JP2012195482A - Unit for configuring capacitor and capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a unit having compatibility with a conventional laminated capacitor, and useful for satisfying the requirements of higher capacity.SOLUTION: A unit U10 comprises: a rectangular dielectric plate 11 having a plurality of through holes 11a formed in the thickness direction; a first conductor film 14 covering the region of the upper surface of the plate excepting the front end thereof; a first insulator film 16 covering the front end of the upper surface of the plate; a second conductor film 15 covering the region of the lower surface of the plate excepting the rear end thereof; a second insulator film 17 covering the rear end of the lower surface of the plate; a plurality of first electrode rods 12 arranged on the inside of some of the plurality of through holes 11a and connected electrically with the first conductor film 14 but insulated electrically from the second conductor film 15; and a plurality of second electrode rods 13 arranged on the inside of the remainder of the plurality of through holes 11a and connected electrically with the second conductor film 15 but insulated electrically from the first conductor film 14.

Description

  The present invention relates to a unit used when a capacitor is configured, and a capacitor configured using the unit.

  Currently, several hundreds of multilayer capacitors are used for electronic devices such as mobile phones, notebook computers, video cameras, and digital cameras. The reason why multilayer capacitors are widely used in various electronic devices is that they are excellent in mountability on circuit boards and have a large capacity despite being small. As an example, a multilayer capacitor (rated voltage: 4.0 V) having a 0603 size and a capacity of 0.47 μF has already been commercialized.

  In recent years, “further increase in capacity” has been demanded for multilayer capacitors as performance of various electronic devices increases. “Further increase in capacity” in multilayer capacitors can be improved by changing the number and thickness of internal electrode layers, but it is actually possible to satisfy the requirements for “higher capacity” without changing the external size. Extremely difficult.

  The series of requirements described above are (1) excellent in mountability, (2) small size, (3) large capacity, and (4) following further increase in capacity. ,It is in. In other words, from a different viewpoint, it is only necessary to provide a new capacitor that is compatible with the conventional multilayer capacitor and can satisfy the requirement (4).

  Incidentally, an approach to a capacitor structure suitable for satisfying the requirements (2) and (3) has already been made by the present applicant (see Patent Document 1). This capacitor structure includes a pair of conductor layers facing each other at a predetermined interval, a dielectric layer made of a valve metal oxide and provided between the pair of conductor layers, and a pair of conductor layers on the dielectric layer. A plurality of substantially columnar holes penetrating in an orthogonal direction, and a plurality of holes filled in a part of the plurality of holes, one end conducting to one conductor layer and the other end insulated from the other conductor layer A first electrode and a plurality of second electrodes filled in a hole not filled with the first electrode of the plurality of holes and having one end conducting to the other conductor layer and the other end insulated from the one conductor layer; It has.

  The capacitor structure disclosed in Patent Document 1 is suitable for satisfying the requirements (2) and (3), but is compatible with a conventional multilayer capacitor and satisfies the requirement (4). In order to provide a satisfactory new capacitor, in addition to the structural device that satisfies the requirements (1) and (4), the manufacturing cost of the new capacitor is equal to or less than the manufacturing cost of the conventional multilayer capacitor. Structural ingenuity is required. In particular, the latter structural contrivance is extremely important when commercializing a new capacitor, and even if a new capacitor is commercialized without the contrivance, the unit price is a bottleneck and cannot be accepted by the user.

  Patent Documents 2 and 3 disclose capacitor structures similar to the capacitor structure disclosed in Patent Document 1. However, the capacitor structure disclosed in Patent Document 2 includes a semiconductor grain boundary insulating dielectric ceramic having a plurality of through holes extending toward opposite end faces, and external connections provided on the opposite end faces of the dielectric ceramic. The electrode for capacity and the electrode body for capacity | capacitance inserted in each through-hole of the dielectric ceramic are electrically connected to the external connection electrodes which are adjacent to each other. Since the one corresponding to one dielectric layer is a semiconductor grain boundary insulation type dielectric ceramic, it is substantially different from the capacitor structure disclosed in Patent Document 1.

  The capacitor structure disclosed in Patent Document 3 includes a first electrode having a planar electrode layer and a cylindrical body, a dielectric thin film formed on the surface of the first electrode so as to cover the cylindrical body, And a second electrode formed on the surface of the dielectric thin film so as to cover the outside of the cylindrical body through the dielectric thin film. A dielectric thin film corresponds to the dielectric layer of Patent Document 1. Therefore, the capacitor structure disclosed in Patent Document 1 is substantially different.

Japanese Patent No. 4493686 Japanese Patent Publication No. 61-029133 JP 2003-249417 A

  An object of the present invention is to provide a unit that is compatible with a conventional multilayer capacitor and is useful for constructing a capacitor that satisfies the demand for further increase in capacity, and is compatible with a conventional multilayer capacitor. And providing a capacitor that satisfies the demand for larger capacity.

  In order to achieve the above object, a capacitor constituting unit according to the present invention includes a rectangular dielectric plate having a predetermined thickness and having a plurality of through holes in the thickness direction, and one of the dielectric plates. A first conductor film formed so as to cover a region excluding one end portion of the through hole exposed surface, and a first insulator film formed so as to cover the one end portion of one through hole exposed surface of the dielectric plate A second conductor film formed to cover a region excluding the other end of the other through hole exposed surface of the dielectric plate, and the other end of the other through hole exposed surface of the dielectric plate. A second insulator film formed so as to cover; and disposed inside a part of the plurality of through holes of the dielectric plate, electrically connected to the first conductor film, and the second conductor film A plurality of first electrode bars electrically insulated from each other, and the dielectric A plurality of second electrode rods disposed inside the remainder of the plurality of through holes of the rate, electrically connected to the second conductor film, and electrically insulated from the first conductor film. ing.

  On the other hand, the first capacitor according to the present invention has a structure in which n units (n is an integer of 2 or more) are stacked and integrated in the thickness direction, and two adjacent units are first conductors. The films or the second conductor films face each other and are electrically connected to each other, the edge of the first conductor film of each unit is exposed on one of the two opposing faces, and the other A rectangular parallelepiped unit laminated body in which the edge of the second conductor film of each unit is exposed, and an insulating property formed so as to cover the surface excluding the two opposed faces of the unit laminated body One exterior formed so as to cover at least one of the two opposing surfaces of the exterior laminate film and the unit laminate, and electrically connected to the edge of the first conductor film of each unit Terminals and the two opposing surfaces of the unit laminate The other surface of the inner is formed so as to cover at least, and a, and the other external terminal electrically connected to the end edge of the second conductive layer of each unit.

  Further, the second capacitor according to the present invention has a structure in which n units (n is an integer of 2 or more) are stacked and integrated in the thickness direction, and two adjacent units are the first conductors. The film and the second conductor film face each other and are electrically insulated via the insulator layer, and the edge of the first conductor film of each unit is exposed on one of the two opposing faces. In addition, the other surface covers a rectangular parallelepiped unit laminated body in which the edge of the second conductor film of each unit is exposed, and a surface excluding the two opposed surfaces of the unit laminated body. It is formed so as to cover at least one of the two opposing surfaces of the unit laminate body and the formed insulating exterior film, and is electrically connected to the edge of the first conductor film of each unit One external terminal and the two opposite of the unit laminate Is formed the other surface of the surface so as to at least cover, and a, and the other external terminal electrically connected to the end edge of the second conductive layer of each unit.

