JP2012199454A - Grip hand - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a grip hand capable of securely releasing gripping even when an adhesive portion of a carried member, having an adhesive material on the surface, is gripped.SOLUTION: In the grip hand for gripping the carried member having the adhesive material on the surface, a main body of the hand for gripping a tip includes: an upper claw and a lower claw for gripping the upper face and the lower face of the peripheral portion of the tip of the carried member; an open/close gripping mechanism for performing opening/closing operation of the tip upper claw and the tip lower claw; and a stopper capable of abutting on the upper face or the upper end portion of the tip of the carried member. When the tip open/close gripping mechanism is in a closed state, the tip abutment portion of the tip stopper on the tip stopper side is located upper than the tip abutment portion on the tip of the carried member side.

Description

  The present invention relates to a gripping hand for gripping a member to be transported having an adhesive material on its surface, particularly a wafer transporting ring for transporting a semiconductor, an LED wafer, an electronic circuit board or the like.

  In a manufacturing process of a semiconductor used for an electronic device, an LED, or the like, a large number of chips are arranged on a single wafer, and the chips are cut into individual chips in a dicing process. Prior to the dicing process, the pre-cut wafer is placed on a stretchable adhesive sheet (hereinafter referred to as wafer sheet) that is attached to a metal frame (hereinafter referred to as wafer transfer ring) having an inner diameter larger than that of the wafer. It is pasted. Thereafter, the wafer is cut into individual chips in a dicing process, and the wafer sheet is stretched in an expanding process. By doing so, the space | interval of the said chips spreads and it becomes easy to pick up.

  The chip is picked up and mounted on an electronic device or individually packaged. Before the chip is picked up, the wafer sheet is stretched and the chip surface or edge portion is stretched. There is a process for inspecting whether there is any foreign matter or chipping. As a form at the time of carrying the wafer carrying ring, there is a form in which the upper and lower surfaces are held by a holding tool called a gripper (for example, Patent Document 1).

  On the other hand, when changing the product type in the inspection process or the pick-up process, if the wafer transfer ring is taken out as it is, the expanded state is not maintained and adjacent chips come into contact with each other. In order to avoid this, when switching the product type in the inspection process or the pick-up process, the wafer transfer ring is inserted in a state where a double fitting ring called a grip ring is fitted in the wafer sheet. May be sent. By doing so, the semiconductor sheet can be transferred to the next step without being in contact with the wafer sheet while maintaining the stretched state of the wafer sheet. (For example, Patent Document 2)

JP 2010-028064 A JP 2008-135513 A

  When handling a wafer transport ring in which a wafer sheet is affixed to the upper surface of the wafer transport ring or the wafer sheet is exposed on the upper surface of the grip ring, or a transported member having an adhesive material on the surface The gripping hand directly touches the adhesive material. Then, even if it is attempted to release the grip after the transported member is gripped by the gripping hand, the transported member and the gripping hand are in an adhesive state. If it does so, grip cannot be released, it will interrupt conveyance operation, it will shift in position at the time of grip release, and it will cause various problems.

  On the other hand, if the surface of the gripping hand is made of a material or shape that is difficult to adhere and has a form that makes it easy to release the grip, there is a risk of displacement or dropping due to vibration or acceleration / deceleration when transporting the transported member. there were.

  Further, it is complicated to select and handle the non-adhesive portion of the transported member.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a gripping hand that can reliably release gripping even when gripping an adhesive portion of a transported member having an adhesive material on its surface.

In order to solve the above problems, the invention described in claim 1
In a gripping hand for gripping a transported member having an adhesive material on the surface,
In the main body of the gripping hand,
An upper claw portion and a lower claw portion for gripping the upper surface and the lower surface of the peripheral portion of the transported member;
An opening and closing gripping mechanism for opening and closing the upper nail portion and the lower nail portion;
A stopper portion capable of coming into contact with the upper surface or upper end portion of the transported member,
The stopper part is
The gripping hand is disposed above the contact portion of the transported member when the open / close gripping mechanism is in a closed state.

The invention described in claim 2
The gripping hand according to claim 1, wherein the transported member is a grip ring for transporting a semiconductor wafer.

