JP2012156265A - Installation structure of semiconductor light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an installation structure that has an excellent installation property, is capable of replacing an LED light-emitting device, and is capable of reducing the thickness, in installing the LED light-emitting device into a mounting board.SOLUTION: In an installation structure of a semiconductor light-emitting device in which a semiconductor light-emitting element 1 is mounted on a light-emitting element substrate 2 having connection electrodes 3a and 3b, a frame body 5 defines the position of the shape of the light-emitting element substrate 2, and the connection electrodes 3a and 3b of the light-emitting element substrate 2 are pressed by clamping springs 6 integrally formed with the frame body 5, which fixes the light-emitting element substrate 2 and performs the electrical connection of the light-emitting element substrate 2.

Description

  The present invention relates to a structure for incorporating a semiconductor light emitting device, and more particularly, to a structure for incorporating a semiconductor light emitting device that can be easily assembled and replaced by using a frame having a spring for pressing and fixing.

  In recent years, a light-emitting diode (hereinafter abbreviated as LED) is a semiconductor light-emitting element, so it has a long life and excellent driving characteristics, is small in size, has high luminous efficiency, and has a bright emission color. It has come to be widely used for backlights and lighting of display devices. Also in this embodiment, an LED light emitting device will be described as an example as a semiconductor light emitting device.

  In particular, in recent years, there has been a demand for a semiconductor light-emitting device that can be easily assembled and replaced, and the LED light-emitting device mounting structure that is incorporated in a portable device can be easily incorporated and replaced. There is a strong demand. As a countermeasure to answer such a demand, there has been proposed a built-in structure in which an LED light emitting device is fixed to a mounting substrate by spring connection, spring fixing, or screw fixing (for example, see Reference 1).

  Hereinafter, a conventional LED light-emitting device built-in structure described in the cited document 1 will be described. FIG. 4 of the cited document 1 is reposted in FIG. In addition, in the range which does not change the meaning of invention, the part name of a prior art and the part name of this invention are made to correspond, and the comparison is clarified.

  For example, as shown in FIG. 17, the LED light emitting device built-in structure in the cited document 1 is an LED light emitting device including a driving electrode 71 (conductive film for power supply) provided on the surface of a mounting substrate 60 (base member) and a connection electrode 513. Device 51 (LED element), means for positioning and fixing LED light emitting device 51 to mounting substrate 60 (case 52 and cover 53), connection electrode 513 of LED light emitting device 51 and drive electrode 71 of mounting substrate 60 The LED light-emitting device 51 is incorporated into the mounting substrate 60 without using solder by providing the contact member 54 interposed between the contact members 54 and elastically contacting the both.

  As a structure for fixing the LED light emitting device 51 to the mounting substrate 60, a frame body 52 (case) for positioning the LED is fixed to the mounting substrate 60 with screws 50 as shown in FIG. ), The LED light emitting device 51 is loaded in the frame 52, and the cover 53 is locked and fixed by a locking piece 523 provided on the frame 52. At this time, the pressing force for fixing the LED light emitting device 51 to the mounting substrate 60 is a spring force of the contact member 54 interposed between the connection electrode 513 of the LED light emitting device 51 and the drive electrode 71 of the mounting substrate 60.

JP 2009-295369 A (see FIG. 4)

Next, the problem of the built-in structure of the LED light emitting device shown in the cited document 1 will be described.
First, the positioning structure of the LED light emitting device 51 has a three-body configuration of a case 52 (frame body), a cover 53, and a spring contact member 54 as means for pressing and fixing to the mounting substrate 60, and thus has a large number of parts. As a result, the assemblability deteriorates, and at the same time, the cost increases due to an increase in the number of parts.

  Further, since the spring contact member 54 is disposed between the LED light emitting device 51 and the mounting substrate 60, the heat generated by the LED light emitting device 51 is not easily transmitted to the mounting substrate 60 side, and the heat dissipation of the LED light emitting device 51 is performed. There are also problems of a decrease in the amount of light emission due to poor characteristics and a shortening of the life of the LED light emitting device 51.

