JP2012163369A - Magnetic sensor, magnetic sensor module, and manufacturing method for magnetic sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetic sensor capable of preventing entry of an electromagnetic noise, protecting a magnetic resistor from external shock, and ensuring waterproofness and anticorrosion property.SOLUTION: A magnetic sensor includes: a substrate 31; a magnetic circuit part 21a formed on a surface of the substrate 31 and having a magnet sensitive element 21c whose resistance value in a magnet sensitive region 31a changes in accordance with an external magnetic field; a first inorganic film 32 covering the magnetic circuit part 21a formed on the surface of the substrate 31; a first organic resin layer 33 covering the first inorganic film 32; a nonmagnetic conductive film 34 formed on a surface of the first organic resin layer 33 so as to block an external electromagnetic wave from the magnet sensitive region 31a; a second organic resin film 35 covering the nonmagnetic conductive film 34; and a second inorganic film 36 formed on a surface of the second organic resin film 35.

Description

  The present invention relates to a magnetic sensor, a magnetic sensor module, and a magnetic sensor manufacturing method used in a position detection device that detects a moving distance and a position of a movable part such as a machine tool, an industrial machine, and a general measuring machine.

  2. Description of the Related Art Magnetic sensors using a magnetoresistive effect whose resistance value changes with an external magnetic field are widely used. In a machine tool or the like, a moving amount is detected by fixing a scale on which a magnetic signal is recorded on a movable part and reading the magnetic signal with a magnetic sensor.

  The resistance change rate of the magnetoresistive element used as such a magnetic sensor is about several percent, and the signal level of the detection signal is very small. For this reason, the magnetic sensor cannot perform an accurate operation in an environment where an electromagnetic wave such as an electric discharge machine is generated greatly. Therefore, for example, Patent Documents 1, 2, and 3 describe a technique for shielding electromagnetic waves from a magnetoresistive element of a magnetic sensor.

  Further, a position detection device using a magnetic sensor needs to make the pitch of magnetic recording signals finer in order to increase the resolution of position detection. Therefore, the position detection device needs to bring the magnetic recording medium and the magnetoresistive element closer, but there is a possibility that the magnetic recording medium and the magnetic sensor come into contact with each other due to vibration.

  Further, in such a position detection device, assembly may be performed with a spacer interposed between the magnetic recording medium and the magnetic sensor, and the magnetic sensor may be damaged when the spacer is pulled out after assembly.

  In addition, such a position detection device may damage the magnetic sensor due to mixing of cutting powder during operation of the machine tool. For example, Patent Document 4 describes a position detection device in which a hard film is formed on the outermost surface of a magnetic detector in order to protect the magnetoresistive element from such an external impact.

  Furthermore, such a position detection device ensures waterproofness and corrosion resistance from the viewpoint of ensuring high reliability when used in a harsh environment where grinding fluid adheres, such as the inside of a cutting machine. It is desirable.

JP 2007-232616 A Japanese Patent Laid-Open No. 07-181241 Japanese Patent Laid-Open No. 03-146888 JP 2004-245644 A

  As described above, the magnetic sensor of the position detection device incorporated in a machine tool, etc. is reliable even in an environment where grinding fluid adheres, measures to prevent electromagnetic noise from entering, measures to protect the magnetoresistive element from external impact, etc. It is hoped that all measures to ensure

  The present invention has been proposed in view of such a situation, and it is possible to prevent electromagnetic noise from entering, protect the magnetoresistive element from external impact, and ensure the waterproof and anticorrosive properties. An object is to provide a sensor, a magnetic sensor module, and a method for manufacturing the magnetic sensor.

  As means for solving the above-described problems, a magnetic sensor according to the present invention includes a substrate and a magnetic circuit formed on the surface of the substrate and having a magnetosensitive element in which the resistance value of the magnetosensitive region changes according to an external magnetic field. Part, a first inorganic film covering the magnetic circuit part formed on the surface of the substrate, a first organic resin layer covering the first inorganic film, and an external electromagnetic wave to the magnetosensitive region Thus, the nonmagnetic conductive film formed on the surface of the first organic resin layer, the second organic resin film covering the nonmagnetic conductive film, and the second formed on the surface of the second organic resin film An inorganic film.

