JP2012157828A5 - - Google Patents
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- Publication number
- JP2012157828A5 JP2012157828A5 JP2011019970A JP2011019970A JP2012157828A5 JP 2012157828 A5 JP2012157828 A5 JP 2012157828A5 JP 2011019970 A JP2011019970 A JP 2011019970A JP 2011019970 A JP2011019970 A JP 2011019970A JP 2012157828 A5 JP2012157828 A5 JP 2012157828A5
- Authority
- JP
- Japan
- Prior art keywords
- forming
- molded body
- base material
- impregnation
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011019970A JP5353916B2 (ja) | 2011-02-01 | 2011-02-01 | 絶縁樹脂材料の製造方法 |
| CN201280007000.3A CN103339173B (zh) | 2011-02-01 | 2012-01-04 | 绝缘树脂材料的生产方法 |
| PCT/IB2012/000010 WO2012104689A1 (en) | 2011-02-01 | 2012-01-04 | Method of fabricating insulating resin material |
| EP12703875.0A EP2670793B8 (en) | 2011-02-01 | 2012-01-04 | Method of fabricating insulating resin material |
| US13/981,196 US8771566B2 (en) | 2011-02-01 | 2012-01-04 | Method of fabricating insulating resin material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011019970A JP5353916B2 (ja) | 2011-02-01 | 2011-02-01 | 絶縁樹脂材料の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012157828A JP2012157828A (ja) | 2012-08-23 |
| JP2012157828A5 true JP2012157828A5 (https=) | 2012-10-04 |
| JP5353916B2 JP5353916B2 (ja) | 2013-11-27 |
Family
ID=45592755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011019970A Expired - Fee Related JP5353916B2 (ja) | 2011-02-01 | 2011-02-01 | 絶縁樹脂材料の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8771566B2 (https=) |
| EP (1) | EP2670793B8 (https=) |
| JP (1) | JP5353916B2 (https=) |
| CN (1) | CN103339173B (https=) |
| WO (1) | WO2012104689A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6322016B2 (ja) * | 2013-03-28 | 2018-05-09 | 積水化学工業株式会社 | 有機無機ハイブリッド粒子の製造方法、導電性粒子の製造方法、導電材料の製造方法及び接続構造体の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11233694A (ja) | 1998-02-18 | 1999-08-27 | Toshiba Chem Corp | 高熱伝導樹脂封止型半導体装置 |
| CN1211444C (zh) * | 1999-12-23 | 2005-07-20 | 阿克佐诺贝尔股份有限公司 | 包含加聚物和聚氨酯的水性涂料组合物 |
| DE102006009842A1 (de) * | 2006-03-01 | 2007-09-06 | Röhm Gmbh | Additive Baustoffmischungen mit Mikropartikeln die in der Mischung quellen |
| GB0617480D0 (en) | 2006-09-06 | 2006-10-18 | Univ Sheffield | Novel nanoparticles |
| JP2009018215A (ja) * | 2007-07-10 | 2009-01-29 | Osaka Prefecture | コア−シェル型高分子ゲル微粒子の固定化方法及び分離材 |
| JP2010144153A (ja) | 2008-12-22 | 2010-07-01 | Nitto Denko Corp | 有機−無機複合成形体 |
| JP4793456B2 (ja) * | 2009-02-20 | 2011-10-12 | トヨタ自動車株式会社 | 熱伝導性絶縁樹脂成形体 |
-
2011
- 2011-02-01 JP JP2011019970A patent/JP5353916B2/ja not_active Expired - Fee Related
-
2012
- 2012-01-04 WO PCT/IB2012/000010 patent/WO2012104689A1/en not_active Ceased
- 2012-01-04 EP EP12703875.0A patent/EP2670793B8/en not_active Not-in-force
- 2012-01-04 CN CN201280007000.3A patent/CN103339173B/zh not_active Expired - Fee Related
- 2012-01-04 US US13/981,196 patent/US8771566B2/en active Active
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