JP2012172178A5 - - Google Patents

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Publication number
JP2012172178A5
JP2012172178A5 JP2011033496A JP2011033496A JP2012172178A5 JP 2012172178 A5 JP2012172178 A5 JP 2012172178A5 JP 2011033496 A JP2011033496 A JP 2011033496A JP 2011033496 A JP2011033496 A JP 2011033496A JP 2012172178 A5 JP2012172178 A5 JP 2012172178A5
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Japan
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alloy material
mass
range
fills
substrates
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JP2011033496A
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English (en)
Japanese (ja)
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JP2012172178A (ja
JP5667467B2 (ja
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Publication of JP2012172178A5 publication Critical patent/JP2012172178A5/ja
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JP2011033496A 2011-02-18 2011-02-18 合金材料、回路基板、電子デバイス及びその製造方法 Active JP5667467B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011033496A JP5667467B2 (ja) 2011-02-18 2011-02-18 合金材料、回路基板、電子デバイス及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011033496A JP5667467B2 (ja) 2011-02-18 2011-02-18 合金材料、回路基板、電子デバイス及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012172178A JP2012172178A (ja) 2012-09-10
JP2012172178A5 true JP2012172178A5 (https=) 2014-03-06
JP5667467B2 JP5667467B2 (ja) 2015-02-12

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ID=46975373

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JP2011033496A Active JP5667467B2 (ja) 2011-02-18 2011-02-18 合金材料、回路基板、電子デバイス及びその製造方法

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JP (1) JP5667467B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016157971A1 (ja) * 2015-03-31 2016-10-06 住友金属鉱山株式会社 はんだペースト
WO2017065236A1 (ja) * 2015-10-15 2017-04-20 住友精密工業株式会社 充填方法および充填装置
CN106001982A (zh) * 2016-07-08 2016-10-12 重庆科技学院 一种高熔点无铅铋银锡钎料及其制备方法
JP7487471B2 (ja) * 2019-12-13 2024-05-21 株式会社レゾナック 金属ペースト、導電体、並びに、貫通電極を有する基体及びその製造方法
JP7417696B1 (ja) 2022-08-01 2024-01-18 千住金属工業株式会社 金属及び電子装置
JP7534693B1 (ja) 2023-12-14 2024-08-15 千住金属工業株式会社 金属及び電子装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3671815B2 (ja) * 2000-06-12 2005-07-13 株式会社村田製作所 はんだ組成物およびはんだ付け物品
KR100700233B1 (ko) * 2001-05-28 2007-03-26 허니웰 인터내셔날 인코포레이티드 고온 무연 땜납용 조성물, 방법 및 소자
US9162324B2 (en) * 2005-11-11 2015-10-20 Senju Metal Industry Co., Ltd. Solder paste and solder joint
KR20090050072A (ko) * 2006-09-13 2009-05-19 허니웰 인터내셔널 인코포레이티드 전기적 상호 연결부를 위한 개선된 솔더 합금, 그 생산 방법 및 용도
JP4444995B2 (ja) * 2007-08-10 2010-03-31 有限会社ナプラ 基板配線用導電性組成物、回路基板及び電子デバイス
JP5194326B2 (ja) * 2008-12-27 2013-05-08 千住金属工業株式会社 Ｂｉ−Ｓｎ系リール巻きはんだ線およびはんだ線の製造方法
EP2589459B1 (en) * 2010-06-30 2017-08-09 Senju Metal Industry Co., Ltd Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY

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