  The magnetic sensor module according to the present invention includes a magnetic sensor that detects an external magnetic field and an external connection substrate that outputs a detection signal of the magnetic sensor to the outside. The magnetic sensor is formed on the substrate and the surface of the substrate. A magnetic circuit portion having a magnetic sensing element whose resistance value changes in response to an external magnetic field, a first inorganic film covering the magnetic circuit portion formed on the surface of the substrate, and a first inorganic film A first organic resin layer covering the film; a nonmagnetic conductive film formed on the surface of the first organic resin layer so as to block external electromagnetic waves against the magnetically sensitive region; and a nonmagnetic conductive film A second organic resin film and a second inorganic film formed on the surface of the second organic resin film, and the external connection substrate is electrically connected to the terminal portion, and the magnetic sensor The periphery of the joint portion is sealed with an insulating resin.

  The magnetic sensor manufacturing method according to the present invention includes a magnetic circuit part forming step of forming a magnetic circuit part having a magnetosensitive element in which a resistance value of a magnetosensitive area changes according to an external magnetic field on a surface of a substrate, A first inorganic film coating step for coating the magnetic circuit portion formed on the surface of the substrate with the first inorganic film, and a first organic film coating for coating the first inorganic film with the first organic resin layer A step of coating a nonmagnetic conductive film with a nonmagnetic conductive film for blocking external electromagnetic waves with respect to the magnetosensitive region on the surface of the first organic resin layer; A second organic resin film coating step of covering with a film; and a second inorganic film forming step of forming a second inorganic film on the surface of the second organic resin film.

  In the present invention, the magnetosensitive element is covered with a nonmagnetic conductive film to prevent electromagnetic noise from entering, and the second inorganic film formed on the outer surface prevents the magnetoresistive element from being externally impacted. Protect. In the present invention, the nonmagnetic conductive film is covered with the first organic resin film and the second organic resin film, so that the antimagnetic property of the nonmagnetic conductive film is secured and the first and second The magnetic sensitive element can be reliably waterproofed by the nonmagnetic conductive film sandwiched between the organic resin films. Therefore, the present invention can be used as a magnetic sensor of a position detection device incorporated in a machine tool or the like while ensuring reliability.

It is a figure for demonstrating the structure of the separation-type position detection apparatus incorporating the magnetic sensor to which this invention was applied. It is a figure for demonstrating the structure of the integrated position detection apparatus incorporating the magnetic sensor to which this invention was applied. It is a figure for demonstrating the structure of the magnetic sensor module to which this invention was applied. It is a figure for demonstrating the cross-section of the magnetic sensor to which this invention was applied. It is a figure for demonstrating a magnetic circuit part formation process. It is a figure for demonstrating a magnetic circuit part formation process. It is a figure for demonstrating a 1st inorganic film coating process. It is a figure for demonstrating a 1st organic film coating process. It is a figure for demonstrating a nonmagnetic electrically conductive film coating process. It is a figure for demonstrating a 2nd organic resin film coating process. It is a figure for demonstrating a 2nd inorganic film formation process. It is a figure for demonstrating a sealing process. It is a figure for demonstrating the structure of the magnetic sensor module which concerns on the comparative example 1. FIG. It is a figure for demonstrating the structure of the magnetic sensor module which concerns on the comparative example 2. FIG.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention.

  The magnetic sensor to which the present invention is applied is used in a position detection device that detects the moving distance and position of a movable part such as a machine tool, an industrial machine, and a general measuring machine. It is suitable to be used in a harsh environment where the grinding fluid adheres. Such a magnetic sensor is used by being incorporated in, for example, a position detection apparatus 1 that can separate the scale 10 and the read head case 13 as shown in FIG.