According to invention of Claim 2,
The semiconductor chips separated into individual chips are handled in an expanded state, the chip surface and corners are inspected, and the expanded state is automatically sent to the pick-up process and stored in a cassette. it can. Therefore, the time required for handling can be shortened, and the productivity of the semiconductor chip is improved.

The invention according to claim 3
The gripping hand according to claim 1 or 2, wherein the contact portion between the transported member and the stopper portion is in point contact or line contact.

According to invention of Claim 3,
Re-adhesion is unlikely to occur at the contact portion between the stopper portion and the transported member. For this reason, it is difficult for the position shift after the gripped release of the transported member occurs.

The invention according to claim 4
The gripping hand according to any one of claims 1 to 3, wherein a plurality of the stopper portions are arranged across the upper claw portion.

According to invention of Claim 4,
The load concentrated on the contact portion between the stopper and the transported member is reduced, and deformation or breakage of the transported member can be prevented.

  The gripping hand of the present invention can quickly and reliably perform gripping, transporting, and releasing operations even when gripping an adhesive portion of a transported member having an adhesive material on the surface. In addition, since the adhesive portion is gripped during transport, the transported member may be misaligned with respect to the gripping hand even when external vibration is applied or high-speed transport with sudden acceleration / deceleration is performed. No fear of falling.

It is a top view which shows the 1st example of the form which embodies this invention. It is a side view which shows the 1st example of the form which embodies this invention. It is a side view which shows the 2nd example of the form which embodies this invention. It is a side view which shows the 3rd example of the form which embodies this invention. It is a side view which shows the 4th example of the form which embodies this invention.

DESCRIPTION OF EMBODIMENTS Embodiments for carrying out the present invention will be described with reference to the drawings.
FIG. 1A is a plan view showing a first example of a form embodying the present invention.
FIG. 1B is a side view showing a first example of a form embodying the present invention.
In each figure, the three axes of the orthogonal coordinate system are X, Y, and Z, the XY plane is the horizontal plane, and the Z direction is the vertical direction. In particular, in the Z direction, the direction of the arrow is represented as the top, and the opposite direction is represented as the bottom.

  The gripping hand 1 includes a hand main body portion 2, an opening / closing gripping mechanism 3 including an upper claw portion 31 and a lower claw portion 33, and a stopper portion 4. The hand main body 2 is attached to a multi-axis robot, position-controlled by an automatic control program, and an opening / closing operation is performed by an external opening / closing signal. Alternatively, the hand main body 2 may be configured to be attached to a handle and to be operated manually.

The open / close gripping mechanism 3 includes an open / close chuck 30, and an upper claw portion 31 and a lower claw portion 33 are attached to the open / close chuck 30. The open / close gripping mechanism 3 has a structure in which the upper claw portion 31 and the lower claw portion 33 can move in the thickness direction (that is, the Z direction) of the wafer transfer ring 10 to be transferred. Therefore, the open / close gripping mechanism 3 performs a so-called opening / closing operation that holds the outer peripheral portion of the wafer transfer ring 10 from the front and back surfaces in the closed state and releases the grip in the open state. Can do.

  On the side of the opening / closing chuck 30, a stopper portion 4 as exemplified by rod-shaped stoppers 41a and 41b is attached. The tip ends of the rod-shaped stoppers 41a and 41b are located on the inner side of the outer periphery of the wafer transfer ring 10, and are not in contact with the wafer transfer ring 10 when the open / close gripping mechanism 3 is in a closed state, that is, for wafer transfer. It is arranged above the ring 10. Then, before the opening / closing gripping mechanism 3 is opened and the wafer transfer ring 10 is brought into close contact with the upper claw portion 31 and moves upward together with the upper claw portion 31, before reaching the open limit position of the opening / closing chuck 30, the rod-like stoppers 41 a and 41 b And the upper surface or upper end of the wafer transfer ring 10 abut. By doing so, the upward movement of the wafer transfer ring 10 is restricted.

