolet light from the solid light source 5, white illumination light can be obtained as reflected light. Moreover, when the solid light source 5 emits blue light as visible light, the phosphor layer 2 includes at least one kind of phosphor among phosphors such as green, red, and yellow. When the solid-state light source 5 emits blue light as visible light, when the phosphor layer 2 contains, for example, green and red phosphors (the green and red phosphors are dispersed uniformly, for example) When the phosphor layer 2 is irradiated with blue light from the solid light source 5, illumination light such as white can be obtained as reflected light. Further, when the solid light source 5 emits blue light as visible light, for example, when the phosphor layer 2 contains only a yellow phosphor, the blue light from the solid light source 5 is emitted from the phosphor layer 2. When illuminating, illumination light such as white can be obtained as reflected light.

  Further, in the light source device 10 of FIGS. 2A and 2B, the heat dissipation substrate 6 includes light (light emission (fluorescence) from the phosphor layer 2 excited by excitation light from the solid light source 5 and phosphor layer). The role of the reflecting surface for the light from the solid light source 5 that has not been absorbed in 2), the role of dissipating the heat dissipated from the phosphor layer 2 to the outside, and the role of the support substrate of the phosphor layer 2 is there. For this reason, high light reflection characteristics, heat transfer characteristics, and workability are required. The heat dissipation substrate 6 can be a metal substrate, oxide ceramics such as alumina, non-oxide ceramics such as aluminum nitride, etc., but a metal substrate having particularly high light reflection characteristics, heat transfer characteristics, and workability is used. It is desirable to be done.

  Further, the junction 7 between the phosphor layer 2 and the heat dissipation substrate 6 is also not absorbed by light (luminescence (fluorescence) from the phosphor layer 2 excited by the excitation light from the solid light source 5) and the phosphor layer 2. The metal (metal brazing) that has both high light reflection characteristics and heat transfer characteristics is responsible for the role of the reflecting surface for the light from the solid light source 5) and the role of dissipating heat from the phosphor layer. Desirably, the bonding portion 7 may be made of an organic adhesive, an inorganic adhesive, low-melting glass, metal (metal brazing), or the like. However, when a phosphor layer 2 that does not substantially contain a resin component (for example, phosphor ceramics) is used, the bonding portion 7 is made of an organic adhesive, an inorganic adhesive, low-melting glass, metal (metal brazing). For example, when the phosphor layer 2, the bonding portion 7, and the heat dissipation substrate 6 are difficult to match, the excitation light is incident on the phosphor layer 2 and the phosphor layer 2 is formed. When heated, there arises a problem that the phosphor layer 2 breaks due to the thermal stress generated by the heating. When the phosphor layer 2 is cracked, the light emission intensity changes, which is a serious problem when used as a light source device. In order to solve this problem, in the light source device 10 of FIGS. 2A and 2B, a material having light reflectivity, thermal conductivity, and fluidity is used for the joint portion 7.

  Here, as a material having light reflectivity, heat conductivity, and fluidity, heat conductive grease or the like is used. Thermally conductive grease is a mixture of hydrocarbon-based oil or silicone oil mixed with a metal filler having light reflectivity and heat conductivity to improve light reflectivity and heat conductivity. It is a substance that does not cure. Accordingly, although the adhesiveness is inferior to that of the resin, it has fluidity and therefore has the effect of absorbing the thermal expansion of the phosphor layer 2 and consequently preventing the phosphor layer 2 from cracking.

  As described above, the light source device 10 shown in FIGS. 2A and 2B includes a solid-state light source 5 that emits light having a predetermined wavelength in a wavelength region from ultraviolet light to visible light, and the solid-state light source 5. A phosphor layer 2 that contains at least one type of phosphor that is excited by excitation light and emits fluorescence having a longer wavelength than the emission wavelength of the solid light source 5, and substantially does not contain a resin component, And the phosphor layer 2 are spatially separated from each other, and at least the fluorescence is extracted by a reflection method from the surface of the phosphor layer 2 on the side where the excitation light from the solid light source 5 is incident. The surface of the phosphor layer 2 includes a substrate (heat radiating substrate) 6 having light reflectivity and thermal conductivity on the surface opposite to the side on which the excitation light is incident, and the phosphor layer 2 includes: A material having light reflectivity, thermal conductivity, and fluidity (eg, thermal conductive grease) Is characterized in that in Ranaru junction 7 is joined to the substrate 6.

  Thereby, it can prevent effectively that the fluorescent substance layer (for example, fluorescent ceramics) 2 which does not contain a resin component substantially breaks by the difference in thermal expansion coefficient with the board | substrate 6 and the junction part 7 with the board | substrate 6.