  The unit according to the present invention has a structure in which a large capacity can be secured between the first conductor film and the second conductor film, and n pieces (n is an integer of 2 or more) are stacked and integrated in the thickness direction. And a first insulator film and a second insulator film suitable for connecting the capacitors in parallel. In addition, since this unit has a simple structure, its production is easy and does not cost much.

  That is, if the unit is used, as the unit capacitor laminate of the first capacitor according to the present invention, the first conductor films of the two adjacent units or the second conductor films face each other and are electrically connected, A rectangular parallelepiped shape in which the edge of the first conductor film of each unit is exposed on one of the two opposing faces, and the edge of the second conductor film of each unit is exposed on the other face. A capacitor in which n capacitors are connected in parallel between a pair of external terminals can be easily manufactured by forming an insulating exterior film and a pair of external terminals in the unit laminate. That is, if the unit is prepared in advance, the capacitor can be manufactured by a simple process. Therefore, the manufacturing cost can be made equal to or less than the manufacturing cost of the conventional multilayer capacitor, and the increase in the unit price can be avoided.

  In addition, if the unit is used, the first conductor film and the second conductor film of two adjacent units face each other as a unit laminated body of the second capacitor according to the present invention and are electrically connected through the insulator layer. The edge of the first conductor film of each unit is exposed on one of the two opposing surfaces, and the edge of the second conductor film of each unit is exposed on the other surface. A rectangular parallelepiped shape can be easily manufactured, and by forming an insulating exterior film and a pair of external terminals in the unit laminate, a capacitor in which n capacitors are connected in parallel between the pair of external terminals can be easily obtained Can be manufactured. That is, if the unit is prepared in advance, the capacitor can be manufactured by a simple process. Therefore, the manufacturing cost can be made equal to or less than the manufacturing cost of the conventional multilayer capacitor, and the increase in the unit price can be avoided.

  In short, the unit is very useful for constructing a capacitor that is compatible with a conventional multilayer capacitor and satisfies the demand for further increase in capacity. Further, the capacitor is compatible with a conventional multilayer capacitor and satisfies the demand for further increase in capacity. Moreover, by changing the number of units used, the capacity of the capacitor itself can be easily changed according to needs.

  The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

FIG. 1 is a top view of the unit. FIG. 2 is a left side view of the unit shown in FIG. 3 is a cross-sectional view taken along line S11-S11 in FIG. 4 is a cross-sectional view taken along line S12-S12 of FIG. FIG. 5 is a cross-sectional view taken along line S13-S13 in FIG. FIG. 6 is a diagram for explaining a method of manufacturing the unit shown in FIG. FIG. 7 is a diagram for explaining a method of manufacturing the unit shown in FIG. FIG. 8 is a diagram for explaining a method of manufacturing the unit shown in FIG. FIG. 9 is a diagram for explaining a method of manufacturing the unit shown in FIG. FIGS. 10A to 10C are diagrams showing a modification of the unit shown in FIG. FIG. 11A to FIG. 11C are diagrams showing another modification of the unit shown in FIG. FIG. 12 is an external perspective view of a capacitor (first embodiment of a capacitor) configured using the unit shown in FIG. 13 is a cross-sectional view taken along line S21-S21 in FIG. FIG. 14 is an equivalent circuit of the capacitor shown in FIG. FIG. 15 is a diagram for explaining a method of manufacturing the capacitor shown in FIG. FIG. 16 is a diagram for explaining a method of manufacturing the capacitor shown in FIG. FIG. 17 is a diagram for explaining a method of manufacturing the capacitor shown in FIG. FIG. 18 is a diagram for explaining a method of manufacturing the capacitor shown in FIG. FIG. 19 is a cross-sectional view corresponding to FIG. 13 showing a modification of the capacitor shown in FIG. FIG. 20 is an equivalent circuit of the capacitor shown in FIG. FIG. 21 is a cross-sectional view corresponding to FIG. 13 of a capacitor (second embodiment of a capacitor) configured using the unit shown in FIG. FIG. 22 is an equivalent circuit of the capacitor shown in FIG. FIG. 23 is a diagram for explaining a method of manufacturing the capacitor shown in FIG. FIG. 24 is a diagram for explaining a method of manufacturing the capacitor shown in FIG. FIG. 25 is a diagram for explaining a method of manufacturing the capacitor shown in FIG. FIG. 26 is a diagram for explaining a method of manufacturing the capacitor shown in FIG. FIG. 27 is a cross-sectional view corresponding to FIG. 21, showing a modification of the capacitor shown in FIG. FIG. 28 is an equivalent circuit of the capacitor shown in FIG.

<< Unit U10 used when configuring capacitor >>
Hereinafter, with reference to FIGS. 1 to 9, the structure of the unit U <b> 10 used when configuring the capacitor described later and a preferable manufacturing method will be described. In the description here, for the sake of convenience of explanation, the left, right, bottom, top, front, and back in FIG. 1 are referred to as front, back, left, right, top, and bottom, respectively, and correspond to these in FIGS. The direction is also referred to similarly.

<Structure of unit U10>
The unit U10 shown in FIGS. 1 to 5 is used when a 0603 size capacitor is configured, and includes a dielectric plate 11, a first electrode rod 12, a second electrode rod 13, and a first electrode. A conductor film 14, a second conductor film 15, a first insulator film 16, and a second insulator film 17 are provided.

  The dielectric plate 11 has a rectangular outline in top view and a predetermined thickness (vertical dimension). The dielectric plate 11 is made of a valve metal oxide (= dielectric) such as Al, Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, etc., and has a thickness of 50 to 150 μm. The front-rear dimension of the dielectric plate 11 is slightly smaller than 0.6 mm, and the left-right dimension is slightly smaller than 0.3 mm.

  Further, a plurality of through holes 11a in the thickness direction having a circular cross-sectional shape and a predetermined inner diameter (a total of 108 in the drawing) are arranged in a predetermined arrangement in a portion excluding the front surface vicinity portion and the rear surface vicinity portion of the dielectric plate 11. Specifically, it is formed of a regular hexagonal regular array (see regular hexagons shown in FIG. 3) whose centers are located at the corners of regular hexagons. The inner diameter of each through hole 11a is 15 to 45 nm.