  The object of the present invention is to solve the above-mentioned problems, and by assembling the LED light-emitting device into the mounting board by means of pressing and fixing means with a small number of parts, the assemblability and heat dissipation are good, and the number of parts at the same time. It is to provide a built-in structure of an LED light-emitting device with a small amount of LED.

  In order to achieve the above object, according to the present invention, a semiconductor light emitting device incorporating a semiconductor light emitting device including a semiconductor light emitting device, a light emitting device substrate on which the semiconductor light emitting device is mounted, and a connection electrode formed on the light emitting device substrate. In the built-in structure, the frame includes a mounting body and a frame provided with a pressure spring, and the frame body positions the outer shape of the light-emitting element substrate by incorporating the semiconductor light emitting device into the frame fixed to the mounting board. In addition, the pressure contact spring presses the connection electrode of the light emitting element substrate to fix and electrically connect the light emitting element substrate.

  According to the above configuration, since the LED light emitting device can be positioned and fixed with respect to the mounting substrate by only one frame body provided with the press contact spring, it is possible to provide an LED light emitting device assembling structure with extremely good assemblability. In addition, since the light emitting element substrate is pressed and brought into close contact with the mounting substrate, the heat generated by the LED can be radiated to the mounting substrate side via the LED light emitting device, so that improvement in heat dissipation characteristics can be expected.

  The press contact spring has a shape penetrating the outer side and the inner side of the frame body, and a portion protruding to the outer side of the frame body is a fixed electrode fixed to a drive electrode provided on the mounting substrate, The portion protruding to the inside of the frame body may be a pressure contact spring portion that presses the connection electrode of the light emitting element substrate.

  The frame body may have a rectangular shape, and the pressure contact springs may be provided on two opposing sides of the rectangular shape.

  The frame body preferably has an escape groove for retracting the press contact spring portion when the semiconductor light emitting device is assembled.

  The frame body may have a U-shape having an open end on one side that does not have a pressure spring, and the semiconductor light emitting device may be assembled and removed from the open end.

  According to the above configuration, the exchangeability when the semiconductor light emitting device fails is extremely improved.

  The frame body may further have a function of positioning the heat dissipation sheet member, and the heat dissipation sheet member and the light emitting element substrate may be stacked and positioned on the frame body.

  According to the above configuration, since the light emitting element substrate is further pressed and adhered to the mounting substrate via the heat dissipation sheet, the effect of dissipating the heat generated by the LED toward the mounting substrate is enhanced, and the improvement of the favorable heat dissipation characteristics is achieved. I can expect.

  The heat dissipation sheet may have conductivity only in the thickness direction.

  As described above, according to the present invention, the LED light emitting device can be positioned and fixed with respect to the mounting substrate using only one frame body provided with a pressure contact spring. Can be provided. In addition, since the light emitting element substrate is pressed and brought into close contact with the mounting substrate, the heat generated by the LED can be radiated to the mounting substrate side, so that improvement in heat dissipation characteristics can be expected.

It is a top view of the LED light-emitting device in this invention. It is AA sectional drawing of the LED light-emitting device shown in FIG. It is a disassembled top view of the LED light-emitting device and built-in member in 1st Embodiment of this invention, (a) is a LED light-emitting device, (b) is a thermal radiation sheet | seat, (c) is a frame. It is a top view which shows the state which integrated the LED light-emitting device in the mounting substrate in 1st Embodiment of this invention. It is AA sectional drawing of the LED light-emitting device shown in FIG. It is sectional drawing which shows the structure and operation | movement of a press-contact spring shown in FIG. 5, (a) is sectional drawing of a press-contact spring, (b) is a fragmentary sectional view in the middle of incorporating an LED light-emitting device in a frame, (c) is LED It is a fragmentary sectional view of the completion state incorporating a light-emitting device. It is a top view which shows the state which incorporated the LED light-emitting device in the mounting substrate in 2nd Embodiment of this invention. It is AA sectional drawing of the LED light-emitting device shown in FIG. FIG. 8 is a plan view showing an assembled state of the LED light emitting device shown in FIG. 7. It is sectional drawing which shows the structure and operation | movement of a pressure contact spring shown in FIG. 8, (a) is sectional drawing of a pressure contact spring, (b) is a fragmentary sectional view in the middle of incorporating an LED light-emitting device in a frame, (c) is LED. It is a fragmentary sectional view of the assembly completion state of a light-emitting device. It is a top view of the frame in a 3rd embodiment of the present invention. It is AA sectional drawing of the frame shown in FIG. It is BB sectional drawing of the frame shown in FIG. It is a top view of the LED light-emitting device in 4th Embodiment of this invention. It is AA sectional drawing of the LED light-emitting device shown in FIG. It is sectional drawing which shows the state which incorporated the LED light-emitting device in the mounting board | substrate in 4th Embodiment of this invention. It is sectional drawing which shows the incorporating structure of the conventional LED light-emitting device.

