JP2012204791A - 気化装置、ガス供給装置及びこれを用いた成膜装置 - Google Patents

気化装置、ガス供給装置及びこれを用いた成膜装置 Download PDF

Info

Publication number
JP2012204791A
JP2012204791A JP2011070661A JP2011070661A JP2012204791A JP 2012204791 A JP2012204791 A JP 2012204791A JP 2011070661 A JP2011070661 A JP 2011070661A JP 2011070661 A JP2011070661 A JP 2011070661A JP 2012204791 A JP2012204791 A JP 2012204791A
Authority
JP
Japan
Prior art keywords
gas
raw material
carrier gas
liquid
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011070661A
Other languages
English (en)
Japanese (ja)
Inventor
Nariyuki Okura
成幸 大倉
Junichi Takei
純一 武井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2011070661A priority Critical patent/JP2012204791A/ja
Priority to PCT/JP2012/056416 priority patent/WO2012132878A1/ja
Priority to TW101110567A priority patent/TW201303971A/zh
Publication of JP2012204791A publication Critical patent/JP2012204791A/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02Spray pistols; Apparatus for discharge
    • B05B7/06Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane
    • B05B7/062Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane with only one liquid outlet and at least one gas outlet
    • B05B7/066Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane with only one liquid outlet and at least one gas outlet with an inner liquid outlet surrounded by at least one annular gas outlet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02Spray pistols; Apparatus for discharge
    • B05B7/08Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point
    • B05B7/0869Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point the liquid or other fluent material being sucked or aspirated from an outlet orifice by another fluid, e.g. a gas, coming from another outlet orifice
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4481Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
JP2011070661A 2011-03-28 2011-03-28 気化装置、ガス供給装置及びこれを用いた成膜装置 Withdrawn JP2012204791A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011070661A JP2012204791A (ja) 2011-03-28 2011-03-28 気化装置、ガス供給装置及びこれを用いた成膜装置
PCT/JP2012/056416 WO2012132878A1 (ja) 2011-03-28 2012-03-13 気化装置、ガス供給装置及び成膜装置
TW101110567A TW201303971A (zh) 2011-03-28 2012-03-27 氣化裝置、氣體供給裝置及成膜裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011070661A JP2012204791A (ja) 2011-03-28 2011-03-28 気化装置、ガス供給装置及びこれを用いた成膜装置

Publications (1)

Publication Number Publication Date
JP2012204791A true JP2012204791A (ja) 2012-10-22

Family

ID=46930616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011070661A Withdrawn JP2012204791A (ja) 2011-03-28 2011-03-28 気化装置、ガス供給装置及びこれを用いた成膜装置

Country Status (3)

Country Link
JP (1) JP2012204791A (zh)
TW (1) TW201303971A (zh)
WO (1) WO2012132878A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014127667A (ja) * 2012-12-27 2014-07-07 Showa Denko Kk 成膜装置
US20150345046A1 (en) * 2012-12-27 2015-12-03 Showa Denko K.K. Film-forming device
US20160194753A1 (en) * 2012-12-27 2016-07-07 Showa Denko K.K. SiC-FILM FORMATION DEVICE AND METHOD FOR PRODUCING SiC FILM
WO2017094469A1 (ja) * 2015-11-30 2017-06-08 株式会社アルバック 蒸気放出装置及び成膜装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7402801B2 (ja) * 2018-08-24 2023-12-21 株式会社堀場エステック 気化器、液体材料気化装置、及び気化方法
JP7417191B2 (ja) * 2020-01-30 2024-01-18 セイコーエプソン株式会社 液体噴射装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4056888B2 (ja) * 2003-01-07 2008-03-05 株式会社島津製作所 気化器
JP2004335564A (ja) * 2003-05-01 2004-11-25 Japan Pionics Co Ltd 気化器
JP2005026599A (ja) * 2003-07-01 2005-01-27 Lintec Co Ltd 液体気化供給器及びこれを用いた液体気化供給装置
JP4607474B2 (ja) * 2004-02-12 2011-01-05 東京エレクトロン株式会社 成膜装置
JP5141141B2 (ja) * 2007-08-23 2013-02-13 東京エレクトロン株式会社 気化器、気化器を用いた原料ガス供給システム及びこれを用いた成膜装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014127667A (ja) * 2012-12-27 2014-07-07 Showa Denko Kk 成膜装置
US20150345046A1 (en) * 2012-12-27 2015-12-03 Showa Denko K.K. Film-forming device
US20160194753A1 (en) * 2012-12-27 2016-07-07 Showa Denko K.K. SiC-FILM FORMATION DEVICE AND METHOD FOR PRODUCING SiC FILM
WO2017094469A1 (ja) * 2015-11-30 2017-06-08 株式会社アルバック 蒸気放出装置及び成膜装置
CN108291292A (zh) * 2015-11-30 2018-07-17 株式会社爱发科 蒸汽释放装置及成膜装置
JPWO2017094469A1 (ja) * 2015-11-30 2018-08-02 株式会社アルバック 蒸気放出装置及び成膜装置
CN108291292B (zh) * 2015-11-30 2020-06-26 株式会社爱发科 蒸汽释放装置及成膜装置

Also Published As

Publication number Publication date
WO2012132878A1 (ja) 2012-10-04
TW201303971A (zh) 2013-01-16

Similar Documents

Publication Publication Date Title
US6596085B1 (en) Methods and apparatus for improved vaporization of deposition material in a substrate processing system
JP4696561B2 (ja) 気化装置及び処理装置
WO2012132878A1 (ja) 気化装置、ガス供給装置及び成膜装置
KR100728401B1 (ko) 샤워 헤드 및 이것을 이용한 성막장치
JP6724005B2 (ja) 基板処理装置、半導体装置の製造方法及び気化システム
JP5699425B2 (ja) 載置台構造及び成膜装置
JP2009224775A (ja) ガス供給装置、成膜装置及び成膜方法
JP2004140328A (ja) ガス供給系及び処理システム
KR100800377B1 (ko) 화학기상증착설비
JP4607474B2 (ja) 成膜装置
TWI669747B (zh) 基板處理裝置及其基板處理方法
US20130205611A1 (en) Gas supply apparatus and heat treatment apparatus
JP2005506448A (ja) 汚染防止と膜成長速度増進機能を備える化学気相蒸着方法及び装置
KR100716477B1 (ko) 기판 프로세스 시스템에서의 프로세스 및 정화 물질의향상된 제어를 위한 방법 및 장치
TW200845182A (en) Etching gas control system
KR101349423B1 (ko) Cu막의 성막 방법
JP2010028000A (ja) 気化器、基板処理装置及び半導体装置の製造方法
JP7191558B2 (ja) 成膜装置および成膜方法、クリーニング方法
KR101773038B1 (ko) 기화기를 갖는 증착장치 및 증착방법
US20060231026A1 (en) Vapor deposition systems having separate portions configured for purging using different materials
KR100618690B1 (ko) 반도체 제조용 전구체 저장통
KR20070010830A (ko) 가스 공급 장치 및 이를 갖는 박막 형성 설비
JP2010189727A (ja) Cu膜の成膜方法および記憶媒体
JP2011061108A (ja) 基板処理装置
JP2013100576A (ja) 液体原料の気化方法

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20140603