  As shown in FIG. 1A, the position detection device 1 includes a scale 10 on which a magnetic scale 10a is recorded in the longitudinal direction and a magnetic sensor module 11 including a magnetic sensor for detecting the magnetic scale 10a. And a read head case 13 attached thereto.

  The scale 10 is, for example, applied to a surface of a scale base material (glass substrate) having a flat plate shape, which is obtained by mixing and stirring metal magnetic powder, an organic binder (urethane, etc.) and other additives with an organic solvent, and leaving it for a predetermined time. The magnetic scale 10a is formed by drying and curing, and the magnetic scale 10a is formed by recording on the formed magnetic scale 10a a magnetic scale in which S poles and N poles are alternately arranged at a predetermined pitch along the longitudinal direction. .

  In the position detection apparatus 1 having such a configuration, the reading head case 13 moves on the magnetic scale 10a, so that the magnetic sensor 21 built in the magnetic sensor module 11 is provided as shown in FIG. The amount of movement is detected by detecting a change in the magnetic field from the magnetic scale 10a that changes according to the change in the relative position.

  Further, the magnetic sensor to which the present invention is applied is used by being incorporated in a position detection device 1a in which a scale 110 and a read head case 13 are integrated as shown in FIG.

  As shown in FIG. 2A, the position detection device 1a includes a scale 110 in which a magnetic scale 10a is formed on a guide portion 110a that guides the reading head case 13 in a linear direction, and a magnetic sensor that detects the magnetic scale 10a. And a read head case 13 to which a built-in magnetic sensor module 11 is attached. Here, for the sake of convenience, the position detection device 1a will be described with the same reference numerals for the same configuration as the position detection device 1.

  As shown in FIG. 2B, the position detection device 1a having such a configuration causes the magnetic sensor 21 built in the magnetic sensor module 11 to move as the reading head case 13 moves on the magnetic scale 10a. The amount of movement is detected by detecting the change in the magnetic field from the magnetic scale 10a that changes in accordance with the change in the relative position at a higher density than in the case of FIG.

  Such a position detection device 1a is attached to, for example, a reference portion and a movable portion of a machine tool or the like that relatively linearly moves. In the position detection device 1a, either the scale 110 or the magnetic sensor module 11 is fixed to a reference portion that does not move, and the other is fixed to a movable portion. The scale 110 is attached so as to be parallel to the moving direction of the movable part.

  As shown in FIG. 3, the magnetic sensor module 11 detects external magnetism, thereby detecting a magnetic scale 10 a recorded on the scale 10 and outputs a detection signal of the magnetic sensor 21 to the outside. And an external connection board 22.

  As shown in FIG. 3, the magnetic sensor 21 is formed in a substantially rectangular shape, and has a built-in magnetic circuit portion 21a having a magnetosensitive element in which the resistance value of the magnetosensitive region changes according to an external magnetic field. The magnetic circuit portion 21 a is connected to the external connection substrate 22 by a terminal portion formed at one end thereof, and a signal detected from the scale 10 is transmitted to the outside of the position detection device 1 through the external connection substrate 22. Output.

  The magnetic sensor 21 incorporated in the position detecting device 1 having the above-described configuration is reliable even in an environment in which grinding liquid or the like is attached, a measure for preventing electromagnetic noise from entering, a measure for protecting the magnetoresistive element from an external impact, It is desired to satisfy all the measures for ensuring the properties, and in order to satisfy these requirements, a cross-sectional structure as shown in FIG. 4 is provided.

  That is, the magnetic sensor 21 includes a substrate 31, a magnetic circuit unit 21 a formed on the surface of the substrate 31, a first inorganic film 32 that covers the magnetic circuit unit 21 a, and a first inorganic film 32 that covers the first inorganic film 32. A first organic resin layer 33, a non-magnetic conductive film 34 covering the first organic resin layer 33 and blocking external electromagnetic waves, a second organic resin film 35 covering the non-magnetic conductive film 34, and a second It has a laminated structure including a second inorganic film 36 formed on the surface of the organic resin film 35 and a TiN film 37. Here, covering means to cover in a state where it is not exposed to the outside from the viewpoint of realizing corrosion resistance and waterproofing.