  In the light source device 10 of FIGS. 2A and 2B, since the material having fluidity is used for the joint portion 7, the phosphor layer (for example, phosphor ceramic) 2 remains on the substrate 6 as it is. Will move. That is, the phosphor layer (for example, phosphor ceramic) 2 needs to be firmly fixed to the substrate 6. In other words, a fixing means for fixing the phosphor layer 2 to the substrate 6 needs to be further provided.

  FIGS. 3A and 3B show an example of a fixing means 9 for fixing the phosphor layer 2 to the substrate 6 in the light source device 10 of FIGS. 2A and 2B. 3A is a front view, and FIG. 3B is a plan view. Referring to FIGS. 3A and 3B, the fixing means 9 includes a fixing member 11 that covers the phosphor layer 2 from above, and the phosphor layer 2 by screwing the fixing member 11 to the substrate 6. And a screw 12 for fixing to the substrate 6. In the example of FIGS. 3A and 3B, the fixing member 11 is provided with a recess in a portion covering the phosphor layer 2. 4 and 5 are diagrams showing another example of the fixing means 9. In the example of FIG. 4, a flat plate is used for the fixing member 11. However, as compared with the case of using a flat plate for the fixing member 11 as in the example of FIG. 4, the fixing member 11 has a concave portion covering the phosphor layer 2 as in the example of FIGS. 3A and 3B. When using what is provided, the light emission component from the end face of the phosphor layer 2 can be reflected, which leads to higher brightness and is desirable. Further, if the phosphor layer 2 is fixed on the convex substrate 6 by the fixing member 11 as in the example of FIG. 5, the heat conducted to the fixing member 11 is efficiently dissipated to the substrate 6. Therefore, higher reliability and higher luminance of the light emitting device can be realized. The fixing member 11 is preferably made of metal from the viewpoint of thermal conductivity, but is preferably made of rubber from the viewpoint of relaxation of stress generated in the phosphor layer and ease of mounting of the fixing member. In particular, when the fixing member 11 is made of rubber, it is desirable because the phenomenon of bleed out in which oil comes out from the grease that is the joint 7 can be prevented from affecting the apparatus. More specifically, it is well known that when the grease is kept at high temperature for a long time, the oil component of the grease oozes from the surface, that is, bleed out. In the configuration of the light source device 10 shown in FIGS. 2A and 2B, the grease as the joint 7 is placed directly under the phosphor layer 2 and is the main path for heat dissipation, so that it is the same as the phosphor layer 2. It is expected to be exposed to high temperatures. In that case, bleed-out occurs, and the oil that has blotted spills over the upper surface (surface excited by the excitation light) of the phosphor layer 2, causing the surface to become cloudy, resulting in a problem of lowering brightness. There is. When rubber is used for the fixing member 11, the gap between the phosphor layer 2 and the joint portion 7 and the fixing member 11 can be easily eliminated as compared with metal, so that the above problem can be suppressed. By fixing the fixing member 11 to the heat dissipation substrate 6, the phosphor layer 2 is also fixed on the heat dissipation substrate 6. As a fixing method of the metal fixing member 11, screwing as shown in FIGS. 3A, 3B and 4 can be considered, and other fixing methods such as a spring or caulking can be employed. In the case of the rubber fixing member 11, the fixing member 11 can be covered on the phosphor layer 2 as shown in FIG. 5 so that the fixing member 11 can be fixed to the heat dissipation substrate 6 without using screws or the like.

  Moreover, in the light source device 10 of the first configuration example described above, the phosphor layer 2 may be fixed, but the phosphor layer 2 may be configured to be movable. For example, as shown in FIGS. 6A and 6B (FIG. 6A is a front view and FIG. 6B is a plan view), the phosphor layer 2 is rotated around the rotation axis X. It can also be configured as a reflection type fluorescent rotating body 1 (rotated by a motor 4 or the like). That is, the reflection type fluorescent rotator 1 can be realized by connecting the phosphor layer 2 and the heat dissipation substrate 6 joined at the joint 7 to the motor 4 or the like. In the reflection type fluorescent rotating body 1, the heat dissipation substrate 6 and the joint 7 function as a reflection surface for excitation light and fluorescence. In addition, the shape of the heat dissipation substrate 6 may be a disk shape or a quadrangle. In addition, in order to ensure the stability of rotation, it is possible to cut out a part of the disk or to have a shape with a weight on the contrary. As described above, by rotating the phosphor layer 2 with respect to the solid light source 5, it is possible to disperse the places where the excitation light hits and to suppress heat generation in the light irradiation unit. By using this fluorescent rotator 1, heat generation of the fluorescent substance can be suppressed in the first place, so that even higher luminance can be achieved.

