JP2012160684A - Substrate joining apparatus and substrate joining method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate joining apparatus which joins a joint substrate to a base substrate without causing cracks on the joint substrate.SOLUTION: Since a substrate joining apparatus 300 does not press an upper substrate 220 from above with a clamp, cracks due to the pressing are prevented from occurring on the upper substrate 220. However, a guide pin 310 is erected at an outer peripheral part of a lower substrate 210. Thus, the position of the upper substrate 220, which is to be joined to the lower substrate 210, is properly regulated and the lower substrate 210 and the upper substrate 220 are properly joined.

Description

  The present invention relates to a substrate bonding apparatus and method for supporting a bonded substrate in a movable manner and bonding the bonded substrate to a surface of a base substrate to which an adhesive resin is applied.

  2. Description of the Related Art Conventionally, there is a substrate bonding apparatus that supports and bonds a bonded substrate to a surface of a base substrate on which an adhesive resin is applied. For example, when thinning a semiconductor wafer on which a semiconductor element is formed, the semiconductor wafer is attached to a support substrate with an adhesive, and the semiconductor wafer and the support substrate are attached with no bubbles remaining in the adhesive. There is a proposal to wear (Patent Document 1).

  In the technology, in the manufacture of a semiconductor device including a step of bonding a front surface side of a semiconductor wafer having a semiconductor element formed on the surface thereof to a support substrate with an adhesive and polishing a back surface side of the semiconductor wafer, the adhesive is applied. While the attached support substrate is heated to melt the adhesive, the semiconductor wafer is bonded onto the support substrate, and the weight supported by the thin layer sheet is placed on the semiconductor wafer while rotating on the semiconductor wafer. The semiconductor wafer is pressed to bond the semiconductor wafer and the support substrate while removing bubbles contained in the adhesive.

There is also a proposal of an anodic bonding apparatus with a small number of work steps, a high yield rate, and excellent safety (Patent Document 2). In this technique, a base plate made of ceramics having high machinability, which is mainly composed of aluminum nitride and boron nitride, is provided as a member for holding and positioning a glass substrate or silicon wafer as a bonding target substrate. The base plate includes a holding plate on which the bonding target substrate is mounted and a work guide that positions the bonding target substrate. It is also effective to attach a heating plate made of the above ceramics to the surface of the heater. In this case, a guide hole is provided in the holding plate and a base plate guide is provided in the heating plate.

Japanese Patent Application Laid-Open No. 06-029385 Japanese Patent Laying-Open No. 2005-093744

  However, the substrate bonding apparatus disclosed in Patent Document 1 only removes air bubbles from the adhesive obtained by bonding two semiconductor wafers, and supports the upper semiconductor wafer movably and appropriately bonds it to the lower semiconductor wafer. It doesn't let you. Moreover, the apparatus of patent document 2 is an anodic bonding apparatus, and cannot be used for a substrate bonding apparatus in which a bonding substrate is connected to the surface of a base substrate with an adhesive resin.

  Therefore, as a substrate bonding apparatus that solves the above-described problems, an apparatus illustrated in FIGS. 3 to 6 can be assumed, as will be described in detail later. An elongated spacer that supports the bonded substrate on the outer periphery of the back surface and a clamp that holds the bonded substrate on the outer periphery of the front surface are mounted on the annular fixture.

  In such a substrate bonding apparatus, for example, the bonding substrate is held at three points by the spacer and the clamp of the fixture. In such a state, the bonding substrate is disposed above the fixture via the base substrate and the spacer. Then, when the spacer is displaced inside the fixture, the bonding substrate falls onto the surface of the base substrate on which the resin is applied, and each substrate is bonded by being pressed by the heated upper and lower plates. .

  However, in the substrate bonding apparatus as described above, since the bonded substrate is sandwiched in the vertical direction by the spacer and the clamp, a crack may occur in the bonded substrate at the position of the clamp. This is due to the fact that the surface of the bonding substrate is pressed downward from above by the clamp.

  The present invention has been made in view of the above-described problems, and provides a substrate bonding apparatus capable of preventing the occurrence of cracks in a bonding substrate bonded to the surface of the base substrate on which the adhesive resin is applied. Is.