  In the magnetic sensor 21 having such a structure, the magnetic sensitive element of the magnetic circuit portion 21a is covered with the nonmagnetic conductive film 34, thereby preventing the intrusion of electromagnetic noise and the second surface formed on the outer surface. The magnetic film portion 21a is protected from external impact by the inorganic film 36. In addition, the magnetic sensor 21 has the nonmagnetic conductive film 34 covered with the first organic resin film 33 and the second organic resin film 35, thereby ensuring the anticorrosive property of the nonmagnetic conductive film 34. The non-magnetic conductive film 34 sandwiched between the first organic resin film 33 and the second organic resin film 35 can reliably waterproof the magnetosensitive element.

  For this reason, the magnetic sensor 21 can be used as a magnetic sensor of a position detection device incorporated in a machine tool or the like while ensuring reliability. In particular, as described above, the magnetic sensor 21 is suitable for use in a harsh environment where a grinding fluid adheres, such as the inside of a cutting machine.

  The magnetic sensor module having the magnetic sensor 21 having such a structure is specifically manufactured by the following manufacturing process.

  First, a magnetic circuit part formation process is demonstrated with reference to FIG.5 and FIG.6. As shown in FIG. 5A, on the substrate 31 having an insulating property such as glass, silicon, ceramics, etc., as an electrode film 41, for example, Al is formed by sputtering so that the thickness becomes 1 μm. A pattern is formed by photolithography. As a result of this processing, as shown in FIG. 5B, the conductor pattern that does not include the magnetosensitive element in the magnetic circuit portion 21a and the terminal portion 21b that is electrically connected to the magnetic circuit portion 21a are formed on the same substrate 31. Formed on top.

  Subsequently, as shown in FIG. 6A, as the magnetic film 42, for example, Ni—Fe is formed by sputtering so as to have a thickness of 40 nm, and pattern formation is performed by a photolithography technique. By this treatment, the magnetic film 42 is laminated on the surface of the electrode film 41, and the magnetic sensitive element 21c is formed in the magnetic sensitive region 31a on the substrate 31 as shown in FIG.

  In the magnetic circuit portion forming step, the magnetic circuit portion 21a and the terminal portion 21b are formed by directly pattern-forming only the magnetic film 42 on the substrate 31 without using the electrode film 41 such as Al. However, it is particularly preferable to use the electrode film 41 from the viewpoint of maintaining the adhesiveness with the substrate 31 in a higher state.

Next, the first inorganic film coating step will be described with reference to FIG. As shown in FIG. 7A, the magnetic circuit portion 21 a formed on the substrate 31 is covered with a first inorganic film 32. Specifically, as the first inorganic film 32, SiO ₂ is formed by sputtering so as to have a thickness of 200 nm, and pattern formation is performed by a photolithography technique. By this processing, as shown in FIG. 7B, the region other than the terminal portion 21 b on the substrate 31 is covered with the first inorganic film 32. Note that Al ₂ O ₃ and Si ₃ N ₄ may be used as the first inorganic film 32.

  Next, the first organic film coating step will be described with reference to FIG. As shown in FIGS. 8A and 8B, a region other than the terminal portion 21 b on the substrate 31 is covered with the first organic resin layer 33. Specifically, a photosensitive polyimide resin is applied as the first organic resin layer 33, a pattern is formed by a photolithography technique, and cured by heat treatment. For example, the photosensitive polyimide resin can be reliably coated without exposing the unevenness of the 1 μm Al electrode film after the heat treatment, and the film thickness is 3 μm to flatten the coated surface. Apply as follows. The first organic resin layer 33 insulates the magnetic circuit portion 21a from the nonmagnetic conductive film 34, waterproofs the magnetic circuit portion 21a, and protects it from an externally applied impact.