  The first electrode rod 12 is disposed inside a part (54 in the drawing) of the plurality of through holes 11a formed in the dielectric plate 11, and is in close contact with the inner surface. Each first electrode rod 12 is made of a conductive material such as a pure metal such as Cu, Ni, Co, Cr, Ag, Au, Pd, Fe, Sn, Pb, and Pt, or an alloy thereof, and each outer diameter is a through hole. It is the same as the inner diameter of 11a. As can be seen from FIGS. 4 and 5, the upper end of each first electrode rod 12 is flush with the upper surface (one through hole exposed surface) of the dielectric plate 11, and the lower end of each first electrode rod 12 is dielectric. The body plate 11 is slightly retracted from the lower surface (other exposed surface of the through hole). That is, an insulating gap 12a formed of a gap exists between the lower end of each first electrode rod 12 and the lower surface of the dielectric plate 11 (the other through hole exposed surface). The vertical dimension of each insulating gap 12a is 5 to 15 μm. As can be seen from FIG. 3, when the through-holes 11a are arranged at equal intervals in the left-right direction (in the drawing, 5 rows and 4 rows) as one row, 1, 2, 5, 6, 9 from the front. Since the first electrode rods 12 exist in the tenth, thirteenth, fourteenth, seventeenth, eighteenth, twenty-first, twenty-first and twenty-second rows, the first electrode rods 12 are positioned such that their centers are located at the vertices of the solid line in the left-right direction. They are lined up.

  The second electrode rod 13 is disposed inside the remaining portions (54 in the drawing) of the plurality of through holes 11a formed in the dielectric plate 11, and is in close contact with the inner surface. Each second electrode rod 13 is made of a pure metal such as Cu, Ni, Co, Cr, Ag, Au, Pd, Fe, Sn, Pb, and Pt, or a conductor material such as an alloy thereof, and each outer diameter is a through hole. It is the same as the inner diameter of 11a. As can be seen from FIGS. 4 and 5, the lower end of each second electrode bar 13 is flush with the lower surface of the dielectric plate 11 (the other through-hole exposed surface), and the upper end of each second electrode bar 13 is dielectric. The body plate 11 is slightly retracted from the upper surface (one through hole exposed surface). That is, an insulating gap 13a formed of a gap exists between the upper end of each second electrode bar 13 and the upper surface (one through hole exposed surface) of the dielectric plate 11. The vertical dimension of each insulating gap 13a is 5 to 15 μm. As can be seen from FIG. 3, when the through-holes 11 a are arranged at equal intervals in the left-right direction (5 rows and 4 rows in the drawing) as one row, 3, 4, 7, 8, 11 from the front. , 12, 15, 16, 19, 20, 23, and 24 th row, the second electrode rods 13 are located at the vertices of broken lines in the left-right direction. They are lined up. In short, the arrangement of the first electrode bars 13 indicated by the solid wavy lines in FIG. 3 and the arrangement of the second electrode bars 13 indicated by the broken wavy lines are alternately present in the front-rear direction of the dielectric plate 11.

  The first conductor film 14 is formed so as to cover a rectangular region excluding the front end portion of the upper surface (one through hole exposed surface) of the dielectric plate 11 and is in close contact with the region. The first conductor film 14 is made of a conductive material such as pure metals such as Cu, Ni, Cr, Ag, Au, Pd, Fe, Sn, Pb, Pt, Ir, Rh, Ru, Al, Ti, and alloys thereof. Its thickness (vertical dimension) is 0.5 to 1.5 μm. The left and right dimensions of the first conductor film 14 are the same as the left and right dimensions of the dielectric plate 11, and the preferred front and rear dimensions are 85/100 to 95/100 of the front and rear dimensions of the dielectric plate 11. As can be seen from FIGS. 4 and 5, the lower surface of the first conductive film 14 is electrically connected to the upper end of each first electrode rod 12, but the lower surface is connected to the upper end of each second electrode rod 13. It is electrically insulated via 13a. The rear surface of the first conductor film 14 is flush with the rear surface of the dielectric plate 11. A preferred embodiment of the first conductor film 14 is a two-layer structure of a Ti film and a Cu film covering the Ti film. However, the first conductor film 14 can be satisfactorily adhered to the dielectric plate 11 and can be electrically connected to each first electrode rod 12. There are no particular restrictions on the number of layers and materials as long as the material can be satisfactorily performed.

  The second conductor film 15 is formed so as to cover a rectangular region excluding the rear end portion of the lower surface (the other through hole exposed surface) of the dielectric plate 11, and is in close contact with the region. The second conductive film 15 is made of a conductive material such as pure metals such as Cu, Ni, Cr, Ag, Au, Pd, Fe, Sn, Pb, Pt, Ir, Rh, Ru, Al, Ti, and alloys thereof. Its thickness (vertical dimension) is 0.5 to 1.5 μm. The left and right dimensions of the second conductor film 15 are the same as the left and right dimensions of the dielectric plate 11, and the preferred front and rear dimensions are 85/100 to 95/100 of the front and rear dimensions of the dielectric plate 11. As can be seen from FIGS. 4 and 5, the upper surface of the second conductor film 15 is electrically connected to the lower end of each second electrode rod 13, and the upper surface is electrically connected to the lower end of each first electrode rod 12. It is electrically insulated through 12a. The front surface of the second conductor film 15 is flush with the front surface of the dielectric plate 11. A preferred embodiment of the second conductor film 15 is a two-layer structure of a Ti film and a Cu film covering the Ti film. However, the second conductor film 15 can be satisfactorily adhered to the dielectric plate 11 and can be electrically connected to each second electrode rod 13. There are no particular restrictions on the number of layers and materials as long as the material can be satisfactorily performed.

  The first insulator film 16 is formed so as to cover the front end portion of the upper surface (one through-hole exposed surface) of the dielectric plate 11, that is, the rectangular front region where the first conductor film 14 is not formed, The rear surface is in close contact with the front surface of the first conductor film 14. The first insulator film 16 is made of an insulator material such as epoxy resin, phenol resin, unsaturated polyester, polyimide, etc., and its thickness (vertical dimension) is the same as that of the first conductor film 14. The left and right dimensions of the first insulator film 16 are the same as the left and right dimensions of the dielectric plate 11, and the front and rear dimensions are “front and rear dimensions of the dielectric plate 11” − “front and rear dimensions of the first conductor film 14”. As can be seen from FIGS. 4 and 5, the front surface of the first insulator film 16 is flush with the front surface of the dielectric plate 11.

  The second insulator film 17 is formed so as to cover the rear end portion of the lower surface of the dielectric plate 11 (the exposed surface of the other through hole), that is, the rectangular rear region where the second conductor film 15 is not formed. In addition, it is in close contact with the rear region, and its front surface is in close contact with the rear surface of the second conductor film 15. The second insulator film 17 is made of an insulator material such as epoxy resin, phenol resin, unsaturated polyester, polyimide, etc., and its thickness (vertical dimension) is the same as that of the second conductor film 15. The left and right dimensions of the second insulator film 17 are the same as the left and right dimensions of the dielectric plate 11, and the front and rear dimensions are “front and rear dimensions of the dielectric plate 11” − “front and rear dimensions of the second conductor film 15”. As can be seen from FIGS. 4 and 5, the rear surface of the second insulator film 17 is flush with the rear surface of the dielectric plate 11.

  In the unit U10, each first electrode rod 12 existing in the dielectric plate 11 is electrically connected to the first conductor film 14 and is not in contact with each first electrode rod 12 in the dielectric plate 11. Since each of the second electrode bars 13 is electrically connected to the second conductor film 15, a predetermined capacity (large capacity) can be secured between the first conductor film 14 and the second conductor film 15. it can.