  FIGS. 7A and 7B are diagrams showing a second configuration example of the light source device of the present invention. 7A is a front view of the whole, FIG. 7B is a plan view of a portion where a phosphor layer is provided, and FIGS. 7A and 7B show FIGS. The same code | symbol is attached | subjected to the location similar to (b). Referring to FIGS. 7A and 7B, the light source device 20 includes a solid-state light source 5 that emits light of a predetermined wavelength in a wavelength region from ultraviolet light to visible light, A phosphor layer 2 including at least one kind of phosphor that is excited by excitation light and emits fluorescence having a wavelength longer than that of the solid light source 5, and the solid light source 5 and the phosphor layer 2 are spatially separated. Are located apart.

  Here, it is preferable to use the phosphor layer 2 that does not substantially contain a resin component (for example, phosphor ceramics).

  7A and 7B, a light reflecting film 21 is formed on the surface of the phosphor layer 2 opposite to the side on which the excitation light is incident. Here, the light reflecting film 21 is formed on the phosphor layer 2 with a material such as Ag (silver) or Al (aluminum), for example, to a thickness of about several tens of nm to several μm by vapor deposition or sputtering. Has been. 7A and 7B, the light reflection film 21 is formed on the surface of the phosphor layer 2 opposite to the side on which the excitation light is incident, The light extraction efficiency from the phosphor layer 2 is improved by reflecting the excitation light component and the fluorescence component that are about to pass through the phosphor layer 2. In other words, the light source device 20 of FIGS. 7A and 7B is also a reflective surface provided on the opposite side of the surface of the phosphor layer 2 from the surface on which the excitation light from the solid light source 5 is incident. A method of extracting light such as fluorescence (excitation light, fluorescence) by using reflection by the light source (hereinafter referred to as a reflection method) is employed. In general, the light reflecting film 21 having a high light reflectance can be formed on the phosphor layer 2 polished to the mirror surface state. When the light reflecting film 21 is formed on the phosphor layer 2, FIG. , (B), the light reflectance higher than the reflection by the substrate 6 and the joint portion 7 of the light source device 10 can be realized, and the luminance can be further increased.

  Further, a substrate (heat dissipation substrate) 26 having thermal conductivity is provided on the surface of the phosphor layer 2 and the light reflecting film 21 opposite to the surface on which the excitation light is incident, and the phosphor layer 2 Is bonded to the substrate 26 by a bonding portion 27.

  Here, the substrate 26 also serves to dissipate the heat dissipated from the phosphor layer 2 and the light reflecting film 21 to the outside and to serve as a support substrate for the phosphor layer 2 and the light reflecting film 21. For this reason, high heat transfer characteristics and workability are required. The substrate 26 can be a metal substrate, oxide ceramics such as alumina, non-oxide ceramics such as aluminum nitride, etc., but it is desirable to use a metal substrate having both particularly high heat transfer characteristics and workability. .

  Moreover, since the phosphor layer 2 and the joint portion 27 between the light reflection film 21 and the heat dissipation substrate 26 also serve to dissipate heat from the phosphor layer 2, a metal having a high heat transfer characteristic (metal brazing) The bonding portion 27 may be an organic adhesive, an inorganic adhesive, low-melting glass, metal (metal brazing), or the like. However, when a phosphor layer 2 that does not substantially contain a resin component (for example, phosphor ceramics) is used, the bonding portion 27 is made of an organic adhesive, an inorganic adhesive, low-melting glass, metal (metal brazing). If it is formed of a non-fluid material such as the phosphor layer 2, it is difficult to make the thermal expansion coefficients of the phosphor layer 2, the light reflection film 21, the joint 27, and the heat dissipation substrate 26 coincide with each other. When the phosphor layer 2 is heated, there arises a problem that the phosphor layer 2 is broken by the thermal stress generated by the heating. When the phosphor layer 2 is cracked, the light emission intensity changes, which is a serious problem when used as a light source device. In order to solve this problem, in the light source device 20 of FIGS. 7A and 7B, it is preferable that a material having thermal conductivity and fluidity is used for the joint portion 27. As the material having thermal conductivity and fluidity, thermal conductive grease or the like is used as described above. Thermally conductive grease is a substance in which an oxide or a metal filler is mixed with hydrocarbon-based oil or silicone oil to enhance thermal conductivity, and unlike a resin, it is a substance that is not cured by heating. Accordingly, although the adhesiveness is inferior to that of the resin, it has fluidity, and therefore absorbs the thermal expansion of the phosphor layer 2 and the phosphor layer 2 does not substantially contain a resin component (for example, phosphor ceramics). ), The phosphor layer 2 has an effect of preventing cracking.

