JPH0543530U - Ceramic capacitor - Google Patents

Abstract

(57) [Abstract] [Purpose] An object of the present invention is to simplify connection wiring of capacitor elements to be connected in parallel in a multilayer ceramic capacitor. [Structure] Wiring required for parallel connection is performed by a sprayed metal body sprayed so as to adhere to the side surface of a ceramic single plate. Since the wiring for parallel connection is performed by the metal spray material, the wiring work becomes easy. Since the leads surrounding the space on the side surface are not used, the wiring is not cut by foreign matter.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a ceramic capacitor.

[0002]

[Prior Art]

 It is well known that a ceramic capacitor has a structure in which a plurality of ceramic single plates are laminated via a metal spacer serving as an electrode. In that case, there is no particular problem when connecting all the ceramic veneers in series, but when connecting a plurality of ceramic veneers in parallel, the metal spacers interposed between the ceramic veneers should be connected to other ceramic veneers. The need arises to connect across the plates and metal spacers.

FIG. 3 shows the conventional structure, and reference numeral 1 is a ceramic single plate, and a plurality of the ceramic single plates are laminated with a metal spacer 2 interposed therebetween and, if necessary, molded with a resin or the like. 3 is the resin for that mold. Conventionally, in order to connect a capacitor element composed of a ceramic single plate 1 in parallel, a lead 4 is pulled out from a metal space 2, and this lead 4 allows a metal spacer 2 to be connected across another ceramic single plate 1 and a metal spacer 2. I am trying to connect. The connection example in the figure is an example in which all capacitor elements are connected in parallel. In addition, 5 is a terminal metal fitting.

However, with such a configuration, the larger the number of capacitor elements to be connected, the more complicated the connection work. Further, since the lead 4 is located outside the laminated body of the ceramic single plates 1, it may come into contact with other foreign matter and be cut. For example, in the case of resin molding as shown in the figure, the lead wire is easily cut when the molding resin is injected.

In place of such connection of the lead wires, a configuration is also considered in which a metal spacer is provided with an ear end portion and this ear end portion is connected by a stud or the like, but it is necessary to provide such an ear end portion. Therefore, the diameter increases as a metal spacer, and the ceramic becomes larger.

[0006]

[Problems to be solved by the device]

 The present invention aims at facilitating the wiring work for parallel connection when stacking a plurality of ceramic single plates to form a ceramic capacitor, and avoiding disconnection of the wire for other foreign matter. To do.

[0007]

[Means for Solving the Problems]

 The present invention constructs a capacitor element by providing an electrode on a surface of a ceramic single plate with a part of its peripheral edge left and an insulating separator with a space left on a part of the remaining peripheral edge. , The capacitor elements are stacked so that the voids of the capacitor elements to be connected in parallel are located on the same side, and the metal is sprayed so that it adheres to the side surface of the ceramic veneer and contacts each electrode through the voids. It is characterized in that each electrode is connected at once by a sprayed body.

[0008]

[Action]

 According to this structure, the electrodes that are put together for parallel connection are connected by the metal spray. Since the connection is made by metal spraying through the void, the connection work is extremely easy. Further, when the electrodes are connected by a metal spray material, the separator is present even if there is another electrode that does not require parallel connection between the electrodes, so that it is disturbed by the metal spray material. The body does not touch the electrodes.

[0009]

【Example】

 An embodiment of this invention will be described with reference to FIGS. In addition, the same reference numerals as those in FIG. 3 indicate the same or corresponding portions. According to the present invention, the electrode 6 is formed on the surface of the ceramic single plate 1 while leaving a part of the peripheral edge thereof. This electrode may be a metal spacer, but is not limited to this, and may be a metal vapor deposition, for example.

A capacitor element 9 is formed by providing an insulating separator 8 leaving a space 7 on a part of the remaining peripheral edge of the surface of the ceramic single plate 1. The separator 8 may be made of glass or the like.

Among these capacitor elements 9, the capacitor elements 9 are laminated so that the voids 7 on the surface of the capacitor elements 9 to which the electrodes 6 are collectively connected for parallel connection are located on the same side. Due to such stacking, the separator 8 exists on the same side between the electrodes that are not collectively connected. FIG. 1 shows an example in which the separators 8 are laminated so as to appear alternately on the opposite sides.

With respect to the capacitor element 9 thus laminated, a metal is sprayed on the same side surface thereof to form metal sprayed bodies 10 and 11. The metal sprayed at this time not only adheres to the side surface of the ceramic single plate 1 constituting each capacitor element, but also penetrates into the electrodes 6 collectively connected for parallel connection through the void 7. Then adhere and contact. As a result, these electrodes 6 are collectively connected.

However, at the time of this metal spraying, since the separator 8 is present for the electrodes 6 that are not collectively connected in the same way, the sprayed metal reaches the electrode 6 by being an obstacle. No, and therefore they are not all connected together. Needless to say, the electrodes 6 are collectively connected by a metal sprayed body on another side surface.

[0014]

[Effect of the device]

 As described in detail above, according to the present invention, in a ceramic capacitor in which a plurality of capacitor elements are laminated and a plurality of the capacitor elements are connected in parallel, a metal spray body is used for wiring required for the parallel connection. Therefore, unlike the case of using the lead wire as in the conventional configuration, the connection is not complicated, and it can be configured without increasing the size.Because the separator is provided, it is not possible to wire all together. This has the effect of preventing the metal spray material from adhering even to the electrodes that should not be formed.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a perspective view of a capacitor element.

FIG. 3 is a sectional view of a conventional example.

[Explanation of symbols]

 1 Ceramic Single Plate 6 Electrode 7 Void 8 Separator 9 Capacitor Element 10 Metal Spray Body 11 Metal Spray Body

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Risa Utsunomiya 47 Umezu Takaunecho, Ukyo-ku, Kyoto City Nissin Electric Co., Ltd.

Claims (1)

[Scope of utility model registration request] 1. A ceramic capacitor in which a plurality of capacitor elements made of ceramics are laminated and any one of the capacitor elements is connected in parallel, and electrodes are formed on the surface of a ceramic single plate while leaving the periphery thereof. A capacitor element is formed by providing an insulating separator while leaving a void in a part of the remaining peripheral edge of the capacitor element. A metal that is laminated by stacking the capacitor elements so that the voids are located on the same side, is sprayed so as to adhere to the side surface of the ceramic single plate, and is in contact with each electrode through the voids located on the same side. A ceramic capacitor in which the above-mentioned electrodes are collectively connected by a thermal spray material.