  Next, the nonmagnetic conductive film coating step will be described with reference to FIG. As shown in FIG. 9A, the first organic resin layer 33 is covered with a nonmagnetic conductive film 34. Specifically, Cr is formed as a base 341 by a sputtering process so that the thickness is 40 nm, and subsequently, Cu is formed as a nonmagnetic conductive film 34 by a sputtering process so that the thickness is 3.6 μm. Then, pattern formation is performed by photolithography technology. By this process, as shown in FIG. 9B, the shield part 34a laminated on the first organic resin layer 33 to cover the magnetic circuit part 21a and block external electromagnetic waves, and the same thickness as the shield part 34a. Now, Cu terminals 34b stacked on the terminal portions 21b are respectively formed. Here, as shown in FIG. 9B, the shield part 34a has a structure in which the shield part 34a is electrically connected to a Cu terminal 34b stacked on a terminal functioning as a ground terminal in the terminal part 21b. As a result, the shield part 34a can be set to a potential of 0 with respect to the conductive layer of the magnetic circuit part 21a without being charged even when receiving electromagnetic wave noise from the outside. Can be reduced. Moreover, since the shield part 34a is Cu, it can prevent that the magnetic circuit part 21a is flooded.

  In addition, although 3.6 micrometers was mentioned as an example of the film thickness of the nonmagnetic electrically conductive film 34, if thickness is increased, waterproofness can be improved and the shielding property of electromagnetic wave noise can also be improved. On the other hand, when the film thickness is increased, the distance between the magnetosensitive element 21c and the scale 10 is relatively increased, so that the detection sensitivity is lowered. Therefore, it is preferable to appropriately adjust the nonmagnetic conductive film 34 within an allowable thickness range, specifically, 2 μm to 8 μm, from the viewpoint of realizing all of electromagnetic wave noise blocking properties, waterproofness, and high detection sensitivity.

  Next, the second organic resin film coating step will be described with reference to FIG. As shown in FIGS. 10A and 10B, the nonmagnetic conductive film 34 is covered with the second organic resin film 35 so that the upper surface 342 and the side surface 343 of the nonmagnetic conductive film 34 are not exposed. Specifically, as the second organic resin film 35, a photosensitive polyimide resin is applied to a region other than the terminal portion 21 b on the substrate 31, a pattern is formed by a photolithography technique, and is cured by heat treatment. For example, the photosensitive polyimide resin is applied so that the film thickness becomes 5 μm after the heat treatment. The second organic resin layer 35 protects the shield part 34a from external impact and relaxes the stress applied to the second inorganic film 36 laminated on the second organic resin layer 35. Further, the second organic resin layer 35 can prevent the entire nonmagnetic conductive film 34 including the shield part 34a from being corroded, and can reliably prevent the magnetic circuit part 21a from being submerged. For example, the photosensitive polyimide resin has a water absorption rate of about 0.6% and can sufficiently exhibit the anticorrosion and waterproof functions as described above.

  The second organic resin layer 33 is a photosensitive polyimide resin as described above, and the same member as that of the first organic resin layer 33 is used. However, the present invention is not limited to this, and different organic resins are used. You may do it.

Next, the second inorganic film forming step will be described with reference to FIG. As shown in FIGS. 11A and 11B, a second inorganic film 36 is formed on the surface of the second organic resin film 35. Specifically, as the second inorganic film 36, SiO ₂ is formed by sputtering so as to have a thickness of 2 μm, and then the TiN film 37 is thickened through a Cr base 371 having a thickness of 40 nm. A film is formed by sputtering so that the thickness becomes 400 nm, and a pattern is formed by a photolithography technique. Here, the TiN film 37 is a hard film, and as the film thickness increases, the stress tends to become very large. In addition, a hard film such as the TiN film 37 tends to crack and easily crack as the film thickness increases. For this reason, it is difficult to set the thickness of the TiN film 37 to 500 nm or more. Therefore, in this step, SiO ₂ , Al ₂ O ₃ , Si ₃ N _4, etc. having relatively high hardness and relatively low stress. As described above, the second inorganic film 36 is formed so as to have a thickness of 2 μm, and the TiN film 37 is formed to have a thickness of about 400 nm through a Cr base 371 that improves adhesion. By forming the film, the stress can be reduced and cracking can be prevented while ensuring the necessary hardness. Note that Al ₂ O ₃ and Si ₃ N ₄ may be used as the second inorganic film 36.