  In other words, in this second configuration example, the reflection function is provided not on the substrate 26 or the bonding portion 27 but on the light reflecting film 21, and the heat radiation function is provided on the substrate 26 and the bonding portion 27, so that the phosphor layer When 2 is a phosphor layer substantially free of a resin component (for example, phosphor ceramic), the phosphor layer substantially free of a resin component (for example phosphor ceramic) is bonded to the substrate 26 and the substrate 26. The joint 27 is provided with a function of effectively preventing cracking due to a difference in thermal expansion coefficient with the portion 27.

  That is, as in the conventional light source device shown in FIG. 1, when the phosphor layer 92 is in contact with the solid light source 95, both the phosphor layer 92 and the solid light source 95 are used even if the luminance is increased. However, in the light source device 20 shown in FIGS. 7A and 7B, the phosphor layer 2 is disposed away from the solid light source 5 because the heat dissipation efficiency from the phosphor layer 92 is poor. As a result, even when the luminance is increased, the heat from the phosphor layer 2 can be dissipated to the low-temperature heat dissipation substrate 26 via the joint portion 27, and the efficiency of heat dissipation from the phosphor layer 2 can be improved. Compared to the conventional light source device shown in FIG.

  Further, in the conventional light source device shown in FIG. 1, among the excitation light from the solid light source 95 and the fluorescence from the phosphor layer 92, the fluorescence emitted to the side opposite to the solid light source 95 and the phosphor layer 92 Excitation light from a solid light source 95 that is transmitted without being absorbed is used. In other words, the transmission method is used. Here, in the transmission method, when the emitted light from the phosphor layer 92 is considered, the excitation light is reflected at the interface with the phosphor layer 92 together with the transmitted light and returns to the solid light source 95 side, that is, reflected. There is also light, and this reflected light is reabsorbed by the solid light source 95 and becomes light that cannot be used as illumination light. Further, since the fluorescence from the phosphor layer 92 is emitted from both sides of the phosphor layer 92, the light emitted to the solid light source 95 side cannot be used. Thus, in the transmission method, the light use efficiency is reduced. In addition, in the transmission method, in order to obtain illumination light with a desired chromaticity, it is necessary to increase the thickness of the phosphor layer 92, and the distance from the phosphor layer 92 to the solid light source 95 becomes long. It was disadvantageous in dissipating the heat from 92 to the solid light source 95.

  On the other hand, in the light source device 20 of FIGS. 7A and 7B, the light (excitation light, fluorescence) emitted to the side opposite to the solid light source 5 is reflected by the solid light source 5 on the reflection surface (light reflecting film 21). Since the reflection method of reflecting to the side is adopted, all of the light emission (fluorescence) from the phosphor layer 2 excited by the excitation light from the solid light source 5 (that is, the fluorescence emitted to the solid light source 5 side), All of the excitation light from the solid light source 5 that has not been absorbed by the phosphor layer 2 (that is, the reflected light of the light from the solid light source 5 that has not been absorbed by the phosphor layer 2) can be used as illumination light (that is, Since both excitation light and fluorescence can be efficiently used as illumination light), the light use efficiency can be remarkably increased, and high brightness can be achieved. In contrast to the transmission type, in the reflection type, even if the thickness of the phosphor layer 2 is less than half, the optical path lengths in the phosphor layer 2 are equal, and light of the same chromaticity can be obtained. In addition, the distance from the phosphor layer 2 to the substrate 26 is shortened, which is advantageous in terms of heat dissipation.

  As described above, in the light source device 20 shown in FIGS. 7A and 7B, the solid light source 5 and the phosphor layer 2 are basically spatially separated and light emission is used in a reflective manner. Therefore, it is possible to achieve a sufficiently high brightness as compared with the conventional case.

  Furthermore, in the light source device 20 shown in FIGS. 7A and 7B, when the phosphor layer 2 that does not substantially contain a resin component is used, there is no discoloration due to heat and light absorption is small. For this reason, it is possible to further increase the luminance.

  In the light source device 20 shown in FIGS. 7A and 7B, when a fluid material is used for the joint portion 27, the phosphor layer (for example, phosphor ceramic) 2 and the light reflecting film remain as they are. 21 moves relative to the substrate 26. That is, the phosphor layer (for example, phosphor ceramic) 2 and the light reflecting film 21 need to be firmly fixed to the substrate 26. In other words, a fixing means for fixing the phosphor layer 2 and the light reflecting film 21 to the substrate 26 needs to be further provided.