<Preferred production method of unit U10>
When producing the unit U10, as shown in FIG. 6, first, a plate base material BM for the dielectric plate 11 is prepared, and after forming pits serving as a base point for anodization on the plate base material BM, Two types of holes BMa and BMb (BMa in FIG. 6 indicates a through-hole and BMb indicates a non-penetrating hole) having different depths are formed by two-step anodizing treatment.

  Subsequently, as shown in FIG. 7, the seed layer SL made of Cu or the like is formed on the upper surface of the plate base material BM by the PVD process (physical vapor deposition process) with the front and rear dimensions and the left and right dimensions corresponding to the first conductor film 14. After the formation, the hole BMa is filled with the conductor material CM for the first electrode rod 12 by an electrolytic plating process using the seed layer SL.

  Subsequently, as shown in FIG. 8, the seed layer SL is removed from the plate base material BM, and the lower surface side of the plate base material BM (the lower part than the broken line in FIG. 7) so that the lower end of the hole BMb is opened. ) Is removed to obtain the dielectric plate 11. Then, after the second conductor film 15 is formed on the lower surface of the dielectric plate 11 by the PVD process, the second electrode is formed in the hole BMb (here, a through-hole is shown) by the electrolytic plating process using the second conductor film 15. The conductor material CM for the rod 13 is filled.

  Subsequently, as shown in FIG. 9, the first conductor film 14 is formed on the upper surface of the dielectric plate 11 by PVD processing.

  Subsequently, the first insulator film 16 is formed at the front end portion of the upper surface of the dielectric plate 11 by applying and curing the insulator material, and the second insulator film 17 is formed at the rear end portion of the lower surface of the dielectric plate 11. Form. Thus, the unit U10 is manufactured.

<Modification of unit U10>
(1) The dielectric plate 11 has a plurality of through holes 11a formed in portions excluding the vicinity of the front surface and the vicinity of the rear surface. The plurality of through holes 11a are arranged in a predetermined arrangement on the entire dielectric plate 11. It may be formed by. In this case, depending on the manufacturing method, the number of the first electrode rods 12 and the second electrode rods 13 in the through-holes 11a below the first insulator film 16 and the through-holes 11a above the second insulator film 17 is different. However, the structure of the unit U10 causes no particular problem in the performance of the unit U10 itself, and no particular problem occurs in the performance of the capacitor described later. Of course, the through-hole 11a existing on the lower side of the first insulator film 16 and the through-hole 11a existing on the upper side of the second insulator film 17 are connected to the conductor material CM for the first electrode rod 12 and the second hole 11a. If a mask is attached in advance to the opening of the through hole 11a so as not to be filled with the conductor material CM for the electrode rod 13, the through hole 11a can be left as a hole. Further, an appropriate insulator material may be previously filled in the through hole 11a so that the through hole is not filled with the conductor material CM for the first electrode rod 12 and the conductor material CM for the second electrode rod 13. For example, the through hole 11 a can be a dielectric portion similar to the dielectric plate 11.

  (2) Although a total of 108 through holes 11a are formed in the dielectric plate 11, the number of through holes 11a may be more or less than 108. Further, the first electrode rod 12 is provided in 54 through-holes 11a corresponding to half of the 108 pieces, and the second electrode rod 13 is provided in the remaining 54 through-holes 11a. The number of electrode rods 12 and the number of second electrode rods 13 do not necessarily need to match.

  (3) The arrangement of the first electrode rod 12 and the second electrode rod 13 in the dielectric plate 11 is indicated by the solid line broken line and the broken line broken line in FIG. 3, and is shown in each of FIGS. 10 (A) to 10 (C). Other arrangements may be used. In FIG. 10A, the first electrode rods 12 are arranged such that their centers are located on a solid straight line in the left-right direction, and the second electrode rods 13 are arranged on the broken line straight line in the left-right direction. The first electrode rods 12 and the second electrode rods 13 are alternately arranged in the front-rear direction. In FIG. 10B, the first electrode rods 12 are arranged so that their centers are located at the corners of the solid regular hexagon, and the second electrode rods 13 are arranged so as to be located at the center of the solid regular hexagon. Yes. In FIG. 10 (C), the first electrode rods 12 are arranged so that their centers are located on a solid straight line in an oblique direction of 30 degrees with the left-right direction, and the second electrode rods 13 are arranged in the same oblique direction. Each center is arranged so that it may be located on the straight line of a broken line, and the arrangement of the first electrode rods 12 and the arrangement of the second electrode rods 13 are alternately present in the direction orthogonal to the oblique direction. Of course, a regular arrangement other than the arrangement shown in FIG. 3 and FIGS. 10A to 10C may be adopted, or an arrangement having no regularity may be adopted.

  (4) Although the arrangement of the through holes 11a in the dielectric plate 11 is shown in FIG. 3, as shown in FIGS. 11 (A) to 11 (C), the odd-numbered rows from the front and the even-numbered rows from the front An arrangement (matrix arrangement) in which the columns are not displaced in the left-right direction may be employed. Further, in the case of such an arrangement of the through holes 11a, the arrangement shown in each of FIGS. 11A to 11C can be adopted as the arrangement of the first electrode rod 12 and the second electrode rod 13. In FIG. 11A, the first electrode rods 12 are arranged so that their centers are located at the vertices of the solid wavy lines in the left-right direction, and the second electrode rods 13 are arranged in the left-right direction with each broken line wavy line. The first electrode rods 12 and the second electrode rods 13 are alternately arranged in the front-rear direction. In FIG. 11B, the first electrode rods 12 are arranged so that their centers are located on a solid straight line in the left-right direction, and the second electrode rods 13 are arranged on their respective straight lines in the left-right direction. The first electrode rods 12 and the second electrode rods 13 are alternately arranged in the front-rear direction. In FIG. 11C, the first electrode rods 12 are arranged so that the centers thereof are located at the vertices of solid squares, and the second electrode rods 13 are arranged at the vertices of broken diamonds. Are lined up like Of course, a regular arrangement other than the arrangement shown in each of FIGS. 11A to 11C may be employed, or an arrangement having no regularity may be employed.

  (5) Although an air gap was shown as the insulating gap 12a of each first electrode rod 12, and an air gap was shown as the insulating gap 13a of each second electrode rod 13, each gap was filled with an insulator material such as polyimide, The filler may be employed as the insulating gaps 12a and 13a.

<< Capacitor C20 configured using unit U10 >>
Hereinafter, the structure of a capacitor C20 (first embodiment of the capacitor) configured by using four units U10 and a preferable manufacturing method will be described with reference to FIGS. In the description here, for convenience of explanation, the left, right, front, back, top, and bottom in FIG. 13 are referred to as front, back, left, right, top, and bottom, respectively, and those in FIGS. 12 and 15 to 18. The direction corresponding to is also referred to similarly.

