JP2012220205A - 流体取扱装置及び流体取扱システム - Google Patents
流体取扱装置及び流体取扱システム Download PDFInfo
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Abstract
【解決手段】マイクロ流路チップのチップ本体12の下面21にフィルム14を接合することにより、有底の第1領域23a’、23b’、第2領域24a’、24b’、第3領域25a’、25b’が形成される。第3領域25a’、25b’は、第2領域24a’、24b’に連通し、カーボンインク16a、16b上に形成される。第3領域25a’、25b’の幅は、カーボンインク16a、16bの幅より長くなるように形成される。第3領域25a’、25b’には、導電性の接着剤が充填される。
【選択図】図1
Description
図1は、本実施の形態に係る流体取扱装置としてのマイクロ流路チップの形状を示す図である。図1(A)は平面図、図1(B)はA−A線正面断面図、図1(C)は底面図、図1(D)はB−B線左側面断面図である。なお、図1(A)、図1(B)には、電極棒1a、1bをともに示す。
まず、マイクロ流路チップ10において、第1領域(注入口)23a’に泳動液を注入し、流路22’を充填する。次に分析用の試料を注入する。また、電極棒1a、1bを、第2領域24a’、24b’に挿入して導電性接着剤26a、26bに接触させる。
図4は、図1(A)のE−E線拡大断面図である。図4に示すように、カーボンインクの16b(16a)の厚みに起因して、フィルム14のカーボンインクの16b(16a)の周辺部分がチップ本体12に未接着となり(ラミネート不良)、カーボンインクの16a(16b)の縁部において、チップ本体12とフィルム14との間に隙間31a、31bが生じる虞がある。
以下、本実施の形態に係るマイクロ流路チップのバリエーションについて説明する。
図5は、本実施の形態に係るマイクロ流路チップのバリエーション1の形状を示す図である。バリエーション1のマイクロ流路チップ10−1は、試料をヒータで加熱するために用いられる。図5(A)は平面図、図5(B)はF−F線正面断面図、図5(C)は底面図である。なお、図5(A)、図5(B)には、電熱ヒータ1a−1をともに示す。なお、図5において、図1と共通する部分には、同一の符号を付して詳しい説明を省略する。
12、12−1 チップ本体
14、14−1 フィルム
16a、16b カーボンインク
16a−1 金属膜
22 微細溝
22’ 流路
23a、23b、24a、24b、27 貫通孔
23a’、23b’、26’ 第1領域
24a’、24b’ 第2領域
25a、25b 溝部
25a’、25b’ 第3領域
26a’、26b’、26−1 接着剤
27’ 注入口
Claims (3)
- 板状の基板部材と、
薄膜または薄板であって、前記基板部材の一面に接合される蓋部材と、
前記蓋部材に、前記基板部材との接合面の一部を覆うように層状に形成され、電気または熱を伝達する伝達機能部と、を有し、
前記基板部材の前記一面の前記伝達機能部の一端に対応する部分には、凹みまたは貫通孔が形成され、前記基板部材と前記蓋部材とが接合された際に前記一面側の開口部が前記蓋部材によって閉塞されることにより第1領域が形成され、
前記伝達機能部の他端に対応する部分には、前記基板部材と前記蓋部材とが接合された際に外部に連通する開口部を有する第2領域が形成され、
前記伝達機能部は、前記第1領域と前記第2領域との間を電気的または熱的に接続し、
前記基板部材の前記一面には、前記第1領域と前記第2領域の間に延びる前記伝達機能部の縁部に架かるように溝部が形成され、前記溝部の前記一面側の開口部が前記蓋部材によって閉塞されることにより第3領域が形成され、
前記第3領域は、前記第2領域と連通しており、
前記基板部材に前記蓋部材が接合された状態において、前記第3領域が接着剤で充填される、
流体取扱装置。 - 前記接着剤が、導電性または伝熱性を有する、請求項1記載の流体取扱装置。
- 請求項1または請求項2に記載の流体取扱装置を具備する流体取扱システム。
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JP2011082820A JP5723198B2 (ja) | 2011-04-04 | 2011-04-04 | 流体取扱装置及び流体取扱システム |
US14/110,086 US9120098B2 (en) | 2011-04-04 | 2012-03-12 | Fluid handling device and fluid handling system |
PCT/JP2012/001690 WO2012137413A1 (ja) | 2011-04-04 | 2012-03-12 | 流体取扱装置及び流体取扱システム |
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GB2515571A (en) | 2013-06-28 | 2014-12-31 | Ibm | Fabrication of microfluidic chips having electrodes level with microchannel walls |
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JP2004106508A (ja) * | 2002-07-26 | 2004-04-08 | Enplas Corp | プレートの接着部構造 |
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JP2006145450A (ja) * | 2004-11-24 | 2006-06-08 | Matsushita Electric Ind Co Ltd | 光学的分析デバイス |
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JP2004106508A (ja) * | 2002-07-26 | 2004-04-08 | Enplas Corp | プレートの接着部構造 |
JP2006517652A (ja) * | 2002-12-26 | 2006-07-27 | メソ スケイル テクノロジーズ,エルエルシー | アッセイカートリッジ及び同アッセイカートリッジを用いた方法 |
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US9120098B2 (en) | 2015-09-01 |
JP5723198B2 (ja) | 2015-05-27 |
WO2012137413A1 (ja) | 2012-10-11 |
US20140023566A1 (en) | 2014-01-23 |
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