(Description of the first embodiment)
Embodiments of the present invention will be described below with reference to the drawings. 1 to 6 show a first embodiment of the present invention, FIG. 1 is a plan view of an LED light emitting device according to the present invention, FIG. 2 is a cross-sectional view taken along line AA of the LED light emitting device shown in FIG. 2 is an exploded plan view of the LED light-emitting device and the built-in member shown in FIG. 1, (a) is the LED light-emitting device, (b) is a heat dissipation sheet, and (c) is a frame. 4 is a plan view showing a state in which the LED light-emitting device shown in FIG. 1 is incorporated in a mounting substrate, FIG. 5 is a cross-sectional view taken along line AA in FIG. 4, and FIG. 6 is a cross-sectional view showing the configuration and operation of the press-contact spring shown in FIG. It is a figure and a fragmentary sectional view.

  1 and 2, the LED light emitting device 10 has a light emitting part (LED 1 in which one or a plurality of LED dies are mounted on the light emitting element substrate 2 and coated with a fluorescent resin) in the center of the light emitting element substrate 2, and further emits light. Four wiring electrodes 3 are provided at four corners of the element substrate 2, but two of 3 a and 3 b are connection electrodes connected to the LED 1 (in the subsequent drawings, the electrodes 3 a and 3 b are connected to the LED 1. 3c and 3d are connection dummy electrodes.

  Next, the built-in structure of the LED light emitting device 10 will be described with reference to FIGS. 3A shows the LED light emitting device 10 shown in FIG. 1, FIG. 3B shows the heat radiating sheet 4, and the heat radiating sheet 4 has substantially the same shape as the light emitting element substrate 2 and has a predetermined thickness. It is made of a material with good thermal conductivity. FIG. 3 (c) shows a rectangular frame body 5. As will be described later, four through holes 5a are provided on two opposite sides, and four pressure springs 6 are provided in the through holes 5a. The portion of the pressure spring 6 that protrudes outside the frame 5 constitutes a fixed electrode portion 6e described later, and the portion that protrudes inside the frame 5 constitutes a pressure spring 6h.

  4 and 5, the mounting substrate 7 is provided with four substrate electrodes 8, two of which 8a and 8b are drive electrodes, and two of 8c and 8d are dummy electrodes. Yes. A through hole 5 a is arranged in the frame 5 so as to correspond to the position of the substrate electrode 8 of the mounting substrate 7, and the fixed electrode portion 6 e (see FIG. 3) of the pressure springs 6 a to 6 d drives the mounting substrate 7. The frame body 5 is fixed to the mounting substrate 7 by being fixed to the electrodes 8a, 8b and the dummy electrodes 8c, 8d with solder 9.