<Structure of capacitor C20>
The capacitor C20 shown in FIGS. 12 and 13 is compatible with a conventional 0603 size multilayer capacitor, and is composed of a unit laminate 21, an insulating exterior film 22, a base conductor film 23, and a surface conductor. A pair of external terminals 25 constituted by the membrane 24 is provided, the front-rear dimension is 0.6 mm, and the left-right dimension is 0.3 mm.

  The unit stacked body 21 has a structure in which four units U10 are stacked in the vertical direction in the thickness direction and integrated, and the whole has a rectangular parallelepiped shape. Describing in detail the three-dimensional orientation of the four units U10, the first and third units U10 from the top are such that the first conductor film 14 and the first insulator film 16 are positioned above, and the first insulator film 16 is the front. The second and fourth units U10 from the top are in the three-dimensional direction in which the second conductor film 15 and the second insulator film 17 are located above and the second insulator film 17 is located behind. It is in. That is, the second conductor film 15 of the first unit U10 from the top faces the second conductor film 15 of the second unit U10 from the top, and the second insulator film 17 of the first unit U10 from the top is 2 from the top. It faces the second insulator film 17 of the second unit U10. The first conductor film 14 of the second unit U10 from the top faces the first conductor film 14 of the third unit U10 from the top, and the first insulator film 16 of the second unit U10 from the top is the third from the top. It faces the first insulator film 16 of the unit U10. The second conductor film 15 of the third unit U10 from the top faces the second conductor film 15 of the fourth unit U10 from the top, and the second insulator film 17 of the third unit U10 from the top is the fourth from the top. It faces the second insulator film 17 of the unit U10.

  The lower surface of the second conductor film 15 of the first unit U10 from the top and the upper surface of the second conductor film 15 of the second unit U10 from the top are coupled and electrically connected, and the second from the top. The lower surface of the first conductor film 14 of the unit U10 and the upper surface of the first conductor film 14 of the third unit U10 from the top are combined and electrically connected, and the second conductor film of the third unit U10 from the top is connected. The lower surface of 15 and the upper surface of the second conductor film 15 of the fourth unit U10 from the top are coupled and electrically connected. In addition to direct bonding methods such as diffusion bonding (thermocompression bonding), an indirect bonding method using a conductive bonding material such as solder or a conductive adhesive is employed for these electrical connections.

  That is, the rear end edge of the first conductor film 14 of each unit U10 and the rear end edge of the second insulator film 17 are exposed on the rear surface of the unit laminate 21, and the front end edge of the second conductor film 15 of each unit U10 The front edge of the first insulator film 16 is exposed on the front surface of the unit laminate 21.

  The insulating exterior film 22 is formed so as to continuously cover the left surface, the right surface, the upper surface, and the lower surface of the unit laminate 21. The insulating exterior film 22 is made of an insulating material such as epoxy resin, phenol resin, unsaturated polyester, polyimide, etc., and has a thickness (vertical dimension) of 1.5 to 4.5 μm.

  The front base conductor film 23 constituting the front external terminal 25 continuously covers the front surface of the unit laminate 21 and the left front end, right front front, upper front front, and lower front front of the insulating exterior film 22. It is formed as follows. The rear base conductor film 23 constituting the rear external terminal 25 includes the rear surface of the unit laminate 21 and the left rear end, the right rear end, the upper rear end, and the lower rear end of the insulating exterior film 22. Are continuously covered. Each base conductor film 23 is made of a conductive plastic and has a thickness of 5 to 15 μm. The plastic component of the conductive plastic is made of epoxy resin, phenol resin, unsaturated polyester, polyimide, or the like, and the metal component is made of Ag particles, Pd particles, Cu particles, Ni particles, or the like. As can be seen from FIG. 13, the inner surface of the base conductor film 23 on the front side is electrically connected to the front end edge of the second conductor film 15 of each unit U10, and the inner surface of the base conductor film 23 on the rear side is the first end of each unit U10. The one conductor film 14 is electrically connected to the rear end edge. Since each base conductor film 23 contains a metal component in an amount suitable for ensuring conductivity (for example, 80 to 90 wt%), the electrical connection between the first conductor film 14 and the second conductor film 15 is excellent. Yes. Since each base conductor film 23 contains a plastic component in an amount suitable for ensuring adhesion (for example, 10 to 20 wt%), adhesion to the unit laminate 21 and the insulating exterior film 22 can be performed satisfactorily.

  The front surface conductor film 24 constituting the front external terminal 25 is formed so as to cover the front base conductor film 23. The rear surface conductor film 24 constituting the rear external terminal 25 is formed so as to cover the rear base conductor film 23. Each surface conductor film 24 is made of a conductor material such as Ni, Sn, or Au, and has a thickness of 5 to 15 μm. As can be seen from FIG. 13, the inner surface of the front surface conductor film 24 is electrically connected to the surface of the front conductor film 23, and the inner surface of the rear surface conductor film 24 is the surface of the rear conductor film 23. Is electrically connected. A preferred embodiment of each surface conductor film 24 is a two-layer structure of a Ni film and a Sn film covering the surface of the Ni film. However, the electrical connection to each underlying conductor film 23 can be made well and to the pads of the circuit board. If the soldering can be performed satisfactorily, the number of layers and materials are not particularly limited.

  In the capacitor C20, the first conductor film 14 of each unit U10 is electrically connected to the rear external terminal 25, and the second conductor film 15 of each unit U10 is electrically connected to the front external terminal 25. Because of this structure, the equivalent circuit of the capacitor C20 is as shown in FIG. That is, when the capacity obtained by one unit U10 is C-U10, the capacitor C20 has an equivalent circuit in which four capacitors C-U10 are connected in parallel between a pair of external terminals 25.

<Preferred manufacturing method of capacitor C20>
When the capacitor C20 is manufactured, first, as shown in FIGS. 15 and 16, the second unit from the bottom on the second conductor film 15 and the second insulator film 17 of the first unit U10 from the bottom. The lower surfaces of the second conductor film 15 and the second insulator film 17 of U10 are overlapped, and the third unit U10 from the bottom on the upper surfaces of the first conductor film 14 and the first insulator film 16 of the second unit U10. The lower surfaces of the first conductor film 14 and the first insulator film 16 are overlapped, and the upper surfaces of the second conductor film 15 and the second insulator film 17 of the third unit U10 are overlapped with the fourth unit U10 from the bottom. After the lower surfaces of the second conductor film 15 and the second insulator film 17 are overlapped, the second conductor film 15 of the first unit U10 from the bottom and the second conductor film 15 of the second unit U10 from the bottom are joined. , Second unit U from the bottom The first conductor film 14 of 0 and the first conductor film 14 of the third unit U10 from the bottom are joined together, the second conductor film 15 of the third unit U10 from the bottom and the second conductor film 15 of the fourth unit U10 from the bottom. The unit laminated body 21 is produced by joining the conductor film 15.

  Subsequently, as shown in FIG. 17, for the insulating exterior film 22 so as to continuously cover the left surface, the right surface, the upper surface, and the lower surface of the unit laminate 21 using a coating device such as a roller coating machine or a spray coating machine. After applying the insulating material IMa (uncured material), the insulating material IMa is cured to produce the insulating exterior film 22.