  Next, the sealing process will be described with reference to FIG. As shown in FIGS. 12A and 12B, the external connection substrate 22 is electrically connected to the terminal portion 21b via the Cu terminal 34b, and the periphery of the joint portion 22a with the magnetic sensor 21. Is sealed with an insulating resin 22b such as an epoxy resin.

  Through the above steps, the magnetic sensor module 11 in which the magnetic sensor 21 to which the present invention is applied and the external connection substrate 22 are joined is manufactured.

  Next, the performance of the magnetic sensor module 11 manufactured by the above manufacturing process is evaluated.

First, in the magnetic sensor 21 to which the present invention is applied, on the outermost surface, a second inorganic film 36 made of SiO ₂ , a Cr base 371, and a hard film made of a TiN film 37 are laminated. Therefore, it was confirmed that even if the spacer was pulled out after assembly or contacted with the magnetic recording medium on the scale 10, there was no scratch and it was sufficiently protected from external impact.

  Moreover, the point which ensures reliability also in the environment where a grinding fluid etc. adhere is evaluated compared with the magnetic sensor module 111 which concerns on the comparative example 1 as shown in FIG.

  The magnetic sensor module 111 according to the comparative example 1 includes the magnetic sensor 121 that does not have the nonmagnetic conductive film 34 functioning as the shield portion 34a with respect to the magnetic sensor module 11, and the other structures are the same. For convenience, the same reference numerals as those of the magnetic sensor module 11 are given.

  The magnetic sensors 21 and 121 are immersed in a solution obtained by diluting the cutting fluid MF-2000 manufactured by Toho Chemical Industry Co., Ltd. 10 times, and a DC voltage of 5 V is applied from the terminal portion 21b to the magnetic circuit portion 21a. The changes over time were evaluated under the following conditions.

  As a result, the magnetic sensor 121 without the nonmagnetic conductive film 34 functioning as the shield part 34a is equivalent to 500 hours, and the electrode film 41 made of Al is eroded by the cutting fluid, and the magnetic circuit part 21a is broken. In the magnetic sensor 21 to which the present invention was applied, it was confirmed that the magnetic circuit part 21a did not break and there was no abnormality even for 1000 hours.

  Further, in the magnetic sensor 21 to which the present invention is applied, since the magnetic circuit portion 21a is covered with the shield portion 34a, a necessary and sufficient electromagnetic wave shielding characteristic is obtained as compared with the magnetic sensor 121 according to Comparative Example 1 described above. It was confirmed that

  Next, the detection sensitivity of the magnetic sensor 21 to which the present invention was applied was evaluated in comparison with the magnetic sensor module 211 according to the comparative example 2 as shown in FIG.

  The magnetic sensor module 211 according to the comparative example 2 includes the magnetic sensor 221 that does not have the second organic resin film 35 with respect to the magnetic sensor module 11, and other structures are the same. The same reference numerals as those of the module 11 are given.

  The magnetic sensor 221 without the second organic resin film 35 was tested for reliability by performing a test with a temperature of 120 ° C., a humidity of 85% RH, a pressure of 1.7 atm, and a test time of 100 hours.

  As a result of this test, in the magnetic sensor 221 without the second organic resin film 35, the nonmagnetic conductive film 34 is corroded and the electromagnetic wave noise prevention performance is lowered.

  The magnetic sensor 221 without the second organic resin film 35 is expected to have high detection sensitivity because the distance between the magnetosensitive element 21c and the scale 10 is shorter than the magnetic sensor 21 to which the present invention is applied. There is a problem that the shield part 34a is corroded.

  On the other hand, in the magnetic sensor 21 to which the present invention is applied, the distance between the magnetosensitive element 21c and the scale 10 is relatively larger than the magnetic sensor 221 without the second organic resin film 35. It was confirmed that sufficient detection sensitivity could be realized.