  8A and 8B show an example of a fixing means 29 for fixing the phosphor layer 2 and the light reflecting film 21 to the substrate 26 in the light source device 20 of FIGS. 7A and 7B. It is shown. 8A is a front view and FIG. 8B is a plan view. Referring to FIGS. 8A and 8B, the fixing means 29 includes a fixing member 31 that covers the phosphor layer 2 from above, and the phosphor layer 2 by screwing the fixing member 31 to the substrate 26. And a screw 32 for fixing to the substrate 26. In the example of FIGS. 8A and 8B, the fixing member 31 is provided with a recess in a portion covering the phosphor layer 2. 9 and 10 are diagrams showing other examples of the fixing means 29. FIG. In the example of FIG. 9, a flat plate is used for the fixing member 31. However, compared to the case of using a flat plate for the fixing member 31 as in the example of FIG. 9, the fixing member 31 has a recess in the portion covering the phosphor layer 2 as in the example of FIGS. 8A and 8B. When using what is provided, the light emission component from the end face of the phosphor layer 2 can be reflected, which leads to higher brightness and is desirable. Further, if the phosphor layer 2 and the light reflecting film 21 are fixed on the convex substrate 26 by the fixing member 31 as in the example of FIG. 10, the heat conducted to the fixing member 31 is transferred to the substrate 26. Therefore, it is possible to achieve higher reliability and higher luminance of the light emitting device. The fixing member 31 is preferably made of metal from the viewpoint of thermal conductivity, but is preferably made of rubber from the viewpoint of relaxation of stress generated in the phosphor layer and ease of attachment of the fixing member. In particular, when the fixing member 31 is made of rubber, it is preferable because the phenomenon of bleed out in which oil comes out from the grease as the joint portion 27 can be prevented from affecting the apparatus. More specifically, it is well known that when the grease is kept at high temperature for a long time, the oil component of the grease oozes from the surface, that is, bleed out. In the configuration of the light source device 20 shown in FIGS. 7A and 7B, the grease as the joint 27 is placed directly under the phosphor layer 2 and the light reflecting film 21 and is a main path for heat dissipation. Like the body layer 2 and the light reflecting film 21, it is expected to be exposed to a high temperature. In that case, bleed-out occurs, and the oil that has blotted spills over the upper surface (surface excited by the excitation light) of the phosphor layer 2, causing the surface to become cloudy, resulting in a problem of lowering brightness. There is. When rubber is used for the fixing member 31, the gap between the phosphor layer 2 and the joint portion 27 and the fixing member 31 can be easily eliminated as compared with metal, so that the above problem can be suppressed. By fixing the fixing member 31 to the heat dissipation substrate 26, the phosphor layer 2 and the light reflection film 21 are also fixed on the heat dissipation substrate 26. As a fixing method of the metal fixing member 31, screwing as shown in FIGS. 8A, 8B and 9 can be considered, and other fixing methods such as a spring or caulking can be adopted. In the case of the rubber fixing member 31, the fixing member 31 can be covered on the phosphor layer 2 as shown in FIG. 10, so that the fixing member 31 can be fixed to the heat dissipation substrate 26 without using screws or the like.

  Moreover, in the light source device 20 of the second configuration example described above, the phosphor layer 2 may be fixed, but the phosphor layer 2 may be configured to be movable. For example, as shown in FIGS. 11A and 11B (FIG. 11A is a front view and FIG. 11B is a plan view), the phosphor layer 2 is rotated around the rotation axis X. It can also be configured as a reflection type fluorescent rotating body 41 (rotated by the motor 4 or the like). That is, the reflection type fluorescent rotating body 41 can be realized by connecting the phosphor layer 2, the light reflecting film 21, and the heat dissipation substrate 26 joined at the joining portion 27 to the motor 4 or the like. In the reflection type fluorescent rotating body 41, the light reflection film 21 functions as a reflection surface for excitation light and fluorescence. In addition, the shape of the heat dissipation substrate 26 may be a disk shape, a quadrangle, or the like. In addition, in order to ensure the stability of rotation, it is possible to cut out a part of the disk or to have a shape with a weight on the contrary. As described above, by rotating the phosphor layer 2 with respect to the solid light source 5, it is possible to disperse the places where the excitation light hits and to suppress heat generation in the light irradiation unit. By using this fluorescent rotating body 41, heat generation of the fluorescent substance can be suppressed in the first place, so that a higher luminance can be achieved.