  Subsequently, as shown in FIG. 18, the front surface of the unit laminate 21 and the left front end, the right front end, the upper front end, and the front surface of the insulating laminate film 22 are applied using a coating device such as a roller coating machine or a dip coating machine. A conductive plastic material CMa (uncured material) for the base conductor film 23 is applied so as to continuously cover the lower surface front end portion, and the rear surface of the unit laminate 21 and the left surface rear end portion of the insulating exterior film 22 are applied. After applying the conductive plastic material CMa (uncured) for the base conductor film 23 so as to continuously cover the rear end of the right surface, the rear end of the upper surface, and the rear end of the lower surface, each of the conductive plastic materials CMa is cured to produce each underlying conductor film 23.

  Subsequently, a surface conductor film 24 is formed on each surface of each base conductor film 23 by electrolytic plating. When the number of layers of the surface conductor film 24 is 2 or more, the electrolytic plating process corresponding to each layer is continued. Thus, the capacitor C20 is manufactured.

<Modification of Capacitor C20>
(1) Although each base conductor film 23 is made of a conductive plastic as the capacitor C20, each base conductor film 23 may be made of a conductor material such as Ti, Cu, Ni, Ag, or Pd. A preferred embodiment of each underlying conductor film 23 is a two-layer structure of a Ti film and a Cu film covering the Ti film. However, the electrical connection to the first conductor film 14 and the second conductor film 15 can be satisfactorily performed, and the unit There are no particular restrictions on the number of layers or materials, as long as adhesion to the laminate 21 and the insulating exterior film 22 can be satisfactorily performed.

  (2) Although the capacitor C20 is configured using four units U10, the number of the units U10 configuring the capacitor may be two, or three or more. When a capacitor is configured by using the three units U10, as shown in FIG. 19, the fourth unit U10 from the top of the capacitor C20 may be eliminated, and the capacitor C20-1 An equivalent circuit (see FIG. 20) in which three capacitors C-U10 are connected in parallel between a pair of external terminals 25 is obtained. Although not shown, when a capacitor is formed by using two units U10, a structure in which the third and fourth units U10 from the top of the capacitor C20 are excluded may be used. An equivalent circuit in which the capacitor C-U10 is connected in parallel between the pair of external terminals 25 is obtained. When a capacitor is configured using five units U10, a unit U10 that is in the same three-dimensional direction as the first unit U10 from the top is added below the fourth unit U10 from the top of the capacitor C20. In this capacitor, an equivalent circuit in which five capacitors C-U10 are connected in parallel between a pair of external terminals 25 can be obtained. Even when a capacitor is configured by using six or more units U10, the unit U10 may be added according to the three-dimensional orientation of each unit U10 of the capacitor C20.

<< Capacitor C30 configured using unit U10 >>
Hereinafter, with reference to FIG. 21 and FIG. 22, a structure and a preferable manufacturing method of another type of capacitor C30 (second embodiment of the capacitor) configured by using four units U10 will be described. In the description here, for the convenience of description, the left, right, front, back, top, and bottom in FIG. 21 are referred to as front, back, left, right, top, and bottom, respectively.

<Structure of capacitor C30>
A capacitor C30 shown in FIG. 21 is compatible with a conventional 0603 size multilayer capacitor, and includes a unit laminate 31, an insulating exterior film 32, a base conductor film 33, and a surface conductor film 34. The front and rear dimensions are 0.6 mm and the left and right dimensions are 0.3 mm.

  The unit laminated body 31 has a structure in which four units U10 are stacked in the vertical direction in the thickness direction and integrated, and the whole has a rectangular parallelepiped shape. Describing in detail the three-dimensional orientation of the four units U10, each unit U10 has a three-dimensional orientation in which the first conductor film 14 and the first insulator film 16 are located above and the first insulator film 16 is located in front. It is in. That is, the second conductor film 15 of the first unit U10 from the top faces the first conductor film 14 of the second unit U10 from the top, but the second insulator film 17 of the first unit U10 from the top is It does not face the first insulator film 16 of the second unit U10 from the top. The second conductor film 15 of the second unit U10 from the top faces the first conductor film 14 of the third unit U10 from the top, but the second insulator film 17 of the second unit U10 from the top is from above. It does not face the first insulator film 16 of the third unit U10. The second conductor film 15 of the third unit U10 from the top faces the first conductor film 14 of the fourth unit U10 from the top, but the second insulator film 17 of the third unit U10 from the top is from above. It does not face the first insulator film 16 of the fourth unit U10.

  In addition, the second conductor film 15 of the first unit U10 from the top and the first conductor film 14 of the second unit U10 from the top are electrically insulated via an insulator layer 31a in close contact with both, and from above The second conductor film 15 of the second unit U10 and the first conductor film 14 of the third unit U10 from the top are electrically insulated via an insulator layer 31a that is in close contact with both, and the third unit from the top The second conductor film 15 of U10 and the first conductor film 14 of the fourth unit U10 from the top are electrically insulated via an insulator layer 31a in close contact with both. Each insulator layer 31a is made of an insulator material such as epoxy resin, phenol resin, unsaturated polyester, polyimide, etc., and its thickness (vertical dimension) is 1.5 to 4.5 μm.

  That is, the rear edge of the first conductor film 14 of each unit U10 and the rear edge of the second insulator film 17 are exposed on the rear surface of the unit laminate 31, and the front edge of the second conductor film 15 of each unit U10 The front edge of the first insulator film 16 is exposed on the front surface of the unit laminate 31.

  The insulating exterior film 32 is formed so as to continuously cover the left surface, the right surface, the upper surface, and the lower surface of the unit laminate 31. Since the material and thickness of the insulating packaging film 32 are the same as those of the insulating packaging film 22 of the capacitor C20, description thereof is omitted.

  The front base conductor film 33 constituting the front external terminal 35 continuously covers the front surface of the unit laminate 31 and the left front end, the right front end, the top front end, and the bottom front end of the insulating exterior film 32. It is formed as follows. The rear base conductor film 33 constituting the rear external terminal 35 includes the rear surface of the unit laminate 31 and the left rear end, the right rear end, the upper rear end, and the lower rear end of the insulating exterior film 22. Are continuously covered. As can be seen from FIG. 21, the inner surface of the front conductor film 33 on the front side is electrically connected to the front edge of the second conductor film 15 of each unit U10, and the inner surface of the rear conductor film 33 on the rear side is connected to the second conductor film 15 of each unit U10. The one conductor film 14 is electrically connected to the rear end edge. Since the material, thickness, and the like of each base conductor film 33 are the same as those of the base conductor film 23 of the capacitor C20, description thereof is omitted.

  The front surface conductor film 34 constituting the front external terminal 35 is formed so as to cover the front base conductor film 33. The rear surface conductor film 34 constituting the rear external terminal 35 is formed so as to cover the rear base conductor film 33. As can be seen from FIG. 21, the inner surface of the front surface conductor film 34 is electrically connected to the surface of the front base conductor film 33, and the inner surface of the rear surface conductor film 34 is the surface of the rear base conductor film 33. Is electrically connected. Since the material and thickness of each surface conductor film 34 are the same as those of the surface conductor film 24 of the capacitor C20, the description thereof is omitted.