  Then, in a state where the frame 5 is fixed to the mounting substrate 7 as shown in FIG. 5, the outer shapes of the laminated heat radiation sheet 4 and the LED light emitting device 10 are positioned on the frame 5, and the pressure springs of the pressure springs 6a and 6b. The LED light emitting device 10 is fixed to the mounting substrate 7 by the portion 6 h pressing and fixing the wiring electrode 3 provided on the light emitting element substrate 2. In this state, the connection electrodes 3a and 3b of the LED light-emitting device 10 are connected to the drive electrodes 8a and 8b of the mounting substrate 7 via the pressure springs 6a and 6b so that a drive voltage is supplied. The generated heat of the LED 1 is emitted from the back surface side of the light emitting element substrate 2 to the mounting substrate 7 side through the heat dissipation sheet 4.

In the built-in structure shown in FIG. 4, the four pressure contact springs 6a to 6d are all fixed to the drive electrodes 8a and 8b and the dummy electrodes 8c and 8d of the mounting substrate 7 by the solder 9, but the fixing force is sufficient. In other words, only the pressure springs 6 a and 6 b for the drive electrodes 8 a and 8 b provided on the diagonal line may be fixed by the solder 9. Even in this case, the pressing force of the other pressing springs 6c and 6d against the connection dummy electrodes 3c and 3d acts via the frame 5, so that the effect of the fixing force can be obtained.
Further, when the LED light emitting device 10 fails and is replaced, the LED light emitting device can be easily removed by pushing the pressure spring spring portion 6h into the escape groove 5c (see FIG. 6) of the frame 5 and removing the LED device 10. 10 can be exchanged.

Next, the relationship between the frame 5 and the pressure spring 6 will be described with reference to FIG. 6A is a cross-sectional view of the pressure spring 6, which is formed by bending one flat plate spring material, and includes a fixed electrode portion 6e, a vertical portion 6f, a through portion 6g, and a pressure spring portion. 6h is formed by bending. The press contact spring portion 6h has a bent shape with a rounded inner side in order to facilitate deformation when the LED light emitting device 10 is inserted as will be described later.

  Next, the operation of the press contact spring 6 during the assembling operation of the LED light emitting device 10 will be described with reference to FIGS. FIG. 6B shows a configuration in the middle of assembling the LED light emitting device 10 with respect to the frame 5. When the LED light emitting device 10 is inserted from the direction of the arrow S, the pressure spring portion 6 h of the pressure spring 6 is rounded. The LED light is deformed by being pushed in the direction, retracted in the escape groove 5c, and allows the light emitting element substrate 2 of the LED light emitting device 10 to pass through. The flexible heat radiating sheet 4 is preliminarily aligned with the frame 5 and then disposed on the mounting substrate 7 (not shown). When the light emitting element substrate 2 of the LED light emitting device 10 passes through the region of the press contact spring portion 6h and is positioned at a predetermined position of the frame body 5, the press contact spring portion 6a is released from the deformation and returns to the original shape. The tip portion presses the wiring electrode 3 provided on the upper surface of the light emitting element substrate 2 to fix and electrically connect the LED light emitting device 10 to the mounting substrate 7.

  Further, when the LED light emitting device 10 is failed and needs to be replaced, the LED light emitting device 10 is pulled upward while the pressing spring 6 is deformed to the escape groove 5c side by the release jig 30 as shown in FIG. Accordingly, as shown in FIG. 6B, the pressure contact spring portion 6h is retracted into the escape groove 5c of the frame 5, and the LED light emitting device 10 can be easily detached.

Further, the combination of the frame body 5 and the pressure contact spring 6 is integrated with the through hole 6a and the vertical portion 6f of the pressure contact spring 6 fitted into the through hole 5a and the recess 5b of the frame body 5 as shown in FIGS. A fixed electrode portion 6e is provided on the outer surface of the frame body 5 and a pressure contact spring portion 6h is provided on the inner surface. The movement of the pressure contact spring portion 6 h is given a degree of freedom by the presence of the escape groove 5 c provided in the frame body 5.
In the embodiment of FIG. 6, the frame 5 is formed of a molded body having a through hole 5a, a recess 5b, and a relief groove 5c, and the pressure contact spring 6 is inserted into the through hole 5a using the elasticity of the pressure contact spring portion 6h. It is fitted and integrated. The manufacturing method of the frame 5 is not limited to this. For example, the press contact spring 6 may be integrated by an insert mold, and only the escape groove 5c may be provided by resin molding.