  Next, the light source device 10 shown in FIGS. 2A and 2B and the light source device 20 shown in FIGS. 7A and 7B will be described in more detail.

  In the light source device 10 of FIGS. 2A and 2B and the light source device 20 of FIGS. 7A and 7B, the solid-state light source 5 includes a light emitting diode or semiconductor having a light emission wavelength from the ultraviolet light to the visible light region. A laser or the like can be used.

More specifically, the solid-state light source 5 may be, for example, a light emitting diode or semiconductor laser that emits near-ultraviolet light having an emission wavelength of about 380 nm using an InGaN-based material. In this case, the phosphor of the phosphor layer 2 is excited by ultraviolet light having a wavelength of about 380 nm to about 400 nm. For example, the red phosphor has CaAlSiN ₃ : Eu ²⁺ , Ca ₂ Si ₅ N _8. : Eu ²⁺ , La ₂ O ₂ S: Eu ³⁺ , KSiF ₆ : Mn ⁴⁺ , KTiF ₆ : Mn ^{4+ and the} like can be used. For the green phosphor, Lu ₃ Al ₅ O ₁₂ : Ce ³⁺ , (Si, Al) ₆ (O, N) ₈ : Eu ²⁺ , BaMgAl ₁₀ O ₁₇ : Eu ²⁺ , Mn ²⁺ , (Ba, Sr) ₂ SiO ₄ : Eu ^2+, etc. can be used, and (Sr _{, Ca, Ba, Mg) 10} (PO 4) 6 C l2: Eu 2+, BaMgAl 10 O 17: Eu 2+, LaAl (Si, Al) 6 (N, O) 10: Ce ³⁺ or the like can be used.

The solid light source 5 may be, for example, a light emitting diode or a semiconductor laser that emits blue light having a light emission wavelength of about 460 nm using a GaN-based material. In this case, the phosphor of the phosphor layer 2 is excited by blue light having a wavelength of about 440 nm to about 470 nm. For example, the red phosphor has CaAlSiN ₃ : Eu ²⁺ , Ca ₂ Si ₅ N _8. : Eu ²⁺ , KSiF ₆ : Mn ⁴⁺ , KTiF ₆ : Mn ^{4+ and the} like can be used, and for the green phosphor, Lu ₃ Al ₅ O ₁₂ : Ce ³⁺ , Y ₃ (Ga, Al) ₅ O ₁₂ : Ce ³⁺ , Ca ₃ Sc ₂ Si ₃ O ₁₂ : Ce ³⁺ , CaSc ₂ O ₄ : Eu ²⁺ , (Ba, Sr) ₂ SiO ₄ : Eu ²⁺ , Ba ₃ Si ₆ O ₁₂ N ₂ : Eu ²⁺ , (Si, Al ) ₆ (O, N) ₈ : Eu ²⁺ or the like can be used. Moreover, as what is excited by blue light with a wavelength of about 440 nm to about 470 nm, for example, Y ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG), (Sr, Ba) ₂ SiO ₄ : Eu ²⁺ , Ca _x (Si , Al) ₁₂ (O, N) ₁₆ : Eu ²⁺ or the like can be used.

As the phosphor layer 2, a phosphor in which these phosphor powders are dispersed in glass, a glass phosphor in which a luminescent center ion is added to a glass matrix, a phosphor ceramic not including a binding member such as a resin, or the like is used. Can do. As a specific example of the phosphor powder dispersed in glass, the phosphor powder having the composition listed above is contained in a glass containing components such as P ₂ O ₃ , SiO ₂ , B ₂ O ₃ , and Al ₂ O _3. Are dispersed. Examples of glass phosphors in which a luminescent center ion is added to a glass matrix include Ca—Si—Al—O—N and Y—Si—Al—O—N systems in which Ce ³⁺ or Eu ²⁺ is added as an activator. Examples thereof include oxynitride glass phosphors. Examples of the phosphor ceramic include a sintered body having a phosphor composition having the composition listed above and substantially not including a resin component. Among these, it is desirable to use a phosphor ceramic having translucency. This is a phosphor ceramic that has translucency because there are almost no pores or impurities at grain boundaries that cause light scattering in the sintered body. Since pores and impurities can also prevent thermal diffusion, translucent ceramics exhibit high thermal conductivity. For this reason, when it uses as a fluorescent substance layer, it can take out from a fluorescent substance layer, and can utilize it, without losing excitation light and fluorescence by diffusion, Furthermore, the heat | fever which generate | occur | produced in the fluorescent substance layer can be dissipated efficiently. Even a sintered body that does not show translucency is desirable to have as few pores and impurities as possible. As an index for evaluating the remaining amount of pores, the value of specific gravity of the phosphor ceramic can be used, and it is desirable that the value is 95% or more with respect to the theoretical value by which the value is calculated.