  In the capacitor C30, the first conductor film 14 of each unit U10 is electrically connected to the rear external terminal 35, and the second conductor film 15 of each unit U10 is electrically connected to the front external terminal 35. Because of this structure, an equivalent circuit of the capacitor C30 is as shown in FIG. That is, when the capacity obtained by one unit U10 is C-U10, the capacitor C30 has an equivalent circuit in which four capacitors C-U10 are connected in parallel between a pair of external terminals 35.

<Preferred manufacturing method of capacitor C30>
When manufacturing the capacitor C30, first, as shown in FIGS. 23 and 24, the top surface of the first conductor film 14 and the first insulator film 16 of the first unit U10 from the bottom is used for the insulator layer 31a. An insulating material IMb (uncured material) is applied, and the lower surfaces of the second conductor film 15 and the second insulating film 17 of the second unit U10 from the bottom are overlaid thereon, and the second unit U10 The insulator material IMb (uncured material) for the insulator layer 31a is applied to the top surfaces of the first conductor film 14 and the first insulator film 16, and the second conductor of the third unit U10 from the bottom is applied thereon. The lower surfaces of the film 15 and the second insulator film 17 are overlapped, and the insulator material IMb (not yet formed) for the insulator layer 31a is formed on the upper surfaces of the first conductor film 14 and the first insulator film 16 of the third unit U10. Apply a cured product) After repeated underside of the fourth second unit U10 conductive film 15 and the second insulator film 17, to produce a unit stack 31 shown in FIG. 13 by curing the insulating material IMb.

  Subsequently, as shown in FIG. 25, for the insulating exterior film 32 so as to continuously cover the left surface, the right surface, the upper surface, and the lower surface of the unit laminate 31 using a coating apparatus such as a roller coating machine or a spray coating machine. The insulating material IMa (uncured material) is applied, and then the insulating material IMa is cured to produce the insulating exterior film 32.

  Subsequently, as shown in FIG. 26, the front surface of the unit laminate 31 and the left front end, the right front end, the upper front end, and the front surface of the unit laminate 31 using a coating device such as a roller coating machine and a dip coating machine, A conductive plastic material CMa (uncured material) for the base conductor film 33 is applied so as to continuously cover the lower surface front end portion, and the rear surface of the unit laminate 31 and the left surface rear end portion of the insulating exterior film 32; After applying the conductive plastic material CMa (uncured material) for the base conductor film 33 so as to continuously cover the rear end of the right surface, the rear end of the upper surface, and the rear end of the lower surface, each of the conductive plastic materials CMa is cured to produce each underlying conductor film 33.

  Subsequently, a surface conductor film 34 is formed on each surface of each base conductor film 33 by electrolytic plating. When the number of layers of the surface conductor film 34 is two or more, the electrolytic plating process corresponding to each layer is continued. Thus, the capacitor C30 is manufactured.

<Modification of capacitor C30>
(1) Although each base conductor film 33 is made of a conductive plastic as the capacitor C30, each base conductor film 33 may be made of a conductor material such as Ti, Cu, Ni, Ag, or Pd. A preferred embodiment of each base conductor 323 is a two-layer structure of a Ti film and a Cu film covering the Ti film. However, the electrical connection to the first conductor film 14 and the second conductor film 15 can be satisfactorily performed, and the unit lamination There are no particular restrictions on the number of layers or materials, as long as adhesion to the body 31 and the insulating exterior film 32 can be satisfactorily performed.

  (2) Although the capacitor C30 is configured using four units U10, the number of the units U10 constituting the capacitor may be two, or three or more. When a capacitor is configured using three units U10, as shown in FIG. 27, a structure in which the fourth unit U10 from the top of the capacitor C20 and the third insulator layer 31a from the top are excluded, In the capacitor C30-1, an equivalent circuit (see FIG. 28) in which three capacitors C-U10 are connected in parallel between a pair of external terminals 35 is obtained. Although not shown, when a capacitor is formed using two units U10, the third and fourth units U10 from the top of the capacitor C30 and the second and third insulator layers 31a from above are provided. An equivalent circuit in which two capacitors C-U10 are connected in parallel between a pair of external terminals 35 can be obtained. When a capacitor is configured by using five units U10, a unit U10 in the same three-dimensional direction as the fourth unit U10 is added below the fourth unit U10 from the top of the capacitor C20. In the capacitor, an equivalent circuit in which five capacitors C-U10 are connected in parallel between a pair of external terminals 35 can be obtained. Even when a capacitor is formed by using six or more units U10, the unit U10 may be added according to the three-dimensional orientation of each unit U10 of the capacitor C30.

<< Effects of Unit U10 and Capacitors C20, C20-1, C30, and C30-1 >>
(1) The unit U10 has a structure capable of securing a large capacitance C-U10 between the first conductor film 14 and the second conductor film 15, and n (n is an integer of 2 or more) in the thickness direction. A first insulator film 16 and a second insulator film 17 suitable for connecting the capacitors C-U10 in parallel when stacked and integrated are provided. Further, since the unit U10 has a simple structure, it is easy to manufacture and does not cost much.

  That is, when the unit U10 is used, a unit laminate 21 having a structure in which n units U10 are stacked and integrated in the thickness direction as described in << Capacitor C20 configured using unit U10 >>. The first conductor films 14 or the second conductor films 15 of the two adjacent units U10 face each other and are electrically connected, and the rear edge of the first conductor film 14 of each unit U10 is exposed on the rear surface. In addition, a rectangular parallelepiped shape in which the front end edge of the second conductor film 15 of each unit U10 is exposed on the front surface can be easily manufactured, and an insulating exterior film 22 and a pair of external terminals 25 are provided on the unit laminate 21. As a result, it is possible to easily manufacture capacitors C20 and C20-1 in which n capacitors C-U10 are connected in parallel between a pair of external terminals 25. That is, if the unit U10 is prepared in advance, the capacitors C20 and C20-1 and the like can be manufactured by a simple process. Therefore, the manufacturing cost is made equal to or less than the manufacturing cost of the conventional multilayer capacitor, and the unit price increases. Can be avoided.

  Further, when the unit U10 is used, a unit laminate 31 having a structure in which n units U10 are stacked and integrated in the thickness direction as described in << Capacitor C30 configured using unit U10 >>. As described above, the first conductor film 14 and the second conductor film 15 of the two adjacent units U10 face each other and are electrically insulated via the insulator layer 31a, and the first conductor film 14 of each unit U10 is disposed on the rear surface. A rectangular parallelepiped with the rear end edge exposed and the front end edge of the second conductor film 15 of each unit U10 exposed on the front surface can be easily manufactured. By producing the pair of external terminals 35, the capacitors C30 and C30-1 in which n capacitors C-U10 are connected in parallel between the pair of external terminals 35 can be easily manufactured. That is, if the unit U10 is prepared in advance, the capacitors C30 and C30-1 and the like can be manufactured by a simple process. Therefore, the manufacturing cost is made equal to or lower than the manufacturing cost of the conventional multilayer capacitor, so that the unit price increases. Can be avoided.