(Second Embodiment)
FIG. 7 is a plan view showing a state in which the LED light-emitting device is incorporated in the mounting substrate in the second embodiment of the present invention, and FIG. 8 is a cross-sectional view taken along line AA in FIG. 7 and 8, the basic configuration is the same as that in the first embodiment shown in FIGS. 4 and 5, and the same members are denoted by the same reference numerals and redundant description is omitted.

  The difference between the built-in structure of the LED light emitting device 10 in the second embodiment shown in FIG. 7 and the built-in structure of the LED light emitting device 10 in the first embodiment shown in FIG. This is a built-in configuration of the light emitting device 10. That is, the frame body 15 in the second embodiment has a U-shape in which an open portion 5H is provided on one side of the rectangular frame body 5 in the first embodiment. As a result, the frame body 15 is fixed to the mounting substrate 7 in advance by fixing the press-contact springs 16a to 16c with the solder 9, and the LED light emitting device 10 and the heat insulating sheet 4 are indicated by the arrow from the open portion 5H of the frame body 15. Can be inserted from the direction. In this structure, the frame 15 may be fixed to the mounting substrate 7 with an adhesive or the like. In this embodiment, as will be described later, the pressing spring portions 6h (see FIG. 10) of the pressing springs 16a to 16c are moved upward, so that the shape is different from the escape groove 5c of the first embodiment shown in FIG. Relief grooves 5d (see FIG. 10) for the pressure contact springs 16a to 16d were provided.

  The LED light emitting device 10 is assembled by lifting the pressure contact spring portions 6h of the four pressure contact spring portions 16a to 16d in the escape groove 5d of the frame 15 using a jig 30 (see FIG. 10) described later. The LED light emitting device 10 and the heat insulating sheet 4 can be inserted and positioned up to the corner of the frame 15, and the release jig 30 is removed from this state to return the pressure contact spring 6h to the original position. As a result, the wiring electrode 3 of the light emitting element substrate 2 is pressed by the pressure contact spring portion 6h, and the LED light emitting device 10 is fixed and electrically connected.

  In addition, when the LED light emitting device 10 breaks down, the LED light emitting device 10 can be easily replaced from the opening portion 5H of the frame 15 by operating the pressure contact spring portion 6h by the jig 30. 9 shows a state in which the LED light emitting device 10 shown in FIG. 7 is inserted in the direction of the arrow from the opening 5H of the frame body 15 fixed to the mounting substrate 7.

  Next, the relationship between the frame 15 and the pressure spring 16 will be described with reference to FIG. FIG. 10A is a cross-sectional view of the press contact spring 16, which is formed by bending a flat plate spring material like the press contact spring 6 shown in FIG. The part 6f, the penetrating part 6g, and the pressure contact spring part 6h are formed by bending. The difference between the pressure contact spring 6 shown in FIG. 6 and the pressure contact spring 16 shown in FIG. 10 is that the pressure contact spring portion 6h of the pressure contact spring 6 is bent so as to be easily deformed when the LED light emitting device 10 is inserted. In contrast to the shape, the press contact spring portion 6h of the press contact spring 16 only needs to be deformed up and down when the LED light emitting device 10 is inserted, so that it is formed linearly.

  Next, the operation of the press contact spring 16 during the assembling operation of the LED light emitting device 10 will be described with reference to FIGS. FIG. 10B shows a configuration in the middle of assembling the LED light-emitting device 10 with respect to the frame 15. The pressing spring portion 6 h of the pressing spring 16 is lifted upward by the release jig 30, and the direction shown by the arrow in FIG. The LED light emitting device 10 is pushed in. Then, when the release jig 30 is removed while the LED light emitting device 10 is positioned on the frame 15, the deformation of the press contact spring 6 is released, and the light emitting element substrate 2 is pressed by the press contact spring portion 6h as shown in FIG. The wiring electrode 3 is pressed, and the LED light emitting device 10 is fixed and electrically connected.