Here, a method of manufacturing a phosphor ceramic having translucency will be described by taking as an example a Y ₃ Al ₅ O ₁₂ : Ce ³⁺ phosphor which is a blue-excited yellow light-emitting phosphor. The phosphor ceramic is manufactured through a starting material mixing step, a forming step, a firing step, and a processing step. As starting materials, yttrium oxide, cerium oxide, alumina, and the like, oxides of constituent elements of Y ₃ Al ₅ O ₁₂ : Ce ³⁺ phosphor, carbonates, nitrates, sulfates and the like that become oxides after firing are used. The particle size of the starting material is preferably a submicron size. These raw materials are weighed so as to have a stoichiometric ratio. At this time, for the purpose of improving the transmittance of the ceramic after firing, it is also possible to add a compound such as calcium or silicon. The weighed raw materials are sufficiently dispersed and mixed by a wet ball mill using water or an organic solvent. Next, the mixture is formed into a predetermined shape. As the molding method, a uniaxial pressing method, a cold isostatic pressing method, a slip casting method, an injection molding method, or the like can be used. The obtained molded body is fired at 1600 to 1800 ° C. Thus, translucent ^{_{Y 3 Al 5 O 12: Ce}} 3+ phosphor ceramic can be obtained.

  The phosphor ceramic produced as described above is polished to a thickness of several tens to several hundreds of μm using an automatic polishing apparatus and the like, and is further rounded by dicing or scribing using a diamond cutter or laser. Cut out to a board of any shape such as a square, fan or ring.

  Here, phosphor ceramics have a high refractive index with respect to air, and there are few things that cause scattering such as pores inside, and light is guided inside the ceramics. The light emission component emitted from the side surface increases, and the light emission component emitted in the front direction decreases. In order to solve this problem, the light emission component emitted in the front direction can be increased by providing an uneven light extraction structure by etching on the ceramic surface, mounting a lens, or providing a reflective layer on the side surface. Is also possible. Further, an AR coating (film having an antireflection function) made of an oxide multilayer film may be applied to the excitation light incident surface of the phosphor ceramic.

The light reflecting film 21 may be a metal film typified by silver or aluminum, or a multilayer film in which various oxide films are periodically stacked. Further, instead of these alone, a multilayer film may be provided as an enhanced reflection film, and then a metal film may be provided. In order to prevent the light reflecting film 21 from being deteriorated due to corrosion or the like, a protective film 44 having a barrier property against water or corrosive gas may be formed as shown in FIG. Examples of the protective film 44 include oxides such as silica (SiO ₂ ) and alumina (Al ₂ O ₃ ), nitrides such as silicon nitride, and oxynitride films such as sialon. The light reflecting film 21 can be formed on the phosphor layer 2 by a sputtering method, a vapor deposition method, or the like. Further, as shown in FIG. 13, in order to prevent the light reflecting film 21 from peeling from the phosphor layer 2 due to the thermal stress due to the difference in thermal expansion coefficient between the phosphor layer 2 and the light reflecting film 21, the phosphor Silica (SiO ₂ ), alumina (Al ₂ O ₃ ), or the like may be provided as the thermal stress buffer 45 between the layer 2 and the light reflecting film 21.

Moreover, as the heat conductive grease used for the joint portions 7 and 27, both a silicone grease using silicone oil as an oil component and a non-silicone grease using hydrocarbon oil can be used. Examples of the filler mixed in the grease include oxide fine particles such as alumina and zinc oxide, and metal fine particles such as silver. In particular, since the joint portion 7 is required to have light reflectivity, a material having light reflectivity (such as silica (SiO ₂ ) or alumina (Al ₂ O ₃ )) is used as the filler.

  Moreover, although a metal substrate, oxide ceramics, non-oxide ceramics, etc. can be used for the heat sinks 6 and 26, especially the heat sink 6 is a metal substrate having high light reflection characteristics, heat transfer characteristics, and workability. It is desirable to use As the metal, simple substances such as Al, Cu, Ti, Si, Ag, Au, Ni, Mo, W, Fe, Pd, and alloys containing them can be used. Further, the surface of the heat dissipation substrates 6 and 26 may be coated for the purpose of increasing reflection and preventing corrosion. Further, the heat dissipation boards 6 and 26 may be provided with a structure such as a fin in order to improve heat dissipation.

