JP2012172936A5 - - Google Patents

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Publication number
JP2012172936A5
JP2012172936A5 JP2011037014A JP2011037014A JP2012172936A5 JP 2012172936 A5 JP2012172936 A5 JP 2012172936A5 JP 2011037014 A JP2011037014 A JP 2011037014A JP 2011037014 A JP2011037014 A JP 2011037014A JP 2012172936 A5 JP2012172936 A5 JP 2012172936A5
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JP
Japan
Prior art keywords
flow path
plate
cooling apparatus
core material
type cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011037014A
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English (en)
Japanese (ja)
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JP5660926B2 (ja
JP2012172936A (ja
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Priority to JP2011037014A priority Critical patent/JP5660926B2/ja
Priority claimed from JP2011037014A external-priority patent/JP5660926B2/ja
Publication of JP2012172936A publication Critical patent/JP2012172936A/ja
Publication of JP2012172936A5 publication Critical patent/JP2012172936A5/ja
Application granted granted Critical
Publication of JP5660926B2 publication Critical patent/JP5660926B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011037014A 2011-02-23 2011-02-23 プレート積層型冷却装置 Active JP5660926B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011037014A JP5660926B2 (ja) 2011-02-23 2011-02-23 プレート積層型冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011037014A JP5660926B2 (ja) 2011-02-23 2011-02-23 プレート積層型冷却装置

Publications (3)

Publication Number Publication Date
JP2012172936A JP2012172936A (ja) 2012-09-10
JP2012172936A5 true JP2012172936A5 (OSRAM) 2013-12-05
JP5660926B2 JP5660926B2 (ja) 2015-01-28

Family

ID=46976005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011037014A Active JP5660926B2 (ja) 2011-02-23 2011-02-23 プレート積層型冷却装置

Country Status (1)

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JP (1) JP5660926B2 (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3021067B1 (en) 2013-07-08 2018-08-22 Mitsubishi Electric Corporation Laminated header, heat exchanger, air conditioning device, and method for connecting plate-shaped body and pipe of laminated header
JP6098760B2 (ja) * 2014-05-20 2017-03-22 富士電機株式会社 半導体モジュール用冷却器及びその製造方法
JP2016015381A (ja) * 2014-07-01 2016-01-28 株式会社フジクラ コールドプレート
JP2016018953A (ja) * 2014-07-10 2016-02-01 株式会社フジクラ コールドプレート

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09105592A (ja) * 1995-10-05 1997-04-22 Mitsubishi Electric Corp プレート積層型熱交換器及びその製造方法
JP3759215B2 (ja) * 1995-12-27 2006-03-22 昭和電工株式会社 真空ろう付用Ａｌブレージングシート、ならびにドロンカップ式熱交換器用チューブエレメントおよびドロンカップ式熱交換器
JPH1183372A (ja) * 1997-09-10 1999-03-26 Matsushita Electric Ind Co Ltd 積層式熱交換器及びその製造方法
JP4482997B2 (ja) * 2000-02-02 2010-06-16 パナソニック株式会社 積層式熱交換器およびその製造方法
EP1555079B1 (de) * 2004-01-12 2008-07-23 Electrovac AG Verfahren zum Herstellen von aus Plattenstapeln bestehenden Kühlern oder Kühlerelementen, mit Fügemittel auf Innenflächen der Plattendurchbrüchen oder -öffnungen
JP2005282951A (ja) * 2004-03-30 2005-10-13 Institute Of Tsukuba Liaison Co Ltd 一体型積層構造熱交換器
JP2008036650A (ja) * 2006-08-02 2008-02-21 Denso Corp 熱交換器の製造方法
JP2008300596A (ja) * 2007-05-31 2008-12-11 Sony Corp ヒートシンクおよび半導体レーザ装置

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