  Thereafter, since the opening / closing chuck 30 is further opened toward the open limit position, the close contact between the wafer transfer ring 10 and the upper claw portion 31 is peeled off, and the wafer transfer ring 10 is released from the holding state. At this time, it is preferable to reduce the distance in the Z direction between the wafer transfer ring 10 and the contact portion of the stopper portion 4 when the open / close gripping mechanism 3 is in the closed state. By doing so, the drop distance after the wafer transfer ring 10 abuts against the stopper portion 4 can be reduced, the position is hardly displaced in the horizontal direction (that is, the XY direction), and the impact due to the drop can be reduced.

[Stopper variation]
FIG. 2 is a side view showing a second example of the embodiment embodying the present invention.
Instead of the rod-shaped stoppers 41 a and 41 b exemplified above, spherical stoppers 42 a and 42 b having a spherical tip are attached to the side of the opening / closing chuck 30. The tip ends of the spherical stoppers 42a and 42b are arranged on the inner side of the outer periphery of the wafer transfer ring 10, and are not in contact with the wafer transfer ring 10 when the open / close gripping mechanism 3 is in a closed state, that is, the wafer transfer. It is arranged above the ring 10 for use. Then, before the opening / closing gripping mechanism 3 is opened, the wafer transfer ring 10 is brought into close contact with the upper claw portion 31 and moves upward together with the upper claw portion 31, and before reaching the open limit position of the opening / closing chuck 30, the spherical stoppers 42 a and 42 b. The spherical portion at the tip of the wafer contacts the upper surface or upper end of the wafer transfer ring 10. By doing so, the upward movement of the wafer transfer ring 10 is restricted.

FIG. 3 is a side view showing a third example of the embodiment embodying the present invention.
Instead of the rod-shaped stoppers 41 a and 41 b exemplified above, bent stoppers 43 a and 43 b that are bent from the intermediate portion to the tip portion are attached to the side of the opening / closing chuck 30. The bent stoppers 43a and 43b are arranged such that the starting point of bending is located outside the outer periphery of the wafer transfer ring 10, and the tip portion is located inside the outer periphery of the wafer transfer ring 10. When the gripping mechanism 3 is in the closed state, the gripping mechanism 3 is disposed at a position not in contact with the wafer transfer ring 10, that is, above the wafer transfer ring 10. Then, before the opening / closing gripping mechanism 3 is opened and the wafer transfer ring 10 is brought into close contact with the upper claw portion 31 and moves upward together with the upper claw portion 31, before reaching the open limit position of the opening / closing chuck 30, the bending type stopper 43 a, The abutting portion 43b abuts on the upper end portion of the wafer transfer ring 10. By doing so, the upward movement of the wafer transfer ring 10 is restricted.

FIG. 4 is a side view showing a fourth example of the embodiment embodying the present invention.
In place of the rod-shaped stoppers 41 a and 41 b exemplified above, inclined stoppers 44 a and 44 b that are entirely inclined with respect to the upper surface of the wafer transfer ring 10 are attached to the sides of the opening / closing chuck 30. The tip ends of the inclined stoppers 44a and 44b are arranged on the inner side of the outer periphery of the wafer transfer ring 10, and when the open / close gripping mechanism 3 is in the closed state, the position does not contact the wafer transfer ring 10, that is, the wafer. It is disposed above the transport ring 10. Then, before the opening / closing gripping mechanism 3 is opened and the wafer transfer ring 10 is brought into close contact with the upper claw portion 31 and moves upward together with the upper claw portion 31, the inclined stopper 44 a, The contact portion 44b contacts the upper end portion of the wafer transfer ring 10. By doing so, the upward movement of the wafer transfer ring 10 is restricted.

  Since the stopper portion 4 has the shape illustrated with reference to FIGS. 2 to 4 described above, when the opening / closing chuck 30 is further opened from the contact state with the wafer transfer ring 10 toward the open limit position, the stopper portion 4 is used for wafer transfer. The adhesion between the ring 10 and the upper claw portion 31 is peeled off, and the wafer transfer ring 10 is released from the gripping state.