  The substrate bonding apparatus of the present invention is a substrate bonding apparatus that supports a bonded substrate in a movable manner and bonds the bonded substrate to the surface of the base substrate to which the adhesive resin is applied, a spacer that supports the bonded substrate on the back surface, A position restricting member that is erected on the outer peripheral portion of the bonding substrate and the base substrate and that controls the position opposite to the outer peripheral surfaces of the bonding substrate and the base substrate.

  Therefore, in the substrate bonding apparatus of the present invention, since the bonded substrate is not pressed from above with the clamp, it is possible to prevent a crack caused by this pressing from occurring in the bonded substrate. However, since the position restricting member is erected on the outer peripheral portion of the basic substrate, the position of the bonded substrate bonded to the basic substrate is appropriately restricted.

  The above-described substrate bonding apparatus further includes an annular movable fixture that holds the bonding substrate by supporting the spacer in a displaceable manner, and the position regulating member is erected on the fixture. Also good.

  Further, in the substrate bonding apparatus as described above, the three position regulating members may be erected in a substantially uniform arrangement on the outer periphery of the substantially circular base substrate.

  In the substrate bonding apparatus as described above, the position regulating member may be formed of a cylindrical guide pin whose axial direction is substantially parallel to the bonding direction between the bonding substrate and the base substrate.

  The substrate bonding method of the present invention is a substrate bonding method using the substrate bonding apparatus of the present invention, in which a base substrate whose surface is coated with an adhesive resin is disposed inside a position regulating member, and the bonding substrate is The spacer is supported on the back surface and arranged inside the position regulating member, the spacer is retracted from the back surface of the bonding substrate, and the bonding substrate is dropped onto the surface of the base substrate on which the resin is applied and bonded.

  In the substrate bonding method as described above, a base substrate on which a resin is patterned by a photolithography method may be bonded to the bonding substrate.

  In the substrate bonding method as described above, the base substrate may be bonded from above to the bonding substrate disposed below.

  The various components of the present invention do not necessarily have to be independent of each other. A plurality of components are formed as a single member, and a single component is formed of a plurality of members. It may be that a certain component is a part of another component, a part of a certain component overlaps with a part of another component, or the like.

  In the substrate bonding apparatus of the present invention, the bonded substrate is not pressed from above with a clamp, so that it is possible to prevent a crack caused by the pressing from occurring in the bonded substrate. However, since the position restricting member is erected on the outer periphery of the basic substrate and the bonded substrate, the position of the bonded substrate bonded to the basic substrate can be appropriately controlled, and the basic substrate and the bonded substrate are properly positioned. Can be joined.

It is a typical longitudinal section front view showing the structure of the substrate joining device of an embodiment of the invention. It is a typical top view which shows the structure of the principal part of a substrate bonding apparatus. It is a typical top view which shows the structure of a board | substrate bonding apparatus. It is a typical vertical front view which shows the structure of the board | substrate bonding apparatus of a comparative example. It is a typical top view which shows the structure of the principal part of a substrate bonding apparatus. It is a typical top view which shows the structure of a board | substrate bonding apparatus.

  An embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the substrate bonding apparatus 300 according to the present embodiment supports a lower substrate 210, which is a basic substrate such as a silicon substrate coated with an adhesive resin 211, on the surface of the substrate holding unit. It has an annular fixture 120.

  In addition, an elongated spacer 121 that supports the upper substrate 220, which is a bonding substrate such as a glass substrate, on the outer periphery of the back surface thereof is supported on the inner peripheral surface of the annular fixture 120 so as to be able to appear and retract. The upper substrate 220 is arranged by forming a space above the lower substrate 210 by the fixture 120. The substrate bonding apparatus 300 has a chamber for exhausting the internal atmosphere.

  Further, an upper plate 130 that presses the upper substrate 220 against the lower substrate 210 is disposed so as to be displaced in the vertical direction, and a lower plate 110 that presses the lower substrate 210 against the upper substrate 220 is supported.

  In the substrate bonding apparatus 300 of the present embodiment, as shown in FIGS. 1 and 2, guide pins 310 that are position restricting members are erected on the outer peripheral portion of the fixture 120 on the outer peripheral portion of the lower substrate 210. Thus, the positions of the lower substrate 210 and the upper substrate 220 are regulated.