  In short, the unit U10 is very useful for constructing a capacitor that is compatible with a conventional multilayer capacitor and satisfies the demand for further increase in capacity. Further, the capacitors C20, C20-1, C30, C30-1 and the like are compatible with conventional multilayer capacitors and satisfy the requirement for further increase in capacity. Moreover, by changing the number of units U10 used, the capacity of the capacitor itself can be easily changed according to needs.

  (2) Since the left and right dimensions of the first conductor film 14 and the second conductor film 15 of the unit U10 are the same as the left and right dimensions of the dielectric plate 11, capacitors C20 and C20 configured using n units U10. -1, C30, C30-1, etc., the electrical connection between the rear edge of the first conductor film 14 of each unit U10 and the rear external terminals (25, 35), and the second conductor of each unit U10 The electrical connection between the front end edge of the membrane 15 and the external terminals (25, 35) on the front side is performed well, and n capacitors C-U10 are reliably connected in parallel between the pair of external terminals (25, 35). it can.

  (3) Since the left and right dimensions of the first insulator film 16 and the second insulator film 17 of the unit U10 are the same as the left and right dimensions of the dielectric plate 11, a capacitor C20 configured using n units U10. , C20-1, C30, C30-1, etc., insulation between the first conductor film 14 of each unit U10 and the front external terminals (25, 35), and the second conductor film 15 and rear side of each unit U10 Thus, the n capacitors C-U10 can be reliably connected in parallel between the pair of external terminals (25, 35).

  (4) Direct bonding method such as diffusion bonding (thermocompression bonding) between the first conductor film 14 facing each other and the second conductor film 15 facing each other as described in the above-mentioned << capacitor C20 configured using unit U10 >>. If the unit laminate 21 is coupled and electrically connected by using the indirect bonding method using a conductive bonding material, the vertical size of the unit laminate 21 can be reduced, so that the capacitors C20 and C20-1 can be downsized. Can contribute even more.

<< Supplementary information on the manufacturing method of the unit U10 and the manufacturing method of the capacitors C20, C20-1, C30, C30-1, etc. >>
In the above description, in order to clarify the structure of the unit U10 and the structures of the capacitors C20, C20-1, C30, C30-1, etc., the unit U10 is shown as having a size corresponding to a single capacitor. 1 to 5, a unit base material in which the units U10 are continuously arranged in the front-rear direction and the left-right direction, that is, a unit base material from which a large number of units U10 are obtained by cutting into a lattice shape, is manufactured. In this case, the capacitor can be more easily manufactured using the unit base material.

  In other words, n unit base materials are stacked and integrated so as to match the three-dimensional orientation of n units (n is an integer of 2 or more) constituting capacitors C20, C20-1, C30, C30-1, and the like. Then, if the stack is cut into a lattice shape in accordance with the size of the single unit U10, the unit laminate (21, 31) as shown in FIGS. Can be manufactured at a low cost. Of course, the production cost per unit U10 can be reduced by producing a multi-unit unit base material.

  In short, when the capacitors C20, C20-1, C30, and C30-1 are small in size, the unit base material as described above is manufactured, the unit base materials are stacked and integrated, and then cut into unit laminates. It is more efficient to adopt the method of obtaining the above, and the manufacturing cost of the capacitors C20, C20-1, C30, C30-1, etc. can be further reduced.

《Application to other size capacitors》
In the above description, the unit U10 used when the 0603 size capacitor is configured and the 0603 size capacitors C20, C20-1, C30, and C30-1 configured using the unit U10 are shown. If a unit having the same structure as the unit U10 and smaller in the front-rear dimension and the left-right dimension than the unit U10 is manufactured, a capacitor smaller than 0603 size such as 0402 size can be configured by using a plurality of the units. If a unit having the same structure as the unit U10 and larger in the front-rear dimension and the left-right dimension than the unit U10 is manufactured, a capacitor larger than 0603 size such as 3225 size or 4532 size can be formed using a plurality of the units. it can.

  U10 unit, 11 dielectric plate, 11a through hole, 12 first electrode rod, 13 second electrode rod, 14 first conductor film, 15 second conductor film, 16 first insulator film , 17 ... second insulator film, C20, C20-1, C30, C30-1 ... capacitor, 21,31 ... unit laminate, 22,32 ... insulating exterior film, 23,33 ... underlying conductor film, 24, 34 ... surface conductor film, 25, 35 ... external terminals.

Claims (3)

A rectangular dielectric plate having a predetermined thickness and having a plurality of through holes in the thickness direction;
A first conductor film formed to cover a region excluding one end of the exposed surface of one through hole of the dielectric plate;
A first insulator film formed to cover the one end of the exposed surface of one through hole of the dielectric plate;
A second conductor film formed so as to cover a region excluding the other end of the other through-hole exposed surface of the dielectric plate;
A second insulator film formed so as to cover the other end of the other through-hole exposed surface of the dielectric plate;
A plurality of first electrode rods disposed inside a part of the plurality of through holes of the dielectric plate, electrically connected to the first conductor film, and electrically insulated from the second conductor film When,
A plurality of second electrode rods disposed inside the remaining portions of the plurality of through holes of the dielectric plate, electrically connected to the second conductor film, and electrically insulated from the first conductor film; ,
A capacitor construction unit comprising: 2. The n units (n is an integer of 2 or more) according to claim 1 have a structure in which the units are stacked and integrated in the thickness direction, and two adjacent units are adjacent to each other between the first conductor films or the second conductor films. The ends of the first conductor film of each unit are exposed on one of the two opposing surfaces, and the other surface is exposed to each unit. A rectangular parallelepiped unit laminate in which the edge of the second conductor film is exposed;
An insulating exterior film formed so as to cover the surface excluding the two opposing surfaces of the unit laminate;
One external terminal formed so as to cover at least one of the two opposing surfaces of the unit laminate, and electrically connected to an edge of the first conductor film of each unit;
The other external terminal formed to cover at least the other of the two opposing surfaces of the unit laminate, and electrically connected to the edge of the second conductor film of each unit;
A capacitor comprising: The n units (n is an integer of 2 or more) according to claim 1 have a structure in which the units are stacked and integrated in the thickness direction, and the two adjacent units include a first conductor film and a second conductor film. Are opposed to each other and electrically insulated via an insulator layer, and the edge of the first conductor film of each unit is exposed on one of the two opposing surfaces, and the other surface The unit laminated body of a rectangular parallelepiped shape in which the edge of the second conductor film of each unit is exposed,
An insulating exterior film formed so as to cover the surface excluding the two opposing surfaces of the unit laminate;
One external terminal formed so as to cover at least one of the two opposing surfaces of the unit laminate, and electrically connected to an edge of the first conductor film of each unit;
The other external terminal formed to cover at least the other of the two opposing surfaces of the unit laminate, and electrically connected to the edge of the second conductor film of each unit;
A capacitor comprising:

Images