  From the result of comparison with Comparative Example 2 above, in the magnetic sensor 21 to which the present invention is applied, the second organic resin film 35 is thicker from the viewpoint of reliably preventing the corrosion of the nonmagnetic conductive film 34. On the other hand, the thinner one is preferable from the viewpoint of realizing high detection sensitivity.

  From these two viewpoints, the magnetic sensor 21 to which the present invention is applied has a high detection sensitivity while reliably preventing corrosion by setting the thickness of the second organic resin film 35 in the range of 3 μm to 8 μm. This is particularly preferable because it can be realized.

DESCRIPTION OF SYMBOLS 1 Position detection apparatus 10, 110 scale, 10a Magnetic scale, 11, 111, 211 Magnetic sensor module, 12 Reading head, 13 Reading head case, 21, 121, 221 Magnetic sensor, 21a Magnetic circuit part, 21b Terminal part, 21c Magnetosensitive element, 22 External connection substrate, 22a Bonding part, 22b Insulating resin, 31 Substrate, 31a Magnetosensitive region, 32 First inorganic film, 33 First organic resin layer, 34 Nonmagnetic conductive film, 34a Shield Part, 34b Cu terminal, 35 second organic resin film, 36 second inorganic film, 37 TiN film, 341, 371 base, 41 electrode film, 42 magnetic film, 110a guide part

Claims (5)

A substrate,
A magnetic circuit unit having a magnetosensitive element formed on the surface of the substrate and having a resistance value of a magnetosensitive region that changes in response to an external magnetic field;
A first inorganic film covering the magnetic circuit portion formed on the surface of the substrate;
A first organic resin layer covering the first inorganic film;
A nonmagnetic conductive film that covers the first organic resin layer so as to block external electromagnetic waves from the magnetically sensitive region;
A second organic resin film covering the nonmagnetic conductive film;
A magnetic sensor comprising: a second inorganic film formed on an upper surface of the second organic resin film. A terminal portion formed on the surface of the substrate so as to be electrically connected to the magnetic circuit portion;
The magnetic sensor according to claim 1, wherein the nonmagnetic conductive film is electrically connected to a ground terminal of the terminal portion.   The magnetic sensor according to claim 2, wherein the terminal portion has a conductive film having the same thickness as the nonmagnetic conductive film on an upper surface thereof. A magnetic sensor for detecting an external magnetic field;
An external connection board for outputting the detection signal of the magnetic sensor to the outside,
The magnetic sensor
A substrate,
A magnetic circuit unit having a magnetosensitive element formed on the surface of the substrate and having a resistance value of a magnetosensitive region that changes in response to an external magnetic field;
A first inorganic film covering the magnetic circuit portion formed on the surface of the substrate;
A first organic resin layer covering the first inorganic film;
A nonmagnetic conductive film that covers the first organic resin layer so as to block external electromagnetic waves from the magnetically sensitive region;
A second organic resin film covering the nonmagnetic conductive film;
A second inorganic film formed on the upper surface of the second organic resin film,
The external connection substrate is electrically connected to the terminal portion, and a magnetic sensor module in which a periphery of a joint portion with the magnetic sensor is sealed with an insulating resin. A magnetic circuit part forming step of forming a magnetic circuit part having a magnetosensitive element in which a resistance value of the magnetosensitive area changes according to an external magnetic field on the surface of the substrate;
A first inorganic film coating step of coating the magnetic circuit portion formed on the surface of the substrate with a first inorganic film;
A first organic film coating step of coating the first inorganic film with a first organic resin layer;
A nonmagnetic conductive film coating step of coating the magnetically sensitive region on the surface of the first organic resin layer with a nonmagnetic conductive film that blocks external electromagnetic waves;
A second organic resin film coating step of coating the nonmagnetic conductive film with a second organic resin film;
A method of manufacturing a magnetic sensor comprising: a second inorganic film forming step of forming a second inorganic film on the upper surface of the second organic resin film.

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