  The guide pin 310 is formed in a cylindrical shape whose axial direction is substantially parallel to the vertical direction, which is the bonding direction of the upper substrate 220 and the lower substrate 210. Further, as shown in FIG. 3, three guide pins 310 are erected on the outer peripheral portion of the substantially circular lower substrate 210 in a substantially uniform arrangement.

  In the configuration as described above, the substrate bonding method of the present embodiment is a substrate bonding method using the substrate bonding apparatus 300 of the present embodiment, and the lower substrate on which the adhesive resin 211 is applied on the surface 210 and an upper substrate 220 are disposed on the inner side of the three guide pins 310 via a spacer 121 above the spacer 210, and move together with the fixture 120 onto the lower plate 110 in the chamber.

  Next, the upper plate 130 and the lower plate 110 are heated to a desired temperature and the chamber is evacuated to a desired pressure. Then, the spacer 121 is retracted from the back surface of the upper substrate 220, and the upper substrate 220 is moved by the resin 211. It joins by dropping on the surface of the apply | coated lower substrate 210, and heating and pressurizing.

  More specifically, in the substrate bonding method using the substrate bonding apparatus 300 of the present embodiment, the lower substrate 210 is held by the substrate holding unit of the fixture 120. Next, the spacer 121 is moved above the lower substrate 210 and held at a height that does not contact the lower substrate 210. Next, the upper substrate 220 is set on the surface of the spacer 121. At this time, the upper substrate 220 is aligned by the guide pins 310 joined to the fixture 120.

  The fixture 120 is moved into the chamber of the substrate bonding apparatus 300 and mounted on the lower plate 110. At this time, a cutout is formed in the lower plate 110 so that the substrate holding portion of the fixture 120 does not contact. Furthermore, since the upper substrate 220 is held by the lower spacer 121 and the guide pin 310 on the outer peripheral surface, it is prevented from being displaced from the fixture 120.

  Then, after the air in the gap between the upper / lower substrates 220 and 210 provided by the spacer 121 is exhausted to a desired pressure, when the spacer 121 is displaced into the fixture 120, the upper substrate 220 is coated with the resin 211. It falls on the surface of the lower substrate 210.

  Furthermore, the upper plate 130 with the temperature set presses the upper substrate 220 from above, and the lower plate 110 with the temperature set presses the lower substrate 210 from below, so that the lower substrate 210 and the upper substrate 220 are made of resin 211. Be joined.

  In the substrate bonding apparatus 300 of the present embodiment, the upper substrate 220 is not pressed from above with a clamp, so that cracks due to this pressing can be prevented from occurring in the upper substrate 220.

  However, since the guide pins 310 are erected on the fixture 120, the position of the upper substrate 220 bonded to the lower substrate 210 can be appropriately regulated, and the lower substrate 210 and the upper substrate 220 are appropriately bonded. Can be made.

  Further, since the three guide pins 310 are evenly arranged on the outer periphery of the upper / lower substrates 220 and 210, the position of the upper substrate 220 can be accurately regulated by the minimum necessary guide pins 310. The substrate on which the resin 211 is formed can be arranged at the position of the upper substrate 220, and the base substrate can be arranged at the position of the lower substrate 210.

[Example]
First, the inventor actually experimented by making a prototype of the above-described substrate bonding apparatus 300. The experimental results will be described below as examples. First, in the substrate bonding apparatus 300 of the present invention, the fixture 120 is formed with a plate thickness of 5 to 15 mm, and the spacer 121 is formed with a plate thickness of 100 to 500 μm. The total height of the guide pin 310 is 3 to 6 mm, and the diameter is 2 to 6 mm. The clearance between the guide pin 310 and the upper substrate 220 and the lower substrate 210 is 0.2 to 1.0 mm.

  The upper substrate 220 made of a glass substrate is formed with a plate thickness of 100 to 1000 μm, for example. The lower substrate 210 made of a silicon wafer is formed with a thickness of 400 to 1000 μm, for example, and the resin 211 is formed with a thickness of 5 to 100 μm on the surface thereof, and is formed with a thickness of 50 μm, for example. Patterning is performed by photolithography.