  If the LED light emitting device 10 is broken and needs to be replaced, as shown in FIG. 10B, the LED light emitting device 10 is released from the frame 15 while the pressing spring portion 6h is deformed upward by the release jig 30. By extracting in the direction of the part 5H, it can be easily replaced.

(Third embodiment)
Next, the structure of the frame in the third embodiment of the present invention will be described with reference to FIGS.
11 is a plan view of the frame body 25 in the third embodiment of the present invention, FIG. 12 is a cross-sectional view of the frame body 25 taken along line AA in FIG. 11, and FIG. 13 is a cross-sectional view of the frame body 25 shown in FIG. FIG. The basic configuration of the frame body 25 in the third embodiment is the same as that of the frame body 15 shown in FIG. 7, and the same members are denoted by the same reference numerals, and redundant description is omitted. The frame body 25 in the third embodiment is different from the frame body 15 in the second embodiment in that a notch 5K is formed between the through holes 5a that house the pressure contact springs 16 of the frame body 25 as shown in FIGS. As shown in FIG. 13, the side surfaces of the two through holes 5a are opened by the notch portions 5K.

  Therefore, the frame body 25 and the pressure spring 16 are incorporated into the mounting board 7 as shown in FIG. 13 with the frame body 25 fixed firmly to the mounting board 7 with an adhesive or the like, and the cutout portion 5K of the frame body 25. The pressing spring 16 indicated by the dotted line is pushed in the direction of the arrow, and the penetrating portion 6g of the pressing spring 16 is accommodated in the through hole 5a of the frame 25, so that the pressing spring 16 against the frame 25 is shown in FIG. Installation is performed. The subsequent soldering of the fixed electrode portion 6e of the pressure contact spring 16 and the fixing and electrical connection of the LED light emitting device 10 by the pressure contact spring portion 6h are the same as the built-in structure shown in FIG. However, in the case of the third embodiment, the press contact spring 16 can be easily attached to and detached from the frame 25 that is firmly fixed to the mounting substrate 7, so that the assembling property and the LED light emitting device exchangeability are particularly improved.

  As described above, in the present invention, since the LED light-emitting device for the mounting substrate can be incorporated by using only one frame body in which a plurality of press contact springs are integrated by insert molding, insertion, or fitting, etc., it is easy to incorporate. In addition, it is possible to provide an LED light-emitting device built-in structure that allows replacement of the LED light-emitting device.

(Explanation of Fourth Embodiment)
Next, a built-in structure of the LED light emitting device according to the fourth embodiment of the present invention will be described with reference to FIGS. 14 is a plan view of an LED light emitting device according to a fourth embodiment of the present invention, FIG. 15 is a cross-sectional view taken along line AA of the LED light emitting device shown in FIG. 14, and FIG. 16 is a mounting substrate of the LED light emitting device 20 shown in FIG. It is sectional drawing which shows the state assembled.

  The basic configuration of the LED light-emitting device 20 in the fourth embodiment is the same as that of the LED light-emitting device 10 in the first embodiment, and the same members are denoted by the same reference numerals, and redundant descriptions are omitted. 14 corresponds to the plan view of the LED light-emitting device 10 in FIG. 1, and similarly, the cross-sectional view in FIG. 15 corresponds to the cross-sectional view in FIG. Further, the assembled sectional view of FIG. 16 corresponds to the assembled sectional view of the first embodiment shown in FIG.

  The LED light emitting device 20 shown in FIGS. 14 and 15 is different from the LED light emitting device 10 shown in FIGS. 1 and 2 in that the LED light emitting device 10 has a top electrode configuration, and the LED 1 is formed on the top surface of the light emitting element substrate 2. The LED light emitting device 20 is electrically connected to the drive electrodes 8a and 8b via the connection electrodes 3a and 3b, whereas the LED light emitting device 20 is connected to the through hole electrode 26 of the light emitting element substrate 22 and the heat dissipation sheet 24 (see FIG. 16). In order to electrically connect the LED 21 to the drive electrodes 25a and 25b (see FIG. 16) of the mounting substrate 27 via the connection electrodes 24a and 24b are provided on the lower surface of the light emitting element substrate 22. Therefore, the wiring electrodes 23 provided on the upper surface of the light emitting element substrate 22 are not used for electrical connection, and all have a function as a dummy electrode. Further, if the upper surface of the light emitting element substrate 22 can withstand the strength of the pressure by the press contact spring 16, it is not necessary to provide it.