The contact portion of the lower surface of the stopper portion with the wafer transfer ring 10 may be a plane,
If the adhesive force is exerted by contact with the wafer transfer ring 10 on the lower surface of the stopper portion, it is preferable to make line contact or point contact so that the contact area of the contact portion is reduced. In the case of line contact, if the cross section of the stopper portion is polygonal, it may be arranged so that the ridge portion is a contact portion, and if the cross section of the stopper portion is circular, line contact is obtained.
On the other hand, when making point contact, the abutting portion of the tip portion of the stopper portion 4 with the wafer transfer ring 10 may be spherical or conical.
Therefore, re-adhesion at the contact portion between the stopper portion 4 and the wafer transfer ring 10 hardly occurs, and the wafer transfer ring is in a state where the adhesive force at the contact portion between the stopper portion 4 and the wafer transfer ring 10 is weak. 10 and the upper claw portion 31 are released, and the wafer transfer ring 10 and the stopper portion 4 are easily released by the weight of the wafer transfer ring 10. By doing so, it becomes difficult for the wafer transfer ring 10 to be displaced after the grip is released.

Therefore, the bar-shaped stoppers 41a and 41b described above may have a bar-shaped cross section having a circular shape, a triangular shape, a quadrangular shape, or another polygonal shape.
The stopper material can be exemplified by metal or resin, and the surface is preferably provided with an anti-stick coating or processing.

Moreover, although the stopper part 4 may be comprised with one member, multiple pieces can be arrange | positioned. By doing so, since the plurality of stopper portions 4 are simultaneously contacted, the load concentrated on each contact portion is reduced, and deformation and breakage of the wafer transfer ring 10 can be prevented.
Further, it is preferable that a plurality of the stopper portions arranged in plurality are arranged with the upper claw portion 31 therebetween. By doing so, it is possible to prevent the material to be conveyed from tilting and opening the grip when the upper claw portion 31 is opened.

  Although the example in which the stopper unit 4 is attached to the opening / closing chuck 30 has been described above, the stopper unit 4 may be attached to the hand unit 2 or via a fixing bracket. The structure which restrict | limits continuing moving upwards in the state closely_contact | adhered to the part 31 should just be made.

  In the above example, the contact portion of the stopper portion 4 is in contact with the upper surface or upper end portion of the wafer transfer ring 10. However, the contact portion of the stopper portion 4 is in contact with the upper end portion of the wafer transfer ring 10. It is more preferable to abut. This is because if the upper end portion (corner portion) of the wafer transfer ring 10 is used, the adhesive force with the stopper portion 4 does not reach or the adhesive force is weak.

By using the gripping hand 1 described above, the gripping, transporting and releasing operations can be performed quickly and reliably even when the adhesive part of the transported member having the adhesive material on the surface is gripped. In addition, since the adhesive part is gripped during transport, even if external vibration is applied or high-speed transport with sudden acceleration / deceleration is performed, there is a risk that the gripped hand will be misaligned or dropped. Absent.

DESCRIPTION OF SYMBOLS 1 Holding hand 2 Hand main-body part 3 Opening-closing holding mechanism 4 Stopper part 10 Wafer conveyance ring 31 Upper nail | claw part 33 Lower claw part 41 Bar-shaped stopper 42 Spherical stopper 43 Bending type stopper 44 Inclined type stopper

Claims (4)

In a gripping hand for gripping a transported member having an adhesive material on the surface,
In the main body of the gripping hand,
An upper claw portion and a lower claw portion for gripping the upper surface and the lower surface of the peripheral portion of the transported member;
An opening and closing gripping mechanism for opening and closing the upper nail portion and the lower nail portion;
A stopper portion capable of coming into contact with the upper surface or upper end portion of the transported member,
The stopper part is
The gripping hand is disposed above the contact portion of the transported member when the open / close gripping mechanism is in a closed state.
The gripping hand according to claim 1, wherein the transported member is a grip ring for transporting a semiconductor wafer.
The gripping hand according to claim 1, wherein the contact portion between the transported member and the stopper portion is in point contact or line contact.
  The gripping hand according to claim 1, wherein a plurality of the stopper portions are arranged across the upper claw portion.

Images