  When the upper substrate 220 was bonded to the lower substrate 210 with such a substrate bonding apparatus 300, it was confirmed that the upper substrate 220 could be appropriately bonded to the lower substrate 210 without causing cracks in the upper substrate 220. Further, it was confirmed that even when the glass substrate is set as the lower substrate 210 and the silicon wafer with a resin pattern is set as the upper substrate 220, the bonding can be similarly performed.

[Comparative example]
Next, a substrate bonding apparatus 100 implemented by the present inventor as a comparative example will be described below with reference to FIGS.

  In this substrate bonding apparatus 100, a lower substrate 210 such as a silicon substrate coated with an adhesive resin 211 on its surface, and an elongated spacer 121 that supports an upper substrate 220 such as a glass substrate on the outer periphery of the back surface have an annular shape. The fixture 120 is supported on the inner peripheral surface of the fixture 120 so as to freely appear and disappear. On the upper part of the fixture 120, a clamp 122 for holding the upper substrate 220 detachably on the surface is mounted so as to be displaceable.

  In the configuration as described above, first, the lower substrate 210 on which the adhesive resin 211 is applied is disposed on the upper substrate 220 via the spacer 121 of the fixture 120, and the upper portion of the upper substrate 220 is clamped by the clamp 122. For example, three points are held.

  In this state, the fixture 120 moves and is disposed on the lower plate 110 in the chamber in the substrate bonding apparatus 100. At this time, the upper substrate 220 is held by the lower spacer 121 and the upper clamp 122, so that it is prevented from being displaced from the fixture 120.

  Then, after the air in the gap between the upper / lower substrates 220 and 210 is exhausted, the clamp 122 is removed, and when the spacer 121 is displaced into the fixture 120, the upper substrate 220 is attached to the lower substrate 210 to which the resin 211 is applied. Fall to the surface. Further, the upper plate 130 presses the upper substrate 220 from above, and the lower plate 110 presses the lower substrate 210 from below, so that the lower substrate 210 and the upper substrate 220 are joined by the resin 211.

  However, in the substrate bonding apparatus 100 as described above, since the upper substrate 220 is sandwiched in the vertical direction by the spacer 121 and the clamp 122, a crack may occur in the upper substrate 220 at the position of the clamp 122.

  The present invention is not limited to the present embodiment, and various modifications are allowed without departing from the scope of the present invention.

100 Conventional substrate bonding apparatus 110 Lower plate 120 Fixture 121 Spacer 122 Clamp 130 Upper plate 210 Lower substrate 211 Resin 220 Upper substrate 300 Substrate bonding apparatus 310 of this embodiment Guide pin

Claims (7)

A substrate bonding apparatus for supporting a bonded substrate in a movable manner and bonding the bonded substrate to the surface of the base substrate to which the adhesive resin is applied,
A spacer for supporting the bonding substrate on the back surface;
A position restricting member that is erected on the outer peripheral portion of the bonded substrate and the base substrate and restricts the position facing the outer peripheral surface of the bonded substrate and the basic substrate;
A substrate bonding apparatus. An annular movable fixture for holding the bonding substrate by supporting the spacer in a displaceable manner, further comprising:
The substrate bonding apparatus according to claim 1, wherein the position restricting member is erected on the fixture.   The board | substrate joining apparatus of Claim 1 or 2 with which the three said position control members are standingly arranged by the substantially equal arrangement | positioning at the outer peripheral part of the substantially circular base substrate.   4. The substrate bonding apparatus according to claim 1, wherein the position restricting member includes a cylindrical guide pin whose axial direction is substantially parallel to a bonding direction between the bonding substrate and the base substrate. 5. A substrate bonding method using the substrate bonding apparatus according to any one of claims 1 to 4,
The base substrate on which the adhesive resin is applied on the surface is disposed inside the position regulating member,
The bonding substrate is supported on the back surface by the spacer and arranged inside the position regulating member,
Retreating the spacer from the back surface of the bonding substrate;
A substrate bonding method in which the bonding substrate is dropped and bonded to the surface of the base substrate on which the resin is applied.   The substrate bonding method according to claim 5, wherein the base substrate on which the resin is patterned by a photolithography method is bonded to the bonding substrate.   The substrate bonding method according to claim 5 or 6, wherein the base substrate is bonded to the bonding substrate disposed below from above.

Images