(Explanation of built-in structure and operation of LED light emitting device 20)
FIG. 16 is a cross-sectional view showing a state in which the LED light emitting device 20 is incorporated into the mounting substrate 27 using the frame 5. In this case, the heat dissipation sheet 24 is made of a material having conductive anisotropy and exhibits conductivity only in the thickness direction. In the state in which the LED light emitting device 20 is incorporated by the frame 5 and the press contact spring 16, the connection electrodes 24 a and 24 b and the drive electrodes 25 a and 25 b provided on the mounting substrate 27 are connected by the conductive anisotropy of the heat dissipation sheet 24. The LED 21 is driven and lit when power is supplied.

  The LED light emitting device 20 can be easily assembled and replaced using the release jig 30 by the same method as that of the LED light emitting device 10 in the first embodiment shown in FIG.

1,21 LED (semiconductor light emitting device)
2, 22 Light emitting element substrate 3, 23 Wiring electrode 3a, 3b, 24a, 24b Connection electrode 3c, 3d Connection dummy electrode 4, 24 Heat radiation sheet 5, 15, 25 Frame body 5a Through hole 5b Recessed part 5c, 5d Escape groove 5H Open Part 5K Notch part 6, 6a, 6b, 6c, 6d, 16, 16a-d Pressure spring 6e Fixed electrode 6f Vertical part 6g Through part 6h Pressure spring part 7, 27 Mounting board 8 Board electrode 8a, 8b, 25a, 25b Drive electrode 8c, 8d Dummy electrode 9 Solder 10, 20 LED light emitting device 26 Through hole 30 Release jig

Claims (7)

  In a semiconductor light-emitting element assembly structure in which a semiconductor light-emitting device including a semiconductor light-emitting element, a light-emitting element substrate on which the semiconductor light-emitting element is mounted, and a connection electrode formed on the light-emitting element substrate is incorporated in the mounting substrate. The frame body regulates the position of the outer shape of the light emitting element substrate by incorporating the semiconductor light emitting device into the frame body fixed to the mounting substrate, and the pressure contact spring is the light emitting element. An embedded structure of a semiconductor light emitting device, wherein the connection electrode of the substrate is pressed to fix and electrically connect the light emitting element substrate.   The press contact spring has a shape penetrating the outer side and the inner side of the frame body, and a portion protruding to the outer side of the frame body is a fixed electrode fixed to a drive electrode provided on the mounting substrate, 2. The semiconductor light-emitting device assembly structure according to claim 1, wherein the portion protruding to the inside of the frame is a pressing spring portion that presses the connection electrode of the light-emitting element substrate.   3. The semiconductor light emitting device assembly structure according to claim 1, wherein the frame body has a rectangular shape, and the pressure contact springs are provided on two opposing sides of the rectangular shape.   4. The semiconductor light-emitting device assembly structure according to claim 1, wherein the frame has an escape groove for retracting the pressure contact spring portion when the semiconductor light-emitting device is assembled. 5.   The frame body has a U-shape with one side having no pressure contact spring as an open end, and the semiconductor light-emitting device is assembled and the semiconductor light-emitting device is removed from the open end. Item 5. A structure for incorporating a semiconductor light-emitting device according to any one of Items 1 to 4.   6. The frame according to claim 1, wherein the frame further has a positioning function of the heat radiation sheet member, and the heat radiation sheet member and the light emitting element substrate are laminated and positioned on the frame. A structure for incorporating the semiconductor light emitting device according to 1.   The structure for incorporating a semiconductor light emitting device according to claim 6, wherein the heat dissipation sheet has conductivity only in a thickness direction.

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