The fixing members 11 and 31 can be broadly divided into inorganic materials and rubber materials. In the case of an inorganic substance, a metal substrate, oxide ceramics, non-oxidized ceramics, etc. can be used as with the heat dissipation substrates 6 and 26. In consideration of thermal expansion, it is desirable that the fixing members 11 and 31 and the heat dissipation substrates 6 and 26 are made of the same material. Moreover, when providing a recessed part as the fixing members 11 and 31 in order to hold down the phosphor layer 2, it is desirable to use a metal substrate having excellent workability. On the other hand, in the case of rubber, silicone rubber, fluorine rubber, butyl rubber, nitrile rubber, chloroprene rubber, acrylic rubber, and the like can be used. Among them, silicone rubber and fluorine rubber having excellent heat resistance are preferable. Similarly to the bonding layers 7 and 27, the fixing members 11 and 31 are preferably higher in thermal conductivity because heat dissipation from the phosphor layer 2 can be promoted. Further, in order to efficiently extract the fluorescence emitted from the end face of the phosphor layer 2 from the upper surface of the phosphor layer 2, it is desirable that the fixing members 11 and 31 have a high light reflectance. From these viewpoints, when the fixing members 11 and 31 are made of rubber, a filler such as silica (SiO ₂ ) or alumina (Al ₂ O ₃ ) may be put in the rubber in order to increase thermal conductivity and light reflectance. good.

  Further, the light source device 10 in FIGS. 2A and 2B and the light source device 20 in FIGS. 7A and 7B have a configuration in which only one phosphor layer 2 is provided. Two or more types of phosphor layers can also be used. When two or more kinds of phosphor layers are used, the phosphor layers may be arranged in the horizontal direction or may be arranged in the vertical direction.

  As described above, in the present invention, the solid-state light source 5 and the phosphor layer 2 are installed on the same side with respect to the heat dissipation substrates 6 and 26, whereby a reflective light source device is obtained. Of course, if necessary, an optical element such as a lens can be inserted between the solid-state light source 5 and the phosphor layer 2.

  Further, by combining the above-described various light source devices of the present invention with optical components such as a predetermined lens system, it is possible to provide an illumination device capable of increasing the brightness.

The present invention can be used for lighting in general.

DESCRIPTION OF SYMBOLS 1,41 Fluorescent rotating body 2 Phosphor layer 4 Motor 5 Solid light source 6, 26 Heat-radiating substrate 7, 27 Joining part 9, 29 Fixing means 11, 31 Fixing member 10, 20 Light source device 21 Light reflection film 12, 32 Screw 44 Protection Membrane 45 Buffer material

Claims (7)

A solid-state light source that emits light of a predetermined wavelength in a wavelength region from ultraviolet light to visible light, and at least emits fluorescence having a wavelength longer than the emission wavelength of the solid-state light source when excited by excitation light from the solid-state light source A phosphor layer containing one or more kinds of phosphors and substantially free of a resin component, wherein the solid-state light source and the phosphor layer are in a spatially separated position, of the surface of the phosphor layer A light source device that takes out at least fluorescence in a reflective manner from a surface on which excitation light from the solid light source is incident, and is light-reflective on a surface of the phosphor layer opposite to the side on which excitation light is incident. And a substrate having thermal conductivity, and the phosphor layer is bonded to the substrate with a material having light reflectivity, thermal conductivity, and fluidity. 2. The light source device according to claim 1, wherein the phosphor layer is phosphor ceramic. A solid-state light source that emits light of a predetermined wavelength in a wavelength region from ultraviolet light to visible light, and at least emits fluorescence having a wavelength longer than the emission wavelength of the solid-state light source when excited by excitation light from the solid-state light source A phosphor layer containing one or more kinds of phosphors, wherein the solid light source and the phosphor layer are spatially separated from each other, and excitation light from the solid light source is on the surface of the phosphor layer. A light source device that extracts at least fluorescence from the incident side surface by a reflection method, and a light reflection film is formed on a surface of the phosphor layer opposite to the side on which excitation light is incident, The phosphor layer and the light reflection film are bonded to a substrate by a bonding portion. 4. The light source device according to claim 3, wherein the joint is formed of a material having thermal conductivity and fluidity, and the substrate is formed of a material having thermal conductivity. apparatus. 5. The light source device according to claim 1, further comprising a fixing unit that fixes the phosphor layer to the substrate. 6. The light source device according to claim 1, wherein the light source device includes a fluorescent rotator including the phosphor layer and the substrate. An illumination device using the light source device according to any one of claims 1 to 6.

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